JP7463825B2 - 半導体モジュールおよび車両 - Google Patents
半導体モジュールおよび車両 Download PDFInfo
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Description
[先行技術文献]
[特許文献]
[特許文献1]特開2017-092468号公報
[特許文献2]特開2017-050375号公報
[特許文献3]WO2015/033724
[特許文献4]特開2016-225339号公報
[特許文献5]特開2010-161203号公報
Claims (16)
- 半導体装置および冷却装置を備える半導体モジュールであって、
前記半導体装置は、半導体チップと、前記半導体チップが実装された回路基板と、前記半導体チップを封止する樹脂構造体とを有し、
前記冷却装置は、
前記半導体装置の前記回路基板および前記樹脂構造体が主面に固定される天板と、
前記天板に接続される側壁と、
前記側壁に接続され、前記天板に対面する底板と、
前記天板、前記側壁および前記底板によって画定され、冷媒を流通させるための冷媒流通部と、
前記冷媒流通部に冷媒を導入するための入口と、
前記冷媒流通部から冷媒を導出するための出口と、
前記冷媒流通部に配置され、前記天板と前記底板との間を接続するように延在する複数のフィンおよび補強ピンと
を有し、
前記冷媒流通部は、
前記複数のフィンが配置される冷却領域と、
前記冷却領域の一方側に隣接し、前記入口に連通し、前記複数のフィンが配置されない、第1連通領域と、
前記冷却領域の、前記一方側の反対側である他方側に隣接し、前記出口に連通し、前記複数のフィンが配置されない、第2連通領域と
を含み、
前記回路基板は、上面と下面を有する絶縁板と、前記上面に設けられた回路層と、前記下面に設けられた金属層とを順に含む積層基板であり、
前記金属層は、平面視において、一部が前記冷却領域と重なり、前記一部を除く部分が前記第1連通領域および前記第2連通領域の一方の連通領域と重なり、
前記補強ピンは、前記一方の連通領域に配置され、
前記天板の前記主面に平行な面内において、前記補強ピンの断面の面積は、前記複数のフィンのうちの少なくとも1つのフィンの断面の面積よりも小さい、
半導体モジュール。 - 前記補強ピンは、平面視において、少なくとも一部が前記金属層と重なる、
請求項1に記載の半導体モジュール。 - 前記金属層は、平面視において矩形であり、
前記補強ピンは、平面視において、少なくとも一部が前記金属層の前記矩形の角部と重なる、
請求項2に記載の半導体モジュール。 - 前記補強ピンは、平面視において、一部が前記金属層の前記矩形の角部と重なり、前記一部を除く部分が前記金属層と重ならない、
請求項3に記載の半導体モジュール。 - 前記補強ピンは、平面視において、前記少なくとも一部が、前記金属層の前記矩形の角部における、前記冷却領域から最も離れている部分と重なる、
請求項3または4に記載の半導体モジュール。 - 前記金属層は、平面視において矩形であり、
前記補強ピンは、平面視において、前記金属層と重ならず、且つ、前記金属層の前記矩形の角部近傍に位置する、
請求項1に記載の半導体モジュール。 - 前記補強ピンは、平面視において、前記冷却領域から離れる方向に沿って、前記金属層の前記矩形の角部における前記冷却領域から最も離れている部分から0mmよりも大きく2mm以下の距離だけ離れて位置する、
請求項6に記載の半導体モジュール。 - 前記半導体装置は、2枚以上の前記回路基板を含み、
平面視において、互いに隣接する2つの前記金属層の前記矩形の角部間には、前記補強ピンが1つだけ配置される、
請求項6または7に記載の半導体モジュール。 - 前記冷媒流通部は、平面視において矩形であり、
前記補強ピンは、平面視において、前記冷媒流通部の前記矩形の角部と、前記金属層との間に位置する、
請求項1から8のいずれか一項に記載の半導体モジュール。 - 前記補強ピンは、前記天板の前記主面に平行な断面の形状が円形である、
請求項1から9のいずれか一項に記載の半導体モジュール。 - 前記複数のフィンは、それぞれ、前記天板の前記主面に平行な断面の形状が矩形であり、
前記複数のフィンは、前記冷媒流通部に冷媒が流れた場合に、前記冷却領域における冷媒の主たる流れ方向に対して前記矩形の何れの辺も直交しないように、前記冷媒流通部に配置される、
請求項10に記載の半導体モジュール。 - 前記補強ピンは、前記天板の前記主面に平行な断面の形状が非多角形であり、
前記複数のフィンは、それぞれ、前記天板の前記主面に平行な断面の形状が多角形である、
請求項1から9のいずれか一項に記載の半導体モジュール。 - 前記少なくとも一方の連通領域に配置される複数の前記補強ピンの密度は、前記冷却領域に配置される前記複数のフィンの密度に比べて疎である、
請求項1から12のいずれか一項に記載の半導体モジュール。 - 前記絶縁板はセラミックを含み、
前記金属層は、前記天板の前記主面にはんだで固着されている、
請求項1から13のいずれか一項に記載の半導体モジュール。 - 前記樹脂構造体は、前記半導体チップを封止する封止部と、前記封止部を囲う収容部とを含み、
前記収容部は、前記天板の前記主面に固着剤で固着されている、
請求項1から14の何れか一項に記載の半導体モジュール。 - 請求項1から15の何れか一項に記載の半導体モジュールを備える車両。
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