JP6457235B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP6457235B2 JP6457235B2 JP2014214965A JP2014214965A JP6457235B2 JP 6457235 B2 JP6457235 B2 JP 6457235B2 JP 2014214965 A JP2014214965 A JP 2014214965A JP 2014214965 A JP2014214965 A JP 2014214965A JP 6457235 B2 JP6457235 B2 JP 6457235B2
- Authority
- JP
- Japan
- Prior art keywords
- oxide semiconductor
- transistor
- semiconductor layer
- region
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
- H10D30/6756—Amorphous oxide semiconductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6736—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes characterised by the shape of gate insulators
Landscapes
- Thin Film Transistor (AREA)
- Electroluminescent Light Sources (AREA)
- Semiconductor Memories (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014214965A JP6457235B2 (ja) | 2013-10-22 | 2014-10-22 | 半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013219046 | 2013-10-22 | ||
| JP2013219046 | 2013-10-22 | ||
| JP2014214965A JP6457235B2 (ja) | 2013-10-22 | 2014-10-22 | 半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018237625A Division JP2019062230A (ja) | 2013-10-22 | 2018-12-19 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015109432A JP2015109432A (ja) | 2015-06-11 |
| JP2015109432A5 JP2015109432A5 (enExample) | 2017-11-30 |
| JP6457235B2 true JP6457235B2 (ja) | 2019-01-23 |
Family
ID=52825439
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014214965A Active JP6457235B2 (ja) | 2013-10-22 | 2014-10-22 | 半導体装置 |
| JP2018237625A Withdrawn JP2019062230A (ja) | 2013-10-22 | 2018-12-19 | 半導体装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018237625A Withdrawn JP2019062230A (ja) | 2013-10-22 | 2018-12-19 | 半導体装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US9812586B2 (enExample) |
| JP (2) | JP6457235B2 (enExample) |
| KR (1) | KR102274986B1 (enExample) |
| DE (1) | DE102014220672A1 (enExample) |
| TW (2) | TWI670859B (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10304859B2 (en) * | 2013-04-12 | 2019-05-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having an oxide film on an oxide semiconductor film |
| TWI642186B (zh) | 2013-12-18 | 2018-11-21 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| WO2017006207A1 (en) * | 2015-07-08 | 2017-01-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US9825177B2 (en) | 2015-07-30 | 2017-11-21 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of a semiconductor device using multiple etching mask |
| US20170104033A1 (en) * | 2015-10-13 | 2017-04-13 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Array substrate and manufacturing method for the same |
| CN105355589B (zh) * | 2015-10-13 | 2018-07-17 | 深圳市华星光电技术有限公司 | 阵列基板及其制造方法 |
| TW201804613A (zh) * | 2016-07-26 | 2018-02-01 | 聯華電子股份有限公司 | 氧化物半導體裝置 |
| CN107037643A (zh) * | 2017-06-01 | 2017-08-11 | 厦门天马微电子有限公司 | 液晶显示面板及显示装置 |
| WO2018236359A1 (en) * | 2017-06-20 | 2018-12-27 | Intel Corporation | Thin film core-shell fin and nanowire transistors |
| WO2025046388A1 (ja) * | 2023-08-25 | 2025-03-06 | 株式会社半導体エネルギー研究所 | 半導体装置、及び半導体装置の作製方法 |
| WO2025068833A1 (ja) * | 2023-09-29 | 2025-04-03 | 株式会社半導体エネルギー研究所 | 半導体装置、及び半導体装置の作製方法 |
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| JP2019062230A (ja) | 2019-04-18 |
| KR102274986B1 (ko) | 2021-07-07 |
| US10418492B2 (en) | 2019-09-17 |
| US20150108552A1 (en) | 2015-04-23 |
| KR20150046737A (ko) | 2015-04-30 |
| US20180069133A1 (en) | 2018-03-08 |
| US9812586B2 (en) | 2017-11-07 |
| TW201834255A (zh) | 2018-09-16 |
| JP2015109432A (ja) | 2015-06-11 |
| TWI670859B (zh) | 2019-09-01 |
| TWI635616B (zh) | 2018-09-11 |
| TW201517277A (zh) | 2015-05-01 |
| DE102014220672A1 (de) | 2015-05-07 |
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