JP6493612B1 - パワー半導体モジュールおよび車両 - Google Patents
パワー半導体モジュールおよび車両 Download PDFInfo
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Abstract
Description
特許文献1 特開2017−17195号公報
特許文献2 特開2014−179563号公報
特許文献3 特開平7−176642号公報
特許文献4 WO2013/157467
特許文献5 特開2017−183421号公報
図1から図6に示したパワー半導体モジュール100の補強部171−1および締結部80−1の部分を実施例1とした。なお、実施例1では、補強部171−1と締結部80−1とは上下に接触しているが、接着剤での固定はしていない。
実施例1のパワー半導体モジュール100の補強部171−1および締結部80−1の部分と同じ構成であって、かつ、補強部171−1と締結部80−1とを接着剤で固定したものを実施例2とした。接着剤はSi系接着剤を用いた。
図7に示すように、図1から図6に示したパワー半導体モジュール100における、補強部171−1を設けないものを比較例とした。すなわち、比較例においては、天板20の締結部80−1の上面が露出している。
実施例1: 4.5N/mm2
実施例2: 3.7N/mm2
比較例: 5.8N/mm2
さらに寿命も予測したところ、実施例2は比較例に対して約4倍の寿命を得ることが可能であるという結果が得られた。
Claims (16)
- 冷却装置と、前記冷却装置に搭載されたパワー半導体装置とを備えるパワー半導体モジュールにおいて、
前記冷却装置は、下面を有する天板と、冷媒流通部および前記冷媒流通部を囲む外縁部を含み、前記冷媒流通部が前記天板の下面側に配置され、且つ、前記外縁部において前記天板の下面に直接または間接に密着して配置されたケース部と、前記冷媒流通部に配置された冷却フィンとを有し、
前記天板および前記ケース部は、前記天板および前記外縁部が重なって配置され、且つ、前記天板および前記ケース部を外部装置に締結するための締結部を有し、
前記パワー半導体装置は、回路基板と端子ケースとを有し、
前記締結部は、前記天板の外周よりも外側に突出し、
前記端子ケースは、前記回路基板の周囲に配置されたケース本体と、前記締結部の上面側に延在する補強部とを有し、
前記補強部は、前記締結部の側面を覆う側面部を有するパワー半導体モジュール。 - 前記天板は、上面視において1組の長辺および1組の短辺と、4つの角部とを有しており、
前記締結部は、
全体が前記天板の外周より外側に配置された貫通孔を有して、前記天板の前記長辺と平行な方向に突出する第1の締結部と、
前記天板の前記外周の内側または重なって配された貫通孔を有して、前記天板の前記長辺とは平行でない方向に突出する第2の締結部と
を含む請求項1に記載のパワー半導体モジュール。 - 前記天板は、上面視において2組の対向する辺と、4つの角部とを有しており、
前記締結部は、少なくとも一つの前記角部において前記天板の外周よりも外側に突出して設けられており、
前記ケース部には、前記冷媒流通部と外部とを接続する開口部が設けられており、
前記開口部は、前記天板において前記締結部が設けられた前記角部と対向して配置されている請求項1に記載のパワー半導体モジュール。 - 前記ケース部の前記開口部は、前記ケース部の底面を上下に貫通して設けられている請求項3に記載のパワー半導体モジュール。
- 冷却装置と、前記冷却装置に搭載されたパワー半導体装置とを備えるパワー半導体モジュールにおいて、
前記冷却装置は、下面を有する天板と、冷媒流通部、前記冷媒流通部を囲む外縁部、前記天板の下面との間に前記冷媒流通部を有する底板、および、前記外縁部と前記底板とを接続する側壁を含み、前記外縁部において前記天板の下面に直接または間接に密着して配置されたケース部と、前記冷媒流通部に配置された冷却フィンとを有し、
前記天板および前記ケース部は、前記天板および前記外縁部が重なって配置され、且つ、前記天板および前記ケース部を外部装置に締結するための締結部を有し、
前記パワー半導体装置は、回路基板と端子ケースとを有し、
前記ケース部は、前記底板に、前記冷媒流通部と外部とを接続するための開口部が設けられており、
前記締結部は、前記天板の外周よりも外側に突出し、
前記端子ケースは、前記回路基板の周囲に配置されたケース本体と、前記締結部の上面側に延在する補強部とを有するパワー半導体モジュール。 - 前記締結部は、前記天板の外周において、前記底板および前記開口部とは逆側の外側へ突出して設けられている請求項5に記載のパワー半導体モジュール。
- 前記補強部の高さは前記ケース本体の高さ以下である請求項1から6のいずれか1項に記載のパワー半導体モジュール。
- 前記補強部と前記締結部とは接着剤により固定されている請求項1から7のいずれか1項に記載のパワー半導体モジュール。
- 前記補強部は、前記ケース本体の外周よりも外側に突出している請求項1から8のいずれか1項に記載のパワー半導体モジュール。
- 前記補強部は、上下に貫通した貫通孔の周囲に配された平面部と、前記平面部を囲い、前記平面部よりも上下方向に厚い筒状部を有する請求項1から9のいずれか1項に記載のパワー半導体モジュール。
- 前記補強部は、前記ケース本体から漸次高さが低くなる滑らかな曲面で前記ケース本体と接続している請求項1から10のいずれか1項に記載のパワー半導体モジュール。
- 前記補強部は、前記ケース本体から漸次幅が狭くなる滑らかな曲面で前記ケース本体と接続している請求項1から11のいずれか1項に記載のパワー半導体モジュール。
- 前記ケース部は、前記天板の下面の中心と対向する位置における厚みと、前記締結部における厚みとが同一である
請求項1から12のいずれか一項に記載のパワー半導体モジュール。 - 前記締結部において、前記天板および前記ケース部は同一の厚みである請求項1から13のいずれか1項に記載のパワー半導体モジュール。
- 前記締結部において、前記天板と前記外縁部との間に設けられた補強材を更に備える請求項1から14のいずれか1項に記載のパワー半導体モジュール。
- 請求項1から15のいずれか1項に記載のパワー半導体モジュールを備える車両。
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