JP6469006B2 - 光硬化性組成物 - Google Patents
光硬化性組成物 Download PDFInfo
- Publication number
- JP6469006B2 JP6469006B2 JP2015526614A JP2015526614A JP6469006B2 JP 6469006 B2 JP6469006 B2 JP 6469006B2 JP 2015526614 A JP2015526614 A JP 2015526614A JP 2015526614 A JP2015526614 A JP 2015526614A JP 6469006 B2 JP6469006 B2 JP 6469006B2
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- JP
- Japan
- Prior art keywords
- group
- silyl
- solder resist
- pfpe
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000000203 mixture Substances 0.000 title claims description 107
- -1 silane compound Chemical class 0.000 claims description 70
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 claims description 44
- 125000002947 alkylene group Chemical group 0.000 claims description 43
- 229910000679 solder Inorganic materials 0.000 claims description 42
- 239000010702 perfluoropolyether Substances 0.000 claims description 37
- 239000000178 monomer Substances 0.000 claims description 36
- 229910000077 silane Inorganic materials 0.000 claims description 30
- 239000005056 polyisocyanate Substances 0.000 claims description 27
- 229920001228 polyisocyanate Polymers 0.000 claims description 27
- 125000003118 aryl group Chemical group 0.000 claims description 26
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 24
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 18
- 125000000217 alkyl group Chemical group 0.000 claims description 17
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 15
- 239000000654 additive Substances 0.000 claims description 15
- 229920001187 thermosetting polymer Polymers 0.000 claims description 15
- 229910052739 hydrogen Inorganic materials 0.000 claims description 13
- 230000000996 additive effect Effects 0.000 claims description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 11
- 125000000732 arylene group Chemical group 0.000 claims description 11
- 229910052799 carbon Inorganic materials 0.000 claims description 11
- 229910052757 nitrogen Inorganic materials 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 125000005010 perfluoroalkyl group Chemical group 0.000 claims description 7
- 239000003999 initiator Substances 0.000 claims description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- 125000005518 carboxamido group Chemical group 0.000 claims 2
- 125000005420 sulfonamido group Chemical group S(=O)(=O)(N*)* 0.000 claims 2
- 229920001774 Perfluoroether Chemical group 0.000 claims 1
- 239000012949 free radical photoinitiator Substances 0.000 claims 1
- 229920002120 photoresistant polymer Polymers 0.000 description 74
- 150000001875 compounds Chemical class 0.000 description 40
- 238000000576 coating method Methods 0.000 description 35
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- 125000000524 functional group Chemical group 0.000 description 15
- 239000003822 epoxy resin Substances 0.000 description 14
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 14
- 229920000647 polyepoxide Polymers 0.000 description 14
- 125000004432 carbon atom Chemical group C* 0.000 description 13
- 150000002148 esters Chemical group 0.000 description 13
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 11
- 239000000976 ink Substances 0.000 description 11
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- 229920003270 Cymel® Polymers 0.000 description 10
- 239000004593 Epoxy Substances 0.000 description 10
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- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 10
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical group NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 9
- 125000001931 aliphatic group Chemical group 0.000 description 9
- 239000004814 polyurethane Substances 0.000 description 9
- 229920002635 polyurethane Polymers 0.000 description 9
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 8
- 229920003180 amino resin Polymers 0.000 description 8
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 8
- 125000004404 heteroalkyl group Chemical group 0.000 description 8
- DCAYPVUWAIABOU-UHFFFAOYSA-N hexadecane Chemical compound CCCCCCCCCCCCCCCC DCAYPVUWAIABOU-UHFFFAOYSA-N 0.000 description 8
- 150000002513 isocyanates Chemical class 0.000 description 8
- 230000001681 protective effect Effects 0.000 description 8
- 230000003068 static effect Effects 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- 239000002253 acid Substances 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229920003986 novolac Polymers 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical group O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 6
- 229910052753 mercury Inorganic materials 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- 229920001296 polysiloxane Polymers 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 150000004756 silanes Chemical class 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 5
- 239000004215 Carbon black (E152) Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical group CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 5
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 5
- 229920000877 Melamine resin Polymers 0.000 description 5
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 5
- 125000002723 alicyclic group Chemical group 0.000 description 5
- 125000003277 amino group Chemical group 0.000 description 5
- OHJMTUPIZMNBFR-UHFFFAOYSA-N biuret Chemical compound NC(=O)NC(N)=O OHJMTUPIZMNBFR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- 239000000839 emulsion Substances 0.000 description 5
- 125000001153 fluoro group Chemical group F* 0.000 description 5
- 125000001072 heteroaryl group Chemical group 0.000 description 5
- 229930195733 hydrocarbon Natural products 0.000 description 5
- 125000001183 hydrocarbyl group Chemical group 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 229920005862 polyol Polymers 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 229920002554 vinyl polymer Polymers 0.000 description 5
- JESXATFQYMPTNL-UHFFFAOYSA-N 2-ethenylphenol Chemical compound OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 4
- SHLSSLVZXJBVHE-UHFFFAOYSA-N 3-sulfanylpropan-1-ol Chemical compound OCCCS SHLSSLVZXJBVHE-UHFFFAOYSA-N 0.000 description 4
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 4
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 239000004202 carbamide Chemical group 0.000 description 4
- 239000012986 chain transfer agent Substances 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 125000005442 diisocyanate group Chemical group 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 125000005842 heteroatom Chemical group 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 150000003077 polyols Chemical class 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 229920006395 saturated elastomer Polymers 0.000 description 4
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 4
- DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 description 4
- KCZQSKKNAGZQSZ-UHFFFAOYSA-N 1,3,5-tris(6-isocyanatohexyl)-1,3,5-triazin-2,4,6-trione Chemical compound O=C=NCCCCCCN1C(=O)N(CCCCCCN=C=O)C(=O)N(CCCCCCN=C=O)C1=O KCZQSKKNAGZQSZ-UHFFFAOYSA-N 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- QPRQEDXDYOZYLA-UHFFFAOYSA-N 2-methylbutan-1-ol Chemical compound CCC(C)CO QPRQEDXDYOZYLA-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 206010073306 Exposure to radiation Diseases 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 150000001408 amides Chemical group 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
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- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
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- 230000000694 effects Effects 0.000 description 3
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- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 3
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- 238000009472 formulation Methods 0.000 description 3
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- 238000001459 lithography Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 3
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- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
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- 238000005476 soldering Methods 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
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- 229910052717 sulfur Inorganic materials 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- 150000003606 tin compounds Chemical class 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
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- ULGGZAVAARQJCS-UHFFFAOYSA-N 11-sulfanylundecan-1-ol Chemical compound OCCCCCCCCCCCS ULGGZAVAARQJCS-UHFFFAOYSA-N 0.000 description 2
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- SYNPRNNJJLRHTI-UHFFFAOYSA-N 2-(hydroxymethyl)butane-1,4-diol Chemical class OCCC(CO)CO SYNPRNNJJLRHTI-UHFFFAOYSA-N 0.000 description 2
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- NEJMTSWXTZREOC-UHFFFAOYSA-N 4-sulfanylbutan-1-ol Chemical compound OCCCCS NEJMTSWXTZREOC-UHFFFAOYSA-N 0.000 description 2
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- RZKSECIXORKHQS-UHFFFAOYSA-N Heptan-3-ol Chemical compound CCCCC(O)CC RZKSECIXORKHQS-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000006957 Michael reaction Methods 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
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- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
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- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/365—Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/2805—Compounds having only one group containing active hydrogen
- C08G18/2815—Monohydroxy compounds
- C08G18/282—Alkanols, cycloalkanols or arylalkanols including terpenealcohols
- C08G18/2825—Alkanols, cycloalkanols or arylalkanols including terpenealcohols having at least 6 carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/2805—Compounds having only one group containing active hydrogen
- C08G18/288—Compounds containing at least one heteroatom other than oxygen or nitrogen
- C08G18/2885—Compounds containing at least one heteroatom other than oxygen or nitrogen containing halogen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
- C08G18/78—Nitrogen
- C08G18/79—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates
- C08G18/791—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates containing isocyanurate groups
- C08G18/792—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates containing isocyanurate groups formed by oligomerisation of aliphatic and/or cycloaliphatic isocyanates or isothiocyanates
-
- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
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Description
a)フォトレジスト成分と、
b)次式のペルフルオロポリエーテルシラン:
(RPFPE−X1−CO−NH)x−R1−(NH−CO−X2−Rシリル)y、 I
(式中、
RPFPEは、ペルフルオロポリエーテル基含有部分を表し、
X1及びX2は、独立して、−O−、−S−、又は−NR2−であり、R2はH又はC1〜C4アルキルであり、
R1は、x+yの価数を有するポリイソシアネートの残基であり、
Rシリルはシラン基含有部分であり、
下付き文字x及びyはそれぞれ独立して1〜6である)と、
c)光開始剤と、を含む、光硬化性組成物を提供する。
RPFPE*−Q−X1H(II)
が挙げられ、式中、
RPFPE*は一価のペルフルオロポリエーテル基であり、
Qは、二価のアルキレン基であり、このアルキレンは場合により1個以上のカテナリー(鎖中)窒素又は酸素原子を含有し、場合により1個以上のスルホンアミド、カルボキシアミド、又はカルボキシ官能基を含有する。好ましくは、Qは、−CH2−、C(O)NR2CH2CH2−、−CF2OCH2CH2−、−CF2OCH2CH2CH2−、−CH2CH2−及び−CH2OCH2CH2−から選択され、
X1Hは、イソシアネート反応性基であり、式中X1は、−O−、−NR2−、又は−S−から選択され、R2は、H又はC1〜C4アルキルである。
(RPFPE*−Q−X1−CO−NH)x−R1−(NCO)y、(III)、
式中、X1は−O−、−NR2−、又は−S−から選択され、R2はH又はC1〜C4アルキルであり、(x+y)はポリイソシアネートのイソシアネート基の数である。このような反応の1つは式IIIに示され、追加のイソシアネート基との反応が想到される。
Rf 1−O−Rf 2−(Rf 3)q−、(IV)
式中、Rf 1は全フッ素化アルキル基を表し、Rf 2はC1〜C4ペルフルオロアルキレンオキシ基又はその混合物を表し、Rf 3はペルフルオロアルキレン基を表し、qは0〜1である。
−[CF2−CF2−O]r−[CF(CF3)−CF2−O]s−が挙げられ、式中、r、s、t及びuはそれぞれ、1〜50、好ましくは2〜25の整数である。式(IV)に対応する好ましいペルフルオロオキシアルキル基は、CF3−CF2−CF2−O−[CF(CF3)−CF2O]s−CF(CF3)CF2−であり、式中、sは2〜25の整数である。
PFPE−C(O)−OR+NaBH4→PFPE−CH2OH又は
PFPE−C(O)−OR+NH2CH2CH2OH→PFPE−C(O)NHCH2CH2OH又は
PFPE−C(O)F+エチレンサルフェート+M+F−→PFPE−CF2−OCH2CH2OH。
PFPE−C(O)F+LiI→PFPE−I→PFPE−CH2CH2I→PFPE−CH2CH2−X1H
PFPE−CO2Ag+I2→PFPE−I
H−X2−Rシリル、V
式中、Rシリルはシラン含有部分であり、X2は−O−、−S−又は−NR2−であり、R2はH又はC1〜C4アルキルである。Rシリルは、1つ以上のシリル基を含有できる。
−R4−Si(Y)p(R3)3−p、 VI
式中、
R4は、二価のアルキレン若しくはアリーレン基又はこれらの組み合わせであり、このアルキレン基は1個以上のカテナリー(鎖中)酸素又は窒素原子を場合により含有し、Yはハロ、アルコキシ及びアセトキシ基を包含する加水分解性基であり、R3は一価のアルキル又はアリール基であり、pは1、2又は3、好ましくは3である。
X−(Mシリル)a−(M2)b−S−R4−X2−H VII
式中、
Xは、H、又は反応開始剤の残基であり、
Mシリルは、側鎖シリル基を有する重合エチレン性不飽和モノマー、好ましくは(メタ)アクリレートモノマーの残基であり、
M2は、(メタ)アクリレートエステルモノマーの残基であり、
R4は、二価のアルキレン若しくはアリーレン基、又はこれらの組み合わせであり、このアルキレン基は、1個以上のカテナリー酸素原子を場合により含有し、
aは、少なくとも2であり、bは0であってもよく、a+bは2〜20である。
A−R6−Si−(Y)p(R3)3−p (VIII)
式中、
Aは、ビニル、アリル、ビニルオキシ、アリルオキシ、及び(メタ)アクリロイルを含むエチレン性不飽和重合性基であり、
R6は、共有結合又は二価炭化水素架橋基である。一実施形態において、R6は、約1〜20個の炭素原子の多価炭化水素架橋基であり、アルキレン及びアリーレン並びにこれらの組み合わせを含み、場合により−O−、−C(O)−、−S−、−SO2−及び−NR4−基(及び−C(O)−O−のようなこれらの組み合わせ)(式中、R4は水素である)、又はC1〜C4アルキル基からなる群から選択される1〜5個の部分を主鎖内に含む。別の実施形態において、R6は、式−(OCH2CH2−)n(OCH2CH(R7))m−のポリ(アルキレンオキシド)部分であり、式中、nは、少なくとも5であり、mは、0、好ましくは少なくとも1であってよく、n:mのモル比は、少なくとも2:1(好ましくは少なくとも3:1)である。好ましくは、R6は、二価のアルキレンである。
Yは、加水分解性基であり、
R3は、一価のアルキル又はアリール基であり、
pは、1、2又は3、好ましくは3である。
式中、
R2は、C1〜C4アルキルのHであり、
R6は、二価のアルキレン基であり、このアルキレン基は1個以上のカテナリー酸素原子を場合により含有し、Yは加水分解性基であり、R3は一価のアルキル又はアリール基であり、pは1、2である。
HS−R4−X2−H(X)、式中:
R4は、多価のアルキレン基若しくはアリーレン基、又はこれらの組み合わせであり、このアルキレン基は1個以上のカテナリー酸素原子を場合により含有し、
X2は、−O−又は−NR2−であり、R2は、H又はC1〜C4アルキルである。
式中、
X2及びX3は、独立して、−O−、−S−、又は−NR2−であり、R2はC1〜C4アルキルのHであり、
R5は、多価のアルキレン若しくはアリーレン基、又はこれらの組み合わせであり、このアルキレン基は1個以上のカテナリー酸素原子を場合により含有し、
R6は、二価のアルキレン基であり、そのアルキレン基は1個以上のカテナリー酸素原子を場合により含有し、
Yは、加水分解性基であり、
R3は、一価のアルキル又はアリール基であり、
pは、1、2、又は3、好ましくは3であり、
oは1〜5である。
組成物の重合又は硬化は、光開始剤の存在下で組成物をエネルギーに曝露することにより達成できる。これらの光開始剤は、100pbwのフォトレジスト成分につき、約0.0001〜約3.0pbw、好ましくは約0.001〜約1.0pbw、より好ましくは約0.005〜約0.5pbwの範囲の濃度で使用することができる。組成物は、完全に硬化されても又は部分的に硬化されてもよい。
又は
X−SiR1R2−(O−SiR1R2)n−X
の1つを有し、式中、
R1、R2、及びR3は、独立して、置換又は非置換のC1〜C6アルキル基又は芳香族基であり、
Xは、−OH、−OR、−OC(O)R、−OSiY1Y2Y3、−CH2CH2−L−SiY1Y2Y3、及びR3CO−から選択される硬化性基であり、式中、RはC1〜C4アルキル基であり、Lは二価の結合基であり、Y1、Y2、及びY3は、独立して、C1〜C6アルキル基及びORから選択され、少なくとも1つのYは、−OH、−OC(O)R及び−ORから選択される硬化性基であり、nは少なくとも2であり、mは少なくとも1であるが、ただし、反応性シリコーン添加剤の重量平均分子量(Mw)が約4200以下であることを条件とする。
剥離力
「SCOTCH 610セロハンテープ」(3M Company(St.Paul,MN))の2.54cm幅のストリップを、2kgのゴムローラーを2回通過させてサンプルコーティングに積層した。「IMAS SP2000」(IMASS Inc.(Accord,MA))を使用して、180°の角度及び2.3m/分の速度で5秒間テープを剥離した。剥離力を測定した。試験は、21℃及び相対湿度50%で実施した。異なる位置で3回測定を行い、平均値を報告した。剥離力Δ(%)を下記のように定義する:
剥離力Δ(%)=(剥離力C−剥離力E)/剥離力C×100%
式中、剥離力Cは、添加剤なしの対照ソルダーインクの剥離力であり、剥離力Eは、添加剤ありのソルダーインクの剥離力である。
「剥離」試験に使用したテープストリップを剥離し、2kgのゴムローラーを2回通過させて清浄なステンレス鋼パネルに積層した。「IMASS SP2000」を使用して、180°の角度及び30cm/分の速度で10秒間テープを剥離した。剥離力を測定した。試験は、21℃及び相対湿度50%で実施した。異なる位置で3回測定を行い、平均値を報告した。
前進、後退、及び静的接触角を、「KRUS DSA100」(Cruss GmbH(Hamburg,Germany))を使用して測定した。試薬等級のヘキサデカン及び脱イオン水を使用して、ビデオ式接触角システムアナライザ(「VCA−2500XE」、AST Products(Billerica,MA))で測定を行った。報告される値は、液滴の右側及び左側で測定された3滴の測定値の平均である。液滴体積は、静的接触角測定については5マイクロリットル、前進及び後退接触角測定については1〜3マイクロリットルであった。
ソルダーマスクは、太陽インキ製造株式会社(日本、東京)が作成した技術データシートに記載の手順に従って処方した。予め計量したインク及び架橋剤(いずれも太陽インキ製造から入手可能)を、ビーカー内で、70:30の重量比で、10〜15分間、混合スパチュラを用いて手作業で混合した。続いて、ペルフルオロポリエーテル添加物を添加し、更に10分間混合した。混合したソルダーマスクを、30番手ワイヤーロッドを用いて、下塗りしたポリエチレンテレフタレート(PET)上にコーティングした。このコーティングを80℃のオーブン内で10分間乾燥した後、窒素下で、HバルブUVを用いて30ft/分(9.1m/分)で2回照射した。これで、半固着ソルダーマスクコーティングは、剥離試験に使用できる状態になった。
異なるシラン官能化HFPO−ポリウレタンを、2種類のソルダーインクに処方し、「コーティング処方及び調製」の記載に従ってPET上にコーティングした。この半固着熱硬化/光硬化コーティングを、「剥離力」試験の項の記載に従って剥離性能を試験し、その結果を表4にまとめた。実施例CE1は、3M Scotch(商標)610セロハンテープを、ソルダーインクに触れさせずにステンレス鋼上に接着した接着対照品であり、CE2及びCE3は、AUS303及びAUS308ソルダーインクを接着剤なしで用いた剥離対照品である。すべての処方は、ショッキネス(shockiness)又は不連続な雑音を発する剥離のない、平滑できわめて連続的な剥離を示した。
コスト削減及びソルダーインクの本来の特性への影響低減のため、添加剤量が剥離性能に与える影響を試験し、添加剤の最小レベルを特定した。0.5%、0.25%及び0.1%の添加剤レベルをソルダーインクに処方し、コーティング及び半硬化して、代表的な剥離結果を表5にまとめた。
フッ素化ポリウレタンがソルダーマスクに与える影響を更に確認するため、表5から選択した処方に関して、接触角を測定し、結果を表6にまとめた。表より、フッ素化ポリウレタンの存在は、フッ素化セグメントの表面への移行を示す撥水性及び撥油性の両方を増大することが明らかである。
*L=左、R−右
1.光硬化性組成物であって、
d)フォトレジスト成分と、
e)次式のペルフルオロポリエーテルシランであって、
(RPFPE−X1−CO−NH)x−R1−(NH−CO−X2−Rシリル)y、
式中、
RPFPEは、ペルフルオロポリエーテル基を表し、
X1及びX2は、独立して、−O−、−S−、又は−NR2−であり、R2はH又はC1〜C4アルキルであり、
R1は、ポリイソシアネートの残基であり、
Rシリルは、シラン基含有部分であり、
下付き文字x及びyはそれぞれ独立して1〜6である、ペルフルオロポリエーテルシランと、
f)光開始剤と、を含む、光硬化性組成物。
2.100重量部のフォトレジスト成分に対して、0.1〜5重量部のペルフルオロポリエーテルシラン化合物を含む、実施形態1に記載の光硬化性組成物。
3.フォトレジスト成分が、ポジ型フォトレジストである、実施形態1又は2のいずれか1つに記載の光硬化性組成物。
4.フォトレジスト成分が、ネガ型フォトレジストである、実施形態1又は2のいずれか1つに記載の光硬化性組成物。
5.フォトレジスト成分が、ソルダーレジストである、実施形態1〜4のいずれか1つに記載の光硬化性組成物。
6.ペルフルオロポリエーテル基RPFPEが、式
Rf 1−O−Rf 2−(Rf 3)q−であり、式中、Rf 1は全フッ素化アルキル基を表し、Rf 2はペルフルオロオキシアルキレン基又はその混合物を表し、Rf 3は全フッ素化アルキレン基を表し、qは0〜1である、実施形態1〜5のいずれか1つに記載の光硬化性組成物。
7.Rf 1が、−F−CnF2n−、F−(CF(Z)−、F−(CF(Z)CnF2n−、F−CnF2nCF(Z)−、F−CF2CF(Z)−、及びこれらの組み合わせからなる群から選択される一価のペルフルオロアルキル基であり、式中nは1〜4であり、Zはペルフルオロアルキル基又はペルフルオロオキシアルキル基である、実施形態6に記載のフルオロケミカルウレタン。
8.前記ペルフルオロオキシアルキレン基Rf 2が、−(CF2−CF2−O)r−;−(CF(CF3)−CF2−O)s−;−(CF2CF2−O)r−(CF2O)t−、−(CF2CF2CF2CF2−O)u及び−(CF2−CF2−O)r−(CF(CF3)−CF2−O)s−の1つ以上から選択され、式中、r、s、t及びuはそれぞれ1〜50の整数である、実施形態6に記載のフルオロケミカルウレタン。
9.Rシリルが、式
−R4−Si(Y)p(R3)3−pであり、式中
R4は二価のアルキレン基であり、このアルキレン基は1個以上のカテナリー酸素原子を場合により含有し、Yは加水分解性基であり、R3は一価のアルキル又はアリール基であり、pは1、2又は3である、実施形態1〜8のいずれか1つに記載の光硬化性組成物。
10.Rシリル基のY基がアルコキシ、アセトキシ又はハライド基である、実施形態1〜9のいずれか1つに記載の光硬化性組成物。
11.Rシリルが、ペンダントシリル基を有する(メタ)アクリレートオリゴマーである、実施形態1〜10のいずれか1つに記載の光硬化性組成物。
12.Rシリルが、式
X−(Mシリル)a−(M2)b−S−R4−
であり、式中、
Xは、H、又は反応開始剤の残基であり、
Mシリルは、ペンダントシリル基を有する(メタ)アクリレートモノマーの残基であり、
M2は、(メタ)アクリレートエステルモノマーの残基であり、
R4は、二価のアルキレン若しくはアリーレン基、又はこれらの組み合わせであり、このアルキレン基は、1個以上のカテナリー酸素原子を場合により含有し、
aは、少なくとも2であり、bは0であってもよく、a+bは2〜20である、実施形態11に記載の光硬化性組成物。
13.Mシリルモノマー単位が次式のモノマーから誘導され、
式中、
R2は、C1〜C4アルキルのHであり、
R6は二価のアルキレン基であり、このアルキレン基は1個以上のカテナリー酸素原子を場合により含有し、Yは加水分解性基であり、R3は一価のアルキル又はアリール基であり、pは1、2又は3である、実施形態12に記載の光硬化性組成物。
14.Rシリル基に対するRPFPE基の当量比が1:1〜1:10である、実施形態1〜13のいずれか1つに記載の光硬化性組成物。
15.R1がアルキレン基、及びアリーレン基又はこれらの組み合わせであり、x+yの価数を有する、実施形態1〜14のいずれか1つに記載の光硬化性組成物。
16.Rシリルが、求核性アクリロイル化合物とアミノシランとの間のマイケル反応から誘導されるシラン含有部分である、実施形態1〜10、14又は15のいずれか1つに記載の光硬化性組成物。
17.Rシリルが、式
であり、式中、
X3は、−O−、−S−又は−NR2−であり、R2はC1〜C4アルキルのHであり、
R5は、多価のアルキレン若しくはアリーレン基、又はこれらの組み合わせであり、このアルキレン基は1個以上のカテナリー酸素原子を場合により含有し、
R6は、二価のアルキレン基であり、そのアルキレン基は1個以上のカテナリー酸素原子を場合により含有し、
Yは、加水分解性基であり、
R3は、一価のアルキル又はアリール基であり、
pは、1、2、又は3、好ましくは3であり、
oは、1〜5である、実施形態1〜10、14又は15のいずれか1つに記載の光硬化性組成物。
18.100重量部のフォトレジスト成分を基準にして5〜40重量部の熱硬化性樹脂を更に含む、実施形態1〜17のいずれか1つに記載の光硬化性組成物。
19.
a)金属性ベース基材と、
b)フォトツールと、
c)その間に配置された実施形態1〜18のいずれか1つに記載の光硬化性層と、を含む、多層物品。
20.
a)プリント回路基板基材と、
b)フォトツールと、
c)その間に配置された実施形態1〜18のいずれか1つに記載の光硬化性層と、を含む、多層物品。
21.前記光硬化性層が、熱及び/又は光への曝露によって部分的に硬化されている、実施形態19又は20のいずれか1つに記載の多層物品。
22.前記フォトツールの表面上に配置されたハードコートを更に含む、実施形態19〜21のいずれか1つに記載の多層物品。
23.3M 610テープに対して100g/インチ(約39g/cm)未満の剥離値を有する、実施形態21に記載の部分硬化組成物。
24.少なくとも90°の静的水接触角及び少なくとも50°の静的ヘキサデカン接触角を有する、実施形態19〜23のいずれか1つに記載の半硬化組成物。
25.
a)プリント回路基板基材と、
b)前記基材の表面上の、実施形態1〜18のいずれか1つに記載の硬化組成物の層と、を含む、多層物品。
Claims (14)
- a)ソルダーレジスト成分と、
b)次式のペルフルオロポリエーテルシランであって
(RPFPE−X1−CO−NH)x−R1−(NH−CO−X2−Rシリル)y、
式中、
RPFPEは、式RPFPE*−Qの基を表し、
RPFPE*は一価のペルフルオロポリエーテル基であり、
Qは、二価のアルキレン基であり、
前記アルキレンは1個以上のカテナリー(鎖中)窒素又は酸素原子を含有していてもよく、1個以上のスルホンアミド、カルボキシアミド、又はカルボキシ官能基を含有していてもよく、
X1及びX2は、独立して、−O−、−S−、又は−NR2−であり、R2はH又はC1〜C4アルキルであり、
R1は、x+yの価数を有するポリイソシアネートの残基であり、
Rシリルは、1つ以上のシリル基を含有するシラン基含有部分であり、
下付き文字x及びyはそれぞれ独立して1〜6である、ペルフルオロポリエーテルシランと、
c)フリーラジカル光開始剤と、を含む、光硬化性ソルダーレジスト組成物。 - 100重量部の前記ソルダーレジスト成分に対して、0.1〜5重量部の前記ペルフルオロポリエーテルシラン化合物を含む、請求項1に記載の光硬化性ソルダーレジスト組成物。
- 前記ペルフルオロポリエーテル基RPFPE*が、式
Rf 1−O−Rf 2−(Rf 3)q−であり、式中、Rf 1はペルフルオロアルキル基
を表し、Rf 2はC1〜C4ペルフルオロアルキレンオキシ基又はこれらの混合物を表し、Rf 3は全フッ素化アルキレン基を表し、qは0〜1である、請求項1に記載の光硬化性ソルダーレジスト組成物。 - Rf 1が、F−CnF2n−、F−CF(Z)−、F−CF(Z)CnF2n−、F−CnF2nCF(Z)−、F−CF2CF(Z)−、及びこれらの組み合わせからなる群から選択される1つ以上の全フッ素化された繰返し単位を含む一価のペルフルオロアルキル基であり、式中、nは1〜4であり、Zはペルフルオロアルキル基又はペルフルオロアルコキシ基である、請求項3に記載の光硬化性ソルダーレジスト組成物。
- 前記Rf 2が、−(CF2−CF2−O)r−;−(CF(CF3)−CF2−O)s−;−(CF2CF2−O)r−(CF2O)t−、−(CF2CF2CF2CF2−O)u及び−(CF2−CF2−O)r−(CF(CF3)−CF2−O)s−のうちの1つ以上から選択され、式中、r、s、t及びuはそれぞれ1〜50の整数である、請求項3に記載の光硬化性ソルダーレジスト組成物。
- Rシリルが式
−R4−Si(Y)p(R3)3−pであり、式中
R4は二価のアルキレン基であり、該アルキレン基は1個以上のカテナリー酸素原子を含有していてもよく、Yは加水分解性基であり、R3は一価のアルキル又はアリール基であり、pは1、2又は3である、請求項1に記載の光硬化性ソルダーレジスト組成物。 - Rシリルが式
X−(Mシリル)a−(M2)b−S−R4−
であり、式中、
Xは、H、又は反応開始剤の残基であり、
Mシリルは、ペンダントシリル基を有する(メタ)アクリレートモノマーの残基であり、
M2は、(メタ)アクリレートエステルモノマーの残基であり、
R4は、二価のアルキレン若しくはアリーレン基、又はこれらの組み合わせであり、該アルキレン基は、1個以上のカテナリー酸素原子を含有していてもよく、
aは、少なくとも2であり、bは0であってもよく、a+bは2〜20である、請求項1に記載の光硬化性ソルダーレジスト組成物。 - 前記Mシリルモノマー単位が次式のモノマーから誘導され、
X3は、−O−、−S−又は−NR2−であり、R2はH又はC1〜C4アルキルであり、
R2は、H又はC1〜C4アルキルであり、
R6は二価のアルキレン基であり、該アルキレン基は1個以上のカテナリー酸素原子を含有していてもよく、Yは加水分解性基であり、R3は一価のアルキル又はアリール基であり、pは1、2又は3である、請求項7に記載の光硬化性ソルダーレジスト組成物。 - Rシリル基に対するRPFPE基の当量比が1:1〜1:10である、請求項1に記載の光硬化性ソルダーレジスト組成物。
- Rシリルが式
X3は、−O−、−S−又は−NR2−であり、R2はH又はC1〜C4アルキルであり、
R5は、多価のアルキレン若しくはアリーレン基、又はこれらの組み合わせであり、該アルキレン基は1個以上のカテナリー酸素原子を含有していてもよく、
R6は、二価のアルキレン基であり、該アルキレン基は1個以上のカテナリー酸素原子を含有していてもよく、
Yは、加水分解性基であり、
R3は、一価のアルキル又はアリール基であり、
pは、1、2、又は3であり、
oは1〜5である、請求項1に記載の光硬化性ソルダーレジスト組成物。 - 100重量部の前記ソルダーレジスト成分を基準にして、5〜40重量部の量で熱硬化性樹脂を更に含む、請求項1に記載の光硬化性ソルダーレジスト組成物。
- a)金属性ベース基材又はプリント回路基板基材と、
b)フォトツールと、
c)その間に配置された請求項1に記載の光硬化性ソルダーレジスト組成物の層と、を含む、多層物品。 - 前記フォトツールの表面上に配置されたハードコートを更に含む、請求項12に記載の多層物品。
- 次式のペルフルオロポリエーテルシラン
(RPFPE−X1−CO−NH)x−R1−(NH−CO−X2−Rシリル)y、
[式中、
RPFPEは、式RPFPE*−Qの基を表し、
RPFPE*は一価のペルフルオロポリエーテル基であり、
Qは、二価のアルキレン基であり、
前記アルキレンは1個以上のカテナリー(鎖中)窒素又は酸素原子を含有していてもよく、1個以上のスルホンアミド、カルボキシアミド、又はカルボキシ官能基を含有していてもよく、
X1及びX2は、独立して、−O−、−S−、又は−NR2−であり、R2はH又はC1〜C4アルキルであり、
R1は、x+yの価数を有するポリイソシアネートの残基であり、
Rシリルは、1つ以上のシリル基を含有するシラン基含有部分であり、
下付き文字x及びyはそれぞれ独立して1〜6である]
を含む、ソルダーインク用添加剤。
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Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6477815B2 (ja) * | 2016-09-23 | 2019-03-06 | ダイキン工業株式会社 | 撥水性を有する基材 |
EP3663087A4 (en) * | 2017-08-04 | 2021-04-21 | Daikin Industries, Ltd. | SUBSTRATE INTENDED FOR PATTERN FORMATION |
US11339303B2 (en) * | 2018-09-10 | 2022-05-24 | Sun Chemical Corporation | Energy curable compositions comprising reaction products of poly(alkylene oxide)-containing glycidyl ethers and acrylic acid |
WO2021229338A1 (en) * | 2020-05-14 | 2021-11-18 | 3M Innovative Properties Company | Fluorinated coupling agents and fluorinated (co)polymer layers made using the same |
US20220019145A1 (en) * | 2020-07-16 | 2022-01-20 | Miraclon Corporation | Flexographic printing plate precursor, imaging assembly and use |
WO2023190723A1 (ja) * | 2022-03-31 | 2023-10-05 | ダイキン工業株式会社 | 硬化性組成物 |
JP2023152920A (ja) * | 2022-03-31 | 2023-10-17 | ダイキン工業株式会社 | 硬化性組成物 |
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Family Cites Families (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3046121A (en) | 1949-07-23 | 1962-07-24 | Azoplate Corp | Process for the manufacture of printing plates and light-sensitive material suttablefor use therein |
DE907739C (de) | 1949-07-23 | 1954-02-18 | Kalle & Co Ag | Verfahren zur Herstellung von Kopien, besonders Druckformen, mit Hilfe von Diazoverbindungen und dafuer verwendbares lichtempfindliches Material |
US3046119A (en) | 1950-08-01 | 1962-07-24 | Azoplate Corp | Light sensitive material for printing and process for making printing plates |
US3046112A (en) | 1951-06-30 | 1962-07-24 | Azoplate Corp | Quinone diazide printing plates |
US2716103A (en) | 1951-09-13 | 1955-08-23 | Eastman Kodak Co | Preparation of polymer of vinyl benzal acetophenone |
DE938233C (de) | 1953-03-11 | 1956-01-26 | Kalle & Co Ag | Lichtempfindliches Material fuer die photomechanische Herstellung von Druckformen |
US2940853A (en) | 1958-08-21 | 1960-06-14 | Eastman Kodak Co | Azide sensitized resin photographic resist |
US3149975A (en) | 1962-07-06 | 1964-09-22 | Du Pont | Photopolymerizable compositions and elements |
DE2024909B2 (de) | 1970-05-22 | 1977-09-29 | Bayer Ag, 5090 Leverkusen | Verfahren zur herstellung von n-hydroxyalkyl-perfluoralkansulfonamiden und einige n,n-bis-(hydroxyalkyl)-perfluor-alkansulfonamide |
GB1375461A (ja) | 1972-05-05 | 1974-11-27 | ||
JPS5934293B2 (ja) | 1977-04-20 | 1984-08-21 | 王子製紙株式会社 | 感光性組成物 |
US4180404A (en) | 1977-11-17 | 1979-12-25 | Asahi Kasei Kogyo Kabushiki Kaisha | Heat resistant photoresist composition and process for preparing the same |
DE3107109A1 (de) | 1981-02-26 | 1982-09-09 | Hoechst Ag, 6000 Frankfurt | Lichtempfindliches gemisch und daraus hergestelltes kopiermaterial |
US4377631A (en) | 1981-06-22 | 1983-03-22 | Philip A. Hunt Chemical Corporation | Positive novolak photoresist compositions |
US4378250A (en) | 1981-07-31 | 1983-03-29 | Treadway Gerald D | Organosilicone coating compositions |
US4596763A (en) | 1984-10-01 | 1986-06-24 | American Hoechst Corporation | Positive photoresist processing with mid U-V range exposure |
US4588670A (en) | 1985-02-28 | 1986-05-13 | American Hoechst Corporation | Light-sensitive trisester of O-quinone diazide containing composition for the preparation of a positive-acting photoresist |
JPS61243869A (ja) | 1985-04-19 | 1986-10-30 | Taiyo Ink Seizo Kk | レジストインキ組成物 |
EP0207188B1 (en) | 1985-06-29 | 1996-06-19 | Dainippon Ink And Chemicals, Inc. | Resin composition for solder resist ink |
US4788339A (en) * | 1985-09-06 | 1988-11-29 | Minnesota Mining And Manufacturing Company | Perfluoroaminoethers |
CA1307695C (en) | 1986-01-13 | 1992-09-22 | Wayne Edmund Feely | Photosensitive compounds and thermally stable and aqueous developablenegative images |
US5034304A (en) | 1986-01-13 | 1991-07-23 | Rohm And Haas Company | Photosensitive compounds and thermally stable and aqueous developable negative images |
JPS63286841A (ja) | 1987-05-19 | 1988-11-24 | Hitachi Chem Co Ltd | 感光性樹脂組成物溶液 |
JPH0268A (ja) | 1987-11-13 | 1990-01-05 | Toshiba Corp | ソルダ−レジスト組成物 |
US5061744A (en) | 1989-07-05 | 1991-10-29 | Somar Corporation | Resist ink composition |
AU661438B1 (en) * | 1994-01-25 | 1995-07-20 | Morton International, Inc. | Waterborne photoresists having polysiloxanes |
JPH08234432A (ja) | 1994-11-11 | 1996-09-13 | Taiyo Ink Mfg Ltd | ソルダーレジストインキ組成物 |
JP3190251B2 (ja) | 1995-06-06 | 2001-07-23 | 太陽インキ製造株式会社 | アルカリ現像型のフレキシブルプリント配線板用光硬化性・熱硬化性樹脂組成物 |
JP3276833B2 (ja) | 1995-12-13 | 2002-04-22 | 太陽インキ製造株式会社 | 光硬化性・熱硬化性艶消しレジストインキ組成物 |
WO2001030873A1 (en) | 1999-10-27 | 2001-05-03 | 3M Innovative Properties Company | Fluorochemical sulfonamide surfactants |
JP3888573B2 (ja) | 2001-06-29 | 2007-03-07 | 富士電機ホールディングス株式会社 | ハンダ組成物 |
JP4017068B2 (ja) * | 2002-06-28 | 2007-12-05 | 日本化薬株式会社 | ソルダーレジストインキ組成物及びその硬化物 |
KR100522002B1 (ko) * | 2003-09-22 | 2005-10-18 | 주식회사 코오롱 | 액상 포토 솔더 레지스트 조성물 및 이로부터 제조된 포토솔더 레지스트 필름 |
US20060216524A1 (en) | 2005-03-23 | 2006-09-28 | 3M Innovative Properties Company | Perfluoropolyether urethane additives having (meth)acryl groups and hard coats |
US20090163615A1 (en) | 2005-08-31 | 2009-06-25 | Izhar Halahmi | Uv curable hybridcuring ink jet ink composition and solder mask using the same |
JP2008105999A (ja) | 2006-10-25 | 2008-05-08 | Idemitsu Kosan Co Ltd | アダマンタン誘導体、その製造方法、樹脂組成物およびその硬化物 |
JP5415960B2 (ja) * | 2006-12-20 | 2014-02-12 | スリーエム イノベイティブ プロパティズ カンパニー | ペンダントシリル基を有するフルオロケミカルウレタン化合物 |
EP2164474A2 (en) | 2007-05-08 | 2010-03-24 | Dow Global Technologies Inc. | Water dispersible polymer compositions |
US7897678B2 (en) | 2007-07-26 | 2011-03-01 | 3M Innovative Properties Company | Fluorochemical urethane compounds having pendent silyl groups |
US8015970B2 (en) | 2007-07-26 | 2011-09-13 | 3M Innovative Properties Company | Respirator, welding helmet, or face shield that has low surface energy hard-coat lens |
JP5285257B2 (ja) * | 2007-09-21 | 2013-09-11 | 太陽ホールディングス株式会社 | 光硬化性・熱硬化性樹脂組成物及びその硬化物 |
EP2269116A4 (en) | 2008-03-11 | 2011-09-07 | 3M Innovative Properties Co | PHOTOGRAPHIC MASKS HAVING PROTECTIVE LAYER |
KR101635240B1 (ko) | 2008-12-18 | 2016-06-30 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 코팅 조성물 |
US9096712B2 (en) | 2009-07-21 | 2015-08-04 | 3M Innovative Properties Company | Curable compositions, method of coating a phototool, and coated phototool |
US9051423B2 (en) * | 2009-09-16 | 2015-06-09 | 3M Innovative Properties Company | Fluorinated coating and phototools made therewith |
EP2478033A1 (en) * | 2009-09-16 | 2012-07-25 | 3M Innovative Properties Company | Fluorinated coating and phototools made therewith |
JP5739609B2 (ja) * | 2009-09-16 | 2015-06-24 | 互応化学工業株式会社 | 感光性樹脂組成物、ソルダーレジスト用組成物及びプリント配線板 |
US8420281B2 (en) | 2009-09-16 | 2013-04-16 | 3M Innovative Properties Company | Epoxy-functionalized perfluoropolyether polyurethanes |
WO2013059286A1 (en) | 2011-10-19 | 2013-04-25 | 3M Innovative Properties Company | Hardcoat compositions |
US8703385B2 (en) | 2012-02-10 | 2014-04-22 | 3M Innovative Properties Company | Photoresist composition |
US8715904B2 (en) | 2012-04-27 | 2014-05-06 | 3M Innovative Properties Company | Photocurable composition |
US8883402B2 (en) * | 2012-08-09 | 2014-11-11 | 3M Innovative Properties Company | Photocurable compositions |
-
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- 2013-08-06 JP JP2015526614A patent/JP6469006B2/ja not_active Expired - Fee Related
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- 2013-08-06 CN CN201380041871.1A patent/CN104737075A/zh active Pending
- 2013-08-06 WO PCT/US2013/053687 patent/WO2014025716A1/en active Application Filing
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