JP5469839B2 - 物体表面の欠陥検査装置および方法 - Google Patents
物体表面の欠陥検査装置および方法 Download PDFInfo
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- JP5469839B2 JP5469839B2 JP2008252119A JP2008252119A JP5469839B2 JP 5469839 B2 JP5469839 B2 JP 5469839B2 JP 2008252119 A JP2008252119 A JP 2008252119A JP 2008252119 A JP2008252119 A JP 2008252119A JP 5469839 B2 JP5469839 B2 JP 5469839B2
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- optical
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
Description
本欠陥検査装置の検出光学系20は、対物レンズ21と結像レンズ23から構成されるテレセントリック光学系である。欠陥検査において、欠陥を安定して検出するためには、検出光学系の性能が製造時と変わらないことが好ましい。このため、本発明では、検出光学系の光路途中と結像位置に検出光学系の結像性能を確認するため手段を設けている。
10 照明光学系
11 レーザ光源
20 検出光学系
25 光学フィルタ
30 搬送系
35 駆動回路
40 信号処理系
50 全体制御部
51 入出力手段
52 表示手段
53 記憶部
60 観察光学系
70 瞳観察光学系
80 搬送ロボット
82 搬送アーム
155 裏面検査装置
180 光検出手段
195 異物除去手段
240,320 光学素子
300 端面検査装置
350 オリフラ検出光学系
1301 A/D変換器
1302 データ記憶部
1303 閾値算出処理部
1307 異物検出処理回路
1308 検査領域処理部
1309 特徴量算出回路
1310 統合処理部
1311 結果表示部
Claims (4)
- 基板を載置し、移動する搬送系と、
レーザ光を前記基板に照射する照明光学系と、
前記基板からの光を検出する検出光学系と、
前記レーザ光の光路に配置された光学素子と、
前記レーザ光の状態を観察する観察系と、
前記観察系の結果に応じて前記光学素子を1次元、または2次元的に移動させる移動部と、を有し、
前記移動部は前記照明光学系内の光源と拡大光学系との間に配置され、
さらに、
前記移動部は、
前記光学素子が保持された第1のホルダ、または前記光学素子が設けられた第1の光学ユニットと、
モータと、
送りネジと、
リニアガイドと、を有し、
前記光学素子の移動量は前記光源からの光の大きさから得られる光学式検査装置。 - 請求項1に記載の光学式検査装置において、
前記光学素子は、
平面形状の光学素子である光学式検査装置。 - 請求項1に記載の光学式検査装置において、
前記光学素子は、
ビームスプリッタ,ミラー,NDフィルタ、および偏光子の少なくとも1つである光学式検査装置。 - 請求項1に記載の光学式検査装置において、
第2のホルダ、または第2の光学ユニットを有し、
前記モータと前記送りネジによって、
前記リニアガイド上を移動させ、
第1のホルダ、または第1の光学ユニットと、前記第2のホルダ、または前記第2の光学ユニットとを切換える光学式検査装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008252119A JP5469839B2 (ja) | 2008-09-30 | 2008-09-30 | 物体表面の欠陥検査装置および方法 |
US13/059,523 US20110141272A1 (en) | 2008-09-30 | 2009-07-10 | Apparatus and method for inspecting an object surface defect |
PCT/JP2009/062927 WO2010038533A1 (ja) | 2008-09-30 | 2009-07-10 | 物体表面の欠陥検査装置および方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008252119A JP5469839B2 (ja) | 2008-09-30 | 2008-09-30 | 物体表面の欠陥検査装置および方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010085135A JP2010085135A (ja) | 2010-04-15 |
JP5469839B2 true JP5469839B2 (ja) | 2014-04-16 |
Family
ID=42073310
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2008252119A Active JP5469839B2 (ja) | 2008-09-30 | 2008-09-30 | 物体表面の欠陥検査装置および方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20110141272A1 (ja) |
JP (1) | JP5469839B2 (ja) |
WO (1) | WO2010038533A1 (ja) |
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JP5544176B2 (ja) * | 2010-01-07 | 2014-07-09 | 株式会社日立ハイテクノロジーズ | 検査装置および検査方法 |
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US10900897B2 (en) | 2012-05-29 | 2021-01-26 | Altria Client Services Llc | Oil detection process |
US9212900B2 (en) | 2012-08-11 | 2015-12-15 | Seagate Technology Llc | Surface features characterization |
JP5993691B2 (ja) * | 2012-09-28 | 2016-09-14 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置及び欠陥検査方法 |
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US9377394B2 (en) | 2012-10-16 | 2016-06-28 | Seagate Technology Llc | Distinguishing foreign surface features from native surface features |
US9217714B2 (en) | 2012-12-06 | 2015-12-22 | Seagate Technology Llc | Reflective surfaces for surface features of an article |
US9885670B2 (en) | 2013-01-11 | 2018-02-06 | Hitachi High-Technologies Corporation | Inspection apparatus and adjusting method |
US9097668B2 (en) | 2013-03-15 | 2015-08-04 | Altria Client Services Inc. | Menthol detection on tobacco |
US9073091B2 (en) | 2013-03-15 | 2015-07-07 | Altria Client Services Inc. | On-line oil and foreign matter detection system and method |
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US9217715B2 (en) | 2013-05-30 | 2015-12-22 | Seagate Technology Llc | Apparatuses and methods for magnetic features of articles |
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CN103346105B (zh) * | 2013-06-27 | 2015-09-30 | 上海华力微电子有限公司 | 一种可按照工艺晶圆数量负载动态调整的缺陷抽检方法 |
US10502694B2 (en) * | 2013-08-06 | 2019-12-10 | Kla-Tencor Corporation | Methods and apparatus for patterned wafer characterization |
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KR102175021B1 (ko) | 2014-02-12 | 2020-11-06 | 케이엘에이 코포레이션 | 웨이퍼 노치 검출 |
US9575008B2 (en) * | 2014-02-12 | 2017-02-21 | ASA Corporation | Apparatus and method for photographing glass in multiple layers |
WO2016077471A1 (en) | 2014-11-11 | 2016-05-19 | Altria Client Services Inc. | Method for detecting oil on tobacco products and packaging |
CN106161887B (zh) * | 2015-04-10 | 2019-07-05 | 宁波舜宇光电信息有限公司 | 一种影像模组调节装置及其矫正方法 |
CN205484080U (zh) * | 2016-01-05 | 2016-08-17 | 鄂尔多斯市源盛光电有限责任公司 | 一种密封胶检测及超声清洗装置 |
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GB201715902D0 (en) * | 2017-09-29 | 2017-11-15 | Oxford Instr Plc | Improved system for electron diffraction analysis |
JP7062449B2 (ja) * | 2018-01-23 | 2022-05-06 | 株式会社ディスコ | 被加工物の切削方法 |
US10978331B2 (en) * | 2018-03-30 | 2021-04-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for orientator based wafer defect sensing |
CN109490313B (zh) * | 2018-11-09 | 2022-08-23 | 中国科学院光电技术研究所 | 一种大口径曲面光学元件表面缺陷自动检测装置及方法 |
JP6956063B2 (ja) * | 2018-12-07 | 2021-10-27 | ファナック株式会社 | 加工品の表面損傷検査システム |
US20210097674A1 (en) * | 2019-09-27 | 2021-04-01 | Ford Global Technologies, Llc | System for identifying and correcting irregularities of the surfaces of an object |
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JP2008020374A (ja) * | 2006-07-14 | 2008-01-31 | Hitachi High-Technologies Corp | 欠陥検査方法およびその装置 |
-
2008
- 2008-09-30 JP JP2008252119A patent/JP5469839B2/ja active Active
-
2009
- 2009-07-10 WO PCT/JP2009/062927 patent/WO2010038533A1/ja active Application Filing
- 2009-07-10 US US13/059,523 patent/US20110141272A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
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US20110141272A1 (en) | 2011-06-16 |
WO2010038533A1 (ja) | 2010-04-08 |
JP2010085135A (ja) | 2010-04-15 |
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