JP5180469B2 - 真空蒸着装置 - Google Patents
真空蒸着装置 Download PDFInfo
- Publication number
- JP5180469B2 JP5180469B2 JP2006348641A JP2006348641A JP5180469B2 JP 5180469 B2 JP5180469 B2 JP 5180469B2 JP 2006348641 A JP2006348641 A JP 2006348641A JP 2006348641 A JP2006348641 A JP 2006348641A JP 5180469 B2 JP5180469 B2 JP 5180469B2
- Authority
- JP
- Japan
- Prior art keywords
- deposition
- opening
- evaporation source
- thickness
- vapor deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
- C23C14/546—Controlling the film thickness or evaporation rate using measurement on deposited material using crystal oscillators
Description
2 蒸発源
3 被蒸着体
4 筒状体
5 開口部
6 開閉手段
7 蒸着厚み計測手段
8 開閉制御手段
9 気化物質
Claims (1)
- 真空チャンバー内に蒸発源と被蒸着体とを配置すると共に蒸発源と被蒸着体の間の空間を蒸発源の物質が気化される温度で加熱された筒状体で囲み、蒸発源から気化した物質を筒状体内を通して被蒸着体の表面に到達させて蒸着させるようにした真空蒸着装置において、蒸発源から気化した物質を開口部を通過させた後に筒状体内を通して被蒸着体の表面に到達させるようにし、この開口部の開口度を調整可能な開閉手段と、開口部と被蒸着体との間に配置され、蒸発源から気化した物質を蒸着させてその蒸着厚みを計測する蒸着厚み計測手段と、蒸着厚み計測手段で計測される蒸着厚みに応じて開閉手段の開口度を調整する開閉制御手段とを備え、蒸着厚み計測手段は開閉制御手段に電気的に接続されると共に蒸着厚み計測手段で計測された蒸着厚みのデータが開閉制御手段に入力されるようにし、前記蒸着厚みのデータは、実際に蒸着を行う条件と同じ条件での予備試験により得られた開口部の開口度と単位時間当たりの蒸着膜厚との相関データが単位時間当たりの蒸着膜厚の時間変化に合わせて補正されたデータ、及び、実際の蒸着を行う際に蒸着厚み計測手段で計測された蒸着膜厚のデータからなり、前記蒸着厚みのデータに基づいて、単位時間当たりの蒸着膜厚が維持されるように開閉制御手段から出力される制御信号によって開閉手段の開口度が制御されるようにしたことを特徴とする真空蒸着装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006348641A JP5180469B2 (ja) | 2006-12-25 | 2006-12-25 | 真空蒸着装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006348641A JP5180469B2 (ja) | 2006-12-25 | 2006-12-25 | 真空蒸着装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008156726A JP2008156726A (ja) | 2008-07-10 |
JP5180469B2 true JP5180469B2 (ja) | 2013-04-10 |
Family
ID=39657963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006348641A Expired - Fee Related JP5180469B2 (ja) | 2006-12-25 | 2006-12-25 | 真空蒸着装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5180469B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009019146B4 (de) * | 2009-04-29 | 2014-07-24 | THEVA DüNNSCHICHTTECHNIK GMBH | Verfahren und Vorrichtung zur Hochratenbeschichtung durch Hochdruckverdampfen |
CN105765101A (zh) * | 2013-11-16 | 2016-07-13 | 纽升股份有限公司 | 用于监测真空反应器设备中的硒蒸气的方法 |
CN110029311B (zh) * | 2019-03-29 | 2022-03-18 | 新冶高科技集团有限公司 | 一种蒸镀装置及方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4312289B2 (ja) * | 1999-01-28 | 2009-08-12 | キヤノンアネルバ株式会社 | 有機薄膜形成装置 |
JP4139158B2 (ja) * | 2002-07-26 | 2008-08-27 | 松下電工株式会社 | 真空蒸着方法 |
JP4041005B2 (ja) * | 2003-04-02 | 2008-01-30 | 長州産業株式会社 | 薄膜堆積用分子線源とそれを使用した薄膜堆積方法 |
JP4435523B2 (ja) * | 2003-09-10 | 2010-03-17 | トッキ株式会社 | 蒸着方法 |
JP4462989B2 (ja) * | 2004-04-14 | 2010-05-12 | 日立造船株式会社 | 蒸着装置 |
JP4545028B2 (ja) * | 2005-03-30 | 2010-09-15 | 日立造船株式会社 | 蒸着装置 |
-
2006
- 2006-12-25 JP JP2006348641A patent/JP5180469B2/ja not_active Expired - Fee Related
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Publication number | Publication date |
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JP2008156726A (ja) | 2008-07-10 |
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