JP6256659B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6256659B2 JP6256659B2 JP2017514055A JP2017514055A JP6256659B2 JP 6256659 B2 JP6256659 B2 JP 6256659B2 JP 2017514055 A JP2017514055 A JP 2017514055A JP 2017514055 A JP2017514055 A JP 2017514055A JP 6256659 B2 JP6256659 B2 JP 6256659B2
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- 239000004065 semiconductor Substances 0.000 title claims description 98
- 239000000758 substrate Substances 0.000 claims description 62
- 230000015556 catabolic process Effects 0.000 claims description 46
- 230000001681 protective effect Effects 0.000 claims description 45
- 239000001257 hydrogen Substances 0.000 claims description 22
- 229910052739 hydrogen Inorganic materials 0.000 claims description 22
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 20
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 6
- 229910021334 nickel silicide Inorganic materials 0.000 claims description 5
- RUFLMLWJRZAWLJ-UHFFFAOYSA-N nickel silicide Chemical compound [Ni]=[Si]=[Ni] RUFLMLWJRZAWLJ-UHFFFAOYSA-N 0.000 claims description 5
- 230000007423 decrease Effects 0.000 claims description 3
- 239000010936 titanium Substances 0.000 description 60
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 58
- 229910052719 titanium Inorganic materials 0.000 description 58
- 239000010410 layer Substances 0.000 description 33
- 239000011229 interlayer Substances 0.000 description 31
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- 238000010586 diagram Methods 0.000 description 15
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- 229910052751 metal Inorganic materials 0.000 description 14
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- 230000008569 process Effects 0.000 description 9
- 238000002161 passivation Methods 0.000 description 8
- 230000008859 change Effects 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
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- 239000005360 phosphosilicate glass Substances 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 5
- 239000005380 borophosphosilicate glass Substances 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
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- 238000012986 modification Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 description 2
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
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- 239000010931 gold Substances 0.000 description 2
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- 238000009413 insulation Methods 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
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- 229920005591 polysilicon Polymers 0.000 description 2
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- 238000000926 separation method Methods 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910008486 TiSix Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- PEUPIGGLJVUNEU-UHFFFAOYSA-N nickel silicon Chemical group [Si].[Ni] PEUPIGGLJVUNEU-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- -1 regions Substances 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910021341 titanium silicide Inorganic materials 0.000 description 1
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- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
[先行技術文献]
[特許文献]
[特許文献1] 特開2012−129503号公報
[非特許文献]
[非特許文献1] ケイ・シェナイ(K.Shenai)、外2名、オプティマム セミコンダクターズ フォー ハイパワー エレクトロニクス(Optimum Semiconductors for High−Power Electronics)、アイ・トリプル・イー トランザクションズ オン エレクトロン デバイシズ(IEEE Transactions on Electron Devices)、1989年9月、第36巻、第9号、p.1811−1823
[非特許文献2] ビー・ジャヤン・バリガ(B.Jayant Baliga)著、シリコンカーバイド パワー デバイシズ(Silicon Carbide Power Devices)、(米国)、ワールド サイエンティフィック パブリッシング カンパニー(World Scientific Publishing Co.)、2006年3月30日、p.61
Claims (11)
- 活性領域と、前記活性領域の周りに設けられた耐圧構造部とを有する半導体基板と、
前記活性領域と前記耐圧構造部との間におけるゲートランナー部と、
前記活性領域と前記ゲートランナー部との間におけるゲートパッド部と、
前記半導体基板上において、前記耐圧構造部に設けられた第1の下部絶縁膜と、
前記第1の下部絶縁膜上に設けられ、前記半導体基板と電気的に絶縁された、水素を吸蔵する第1の保護膜と
を備え、
前記ゲートランナー部および前記ゲートパッド部は、
前記半導体基板上における第2の下部絶縁膜と、
前記第2の下部絶縁膜上に設けられた、水素を吸蔵する第2の保護膜と
を有する、半導体装置。 - 前記半導体基板は、第1導電型であり、
前記半導体基板は、前記耐圧構造部のおもて面に第2導電型の領域を有し、
前記第1の保護膜は、前記第2導電型の領域の上方を少なくとも覆う
請求項1に記載の半導体装置。 - 前記第2導電型の領域は、前記活性領域から前記耐圧構造部に向かう方向において濃度が低くなる領域を有する
請求項2に記載の半導体装置。 - 前記耐圧構造部に設けられた前記第1の保護膜は、前記活性領域から電気的に分離されている
請求項3に記載の半導体装置。 - 前記耐圧構造部に設けられた前記第1の保護膜上に、第1の上部絶縁膜をさらに備える
請求項1から4のいずれか一項に記載の半導体装置。 - 前記第1の保護膜は、前記耐圧構造部において一体に形成されている
請求項4に記載の半導体装置。 - 前記半導体基板は、前記耐圧構造部において、傾斜部および平坦部を有する段差部をさらに備え、
前記第1の保護膜は、前記耐圧構造部において、前記段差部を含む前記半導体基板の上方全体を覆って設けられている
請求項6に記載の半導体装置。 - 前記活性領域は、
前記半導体基板上に設けられた第3の下部絶縁膜と、
前記第3の下部絶縁膜上に設けられた、水素を吸蔵する第3の保護膜と
をさらに備える、
請求項1または2に記載の半導体装置。 - 前記活性領域は、前記半導体基板と前記半導体基板上に設けられた前記第3の保護膜との電気的接続を提供するコンタクト部をさらに備え、
前記コンタクト部において、前記半導体基板はニッケルシリサイドを少なくとも有し、
前記コンタクト部において、前記第3の保護膜はチタンカーバイドを少なくとも有する
請求項8に記載の半導体装置。 - 前記耐圧構造部における前記第1の保護膜の厚さは、前記活性領域における前記第3の保護膜の厚さよりも大きい
請求項8に記載の半導体装置。 - 前記活性領域における前記第3の保護膜の厚さは、前記耐圧構造部における前記第1の保護膜の厚さよりも大きい
請求項8に記載の半導体装置。
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