JP6380666B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6380666B2 JP6380666B2 JP2017513995A JP2017513995A JP6380666B2 JP 6380666 B2 JP6380666 B2 JP 6380666B2 JP 2017513995 A JP2017513995 A JP 2017513995A JP 2017513995 A JP2017513995 A JP 2017513995A JP 6380666 B2 JP6380666 B2 JP 6380666B2
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- 239000004065 semiconductor Substances 0.000 title claims description 148
- 239000010410 layer Substances 0.000 claims description 243
- 230000004888 barrier function Effects 0.000 claims description 103
- 239000010936 titanium Substances 0.000 claims description 61
- 229910052719 titanium Inorganic materials 0.000 claims description 61
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 60
- 239000000758 substrate Substances 0.000 claims description 57
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 48
- 239000011229 interlayer Substances 0.000 claims description 31
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 238000010586 diagram Methods 0.000 description 20
- 230000015556 catabolic process Effects 0.000 description 16
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 15
- 239000001257 hydrogen Substances 0.000 description 14
- 229910052739 hydrogen Inorganic materials 0.000 description 14
- 239000012535 impurity Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 13
- 238000000206 photolithography Methods 0.000 description 8
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 7
- 229910010271 silicon carbide Inorganic materials 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 229910005883 NiSi Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910004349 Ti-Al Inorganic materials 0.000 description 2
- 229910004692 Ti—Al Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000005380 borophosphosilicate glass Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000005360 phosphosilicate glass Substances 0.000 description 2
- 230000001603 reducing effect Effects 0.000 description 2
- 229910018575 Al—Ti Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021334 nickel silicide Inorganic materials 0.000 description 1
- RUFLMLWJRZAWLJ-UHFFFAOYSA-N nickel silicide Chemical compound [Ni]=[Si]=[Ni] RUFLMLWJRZAWLJ-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
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Description
[先行技術文献]
[特許文献]
[特許文献1] 特開2012−129503号公報
[特許文献2] 特開2013−201357号公報
Claims (13)
- 半導体装置であって、
前記半導体装置は、
半導体基板と、
前記半導体基板の表面側に設けられたアルミニウムを含む電極と、
前記半導体基板と前記電極との間に設けられたバリア層と
を備え、
前記バリア層は、前記半導体基板に近い方から順に、第1の窒化チタン層、第1のチタン層、第2の窒化チタン層および第2のチタン層を有し、
前記半導体装置は、
ゲート構造を有する活性領域と、
前記活性領域とは異なる領域であって、前記半導体基板の表面側に設けられた半導体素子を含む素子領域と
をさらに備え、
前記素子領域では、前記半導体素子は前記半導体基板に接して設けられた第1絶縁膜上に設けられ、前記半導体素子の表面側には第2絶縁膜をさらに有し、
前記バリア層は前記第2絶縁膜の表面側にも設けられる
半導体装置。 - 半導体装置であって、
前記半導体装置は、
半導体基板と、
前記半導体基板の表面側に設けられたアルミニウムを含む電極と、
前記半導体基板と前記電極との間に設けられたバリア層と
を備え、
前記バリア層は、前記半導体基板に近い方から順に、第1の窒化チタン層、第1のチタン層、第2の窒化チタン層および第2のチタン層を有し、
前記半導体装置は、
ゲート構造を有する活性領域と、
前記活性領域とは異なる領域であって、前記半導体基板の表面側に設けられた半導体素子を含む素子領域と
をさらに備え、
前記素子領域は、前記半導体素子の表面側に絶縁膜をさらに有し、
前記バリア層は、前記活性領域から前記素子領域に延伸して設けられた前記絶縁膜の表面側にも設けられ、
前記第2のチタン層が、前記第1の窒化チタン層、前記第1のチタン層および前記第2の窒化チタン層の端部側面を覆う半導体装置。 - 前記第2のチタン層は、前記第1のチタン層よりも大きい厚みを有する
請求項1または2に記載の半導体装置。 - 前記第1のチタン層および前記第2のチタン層の各々は、前記第1の窒化チタン層および前記第2の窒化チタン層のいずれよりも小さい厚みを有する
請求項1から3のいずれか一項に記載の半導体装置。 - 前記第1のチタン層および前記第2のチタン層の各々の厚みは、10nm以上50nm以下であり、
前記第1の窒化チタン層および前記第2の窒化チタン層の各々の厚みは、50nm以上200nm以下である、
請求項1または2に記載の半導体装置。 - 前記バリア層は、アルミニウムを含む前記電極と前記半導体素子との間に設けられる
請求項1から5のいずれか一項に記載の半導体装置。 - 前記半導体素子は、pn接合ダイオードであり、
アルミニウムを含む前記電極は、前記pn接合ダイオードに電気的に接続した電極である
請求項6に記載の半導体装置。 - 前記絶縁膜は、前記半導体素子とアルミニウムを含む前記電極とが電気的に接続するコンタクトホールを有し、
前記バリア層は、前記コンタクトホールの側壁にも設けられる
請求項1から7のいずれか一項に記載の半導体装置。 - 前記半導体基板を上面視した場合に、前記バリア層は前記素子領域よりも広い領域に設けられる
請求項8に記載の半導体装置。 - 前記活性領域の前記ゲート構造は、
ゲート電極と、
前記ゲート電極よりも表面側に設けられた前記バリア層と
をさらに有し、
前記活性領域における前記バリア層の前記素子領域の側の端部と、前記素子領域における前記バリア層の前記活性領域の側の端部とは10μm以上20μm以下離間している
請求項9に記載の半導体装置。 - 前記ゲート電極よりも表面側に設けられた前記電極と、前記ゲート電極との間に層間絶縁膜をさらに備え、
前記バリア層は、前記ゲート電極よりも表面側に設けられた前記電極と前記層間絶縁膜との間に設けられる
請求項10に記載の半導体装置。 - 前記半導体基板の端部の辺に沿って設けられた耐圧構造部をさらに備え、
前記バリア層は、前記耐圧構造部の表面側に設けられ、
前記耐圧構造部の前記バリア層は、フローティング電位を有する
請求項1から11のいずれか一項に記載の半導体装置。 - 前記耐圧構造部の前記バリア層の表面側には、アルミニウムを含む前記電極が設けられない
請求項12に記載の半導体装置。
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