JP6505726B2 - 半導体チップを相互接続するためのインタポーザを提供するための方法及び装置 - Google Patents

半導体チップを相互接続するためのインタポーザを提供するための方法及び装置 Download PDF

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JP6505726B2
JP6505726B2 JP2016549259A JP2016549259A JP6505726B2 JP 6505726 B2 JP6505726 B2 JP 6505726B2 JP 2016549259 A JP2016549259 A JP 2016549259A JP 2016549259 A JP2016549259 A JP 2016549259A JP 6505726 B2 JP6505726 B2 JP 6505726B2
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glass substrate
ppm
interposer
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cte1
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JP2017505998A5 (enExample
JP2017505998A (ja
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チャンドラ チャパラヤ，サティシュ
チャンドラ チャパラヤ，サティシュ
クリストファー ポラード，スコット
クリストファー ポラード，スコット
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Corning Inc
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Corning Inc
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
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  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
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JP2016549259A 2014-01-31 2015-01-29 半導体チップを相互接続するためのインタポーザを提供するための方法及び装置 Expired - Fee Related JP6505726B2 (ja)

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Application Number Priority Date Filing Date Title
US201461934366P 2014-01-31 2014-01-31
US61/934,366 2014-01-31
PCT/US2015/013405 WO2015116749A1 (en) 2014-01-31 2015-01-29 Methods and apparatus for providing an interposer for interconnecting semiconductor chips

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JP2017505998A JP2017505998A (ja) 2017-02-23
JP2017505998A5 JP2017505998A5 (enExample) 2018-03-22
JP6505726B2 true JP6505726B2 (ja) 2019-04-24

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US (2) US9472479B2 (enExample)
EP (1) EP3100300A1 (enExample)
JP (1) JP6505726B2 (enExample)
KR (1) KR20160114710A (enExample)
CN (1) CN106165088B (enExample)
TW (1) TWI653713B (enExample)
WO (1) WO2015116749A1 (enExample)

Families Citing this family (44)

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Publication number Priority date Publication date Assignee Title
US9472479B2 (en) * 2014-01-31 2016-10-18 Corning Incorporated Methods and apparatus for providing an interposer for interconnecting semiconductor chips
KR101681410B1 (ko) * 2015-04-20 2016-11-30 삼성전기주식회사 커패시터 부품
US9780044B2 (en) * 2015-04-23 2017-10-03 Palo Alto Research Center Incorporated Transient electronic device with ion-exchanged glass treated interposer
JPWO2017010063A1 (ja) * 2015-07-10 2018-07-12 凸版印刷株式会社 配線基板及びその製造方法
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