JP6522501B2 - 表面特徴の特徴決定 - Google Patents
表面特徴の特徴決定 Download PDFInfo
- Publication number
- JP6522501B2 JP6522501B2 JP2015527520A JP2015527520A JP6522501B2 JP 6522501 B2 JP6522501 B2 JP 6522501B2 JP 2015527520 A JP2015527520 A JP 2015527520A JP 2015527520 A JP2015527520 A JP 2015527520A JP 6522501 B2 JP6522501 B2 JP 6522501B2
- Authority
- JP
- Japan
- Prior art keywords
- photon
- article
- features
- photons
- detector array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009826 distribution Methods 0.000 claims description 38
- 238000013507 mapping Methods 0.000 claims description 38
- 238000012512 characterization method Methods 0.000 claims description 27
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 description 32
- 230000007547 defect Effects 0.000 description 30
- 239000002245 particle Substances 0.000 description 29
- 238000003491 array Methods 0.000 description 19
- 238000000034 method Methods 0.000 description 15
- 238000010586 diagram Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000011800 void material Substances 0.000 description 11
- 238000007689 inspection Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- 238000001514 detection method Methods 0.000 description 9
- 238000011109 contamination Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 230000010287 polarization Effects 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 230000004907 flux Effects 0.000 description 5
- 230000001427 coherent effect Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000000295 complement effect Effects 0.000 description 3
- 230000005670 electromagnetic radiation Effects 0.000 description 3
- 210000003128 head Anatomy 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 210000001747 pupil Anatomy 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004445 quantitative analysis Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 230000002123 temporal effect Effects 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/061—Sources
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261682200P | 2012-08-11 | 2012-08-11 | |
| US61/682,200 | 2012-08-11 | ||
| US13/931,266 US9212900B2 (en) | 2012-08-11 | 2013-06-28 | Surface features characterization |
| US13/931,266 | 2013-06-28 | ||
| PCT/US2013/054584 WO2014028407A1 (en) | 2012-08-11 | 2013-08-12 | Surface features characterization |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015531068A JP2015531068A (ja) | 2015-10-29 |
| JP2015531068A5 JP2015531068A5 (enExample) | 2018-12-27 |
| JP6522501B2 true JP6522501B2 (ja) | 2019-05-29 |
Family
ID=50065976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015527520A Expired - Fee Related JP6522501B2 (ja) | 2012-08-11 | 2013-08-12 | 表面特徴の特徴決定 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US9212900B2 (enExample) |
| JP (1) | JP6522501B2 (enExample) |
| CN (1) | CN104704320B (enExample) |
| SG (1) | SG11201501049QA (enExample) |
| WO (1) | WO2014028407A1 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG11201407341TA (en) | 2012-05-09 | 2014-12-30 | Seagate Technology Llc | Surface features mapping |
| US9297759B2 (en) | 2012-10-05 | 2016-03-29 | Seagate Technology Llc | Classification of surface features using fluorescence |
| US9297751B2 (en) | 2012-10-05 | 2016-03-29 | Seagate Technology Llc | Chemical characterization of surface features |
| US9377394B2 (en) | 2012-10-16 | 2016-06-28 | Seagate Technology Llc | Distinguishing foreign surface features from native surface features |
| US9217714B2 (en) | 2012-12-06 | 2015-12-22 | Seagate Technology Llc | Reflective surfaces for surface features of an article |
| KR20140128741A (ko) * | 2013-04-29 | 2014-11-06 | 삼성디스플레이 주식회사 | 결정화 얼룩 검출 장치 |
| US9274064B2 (en) | 2013-05-30 | 2016-03-01 | Seagate Technology Llc | Surface feature manager |
| US9513215B2 (en) * | 2013-05-30 | 2016-12-06 | Seagate Technology Llc | Surface features by azimuthal angle |
| US9201019B2 (en) | 2013-05-30 | 2015-12-01 | Seagate Technology Llc | Article edge inspection |
| US9217715B2 (en) | 2013-05-30 | 2015-12-22 | Seagate Technology Llc | Apparatuses and methods for magnetic features of articles |
| US9581554B2 (en) * | 2013-05-30 | 2017-02-28 | Seagate Technology Llc | Photon emitter array |
| US9678018B2 (en) * | 2015-03-30 | 2017-06-13 | Gemological Institute Of America Inc. (Gia) | Apparatus and method for assessing optical quality of gemstones |
| KR20180028787A (ko) * | 2016-09-09 | 2018-03-19 | 삼성전자주식회사 | 디펙 검사 시스템과 방법, 및 그 검사 방법을 이용한 반도체 소자 제조방법 |
| EP3978868B1 (en) * | 2016-11-21 | 2024-11-06 | Dental Imaging Technologies Corporation | 3-d intraoral surface characterization |
| US11260678B2 (en) * | 2019-06-26 | 2022-03-01 | Xerox Corporation | Print substrate optical motion sensing and dot clock generation |
Family Cites Families (128)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4207467A (en) | 1978-09-05 | 1980-06-10 | Laser Precision Corp. | Film measuring apparatus and method |
| US4806776A (en) * | 1980-03-10 | 1989-02-21 | Kley Victor B | Electrical illumination and detecting apparatus |
| US4598997A (en) | 1982-02-15 | 1986-07-08 | Rca Corporation | Apparatus and method for detecting defects and dust on a patterned surface |
| US4477890A (en) | 1982-03-01 | 1984-10-16 | Discovision Associates | Mapping disc defect detector |
| GB2130835A (en) | 1982-10-04 | 1984-06-06 | Andrzej Kamil Drukier | Apparatus for the diagnosis of body structures into which a gamma-emitting radioactive isotape has been introduced |
| US4551919A (en) | 1982-10-27 | 1985-11-12 | Mitutoyo Mfg. Co., Ltd. | Measuring instrument |
| US4794550A (en) * | 1986-10-15 | 1988-12-27 | Eastman Kodak Company | Extended-range moire contouring |
| GB8729246D0 (en) | 1987-12-15 | 1988-01-27 | Renishaw Plc | Opto-electronic scale-reading apparatus |
| US5131755A (en) | 1988-02-19 | 1992-07-21 | Chadwick Curt H | Automatic high speed optical inspection system |
| US5066130A (en) | 1988-05-10 | 1991-11-19 | Canon Kabushiki Kaisha | Displacement measuring apparatus |
| US5058178A (en) * | 1989-12-21 | 1991-10-15 | At&T Bell Laboratories | Method and apparatus for inspection of specular, three-dimensional features |
| JPH05223532A (ja) * | 1991-07-10 | 1993-08-31 | Raytheon Co | 自動視覚検査システム |
| US5168322A (en) | 1991-08-19 | 1992-12-01 | Diffracto Ltd. | Surface inspection using retro-reflective light field |
| US5563702A (en) | 1991-08-22 | 1996-10-08 | Kla Instruments Corporation | Automated photomask inspection apparatus and method |
| JPH06241758A (ja) | 1993-02-15 | 1994-09-02 | Canon Inc | 欠陥検査装置 |
| EP0622624B1 (en) | 1993-04-23 | 1999-12-01 | Research Development Corporation Of Japan | A method for observing film thickness and/or refractive index |
| US5627638A (en) | 1993-07-01 | 1997-05-06 | Prolaser Ltd. | Method and apparatus for detecting defects in lenses |
| IL110618A (en) | 1994-08-10 | 1996-12-05 | Optomic Techn Corp Ltd | Device for testing optical elements |
| JP3483948B2 (ja) | 1994-09-01 | 2004-01-06 | オリンパス株式会社 | 欠陥検出装置 |
| US5548403A (en) | 1994-11-28 | 1996-08-20 | The Regents Of The University Of California | Phase shifting diffraction interferometer |
| JPH08178867A (ja) | 1994-12-26 | 1996-07-12 | Aichi Steel Works Ltd | 平鋼熱間探傷装置 |
| US20020054291A1 (en) | 1997-06-27 | 2002-05-09 | Tsai Bin-Ming Benjamin | Inspection system simultaneously utilizing monochromatic darkfield and broadband brightfield illumination sources |
| US5726455A (en) | 1995-06-30 | 1998-03-10 | Stormedia, Inc. | Disk film optical measurement system |
| US5790252A (en) * | 1995-09-27 | 1998-08-04 | Shin-Etsu Handotai Co., Ltd. | Method of and apparatus for determining residual damage to wafer edges |
| US5778039A (en) | 1996-02-21 | 1998-07-07 | Advanced Micro Devices, Inc. | Method and apparatus for the detection of light elements on the surface of a semiconductor substrate using x-ray fluorescence (XRF) |
| US5661559A (en) | 1996-03-14 | 1997-08-26 | Phase Metrics, Inc. | Optical surface detection for magnetic disks |
| US5781649A (en) | 1996-04-15 | 1998-07-14 | Phase Metrics, Inc. | Surface inspection of a disk by diffraction pattern sampling |
| US6556783B1 (en) * | 1997-01-16 | 2003-04-29 | Janet L. Gelphman | Method and apparatus for three dimensional modeling of an object |
| US5774212A (en) | 1997-03-19 | 1998-06-30 | General Electric Co. | Method and apparatus for detecting and analyzing directionally reflective surface flaws |
| US5898491A (en) | 1997-03-28 | 1999-04-27 | Hitachi Electronics Engineering Co. Ltd. | Surface defect test method and surface defect tester |
| DE19717488C2 (de) | 1997-04-25 | 2003-05-15 | Baumer Optronic Gmbh | Vorrichtung zur Inspektion der Oberfläche von Objekten |
| US5859698A (en) | 1997-05-07 | 1999-01-12 | Nikon Corporation | Method and apparatus for macro defect detection using scattered light |
| US6040592A (en) * | 1997-06-12 | 2000-03-21 | Intel Corporation | Well to substrate photodiode for use in a CMOS sensor on a salicide process |
| US5973839A (en) | 1998-03-05 | 1999-10-26 | Hewlett-Packard Company | Optical homogenizer |
| US20010036588A1 (en) | 1998-05-05 | 2001-11-01 | Ims-Ionen Mikrofabrikations Systeme Gmbh | Lithographic imaging of a structure pattern onto one or more fields on a substrate |
| IL126866A (en) * | 1998-11-02 | 2003-02-12 | Orbotech Ltd | Apparatus and method for fabricating flat workpieces |
| US6256097B1 (en) | 1999-01-08 | 2001-07-03 | Rudolph Technologies, Inc. | Ellipsometer and ellipsometry method |
| US6327374B1 (en) * | 1999-02-18 | 2001-12-04 | Thermo Radiometrie Oy | Arrangement and method for inspection of surface quality |
| DE19909534B4 (de) | 1999-03-04 | 2011-07-07 | BYK-Gardner GmbH, 82538 | Vorrichtung und Verfahren zur Bestimmung der Qualität strukturierter Oberflächen |
| US6529270B1 (en) | 1999-03-31 | 2003-03-04 | Ade Optical Systems Corporation | Apparatus and method for detecting defects in the surface of a workpiece |
| JP4154891B2 (ja) * | 1999-08-30 | 2008-09-24 | 信越半導体株式会社 | シリコン単結晶の製造方法 |
| EP1116932A3 (de) | 2000-01-14 | 2003-04-16 | Leica Microsystems Wetzlar GmbH | Messgerät und Verfahren zun Vermessen von Strukturen auf einem Substrat |
| US6476908B1 (en) * | 2000-04-10 | 2002-11-05 | Eclipse Optics, Inc. | Optical probe |
| US6483584B1 (en) | 2000-04-14 | 2002-11-19 | National Science Council | Device for measuring the complex refractive index and thin film thickness of a sample |
| US7751609B1 (en) * | 2000-04-20 | 2010-07-06 | Lsi Logic Corporation | Determination of film thickness during chemical mechanical polishing |
| JP2001304835A (ja) * | 2000-04-26 | 2001-10-31 | Toshiba Eng Co Ltd | 凹凸測定用照明装置、凹凸測定装置、欠陥検査用照明装置、欠陥検査装置およびその照明方法 |
| US6392745B1 (en) | 2000-06-13 | 2002-05-21 | American Air Liquide, Inc. | Method and apparatus for the fast detection of surface characteristics |
| DE10031558A1 (de) | 2000-06-28 | 2002-01-10 | Clariant Gmbh | Verfahren zur Konditionierung von organischen Pigmenten |
| US6552783B1 (en) * | 2000-06-28 | 2003-04-22 | Teradyne, Inc. | Optical system |
| FR2811761B1 (fr) | 2000-07-17 | 2002-10-11 | Production Rech S Appliquees | Ellipsometre a haute resolution spatiale fonctionnant dans l'infrarouge |
| JP2002049143A (ja) * | 2000-08-03 | 2002-02-15 | Dainippon Printing Co Ltd | 位相シフトマスクの欠陥検査装置 |
| JP2002190444A (ja) | 2000-10-10 | 2002-07-05 | Canon Inc | パターン露光装置、パターン作製方法、及びこれらを用いて作製したデバイス |
| US6630996B2 (en) | 2000-11-15 | 2003-10-07 | Real Time Metrology, Inc. | Optical method and apparatus for inspecting large area planar objects |
| US6809809B2 (en) | 2000-11-15 | 2004-10-26 | Real Time Metrology, Inc. | Optical method and apparatus for inspecting large area planar objects |
| US6515742B1 (en) | 2000-11-28 | 2003-02-04 | Memc Electronic Materials, Inc. | Defect classification using scattered light intensities |
| US6509966B2 (en) | 2000-12-27 | 2003-01-21 | Hitachi Electronics Engineering Co., Ltd. | Optical system for detecting surface defect and surface defect tester using the same |
| US6617603B2 (en) | 2001-03-06 | 2003-09-09 | Hitachi Electronics Engineering Co., Ltd. | Surface defect tester |
| WO2002079760A2 (en) | 2001-03-30 | 2002-10-10 | Therma-Wave, Inc. | Polarimetric scatterometer for critical dimension measurements of periodic structures |
| US6617087B1 (en) * | 2001-06-27 | 2003-09-09 | Advanced Micro Devices, Inc. | Use of scatterometry to measure pattern accuracy |
| JP4808871B2 (ja) * | 2001-07-12 | 2011-11-02 | 倉敷紡績株式会社 | 表面性状評価装置 |
| US7046353B2 (en) * | 2001-12-04 | 2006-05-16 | Kabushiki Kaisha Topcon | Surface inspection system |
| JP2003202214A (ja) | 2002-01-04 | 2003-07-18 | Mitsubishi Electric Corp | 形状計測装置および形状計測方法 |
| JP4102081B2 (ja) | 2002-02-28 | 2008-06-18 | 株式会社荏原製作所 | 研磨装置及び研磨面の異物検出方法 |
| KR100798320B1 (ko) | 2002-03-06 | 2008-01-28 | 엘지.필립스 엘시디 주식회사 | 액정 패널의 검사 장치 및 그 방법 |
| US20040207836A1 (en) * | 2002-09-27 | 2004-10-21 | Rajeshwar Chhibber | High dynamic range optical inspection system and method |
| US6847907B1 (en) | 2002-12-31 | 2005-01-25 | Active Optical Networks, Inc. | Defect detection and repair of micro-electro-mechanical systems (MEMS) devices |
| DE10313038B4 (de) * | 2003-03-24 | 2005-02-17 | Klingelnberg Gmbh | Vorrichtung zur Erfassung der Lage eines Tastelements in einem Mehrkoordinatenmessgerät |
| US7068363B2 (en) * | 2003-06-06 | 2006-06-27 | Kla-Tencor Technologies Corp. | Systems for inspection of patterned or unpatterned wafers and other specimen |
| US20050067740A1 (en) | 2003-09-29 | 2005-03-31 | Frederick Haubensak | Wafer defect reduction by short pulse laser ablation |
| US7433031B2 (en) * | 2003-10-29 | 2008-10-07 | Core Tech Optical, Inc. | Defect review system with 2D scanning and a ring detector |
| DE102004004761A1 (de) | 2004-01-30 | 2005-09-08 | Leica Microsystems Semiconductor Gmbh | Vorrichtung und Verfahren zur Inspektion eines Wafers |
| WO2005100961A2 (en) * | 2004-04-19 | 2005-10-27 | Phoseon Technology, Inc. | Imaging semiconductor strucutures using solid state illumination |
| DE102004029014B4 (de) * | 2004-06-16 | 2006-06-22 | Leica Microsystems Semiconductor Gmbh | Verfahren und System zur Inspektion eines Wafers |
| US7580126B2 (en) | 2004-06-30 | 2009-08-25 | Chemimage Corp. | Method and apparatus for producing a streaming Raman image of nucleation, aggregation, and chemical interaction |
| US7489399B1 (en) | 2004-08-20 | 2009-02-10 | Kla-Tencor Corporation | Spectroscopic multi angle ellipsometry |
| US7295739B2 (en) * | 2004-10-20 | 2007-11-13 | Kla-Tencor Technologies Corporation | Coherent DUV illumination for semiconductor wafer inspection |
| US7605913B2 (en) | 2004-12-19 | 2009-10-20 | Kla-Tencor Corporation | System and method for inspecting a workpiece surface by analyzing scattered light in a front quartersphere region above the workpiece |
| US20060147814A1 (en) | 2005-01-03 | 2006-07-06 | Ted Liang | Methods for repairing an alternating phase-shift mask |
| JP2006214886A (ja) * | 2005-02-03 | 2006-08-17 | Sharp Corp | 光学素子の欠陥検出方法および欠陥検出装置 |
| JP2006308511A (ja) | 2005-05-02 | 2006-11-09 | Canon Inc | 化学分析装置及びその分析方法 |
| US8243272B2 (en) | 2005-09-19 | 2012-08-14 | Jmar Llc | Systems and methods for detecting normal levels of bacteria in water using a multiple angle light scattering (MALS) instrument |
| JP4988224B2 (ja) | 2006-03-01 | 2012-08-01 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法及びその装置 |
| US7463369B2 (en) | 2006-03-29 | 2008-12-09 | Kla-Tencor Technologies Corp. | Systems and methods for measuring one or more characteristics of patterned features on a specimen |
| US7474410B2 (en) * | 2006-04-11 | 2009-01-06 | Massachusetts Institute Of Technology | Nanometer-precision tip-to-substrate control and pattern registration for scanning-probe lithography |
| US20090122304A1 (en) | 2006-05-02 | 2009-05-14 | Accretech Usa, Inc. | Apparatus and Method for Wafer Edge Exclusion Measurement |
| JP4959225B2 (ja) | 2006-05-17 | 2012-06-20 | 株式会社日立ハイテクノロジーズ | 光学式検査方法及び光学式検査装置 |
| JP5138268B2 (ja) * | 2006-06-14 | 2013-02-06 | 株式会社タニタ | 寸法測定装置 |
| EP2041535A4 (en) | 2006-06-29 | 2010-08-04 | Cdex Inc | METHOD AND APPARATUS FOR MOLECULAR SPECTRUM RECOGNITION, TESTING AND CLASSIFICATION USING ULTRAVIOLETT TO FAST INFRARED AMPLIFIED LIGHT EMISSION SPECTROSCOPY |
| TWI429896B (zh) | 2006-07-27 | 2014-03-11 | Rudolph Technologies Inc | 橢圓偏光測定儀器及監控製程之方法 |
| JP4843399B2 (ja) | 2006-07-31 | 2011-12-21 | 株式会社日立ハイテクノロジーズ | 検査装置及び検査方法 |
| KR100763942B1 (ko) | 2006-09-04 | 2007-10-05 | (주)포씨스 | 표면검사장치 |
| EP1901190A1 (en) | 2006-09-15 | 2008-03-19 | Sony DADC Austria AG | Method and system for managing access to add-on data files |
| US7714996B2 (en) | 2007-01-23 | 2010-05-11 | 3i Systems Corporation | Automatic inspection system for flat panel substrate |
| WO2008139735A1 (ja) | 2007-05-14 | 2008-11-20 | Nikon Corporation | 表面検査装置および表面検査方法 |
| US7636156B2 (en) | 2007-06-15 | 2009-12-22 | Qimonda Ag | Wafer inspection system and method |
| JP2009014510A (ja) | 2007-07-04 | 2009-01-22 | Hitachi High-Technologies Corp | 検査方法及び検査装置 |
| JP2009139248A (ja) | 2007-12-07 | 2009-06-25 | Hitachi High-Technologies Corp | 欠陥検出光学系および欠陥検出画像処理を搭載した表面欠陥検査装置 |
| KR100913484B1 (ko) | 2008-02-19 | 2009-08-25 | 에스엔유 프리시젼 주식회사 | 암시야 검사장치 |
| JP2010050167A (ja) * | 2008-08-19 | 2010-03-04 | Fujitsu Microelectronics Ltd | 欠陥検査装置及び欠陥検査方法 |
| JP5198189B2 (ja) | 2008-08-29 | 2013-05-15 | 富士フイルム株式会社 | ハードディスク検査装置 |
| CN102209609B (zh) * | 2008-09-09 | 2013-12-25 | 康奈尔大学 | 晶圆级纳米计量系统、用于感测加工元件位置的方法 |
| JP5341440B2 (ja) | 2008-09-10 | 2013-11-13 | 株式会社日立ハイテクノロジーズ | 検査装置 |
| JP5469839B2 (ja) | 2008-09-30 | 2014-04-16 | 株式会社日立ハイテクノロジーズ | 物体表面の欠陥検査装置および方法 |
| JP5027775B2 (ja) | 2008-10-03 | 2012-09-19 | 株式会社日立ハイテクノロジーズ | 基板表面形状検出方法及びその装置 |
| JP4719284B2 (ja) | 2008-10-10 | 2011-07-06 | トヨタ自動車株式会社 | 表面検査装置 |
| EP2450944A4 (en) * | 2009-07-01 | 2017-12-27 | Nikon Corporation | Exposure condition setting method and surface inspection apparatus |
| KR101123638B1 (ko) | 2009-08-26 | 2012-03-20 | 주식회사 케이엔제이 | 스크래치 검사장치 및 방법 |
| JP5282002B2 (ja) | 2009-09-30 | 2013-09-04 | 株式会社日立ハイテクノロジーズ | 磁気ディスクの両面欠陥検査方法及びその装置 |
| KR101177299B1 (ko) * | 2010-01-29 | 2012-08-30 | 삼성코닝정밀소재 주식회사 | 평판 유리 표면 이물질 검사 장치 |
| JP5321490B2 (ja) | 2010-02-08 | 2013-10-23 | 新日鐵住金株式会社 | 微粒子分析方法 |
| JP2011185503A (ja) | 2010-03-08 | 2011-09-22 | Bekku Kk | 温度制御方法 |
| JP2012026862A (ja) | 2010-07-23 | 2012-02-09 | Konica Minolta Business Technologies Inc | 表面検査装置、表面検査方法 |
| JP5806808B2 (ja) * | 2010-08-18 | 2015-11-10 | 倉敷紡績株式会社 | 撮像光学検査装置 |
| JP2012078140A (ja) * | 2010-09-30 | 2012-04-19 | Hitachi High-Technologies Corp | 基板表面欠陥検査方法およびその装置 |
| JP5721070B2 (ja) | 2011-03-08 | 2015-05-20 | 国立研究開発法人産業技術総合研究所 | 光学特性測定装置 |
| US9075934B2 (en) | 2011-09-24 | 2015-07-07 | Globalfoundries Inc. | Reticle defect correction by second exposure |
| JP5875812B2 (ja) * | 2011-09-27 | 2016-03-02 | オリンパス株式会社 | 顕微鏡システムおよび照明強度調整方法 |
| SG11201407341TA (en) | 2012-05-09 | 2014-12-30 | Seagate Technology Llc | Surface features mapping |
| US9297751B2 (en) | 2012-10-05 | 2016-03-29 | Seagate Technology Llc | Chemical characterization of surface features |
| US9297759B2 (en) | 2012-10-05 | 2016-03-29 | Seagate Technology Llc | Classification of surface features using fluorescence |
| US9377394B2 (en) | 2012-10-16 | 2016-06-28 | Seagate Technology Llc | Distinguishing foreign surface features from native surface features |
| US20140129179A1 (en) | 2012-11-08 | 2014-05-08 | Datacolor, Inc. | System and apparatus for multi channel gloss measurements |
| US9217714B2 (en) | 2012-12-06 | 2015-12-22 | Seagate Technology Llc | Reflective surfaces for surface features of an article |
| US9513215B2 (en) | 2013-05-30 | 2016-12-06 | Seagate Technology Llc | Surface features by azimuthal angle |
| US9201019B2 (en) | 2013-05-30 | 2015-12-01 | Seagate Technology Llc | Article edge inspection |
| US9217715B2 (en) | 2013-05-30 | 2015-12-22 | Seagate Technology Llc | Apparatuses and methods for magnetic features of articles |
| US9581554B2 (en) * | 2013-05-30 | 2017-02-28 | Seagate Technology Llc | Photon emitter array |
| US9274064B2 (en) | 2013-05-30 | 2016-03-01 | Seagate Technology Llc | Surface feature manager |
-
2013
- 2013-06-28 US US13/931,266 patent/US9212900B2/en not_active Expired - Fee Related
- 2013-08-12 WO PCT/US2013/054584 patent/WO2014028407A1/en not_active Ceased
- 2013-08-12 CN CN201380053262.8A patent/CN104704320B/zh not_active Expired - Fee Related
- 2013-08-12 JP JP2015527520A patent/JP6522501B2/ja not_active Expired - Fee Related
- 2013-08-12 SG SG11201501049QA patent/SG11201501049QA/en unknown
-
2015
- 2015-10-29 US US14/927,308 patent/US9766184B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| SG11201501049QA (en) | 2015-04-29 |
| CN104704320B (zh) | 2017-06-30 |
| US9212900B2 (en) | 2015-12-15 |
| US20160077018A1 (en) | 2016-03-17 |
| JP2015531068A (ja) | 2015-10-29 |
| US20140043621A1 (en) | 2014-02-13 |
| US9766184B2 (en) | 2017-09-19 |
| CN104704320A (zh) | 2015-06-10 |
| WO2014028407A1 (en) | 2014-02-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6522501B2 (ja) | 表面特徴の特徴決定 | |
| JP6486515B2 (ja) | 表面特徴マッピング | |
| US9952151B2 (en) | Surface features by azimuthal angle | |
| US9863876B2 (en) | Reflective surfaces for surface features of an article | |
| US9766179B2 (en) | Chemical characterization of surface features | |
| US9863892B2 (en) | Distinguishing foreign surface features from native surface features | |
| US9201019B2 (en) | Article edge inspection | |
| JP2015530600A (ja) | 蛍光を用いた表面特徴の分類 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160317 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20160317 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20170217 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170228 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170421 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20170919 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20171218 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20171227 |
|
| A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20180202 |
|
| A524 | Written submission of copy of amendment under article 19 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A524 Effective date: 20181113 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190226 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190424 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6522501 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| LAPS | Cancellation because of no payment of annual fees |