JP2016082048A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2016082048A JP2016082048A JP2014211424A JP2014211424A JP2016082048A JP 2016082048 A JP2016082048 A JP 2016082048A JP 2014211424 A JP2014211424 A JP 2014211424A JP 2014211424 A JP2014211424 A JP 2014211424A JP 2016082048 A JP2016082048 A JP 2016082048A
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- lead terminal
- semiconductor device
- semiconductor element
- semiconductor
- sealing resin
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Abstract
【解決手段】半導体装置は、下面が絶縁基板4a側に接合される半導体素子1と、半導体素子1の上面に接合され、水平方向に延在する部分を有する板状のリード端子3aとを備え、リード端子3aの水平方向に延在する部分は、半導体素子1に接合されかつ平面視で直線的に延在する部分を含み、半導体素子1をリード端子3aの直線的に延在する部分とともに封止する封止樹脂5をさらに備え、封止樹脂5の線膨張係数は、リード端子3aの線膨張係数と半導体素子1の線膨張係数との中間値であり、リード端子3aは、直線的に延在する部分を水平方向に部分的に分断する凹部7bまたは凸部7aを備えている。
【選択図】図1
Description
最初に、前提技術に係る半導体装置について説明する。図21は、前提技術に係る半導体装置の概略平面図であり、図22は、図21のA-A断面図である。図21と図22に示すように、半導体装置は、半導体素子1と、リード端子3,3aと、封止樹脂5とを備えている。半導体装置はさらに、絶縁基板4aと、ケース4bとを備えている。半導体素子1の下面は、絶縁基板4aの上面に設けられた配線パターン上にはんだなどのロウ材2で接合されている。リード端子3,3aは、Cu材を用いて板状に形成され、水平方向に延在する部分を有する形状に形成されている。リード端子3,3aは、半導体素子1の上面にロウ材2で接続されている。
本発明の実施の形態1について、図面を用いて以下に説明する。図1は、実施の形態1に係る半導体装置の概略平面図である。なお、実施の形態1において、前提技術で説明したものと同一の構成要素については同一符号を付して説明は省略する。
次に、実施の形態2に係る半導体装置について説明する。図5は、実施の形態2に係る半導体装置の部分平面図である。なお、実施の形態2において、実施の形態1で説明したものと同一の構成要素については同一符号を付して説明は省略する。
次に、実施の形態3に係る半導体装置について説明する。図6は、実施の形態3に係る半導体装置のリード端子3aのベンド部10の部分斜視図である。なお、実施の形態3において、実施の形態1,2で説明したものと同一の構成要素については同一符号を付して説明は省略する。
次に、実施の形態4に係る半導体装置について説明する。図7は、実施の形態4に係る半導体装置のリード端子3aの部分斜視図である。なお、実施の形態4において、実施の形態1から3で説明したものと同一の構成要素については同一符号を付して説明は省略する。
次に、実施の形態5に係る半導体装置について説明する。図10は、実施の形態5に係る半導体装置の部分平面図であり、図11は、実施の形態5に係る半導体装置の部分断面図である。なお、実施の形態5において、実施の形態1から4で説明したものと同一の構成要素については同一符号を付して説明は省略する。
次に、実施の形態6に係る半導体装置について説明する。図12は、実施の形態6に係る半導体装置の部分平面図であり、図13は、実施の形態6に係る半導体装置のリード端子3aの構造を示す部分斜視図である。なお、実施の形態6において、実施の形態1から5で説明したものと同一の構成要素については同一符号を付して説明は省略する。
次に、実施の形態7に係る半導体装置について説明する。図18は、実施の形態7に係る半導体装置の部分斜視図であり、図19は、実施の形態7に係る半導体装置の部分断面図である。なお、実施の形態7において、実施の形態1から6で説明したものと同一の構成要素については同一符号を付して説明は省略する。
次に、実施の形態8に係る半導体装置について説明する。図20は、実施の形態8に係る半導体装置の部分断面図である。なお、実施の形態8において、実施の形態1から7で説明したものと同一の構成要素については同一符号を付して説明は省略する。
Claims (11)
- 下面が基板側に接合される半導体素子と、
前記半導体素子の上面に接合され、水平方向に延在する部分を有する板状のリード端子とを備え、
前記リード端子の前記水平方向に延在する部分は、前記半導体素子に接合されかつ平面視で直線的に延在する部分を含み、
前記半導体素子を前記リード端子の前記直線的に延在する部分とともに封止する封止樹脂をさらに備え、
前記封止樹脂の線膨張係数は、前記リード端子の線膨張係数と前記半導体素子の線膨張係数との中間値であり、
前記リード端子は、前記直線的に延在する部分を水平方向に部分的に分断する凹部または凸部を備える、半導体装置。 - 前記凹部または前記凸部は、前記リード端子の厚さ以上の幅および奥行きで構成される、請求項1記載の半導体装置。
- 前記リード端子は、前記リード端子のうち前記凹部または前記凸部に連続する部分に、前記リード端子の厚さ以上の幅で構成されるスリットをさらに備える、請求項1または請求項2記載の半導体装置。
- 前記リード端子は、前記凹部または前記凸部に対応する部分に、上向きに曲げられたベンド部をさらに備える、請求項1から3のいずれか1つに記載の半導体装置。
- 前記リード端子の長手方向の端部は段付き形状に形成される、請求項1から4のいずれか1つに記載の半導体装置。
- 前記リード端子は、前記半導体素子の前記上面のうち信号配線が接続される部分を除く全上面を覆うように形成される、請求項1から5のいずれか1つに記載の半導体装置。
- 前記リード端子は、前記半導体素子の前記上面のうち信号配線が接続される部分に隣接する前記上面の側へ段付き状に凹んで設けられる凹み部をさらに備える、請求項6記載の半導体装置。
- 前記リード端子のうち前記半導体素子に接続される部分の側面に濡れ性を向上させる表面処理が施される、請求項1から7のいずれか1つに記載の半導体装置。
- 前記リード端子のうち前記半導体素子に接続される部分の側面を覆う端子カバーをさらに備える、請求項1から7のいずれか1つに記載の半導体装置。
- 前記半導体素子はワイドバンドギャップ半導体素子である、請求項1から9のいずれか1つに記載の半導体装置。
- 前記半導体装置は、車両のモータを制御するインバータまたは回生用のコンバータに使用される電力用半導体装置である、請求項1から10のいずれか1つに記載の半導体装置。
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CN201611055874.2A CN106952877B (zh) | 2014-10-16 | 2015-10-16 | 半导体装置 |
CN201910281594.0A CN110071072B (zh) | 2014-10-16 | 2015-10-16 | 半导体装置 |
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