JP6385234B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP6385234B2
JP6385234B2 JP2014211424A JP2014211424A JP6385234B2 JP 6385234 B2 JP6385234 B2 JP 6385234B2 JP 2014211424 A JP2014211424 A JP 2014211424A JP 2014211424 A JP2014211424 A JP 2014211424A JP 6385234 B2 JP6385234 B2 JP 6385234B2
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JP
Japan
Prior art keywords
lead terminal
semiconductor element
semiconductor device
sealing resin
bonded
Prior art date
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Active
Application number
JP2014211424A
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English (en)
Japanese (ja)
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JP2016082048A5 (https=
JP2016082048A (ja
Inventor
祐介 石山
祐介 石山
井本　裕児
裕児 井本
藤野　純司
純司 藤野
晋助 浅田
晋助 浅田
三紀夫 石原
三紀夫 石原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2014211424A priority Critical patent/JP6385234B2/ja
Priority to US14/790,682 priority patent/US9917064B2/en
Priority to DE102015215786.5A priority patent/DE102015215786A1/de
Priority to CN201611055874.2A priority patent/CN106952877B/zh
Priority to CN201510673980.6A priority patent/CN105529319B/zh
Priority to CN201910281594.0A priority patent/CN110071072B/zh
Publication of JP2016082048A publication Critical patent/JP2016082048A/ja
Publication of JP2016082048A5 publication Critical patent/JP2016082048A5/ja
Application granted granted Critical
Publication of JP6385234B2 publication Critical patent/JP6385234B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/465—Bumps or wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/141—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being on at least the sidewalls of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/466—Tape carriers or flat leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07637—Techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/652—Materials of strap connectors comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/655—Materials of strap connectors of outermost layers of multilayered strap connectors, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/871—Bond wires and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
JP2014211424A 2014-10-16 2014-10-16 半導体装置 Active JP6385234B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2014211424A JP6385234B2 (ja) 2014-10-16 2014-10-16 半導体装置
US14/790,682 US9917064B2 (en) 2014-10-16 2015-07-02 Semiconductor device with a plate-shaped lead terminal
DE102015215786.5A DE102015215786A1 (de) 2014-10-16 2015-08-19 Halbleitervorrichtung
CN201510673980.6A CN105529319B (zh) 2014-10-16 2015-10-16 半导体装置
CN201611055874.2A CN106952877B (zh) 2014-10-16 2015-10-16 半导体装置
CN201910281594.0A CN110071072B (zh) 2014-10-16 2015-10-16 半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014211424A JP6385234B2 (ja) 2014-10-16 2014-10-16 半導体装置

Publications (3)

Publication Number Publication Date
JP2016082048A JP2016082048A (ja) 2016-05-16
JP2016082048A5 JP2016082048A5 (https=) 2016-12-22
JP6385234B2 true JP6385234B2 (ja) 2018-09-05

Family

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Family Applications (1)

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JP2014211424A Active JP6385234B2 (ja) 2014-10-16 2014-10-16 半導体装置

Country Status (4)

Country Link
US (1) US9917064B2 (https=)
JP (1) JP6385234B2 (https=)
CN (3) CN106952877B (https=)
DE (1) DE102015215786A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10204847B2 (en) * 2016-10-06 2019-02-12 Infineon Technologies Americas Corp. Multi-phase common contact package
CN109952639B (zh) 2016-11-11 2023-06-27 三菱电机株式会社 半导体装置、逆变器单元及汽车
JP6776840B2 (ja) * 2016-11-21 2020-10-28 オムロン株式会社 電子装置およびその製造方法
DE112017007029T5 (de) * 2017-02-09 2019-10-31 Mitsubishi Electric Corporation Halbleitervorrichtung und Leistungsumwandlungsvorrichtung
JP6474939B2 (ja) * 2017-02-20 2019-02-27 新電元工業株式会社 電子装置及び接続子
DE112017008277B4 (de) 2017-12-13 2025-03-13 Mitsubishi Electric Corporation Halbleitervorrichtung und leistungsumwandlungsvorrichtung
WO2019215806A1 (ja) * 2018-05-08 2019-11-14 三菱電機株式会社 配線部材及びこれを備えた半導体モジュール
CN112567504B (zh) 2018-11-30 2024-08-20 株式会社博迈立铖 电连接用部件、电连接结构和电连接用结构的制造方法
US11387210B2 (en) * 2019-03-15 2022-07-12 Fuji Electric Co., Ltd. Semiconductor module and manufacturing method therefor
US12131971B2 (en) * 2019-07-30 2024-10-29 Sansha Electric Manufacturing Co., Ltd. Semiconductor module
EP4174927A4 (en) * 2020-06-29 2024-07-31 Kyocera Corporation WIRING SUBSTRATE AND ELECTRONIC DEVICE
JP7301805B2 (ja) * 2020-09-24 2023-07-03 株式会社東芝 半導体モジュール
DE112022007088T5 (de) * 2022-04-20 2025-04-10 Mitsubishi Electric Corporation Halbleitervorrichtung und Produktionsverfahren für eine Halbleitervorrichtung
WO2025253910A1 (ja) * 2024-06-03 2025-12-11 三菱電機株式会社 パワーモジュールおよび電力変換装置

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01276655A (ja) 1988-04-27 1989-11-07 Japan Radio Co Ltd トランスファーモールド型集積回路
JPH065742A (ja) 1992-06-22 1994-01-14 Mitsubishi Electric Corp 半導体装置、その封止に用いられる樹脂および半導体装置の製造方法
JPH06120406A (ja) 1992-10-02 1994-04-28 Mitsubishi Electric Corp 半導体装置
JP3866880B2 (ja) 1999-06-28 2007-01-10 株式会社日立製作所 樹脂封止型電子装置
JP2005012085A (ja) * 2003-06-20 2005-01-13 Toyota Motor Corp 半導体モジュールの電極構造
JP4628687B2 (ja) * 2004-03-09 2011-02-09 ルネサスエレクトロニクス株式会社 半導体装置
JP4468115B2 (ja) * 2004-08-30 2010-05-26 株式会社ルネサステクノロジ 半導体装置
CN100442483C (zh) 2004-09-16 2008-12-10 夏普株式会社 半导体光器件、其制造方法、引线框以及电子设备
DE102005043928B4 (de) * 2004-09-16 2011-08-18 Sharp Kk Optisches Halbleiterbauteil und Verfahren zu dessen Herstellung
JP4348267B2 (ja) 2004-09-22 2009-10-21 シャープ株式会社 光半導体装置、光通信装置および電子機器
TWI280673B (en) * 2004-09-22 2007-05-01 Sharp Kk Optical semiconductor device, optical communication device, and electronic equipment
JP4492448B2 (ja) 2005-06-15 2010-06-30 株式会社日立製作所 半導体パワーモジュール
JP4455488B2 (ja) * 2005-12-19 2010-04-21 三菱電機株式会社 半導体装置
JP4349364B2 (ja) * 2005-12-26 2009-10-21 三菱電機株式会社 半導体装置
JP2008016529A (ja) * 2006-07-04 2008-01-24 Renesas Technology Corp 半導体装置
JP2008218688A (ja) * 2007-03-05 2008-09-18 Denso Corp 半導体装置
JP5384913B2 (ja) * 2008-11-18 2014-01-08 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP5218009B2 (ja) * 2008-12-16 2013-06-26 富士電機株式会社 半導体装置
JP5251991B2 (ja) * 2011-01-14 2013-07-31 トヨタ自動車株式会社 半導体モジュール
JP5665572B2 (ja) 2011-01-28 2015-02-04 三菱電機株式会社 半導体装置および半導体装置の製造方法
WO2013046400A1 (ja) * 2011-09-29 2013-04-04 トヨタ自動車株式会社 半導体装置
JP2013197573A (ja) 2012-03-23 2013-09-30 Mitsubishi Electric Corp 半導体装置
CN103545268B (zh) * 2012-07-09 2016-04-13 万国半导体股份有限公司 底部源极的功率器件及制备方法
JP6230238B2 (ja) * 2013-02-06 2017-11-15 三菱電機株式会社 半導体装置及びその製造方法

Also Published As

Publication number Publication date
US20160111379A1 (en) 2016-04-21
CN105529319A (zh) 2016-04-27
CN106952877B (zh) 2021-01-01
CN105529319B (zh) 2019-04-26
DE102015215786A1 (de) 2016-04-21
CN110071072A (zh) 2019-07-30
CN110071072B (zh) 2023-12-01
US9917064B2 (en) 2018-03-13
CN106952877A (zh) 2017-07-14
JP2016082048A (ja) 2016-05-16

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