JP6377116B2 - 樹脂組成物及びこれを含有する絶縁基材及び回路基板 - Google Patents
樹脂組成物及びこれを含有する絶縁基材及び回路基板 Download PDFInfo
- Publication number
- JP6377116B2 JP6377116B2 JP2016235188A JP2016235188A JP6377116B2 JP 6377116 B2 JP6377116 B2 JP 6377116B2 JP 2016235188 A JP2016235188 A JP 2016235188A JP 2016235188 A JP2016235188 A JP 2016235188A JP 6377116 B2 JP6377116 B2 JP 6377116B2
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- diisocyanate
- group
- diamine
- bis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011342 resin composition Substances 0.000 title claims description 66
- 239000000463 material Substances 0.000 title claims description 18
- -1 tetracarboxylic anhydride Chemical class 0.000 claims description 65
- 150000004985 diamines Chemical class 0.000 claims description 42
- 229920006037 cross link polymer Polymers 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 31
- 125000000217 alkyl group Chemical group 0.000 claims description 22
- 125000003118 aryl group Chemical group 0.000 claims description 21
- 239000000178 monomer Substances 0.000 claims description 20
- 125000002947 alkylene group Chemical group 0.000 claims description 14
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 12
- 125000001072 heteroaryl group Chemical group 0.000 claims description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 10
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 9
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 9
- 229920001223 polyethylene glycol Polymers 0.000 claims description 9
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 claims description 8
- 239000002202 Polyethylene glycol Substances 0.000 claims description 8
- 125000001931 aliphatic group Chemical group 0.000 claims description 8
- 229920001400 block copolymer Polymers 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 8
- 125000003545 alkoxy group Chemical group 0.000 claims description 7
- 125000002993 cycloalkylene group Chemical group 0.000 claims description 7
- 239000000539 dimer Substances 0.000 claims description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical group C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 6
- 125000002723 alicyclic group Chemical group 0.000 claims description 6
- 125000000623 heterocyclic group Chemical group 0.000 claims description 6
- 229920001748 polybutylene Polymers 0.000 claims description 6
- 229920001451 polypropylene glycol Polymers 0.000 claims description 6
- 150000000000 tetracarboxylic acids Chemical class 0.000 claims description 6
- 239000004743 Polypropylene Substances 0.000 claims description 5
- 125000000732 arylene group Chemical group 0.000 claims description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 5
- 229920001155 polypropylene Polymers 0.000 claims description 5
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 claims description 4
- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 claims description 4
- 239000005057 Hexamethylene diisocyanate Substances 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 claims description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 4
- 229910052736 halogen Inorganic materials 0.000 claims description 4
- 150000002367 halogens Chemical class 0.000 claims description 4
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 claims description 4
- 229920000573 polyethylene Polymers 0.000 claims description 4
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 4
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims description 4
- 125000003161 (C1-C6) alkylene group Chemical group 0.000 claims description 3
- JRBJSXQPQWSCCF-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine Chemical group C1=C(N)C(OC)=CC(C=2C=C(OC)C(N)=CC=2)=C1 JRBJSXQPQWSCCF-UHFFFAOYSA-N 0.000 claims description 3
- 125000004450 alkenylene group Chemical group 0.000 claims description 3
- 150000008064 anhydrides Chemical class 0.000 claims description 3
- 125000005724 cycloalkenylene group Chemical group 0.000 claims description 3
- 125000006353 oxyethylene group Chemical group 0.000 claims description 3
- 125000006376 (C3-C10) cycloalkyl group Chemical group 0.000 claims description 2
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 claims description 2
- XSCLFFBWRKTMTE-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCCC(CN=C=O)C1 XSCLFFBWRKTMTE-UHFFFAOYSA-N 0.000 claims description 2
- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 claims description 2
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 claims description 2
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 claims description 2
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 claims description 2
- DFPJRUKWEPYFJT-UHFFFAOYSA-N 1,5-diisocyanatopentane Chemical compound O=C=NCCCCCN=C=O DFPJRUKWEPYFJT-UHFFFAOYSA-N 0.000 claims description 2
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 claims description 2
- ICLCCFKUSALICQ-UHFFFAOYSA-N 1-isocyanato-4-(4-isocyanato-3-methylphenyl)-2-methylbenzene Chemical compound C1=C(N=C=O)C(C)=CC(C=2C=C(C)C(N=C=O)=CC=2)=C1 ICLCCFKUSALICQ-UHFFFAOYSA-N 0.000 claims description 2
- LXJLFVRAWOOQDR-UHFFFAOYSA-N 3-(3-aminophenoxy)aniline Chemical group NC1=CC=CC(OC=2C=C(N)C=CC=2)=C1 LXJLFVRAWOOQDR-UHFFFAOYSA-N 0.000 claims description 2
- UCQABCHSIIXVOY-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]phenoxy]aniline Chemical group NC1=CC=CC(OC=2C=CC(=CC=2)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 UCQABCHSIIXVOY-UHFFFAOYSA-N 0.000 claims description 2
- UDKYPBUWOIPGDY-UHFFFAOYSA-N 3-amino-n-(4-aminophenyl)benzamide Chemical compound C1=CC(N)=CC=C1NC(=O)C1=CC=CC(N)=C1 UDKYPBUWOIPGDY-UHFFFAOYSA-N 0.000 claims description 2
- WECDUOXQLAIPQW-UHFFFAOYSA-N 4,4'-Methylene bis(2-methylaniline) Chemical compound C1=C(N)C(C)=CC(CC=2C=C(C)C(N)=CC=2)=C1 WECDUOXQLAIPQW-UHFFFAOYSA-N 0.000 claims description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 claims description 2
- KHYXYOGWAIYVBD-UHFFFAOYSA-N 4-(4-propylphenoxy)aniline Chemical compound C1=CC(CCC)=CC=C1OC1=CC=C(N)C=C1 KHYXYOGWAIYVBD-UHFFFAOYSA-N 0.000 claims description 2
- OMHOXRVODFQGCA-UHFFFAOYSA-N 4-[(4-amino-3,5-dimethylphenyl)methyl]-2,6-dimethylaniline Chemical compound CC1=C(N)C(C)=CC(CC=2C=C(C)C(N)=C(C)C=2)=C1 OMHOXRVODFQGCA-UHFFFAOYSA-N 0.000 claims description 2
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 claims description 2
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 claims description 2
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 claims description 2
- XPAQFJJCWGSXGJ-UHFFFAOYSA-N 4-amino-n-(4-aminophenyl)benzamide Chemical compound C1=CC(N)=CC=C1NC(=O)C1=CC=C(N)C=C1 XPAQFJJCWGSXGJ-UHFFFAOYSA-N 0.000 claims description 2
- SYSGLKFQANQAAH-UHFFFAOYSA-N 5,5-diisocyanato-6-methyl-2-(3-methylphenyl)cyclohexa-1,3-diene Chemical compound C1=CC(N=C=O)(N=C=O)C(C)C=C1C1=CC=CC(C)=C1 SYSGLKFQANQAAH-UHFFFAOYSA-N 0.000 claims description 2
- QHHKLPCQTTWFSS-UHFFFAOYSA-N 5-[2-(1,3-dioxo-2-benzofuran-5-yl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)(C(F)(F)F)C(F)(F)F)=C1 QHHKLPCQTTWFSS-UHFFFAOYSA-N 0.000 claims description 2
- LWBIQFKEKJTQAG-UHFFFAOYSA-N C(=O)(O)C=1C=C(OCC(C)(C2=CC=CC=C2)C2=CC=CC=C2)C=CC1C(=O)O Chemical compound C(=O)(O)C=1C=C(OCC(C)(C2=CC=CC=C2)C2=CC=CC=C2)C=CC1C(=O)O LWBIQFKEKJTQAG-UHFFFAOYSA-N 0.000 claims description 2
- 125000001313 C5-C10 heteroaryl group Chemical group 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- YGTJQODPHKCKMX-UHFFFAOYSA-N benzene-1,4-diamine 2-benzofuran-1,3-dione Chemical compound Nc1ccc(N)cc1.O=C1OC(=O)c2ccccc12 YGTJQODPHKCKMX-UHFFFAOYSA-N 0.000 claims description 2
- TUQQUUXMCKXGDI-UHFFFAOYSA-N bis(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(N)C=CC=2)=C1 TUQQUUXMCKXGDI-UHFFFAOYSA-N 0.000 claims description 2
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 claims description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 claims description 2
- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 claims description 2
- DOBFTMLCEYUAQC-UHFFFAOYSA-N naphthalene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 DOBFTMLCEYUAQC-UHFFFAOYSA-N 0.000 claims description 2
- YTVNOVQHSGMMOV-UHFFFAOYSA-N naphthalenetetracarboxylic dianhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 claims description 2
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 claims description 2
- 239000001294 propane Substances 0.000 claims description 2
- 229910052705 radium Inorganic materials 0.000 claims description 2
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims description 2
- FADTWTSAFSHQKZ-UHFFFAOYSA-N 1,3-bis(3-isocyanatopropyl)cyclohexane Chemical compound O=C=NCCCC1CCCC(CCCN=C=O)C1 FADTWTSAFSHQKZ-UHFFFAOYSA-N 0.000 claims 1
- ROHUXHMNZLHBSF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCC(CN=C=O)CC1 ROHUXHMNZLHBSF-UHFFFAOYSA-N 0.000 claims 1
- RFDJEHMKNKYQDD-UHFFFAOYSA-N 2-[3-[3-[3-(2-aminophenoxy)phenoxy]phenoxy]phenoxy]aniline Chemical compound NC1=CC=CC=C1OC1=CC=CC(OC=2C=C(OC=3C=C(OC=4C(=CC=CC=4)N)C=CC=3)C=CC=2)=C1 RFDJEHMKNKYQDD-UHFFFAOYSA-N 0.000 claims 1
- FYYYKXFEKMGYLZ-UHFFFAOYSA-N 4-(1,3-dioxo-2-benzofuran-5-yl)-2-benzofuran-1,3-dione Chemical compound C=1C=C2C(=O)OC(=O)C2=CC=1C1=CC=CC2=C1C(=O)OC2=O FYYYKXFEKMGYLZ-UHFFFAOYSA-N 0.000 claims 1
- AVCOFPOLGHKJQB-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)sulfonylphthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1S(=O)(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 AVCOFPOLGHKJQB-UHFFFAOYSA-N 0.000 claims 1
- QJENIOQDYXRGLF-UHFFFAOYSA-N 4-[(4-amino-3-ethyl-5-methylphenyl)methyl]-2-ethyl-6-methylaniline Chemical compound CC1=C(N)C(CC)=CC(CC=2C=C(CC)C(N)=C(C)C=2)=C1 QJENIOQDYXRGLF-UHFFFAOYSA-N 0.000 claims 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims 1
- JGCWKVKYRNXTMD-UHFFFAOYSA-N bicyclo[2.2.1]heptane;isocyanic acid Chemical compound N=C=O.N=C=O.C1CC2CCC1C2 JGCWKVKYRNXTMD-UHFFFAOYSA-N 0.000 claims 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 claims 1
- 239000010410 layer Substances 0.000 description 49
- 239000010408 film Substances 0.000 description 33
- 239000011810 insulating material Substances 0.000 description 25
- 125000004432 carbon atom Chemical group C* 0.000 description 15
- 238000006243 chemical reaction Methods 0.000 description 15
- 229920005989 resin Polymers 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- 239000010409 thin film Substances 0.000 description 15
- 239000000843 powder Substances 0.000 description 14
- 125000004427 diamine group Chemical group 0.000 description 13
- 229920001721 polyimide Polymers 0.000 description 13
- 238000003756 stirring Methods 0.000 description 12
- 239000002904 solvent Substances 0.000 description 11
- 239000004642 Polyimide Substances 0.000 description 10
- 235000014113 dietary fatty acids Nutrition 0.000 description 10
- 239000000194 fatty acid Substances 0.000 description 10
- 229930195729 fatty acid Natural products 0.000 description 10
- 150000004665 fatty acids Chemical class 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 9
- 239000000945 filler Substances 0.000 description 8
- 239000003063 flame retardant Substances 0.000 description 8
- 239000011241 protective layer Substances 0.000 description 8
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 7
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000004132 cross linking Methods 0.000 description 7
- 125000000753 cycloalkyl group Chemical group 0.000 description 7
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 7
- 239000002966 varnish Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 125000005462 imide group Chemical group 0.000 description 6
- 238000010030 laminating Methods 0.000 description 6
- 239000012454 non-polar solvent Substances 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 150000002430 hydrocarbons Chemical class 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 5
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052698 phosphorus Inorganic materials 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 150000003949 imides Chemical class 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 239000002798 polar solvent Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000008096 xylene Substances 0.000 description 4
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical group C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 3
- 229910052794 bromium Inorganic materials 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 125000005442 diisocyanate group Chemical group 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000012774 insulation material Substances 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 150000002513 isocyanates Chemical class 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 235000019198 oils Nutrition 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 2
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 2
- 238000005698 Diels-Alder reaction Methods 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910001573 adamantine Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 229920001038 ethylene copolymer Polymers 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000000 metal hydroxide Inorganic materials 0.000 description 2
- 150000004692 metal hydroxides Chemical class 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 125000002950 monocyclic group Chemical group 0.000 description 2
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 125000004817 pentamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 2
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical compound C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 2
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 2
- 150000003018 phosphorus compounds Chemical class 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- 230000004580 weight loss Effects 0.000 description 2
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- NNOZGCICXAYKLW-UHFFFAOYSA-N 1,2-bis(2-isocyanatopropan-2-yl)benzene Chemical compound O=C=NC(C)(C)C1=CC=CC=C1C(C)(C)N=C=O NNOZGCICXAYKLW-UHFFFAOYSA-N 0.000 description 1
- LEEANUDEDHYDTG-UHFFFAOYSA-N 1,2-dimethoxypropane Chemical compound COCC(C)OC LEEANUDEDHYDTG-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- 125000004955 1,4-cyclohexylene group Chemical group [H]C1([H])C([H])([H])C([H])([*:1])C([H])([H])C([H])([H])C1([H])[*:2] 0.000 description 1
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- ZIKLJUUTSQYGQI-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxypropoxy)propane Chemical compound CCOCC(C)OCC(C)OCC ZIKLJUUTSQYGQI-UHFFFAOYSA-N 0.000 description 1
- CAQYAZNFWDDMIT-UHFFFAOYSA-N 1-ethoxy-2-methoxyethane Chemical compound CCOCCOC CAQYAZNFWDDMIT-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- DMFAHCVITRDZQB-UHFFFAOYSA-N 1-propoxypropan-2-yl acetate Chemical compound CCCOCC(C)OC(C)=O DMFAHCVITRDZQB-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- SDTMFDGELKWGFT-UHFFFAOYSA-N 2-methylpropan-2-olate Chemical compound CC(C)(C)[O-] SDTMFDGELKWGFT-UHFFFAOYSA-N 0.000 description 1
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 1
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 description 1
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 1
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 1
- LDFYRFKAYFZVNH-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenoxy]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 LDFYRFKAYFZVNH-UHFFFAOYSA-N 0.000 description 1
- ZHBXLZQQVCDGPA-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)sulfonyl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(S(=O)(=O)C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 ZHBXLZQQVCDGPA-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- DPUOLQHDNGRHBS-UHFFFAOYSA-N Brassidinsaeure Natural products CCCCCCCCC=CCCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- URXZXNYJPAJJOQ-UHFFFAOYSA-N Erucic acid Natural products CCCCCCC=CCCCCCCCCCCCC(O)=O URXZXNYJPAJJOQ-UHFFFAOYSA-N 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 235000019484 Rapeseed oil Nutrition 0.000 description 1
- 235000019774 Rice Bran oil Nutrition 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 235000019486 Sunflower oil Nutrition 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- AMXBISSOONGENB-UHFFFAOYSA-N acetylene;ethene Chemical group C=C.C#C AMXBISSOONGENB-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000005529 alkyleneoxy group Chemical group 0.000 description 1
- 125000001118 alkylidene group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 230000002862 amidating effect Effects 0.000 description 1
- 125000004653 anthracenylene group Chemical group 0.000 description 1
- 125000005428 anthryl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C3C(*)=C([H])C([H])=C([H])C3=C([H])C2=C1[H] 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 150000004984 aromatic diamines Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 125000002619 bicyclic group Chemical group 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- OHJMTUPIZMNBFR-UHFFFAOYSA-N biuret Chemical compound NC(=O)NC(N)=O OHJMTUPIZMNBFR-UHFFFAOYSA-N 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- 125000005569 butenylene group Chemical group 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 235000012343 cottonseed oil Nutrition 0.000 description 1
- 239000002385 cottonseed oil Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000004976 cyclobutylene group Chemical group 0.000 description 1
- 125000001162 cycloheptenyl group Chemical group C1(=CCCCCC1)* 0.000 description 1
- 125000000582 cycloheptyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000004977 cycloheptylene group Chemical group 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- 125000005725 cyclohexenylene group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000004956 cyclohexylene group Chemical group 0.000 description 1
- 125000000640 cyclooctyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- 125000004978 cyclooctylene group Chemical group 0.000 description 1
- 125000002433 cyclopentenyl group Chemical group C1(=CCCC1)* 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000004979 cyclopentylene group Chemical group 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- DPUOLQHDNGRHBS-KTKRTIGZSA-N erucic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-KTKRTIGZSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 125000002541 furyl group Chemical group 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003707 hexyloxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 229910052588 hydroxylapatite Inorganic materials 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000012796 inorganic flame retardant Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000001434 methanylylidene group Chemical group [H]C#[*] 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007719 peel strength test Methods 0.000 description 1
- XYJRXVWERLGGKC-UHFFFAOYSA-D pentacalcium;hydroxide;triphosphate Chemical compound [OH-].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O XYJRXVWERLGGKC-UHFFFAOYSA-D 0.000 description 1
- RGSFGYAAUTVSQA-UHFFFAOYSA-N pentamethylene Natural products C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 1
- 125000004115 pentoxy group Chemical group [*]OC([H])([H])C([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 125000001792 phenanthrenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C=CC12)* 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 238000009829 pitch coating Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 125000001725 pyrenyl group Chemical group 0.000 description 1
- 125000005548 pyrenylene group Chemical group 0.000 description 1
- 125000004076 pyridyl group Chemical group 0.000 description 1
- 125000000714 pyrimidinyl group Chemical group 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000008165 rice bran oil Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000002600 sunflower oil Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000003784 tall oil Substances 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 125000000335 thiazolyl group Chemical group 0.000 description 1
- 125000001544 thienyl group Chemical group 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- AVWRKZWQTYIKIY-UHFFFAOYSA-N urea-1-carboxylic acid Chemical compound NC(=O)NC(O)=O AVWRKZWQTYIKIY-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 235000015112 vegetable and seed oil Nutrition 0.000 description 1
- 239000008158 vegetable oil Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/64—Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63
- C08G18/6415—Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63 having nitrogen
- C08G18/6438—Polyimides or polyesterimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
- C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
- C08G18/7671—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1035—Preparatory processes from tetracarboxylic acids or derivatives and diisocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
- C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Polyurethanes Or Polyureas (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
式中、Yは、互いに独立して、単結合、−O−、−(CH2)j−O−(CH2)j−、C1−6アルキレン、−C(=O)−NH−、−C(=O)−、或いは−S(=O)2−であり、
Rc及びRdは、互いに独立して、C1−10アルキル、C1−10アルコキシ、或いはC 2−6カルバルコキシであり、
Reは、カルボキシル又は−C(=O)O−Rfで、Rfがテトラヒドロフラン基、オキシエチレン、或いはオキセタンであり、
l及びkは、互いに独立して、0〜4の整数であり、
i及びjは、互いに独立して、1或いは2であり、及び
*は、Nとの結合位置である。R1及びR2は、好ましくは互いに同じことである。
m及びnは、互いに独立して、0〜4の整数であり、及び
*はAとの結合位置である。
本発明の実施例において、評価用樹脂組成物の薄膜は、下記方法で作製した。まず、A4サイズ、表面が離型処理を経た50μmのPETキャリアフィルムを準備し、次に、300μmピッチの塗布装置で調製済み、表1に示すものを構成したワニス(Varnish)をPETキャリアフィルムに塗り、120℃に保持したオーブン内に入れて30分焼くと、厚みが50±2μmの評価用樹脂組成物の薄膜が得られた。
まず対照組で、ポリマー溶液の希釈に用いるジメチルアセトアミドをウベローデ粘度計(動粘度範囲2〜10cSt(C=0.00982))の標線間に入れ、液温35℃の恒温槽に入れて10分間放置する。上方に3本のガラス管開口部において、ゴム管とクランプを直径サイズが中程度のガラス管に取り付け、吸着用器具を一番細いガラス管に取り付ける。クランプを取り付けたゴム管を閉め、吸着器具で液体を吸い上げ、液体が一番上の貯液部に上がって来た時、吸着器具を取り外すと共にクランプを外し、液面が標線に下がってきてから、ストップウォッチで測定し、標線間の時間を測定し、3回測定してその平均値を測定値とした。次に、実験組において、50mLの三角フラスコ(中に撹拌器のチップがある)に濃度20wt%ポリマー溶液を0.49g分取し、20mLのジメチルアセトアミドを添加した後で、約10分間撹拌した。対照組と同じようにウベローデ粘度計で液面の標線間における移動時間を3回測定した。その後、3回の平均値で下式に従いηを算出した。
上記作製方法で得られた樹脂組成物の薄膜を100×100mm2の大きさに切り出し、180℃に保持した熱風循環式オーブン内に入れ、185℃で60分の硬化を行った。次に、その中から10×100mm2に切り出し、PETキャリアフィルムを剥がした後の薄膜を試験片とし、また島津製作所社製のAutograph AG S−5kNDで、20mm/minの速度で該試験片の引張弾性率を測定した。
100×100mm2の片面フレキシブル銅張積層板(銅箔の厚み/絶縁層の厚み=12/12μm)を準備し、また該フレキシブル銅張積層板の銅箔上にドライフィルムの絶縁素材を積層して柔軟性の評価基材とした。次に真空状態において、80℃、0.5MPAで60秒のラミネートを行った後、PETキャリアフィルムを剥がし、熱風循環式オーブン内において、185℃で60分の硬化を行った。次に、その中から10×20mm2に切り出して試験片とした。該試験片を180°に折り曲げて天秤上のピッチ2mmの間中に入れ、折り曲げた後の試験片の復元力を測定した。同様の測定を5回繰り返し、その平均値を測定値とした。
柔軟性測定と同じ絶縁素材のラミネート基板を作製し、20mm×20mmの大きさに切り出して試験片とした。1mol%の水酸化ナトリウム水溶液、1mol%の塩酸水溶液、1mol%の硫酸水溶液、MEK、エタノール内に入れ、30℃で7日浸漬した後で、直ちに水洗い、そしてウエスで確実にふき取った後、目視で該試験片の変色や膨張の有無等の外観変化を観察した。外観に変化がなかった場合、「合格」とし、外観に変化があった場合、「不合格」とした。
120×100mm2の片面フレキシブル銅張積層板(銅箔の厚み/絶縁層の厚み=12/12μm)を準備し、該フレキシブル銅張積層板の銅箔上にドライフィルムの絶縁素材を積層して柔軟性の評価基材とした。次に真空状態において、80℃、0.5MPAで60秒のラミネートを行った後、キャリアフィルムを剥がした。次に、その上方において上記120×100mm2の片面フレキシブル銅張積層板(銅箔の厚み/絶縁層の厚み=12/12μm)の銅張面を絶縁素材に積層し、真空状態において、80℃、0.5MPAで60秒のラミネートを行った後、熱風循環式オーブンにおいて185℃で60分の硬化を行った。該基板から100×10mm2の大きさに切り出して試験片とした。評価する時、貼合部をカッターで剥がさせることができ、180°の方向(T型剥離強度試験)に向け、50mm/minの速度において、引張時の強度を測定し、同様の測定を5回繰り返し、その平均値を測定値とした。
柔軟性測定と同じ絶縁素材のラミネート基板を作製し、20mm×20mmの大きさに切り出して試験片とした。評価する時、試験片を260℃に保持したはんだ槽表面に浮かべ、絶縁素材を接触させて、膨張や変色等の異常の有無を確認した。同様の測定を5回繰り返し、全て合格の時「合格」とし、これ以外を一律「不合格」とした。
(実施例1)
2000mlの5口セパラブルフラスコにDMAc(N,N−ジメチルアセトアミド)880.4g、キシレン474.1g、RT−1000 157.1g(0.155mol)とp−BAPP95.5g(0.232mol)を正確に分取した。10分間撹拌した後で、ODPA100.0g(0.322mol)を上記フラスコ内に添加した。カルボン酸二無水物化合物対ジアミン化合物のモル比は、1:1.2とした。次に、油の温度を180℃まで上げ、水がDean−Stark蒸留器で凝縮した後、反応システム外に蒸留した。縮合反応が約5時間で、水の流出しなくなるまでとした。最後に、反応温度を室温まで下げると長鎖ジアミンを得ることができた。次に、のMDI5.7g(0.023molで、NCO対NHのモル比が0.35)をその5倍の質量のMEKに溶かし、室温で1時間かけて長鎖ジアミン溶液に添加し、その後液温を100℃に上げて、5時間の反応を行った。得られた架橋ポリマーの動粘度(η)が0.82であった。50%N−695DMAc溶液35.8g及び828 17.9g、シアノグアニジン5.0g、FPB−100 15.0g、H−42ST 75.0gを該架橋性ポリマーに添加し、混練機で混ぜた後、捷南企業社製サンドミルで微細分散を行った。グラインドゲージで10μm以上の粒子がないことを確認した後、HXA−4922HP5.0g及びKBM−403 4.5gを添加して混合すると、ドライフィルム作製用のワニスが得られた。
2000mlの5口セパラブルフラスコにN−メチルピロリドン(以下、「NMP」という)903.7g、メシチレン602.5g、RT−1000 97.7g(0.096mol)、二量体ジアミンP−1074 51.5g(0.100mol)及びp−BAPP 147.1g(0.358mol)を正確に分取した。10分間撹拌した後、PMDA100.0g(0.4585mol)を上記フラスコ内に添加した。カルボン酸二無水物化合物対ジアミン化合物のモル比は1:1.2とした。実施例1と同様にイミド化を施し、長鎖ジアミンを得た。次に、実施例1と同様に、5倍量のMEK内に溶けたMDI8.0g(0.032mol,NCO対NHのモル比が0.34)を添加し、その反応を促し、ηが0.92の架橋ポリマーを得た。KBM−403 4.0gを該架橋ポリマーに添加して、撹拌した後ドライフィルム作製用のワニスが得られた。
2000mlの5口セパラブルフラスコにDMAc1037.9g、キシレン558.9g、RT−1000 181.2g(0.179mol)とp−BAPP136.4g(0.332mol)を正確に分取した。10分間撹拌した後で、BPDA100.0g(0.340mol)を上記フラスコ内に添加した。カルボン酸二無水物化合物対ジアミン化合物のモル比は、1:1.5とした。実施例1と同様にイミド化を施し、長鎖ジアミンを得た。次に、実施例1と同様に、5倍量のMEK内に溶けたMEK10.6g(0.043mol,NCO対NHのモル比が0.25)を添加し、その反応を促し、ηが1.01の架橋ポリマーを得た。KBM−403 4.3gを該架橋ポリマーに添加して、撹拌した後ドライフィルム作製用のワニスが得られた。
2000mlの5口セパラブルフラスコにDMAc1271.9g、キシレン684.8g、RT−1000 307.1g(0.303mol)とp−BAPP101.8g(0.248mol)を正確に分取した。10分間撹拌した後で、PMDA100.0g(0.459mol)を上記フラスコ内に添加した。カルボン酸二無水物化合物対ジアミン化合物のモル比は、1:1.2とした。実施例1と同様にイミド化を施し、長鎖ジアミンを得た。次に、実施例1と同様に、5倍量のMEK内に溶けたMDI8.0g(0.032mol,NCO対NHのモル比が0.35)を添加し、その反応を促し、ηが1.10の架橋ポリマーを得た。KBM−403 5.2gを該架橋ポリマーに添加して、撹拌した後ドライフィルム作製用のワニスが得られた。
2000mlの5口セパラブルフラスコにNMP726.8g、メシチレン484.6g、RT−1000 160.3g(0.158mol)とODA58.7g(0.293mol)を正確に分取した。10分間撹拌した後で、ODPA100.0g(0.322mol)を上記フラスコ内に添加した。カルボン酸二無水物化合物対ジアミン化合物のモル比は、1:1.4とした。実施例1と同様にイミド化を施し、長鎖ジアミンを得た。次に、実施例1と同様に、5倍量のMEK内に溶けたMDI9.7g(0.039mol,NCO対NHのモル比が0.3)を添加し、その反応を促し、ηが0.91の架橋ポリマーを得た。KBM−403 3.3gを該架橋ポリマーに添加して、撹拌した後ドライフィルム作製用のワニスが得られた。
2000mlの5口セパラブルフラスコにNMP1054.5g、メシチレン703.0g、RT−1000 223.4g(0.220mol)とp−BAPP135.8g(0.330mol)を正確に分取した。10分間撹拌した後で、PMDA100.0g(0.459mol)を上記フラスコ内に添加した。カルボン酸二無水物化合物対ジアミン化合物のモル比は、1:1.2とした。実施例1と同様にイミド化を施し、長鎖ジアミンを得た。次に、実施例1と同様に、5倍量のMEK内に溶けたMDI2.3g(0.009mol,NCO対NHのモル比が0.1)を添加し、その反応を促し、ηが0.55の架橋ポリマーを得た。KBM−403 4.6gを該架橋ポリマーに添加して、撹拌した後ドライフィルム作製用のワニスが得られた。
2000mlの5口セパラブルフラスコにNMP1125.5g、メシチレン750.4g、RT−1000 204.8g(0.202mol)、二量体ジアミン1074 107.9g(0.209mol)とp−BAPP248.9g(0.604mol)を正確に分取した。10分間撹拌した後で、PMDA100.0g(0.4585mol)を上記フラスコ内に添加した。カルボン酸二無水物化合物対ジアミン化合物のモル比は、1:2.2とした。実施例1と同様にイミド化を施し、長鎖ジアミンを得た。次に、実施例1と同様に、5倍量のMEK内に溶けたMDI41.3g(0.162mol,NCO対NHのモル比が0.3)を添加し、その反応を促した後、溶媒に溶けないゲル物となり、狙う架橋ポリマーが得られることができなかった。
図1A乃至1Cは、本実施例の回路基板調製の流れの断面図である。まず、図1Aに示すように、その上方に回路層12を形成した基板11と、その上方に前記実施例の1〜5の樹脂組成物のいずれか1つを包括する絶縁層22を形成した支持体21を提供し、そして図1Bに示すように、支持体21を基板11にラミネートして、回路層12を絶縁層22内に埋め込ませ、最後に、図1Cに示すように、支持体21を除去すると、本実施例の回路基板を完成した。
12:回路層
21:支持体
22:絶縁層
Claims (14)
- 下記式(1)で表される重合体と下記式(2)で表される化合物とから形成される架橋ポリマーを含有する樹脂組成物。
AはC6−60アリール基、或いはC4−60ヘテロアリールであり、
XはC1−60脂肪族基、C4−20脂環族基、或いはC6−60アリール基であり、
aは1〜100の整数であり、
前記架橋ポリマーにおいて、式(1)で表される重合体に由来する単位と式(2)で表される化合物に由来する単位のモル比は1:0.25〜1:0.95であり、
式(1)で表される重合体は、テトラカルボン酸無水物モノマーとジアミンモノマーで形成した重合体であり、且つ前記テトラカルボン酸無水物モノマー及び前記ジアミンモノマーのモル比が1:1.05〜1:2である。 - R1及びR2は、互いに独立して、C1−12アルキレン、C2−12アルケニレン、C4−12シクロアルキレン、C4−12シクロアルケニレン、
式中、Yは、互いに独立して、単結合、−O−、−(CH2)j−O−(CH2)j−、C1−6アルキレン、−C(=O)−NH−、−C(=O)−、或いは−S(=O)2−であり、
Rc及びRdは、互いに独立して、C1−10アルキル、C1−10アルコキシ、或いはC2−6カルバルコキシであり、
Reは、カルボキシル又は−C(=O)O−Rfで、Rfがテトラヒドロフラン基、オキシエチレン、或いはオキセタンであり、
l及びkは、互いに独立して、0〜4の整数であり、
i及びjは、互いに独立して、1或いは2であり、及び
*は、Nとの結合位置である。 - R1及びR2は、互いに同じことであることを特徴とする請求項1に記載の樹脂組成物。
- Xは、C4−18アルキレン、C8−22シクロアルキレン、C8−22シクロアルケニレン、C6−18アリーレン、及び−(C1−4アルキル)−C6−18アリーレン−(C1−4アルキル)−からなる群より選ばれることを特徴とする請求項1に記載の樹脂組成物。
- 式(2)で表される化合物は、トルエンジイソシアネート(TDI)、4,4−ジフェニルメタンジイソシアネート(MDI)、ナフタレンジイソシアネート(NDI)、3,3’−ジメチルビフェニル−4,4−ジイルジイソシアネート(TODI)、o−キシリレンジイソシアネート、m−キシリレンジイソシアネート、及びp−キシリレンジイソシアネート、テトラメチレンジイソシアネート、ペンタメチレンジイソシアネート、ヘキサメチレンジイソシアネート(HDI)、2,2,4−トリメチル−1,6−ジイソシアネートヘキサン、2,4,4−トリメチル−1,6−ジイソシアネートヘキサン、リジンジイソシアネート、イソホロンジイソシアネート(IPDI)、1,4−シクロヘキサンジイソシアネート、1,3−ビス(イソシアナトメチル)−シクロヘキサン、1,4−ビス(イソシアナトメチル)−シクロヘキサン、1,3−ビス(イソシアナトプロピル)シクロヘキサン、4,4−ジシクロヘキシルメタンジイソシアネート、ノルボルネンジメチルエステルジイソシアネート、ノルボルナンジイソシアネート、テトラメチルキシリレンジイソシアネート及びキシリレンジイソシアネートからなる群より選ばれることを特徴とする請求項5に記載の樹脂組成物。
- 前記テトラカルボン酸無水物モノマーは、ピロメリット酸二無水物、3,3’,4,4’−ベンゾフェノンテトラカルボン酸二無水物、3,3’,4,4’−ジフェニルスルホンテトラカルボン酸二無水物、1,4,5,8−ナフタレンテトラカルボン酸二無水物、2,3,6,7−ナフタレンテトラカルボン酸二無水物、4,4’−ベンゼンジカルボン酸無水物、3,3’,4,4’−ジメチルジフェニルシランテトラカルボン酸無水物、3,3’,4,4’−テトラフェニルシランテトラカルボン酸二無水物、1,2,3,4−フランテトラカルボン酸二無水物、4,4’−ビス(3,4−ジカルボキシフェノキシ)ジフェニルプロパン二無水物、4,4’−(ヘキサフルオロイソプロピリデン)ジフタル酸無水物、3,3‘,4,4’− ビフェニルテトラカルボン酸二無水物、2,3,3’,4’−ビフェニルテトラカルボン酸二無水物、p-フェニレン(無水トリメリット酸)及びp−フェニレンジアミンフタル酸無水物からなる群より選ばれることを特徴とする請求項1に記載の樹脂組成物。
- 前記ジアミンモノマーは、3,3’−ジアミノジフェニルエーテル、4,4’−ジアミノ−3,3’,5,5’−テトラメチルジフェニルメタン、4,4’−ジアミノ−3,3’−ジエチル−5,5’−ジメチルジフェニルメタン、4,4’−ジアミノジフェニル−2,2’−プロパン、4,4’−ジアミノジフェニルメタン、3,4’−ジアミノベンズアニリド、4,4’−ジアミノベンズアニリド、3,3’−ジアミノベンゾフェノン、4,4’−ジアミノベンゾフェノン、3,3’−ジエチル−4,4’−ジアミノジフェニルエーテル、3,3’−ジエトキシ−4,4’−ジアミノジフェニルメタン、3,3’−ジメチル−4,4’−ジアミノジフェニルメタン、3,3’−ジメチル−4,4’−ジアミノジフェニルプロパン、3,3’−ジエチル−4,4’−ジアミノジフェニルプロパン、3,3’−ジメチル−5,5’−ジエチル−4,4’−ジアミノジフェニルメタン、3,3’−ジメトキシ−4,4’−ジアミノジフェニルエーテル、3,3’−ジメトキシ−4,4’−ジアミノジフェニルメタン、3,3’−ジメトキシ−4,4’−ジアミノジフェニルスルフォン、3,3’−ジメトキシ−4,4’−ジアミノジフェニルプロパン、3,3’−ジエトキシ−4,4’−ジアミノジフェニルプロパン、3,3’,5,5’−テトラメチル−4,4’−ジアミノジフェニルメタン、3,3’,5,5’−テトラエチル−4,4’−ジアミノジフェニルメタン、ポリテトラメチレンオキシド−ジ−p−アミノベンゾエート、ポリエチレンオキシド−ジ−p−アミノベンゾエート、ポリプロピレンオキシド−ジ−p−アミノベンゾエート、4,4’−ビス(3−アミノフェノキシ)ビフェニル、4,4’−ビス(4−アミノフェノキシ)ビフェニル、1,3−ビス(3−アミノフェノキシ)ベンゼン、1,3−ビス(4−アミノフェノキシ)ベンゼン、1,4−ビス(4−アミノフェノキシ)ベンゼン、1,3−ビス[3−(アミノフェノキシ)フェノキシ]ベンゼン、ビス[4−(4−アミノフェノキシ)フェニル]エーテル、および2,2’−ビス[4−(4−アミノフェノキシ)フェニル]プロパンからなる群より選ばれることを特徴とする請求項1に記載の樹脂組成物。
- R1及びR2は、互いに独立して、置換又は非置換のC1−60脂肪族基の場合、式(1)で表される単位が前記架橋ポリマー総分子量の20〜90wt%を占め、且つ前記架橋ポリマーの室温における引張弾性率は0.1〜2.0GPaであることを特徴とする請求項1に記載の樹脂組成物。
- R1及びR2は、互いに独立して、置換又は非置換のC6−60アリール基の場合、式(1)で表される単位が前記架橋ポリマー総分子量の10〜80wt%を占め、且つ前記架橋ポリマーの室温における引張弾性率は0.1〜2.0GPaであることを特徴とする請求項1に記載の樹脂組成物。
- 前記架橋ポリマーは、ポリエチレングリコールジアミン、ポリプロピレングリコールジアミン、ポリブチレングリコールジアミン、ポリテトラメチレングリコールジアミン、ポリエチレングリコールとポリオキシエチレンビス(アミン)とのブロック共重合体、ポリエチレングリコールとポリ(ジアミンテトラメチレングリコール)とのブロック共重合体、ポリプロピレングリコールジアミンとポリブチレングリコールジアミンのブロック共重合体、ポリエチレングリコールジアミンとポリプロピレングリコールジアミンとポリブチレングリコールジアミンとのブロック共重合体からなる群より選ばれる二量体ジアミンから派生した繰返し単位を更に含むことを特徴とする請求項1に記載の樹脂組成物。
- 請求項1〜11のいずれか一項に記載の樹脂組成物を含有することを特徴とする絶縁基材。
- 基板と、
前記基板上に設けられ、且つ請求項1〜11のいずれか一項に記載の樹脂組成物を含有する絶縁層と、
を含むことを特徴とする回路基板。 - 前記基板と前記絶縁層の間に設けられる回路層を更に含むことを特徴とする請求項13に記載の回路基板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104140747 | 2015-12-04 | ||
TW104140747A TWI567110B (zh) | 2015-12-04 | 2015-12-04 | 樹脂組合物、以及包含此樹脂組合物之絕緣基材及電路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017101238A JP2017101238A (ja) | 2017-06-08 |
JP6377116B2 true JP6377116B2 (ja) | 2018-08-22 |
Family
ID=58407853
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016235188A Active JP6377116B2 (ja) | 2015-12-04 | 2016-12-02 | 樹脂組成物及びこれを含有する絶縁基材及び回路基板 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10280250B2 (ja) |
JP (1) | JP6377116B2 (ja) |
KR (1) | KR101939648B1 (ja) |
CN (1) | CN106916306B (ja) |
TW (1) | TWI567110B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230106750A (ko) | 2016-07-29 | 2023-07-13 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 박리 방법, 표시 장치, 표시 모듈, 및 전자 기기 |
TWI753868B (zh) * | 2016-08-05 | 2022-02-01 | 日商半導體能源研究所股份有限公司 | 剝離方法、顯示裝置、顯示模組及電子裝置 |
TWI730017B (zh) | 2016-08-09 | 2021-06-11 | 日商半導體能源研究所股份有限公司 | 顯示裝置的製造方法、顯示裝置、顯示模組及電子裝置 |
JP6591490B2 (ja) * | 2017-05-22 | 2019-10-16 | 株式会社大一商会 | 遊技機 |
JP6591486B2 (ja) * | 2017-05-22 | 2019-10-16 | 株式会社大一商会 | 遊技機 |
CN109438735B (zh) * | 2018-11-08 | 2021-07-20 | 株洲时代华鑫新材料技术有限公司 | 一种高导热聚酰亚胺基复合薄膜及其制备方法 |
CN114479076B (zh) * | 2021-12-31 | 2023-09-19 | 浙江中科玖源新材料有限公司 | 一种低介电聚酰亚胺薄膜及其制备方法、应用 |
CN115556450A (zh) * | 2022-09-26 | 2023-01-03 | 湖北慧狮塑业股份有限公司 | 一种超薄型聚烯烃干膜保护膜 |
CN115838580B (zh) * | 2022-11-22 | 2024-07-30 | 浙江中科玖源新材料有限公司 | 一种聚酰亚胺粘结剂及其制备方法、应用 |
CN117659661A (zh) * | 2023-12-06 | 2024-03-08 | 东莞市百富塑料科技有限公司 | 一种有机硅共聚物改性聚碳酸酯及其制备工艺 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4954601A (en) * | 1989-01-03 | 1990-09-04 | Dow Corning Corporation | Polyimide precursors and method for preparing crosslinked polyimides using said precursors |
JP3675958B2 (ja) * | 1996-06-05 | 2005-07-27 | 株式会社アルバック | 耐湿性絶縁膜の形成方法及び層間絶縁膜の形成方法 |
JPWO2005007756A1 (ja) * | 2003-05-21 | 2006-08-31 | 日立化成工業株式会社 | プライマ、樹脂付き導体箔、積層板並びに積層板の製造方法 |
WO2006028289A1 (en) * | 2004-09-10 | 2006-03-16 | Ube Industries, Ltd. | Modified polyimide resin and curable resin composition |
JP2008120954A (ja) * | 2006-11-14 | 2008-05-29 | Kaneka Corp | 新規なポリイミド樹脂 |
JP2008255249A (ja) * | 2007-04-05 | 2008-10-23 | Kaneka Corp | 新規な熱硬化性樹脂組成物、それを用いたフレキシブルプリント配線板 |
JP2012214670A (ja) * | 2011-03-30 | 2012-11-08 | Sanyo Chem Ind Ltd | ポリイミド樹脂 |
CN103298855B (zh) | 2011-07-08 | 2015-09-02 | 三井化学株式会社 | 聚酰亚胺树脂组合物及含有其的叠层体 |
CN103666645B (zh) * | 2012-09-26 | 2017-05-24 | 中国石油化工股份有限公司 | 一种无灰分散剂、其制备方法及润滑油组合物 |
JP5934658B2 (ja) * | 2013-01-29 | 2016-06-15 | Jxエネルギー株式会社 | イミド−ウレア化合物及びその製造方法、グリース用増ちょう剤並びにグリース組成物 |
US8974903B2 (en) * | 2013-03-14 | 2015-03-10 | Ohio Aerospace Institute | Porous cross-linked polyimide-urea networks |
JP6485996B2 (ja) * | 2013-06-14 | 2019-03-20 | ソマール株式会社 | ポリイミド共重合体オリゴマー、ポリイミド共重合体、およびそれらの製造方法 |
JP6325836B2 (ja) * | 2014-02-13 | 2018-05-16 | 三井化学株式会社 | ポリイミド樹脂組成物、及びそれを用いたカバーレイフィルム |
JP6234870B2 (ja) | 2014-04-01 | 2017-11-22 | エア・ウォーター株式会社 | ポリアミドイミド樹脂および当該ポリアミドイミド樹脂の製造方法 |
-
2015
- 2015-12-04 TW TW104140747A patent/TWI567110B/zh active
-
2016
- 2016-11-03 CN CN201610954362.3A patent/CN106916306B/zh active Active
- 2016-11-30 US US15/364,365 patent/US10280250B2/en active Active
- 2016-12-01 KR KR1020160162993A patent/KR101939648B1/ko active IP Right Grant
- 2016-12-02 JP JP2016235188A patent/JP6377116B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
TW201720856A (zh) | 2017-06-16 |
CN106916306B (zh) | 2020-11-17 |
JP2017101238A (ja) | 2017-06-08 |
KR20170070822A (ko) | 2017-06-22 |
TWI567110B (zh) | 2017-01-21 |
US20170158805A1 (en) | 2017-06-08 |
KR101939648B1 (ko) | 2019-01-18 |
US10280250B2 (en) | 2019-05-07 |
CN106916306A (zh) | 2017-07-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6377116B2 (ja) | 樹脂組成物及びこれを含有する絶縁基材及び回路基板 | |
TWI716524B (zh) | 覆銅積層體及印刷線路板 | |
CN107793991B (zh) | 柔性印刷布线板用覆铜层叠板和柔性印刷布线板 | |
TWI690578B (zh) | 黏著劑組成物、薄膜狀黏著材料、黏著層、黏著薄片、附有樹脂的銅箔、覆銅積層板、可撓性覆銅積層板、印刷線路板、可撓性印刷線路板、多層線路板、印刷電路板及可撓性印刷電路板 | |
EP1764381B1 (en) | Polycyclic polyimides and compositions and their corresponding polyamic acids | |
JP7446741B2 (ja) | 金属張積層板及び回路基板 | |
TW201840650A (zh) | 聚醯亞胺、黏著劑、薄膜狀黏著材料、黏著層、黏著片、附有樹脂之銅箔、覆銅積層板、印刷線路板、以及多層線路板及其製造方法 | |
TW201840649A (zh) | 聚醯亞胺、黏著劑、薄膜狀黏著材料、黏著層、黏著片、附有樹脂之銅箔、覆銅積層板、印刷線路板、以及多層線路板及其製造方法 | |
TW201736559A (zh) | 聚醯亞胺系黏著劑 | |
JP7469537B2 (ja) | ポリイミドの製造方法 | |
JP2020105493A (ja) | ポリイミド、ポリイミド樹脂組成物、ポリイミドフィルム、接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板及びプリント配線板、並びに、ポリイミドの製造方法 | |
TW202140622A (zh) | 樹脂膜、覆金屬層疊板及電路基板 | |
JP2019172898A (ja) | 樹脂組成物、シート状積層材料、プリント配線板及び半導体装置 | |
JP2021161387A (ja) | ポリイミド、架橋ポリイミド、接着剤フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板、回路基板及び多層回路基板 | |
JP2008303372A (ja) | 非対称構造を有するポリイミド前駆体、ポリイミドおよびそれらの製造方法 | |
TW202239931A (zh) | 黏合層、使用所述黏合層的電路基板及帶狀線 | |
TW201720858A (zh) | 聚醯亞胺聚合物、聚醯亞胺膜以及軟性銅箔基板 | |
TW200930563A (en) | Metal laminate | |
JP2005226059A (ja) | 樹脂組成物及びこれを用いた接着フィルム | |
TW202340323A (zh) | 聚醯亞胺樹脂、含有該聚醯亞胺樹脂之樹脂組成物及其硬化物 | |
TW202138434A (zh) | 聚醯亞胺、聚醯亞胺組成物、接著劑膜、及其應用 | |
JP4443176B2 (ja) | 接着補助剤組成物 | |
TWI789796B (zh) | 聚合物及其應用 | |
WO2023112443A1 (ja) | 熱硬化性組成物、接着シート、プリント配線板および電子機器 | |
JP2022101117A (ja) | 樹脂フィルム、金属張積層板及び回路基板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20171004 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20171017 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20180116 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180301 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180313 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180611 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180626 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180724 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6377116 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |