JP6372543B2 - 異方性導電フィルム及びその製造方法 - Google Patents
異方性導電フィルム及びその製造方法 Download PDFInfo
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- JP6372543B2 JP6372543B2 JP2016201524A JP2016201524A JP6372543B2 JP 6372543 B2 JP6372543 B2 JP 6372543B2 JP 2016201524 A JP2016201524 A JP 2016201524A JP 2016201524 A JP2016201524 A JP 2016201524A JP 6372543 B2 JP6372543 B2 JP 6372543B2
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- conductive particles
- connection layer
- insulating resin
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- connection
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- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/263—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer having non-uniform thickness
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- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
- B32B37/025—Transfer laminating
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- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
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- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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Description
第1接続層が、絶縁性樹脂層の第2接続層側の平面方向に導電粒子が単層で配列された構造を有し、隣接する導電粒子間の中央領域の絶縁性樹脂層厚が、導電粒子近傍の絶縁性樹脂層厚よりも薄くなっている異方性導電フィルムを提供する。
開口が形成された転写型の開口内に導電粒子を配置し、開口が形成された転写型の表面に、剥離フィルム上に形成された絶縁性樹脂層を対向させる工程。
剥離フィルム側から絶縁性樹脂層に対して圧力をかけ、開口内に絶縁性樹脂を押し込んで絶縁性樹脂層の表面に導電粒子を転着させ、それにより、絶縁性樹脂層の平面方向に導電粒子が単層で配列された構造であって、隣接する導電粒子間の中央領域の絶縁性樹脂層厚が、導電粒子近傍の絶縁性樹脂層厚よりも薄くなっている第1接続層を形成する工程。
第1接続層の導電粒子側表面に、主として絶縁性樹脂からなる第2接続層を形成する工程。
第2接続層と反対側の第1接続層の表面に、主として絶縁性樹脂からなる第3接続層を形成する工程。
開口が形成された転写型の開口内に導電粒子を配置し、開口が形成された転写型の表面に、予め第3接続層が貼り合わされた絶縁性樹脂層を対向させる工程。
剥離フィルム側から絶縁性樹脂層に対して圧力をかけ、開口内に絶縁性樹脂を押し込んで絶縁性樹脂層の表面に導電粒子を転着させ、それにより、絶縁性樹脂層の平面方向に導電粒子が単層で配列された構造であって、隣接する導電粒子間の中央領域の絶縁性樹脂層厚が、導電粒子近傍の絶縁性樹脂層厚よりも薄くなっている第1接続層を形成する工程。
第1接続層の導電粒子側表面に、主として絶縁性樹脂からなる第2接続層を形成する工程。
第2電子部品に対し、異方性導電フィルムをその第3接続層側から仮貼りし、仮貼りされた異方性導電フィルムに対し、第1電子部品を搭載し、第1電子部品側から熱圧着する接続方法を提供する。
図1Aに示すように、本発明の異方性導電フィルム100は、第1接続層1が、主として絶縁性樹脂からなる第2接続層2と第3接続層3とに挟持された3層構造を有する。この第1接続層1は、絶縁性樹脂層10の第2接続層2側の平面方向に導電粒子4が単層で配列されている構造を有する。この場合、導電粒子4は、平面方向に最密充填されていてもよいが、導電粒子4が平面方向に一定の間隔をあけて規則的に(例えば、正方格子状に)配列されていることが好ましい。また、隣接する導電粒子4間の中央領域の絶縁性樹脂層厚t1が、導電粒子4の近傍の絶縁性樹脂層厚t2よりも薄くなっている構造を有する。絶縁性樹脂層厚t1が絶縁性樹脂層厚t2よりも薄くなっていると、異方性導電接続の際、接続すべき端子間に存在せずに利用されなかった導電粒子4は、図1Bに示すように、異方性導電接続の際の加熱加圧により導電粒子4間の絶縁性樹脂層が溶断して導電粒子4を被覆して被覆層1dを形成することができるため、ショートの発生を抑制することができる。
このような第1接続層1を構成する絶縁性樹脂層10としては、公知の絶縁性樹脂層を適宜採用することができる。例えば、アクリレート化合物と熱又は光ラジカル重合開始剤とを含む熱又は光ラジカル重合型樹脂層又はそれを熱又は光ラジカル重合させたもの、またはエポキシ化合物と熱又は光カチオン若しくはアニオン重合開始剤とを含む熱又は光カチオン若しくはアニオン重合型樹脂層又はそれを熱又は光カチオン重合若しくはアニオン重合させたものを採用することができる。
第1接続層1を構成する絶縁性樹脂層10に使用するアクリレート化合物としては、従来公知のラジカル重合性アクリレートを使用することができる。例えば、単官能(メタ)アクリレート(ここで、(メタ)アクリレートにはアクリレートとメタクリレートとが包含される)、二官能以上の多官能(メタ)アクリレートを使用することができる。本発明においては、接着剤を熱硬化性とするために、アクリル系モノマーの少なくとも一部に多官能(メタ)アクリレートを使用することが好ましい。
光ラジカル重合開始剤としては、公知の光ラジカル重合開始剤の中から適宜選択して使用することができる。たとえは、アセトフェノン系光重合開始剤、ベンジルケタール系光重合開始剤、リン系光重合開始剤等が挙げられる。具体的には、アセトフェノン系光重合開始剤として、2−ヒドロキシ−2−シクロへキシルアセトフェノン(イルガキュア(IRGACURE)184、BASFジャパン(株))、α−ヒドロキシ−α,α′−ジメチルアセトフェノン(ダロキュア(DAROCUR)1173、BASFジャパン(株))、2,2−ジメトキシ−2−フェニルアセトフェノン(イルガキュア(IRGACURE)651、BASFジャパン(株))、4−(2−ヒドロキシエトキシ)フェニル(2−ヒドロキシ−2−プロピル)ケトン(ダロキュア(DAROCUR)2959、BASFジャパン(株))、2−ヒドロキシ−1−{4−[2−ヒドロキシ−2−メチル−プロピオニル]−ベンジル}フェニル}−2−メチル−プロパン−1−オン(イルガキュア(IRGACURE)127、BASFジャパン(株))等が挙げられる。ベンジルケタール系光重合開始剤として、ベンゾフェノン、フルオレノン、ジベンゾスベロン、4−アミノベンゾフェノン、4,4′−ジアミノベンゾフェノン、4−ヒドロキシベンゾフェノン、4−クロロベンゾフェノン、4,4′−ジクロロベンゾフェノン等が挙げられる。また、2−ベンジル−2−ジメチルアミノ−1−(4−モルフォリノフェニル)−ブタノン−1(イルガキュア(IRGACURE)369、BASFジャパン(株))も使用することができる。リン系光重合開始剤として、ビス(2,4,6−トリメチルベンゾイル)−フェニルフォスフィンオキサイド(イルガキュア(IRGACURE)819、BASFジャパン(株))、(2,4,6−トリメチルベンゾイル−ジフェニルフォスフィンオキサイド(ダロキュア(DAROCUR)TPO、BASFジャパン(株))等が挙げられる。
また、熱ラジカル重合開始剤としては、例えば、有機過酸化物やアゾ系化合物等が挙げられるが、気泡の原因となる窒素を発生しない有機過酸化物を好ましく使用することができる。
また、第1接続層1を構成する絶縁性樹脂層10を、エポキシ化合物と熱又は光カチオン若しくはアニオン重合開始剤とを含有する熱又は光カチオン若しくはアニオン重合型樹脂層、又はそれらを熱又は光ラジカル重合させたものから構成してもよい。
熱カチオン重合開始剤としては、エポキシ化合物の熱カチオン重合開始剤として公知のものを採用することができ、例えば、熱により、カチオン重合型化合物をカチオン重合させ得る酸を発生するものであり、公知のヨードニウム塩、スルホニウム塩、ホスホニウム塩、フェロセン類等を用いることができ、温度に対して良好な潜在性を示す芳香族スルホニウム塩を好ましく使用することができる。熱カチオン系重合開始剤の好ましい例としては、ジフェニルヨードニウムヘキサフルオロアンチモネート、ジフェニルヨードニウムヘキサフルオロホスフェート、ジフェニルヨードニウムヘキサフルオロボレート、トリフェニルスルフォニウムヘキサフルオロアンチモネート、トリフェニルスルフォニウムヘキサフルオロホスフェート、トリフェニルスルフォニウムヘキサフルオロボレートが挙げられる。具体的には、(株)ADEKA製SP−150、SP−170、CP−66、CP−77;日本曹達(株)製のCI−2855、CI−2639;三新化学工業(株)製のサンエイドSI−60、SI−80;ユニオンカーバイド社製のCYRACURE−UVI−6990、UVI−6974等が挙げられる。
熱アニオン重合開始剤としては、エポキシ化合物の熱アニオン重合開始剤として公知のものを採用することができ、例えば、熱により、アニオン重合性化合物をアニオン重合させ得る塩基を発生するものであり、公知の脂肪族アミン系化合物、芳香族アミン系化合物、二級又は三級アミン系化合物、イミダゾール系化合物、ポリメルカプタン系化合物、三フッ化ホウ素−アミン錯体、ジシアンジアミド、有機酸ヒドラジッド等を用いることができ、温度に対して良好な潜在性を示すカプセル化イミダゾール系化合物を好ましく使用することができる。具体的には、旭化成イーマテリアルズ(株)製ノバキュアHX3941HP等が挙げられる。
エポキシ化合物用の光カチオン重合開始剤又は光アニオン重合開始剤としては、公知のものを適宜使用することができる。
第1接続層1を構成する導電粒子4としては、従来公知の異方性導電フィルムに用いられているものの中から適宜選択して使用することができる。例えばニッケル、コバルト、銀、銅、金、パラジウムなどの金属粒子、金属被覆樹脂粒子などが挙げられる。2種以上を併用することもできる。
第1接続層1には、必要に応じて、フェノキシ樹脂、エポキシ樹脂、不飽和ポリエステル樹脂、飽和ポリエステル樹脂、ウレタン樹脂、ブタジエン樹脂、ポリイミド樹脂、ポリアミド樹脂、ポリオレフィン樹脂などの膜形成樹脂を併用することができる。
第2接続層2及び第3接続層3は、いずれも主として絶縁性樹脂から形成されるものである。絶縁性樹脂としては、公知の絶縁性樹脂の中から、適宜選択して使用することができる。第1接続層1の絶縁性樹脂層10と同様な材質から形成することができる。
次に、本発明の異方性導電フィルムの製造方法の一例を説明する。この製造方法は、以下の工程(A)〜(D)を有する。以下工程毎に説明する。
図2Aに示すように、開口21が形成された転写型20の開口21内に導電粒子4を配置し、図2Bに示すように、開口21が形成された転写型20の表面に、剥離フィルム22上に形成された絶縁性樹脂層10を対向させる。
次に、図3Aに示すように、剥離フィルム22側から絶縁性樹脂層10に対して圧力をかけ、開口21内に絶縁性樹脂を押し込んで絶縁性樹脂層10の表面に導電粒子4を埋め込むように転着させる。これにより、図3Bに示すような、絶縁性樹脂層10の平面方向に導電粒子4が単層で配列された構造であって、隣接する導電粒子4間の中央領域の絶縁性樹脂層厚が、導電粒子近傍の絶縁性樹脂層厚よりも薄くなっている第1接続層1を形成する。この場合、隣接する導電粒子4間で絶縁性樹脂層厚が実施的に0となってもよい(図1C参照)。実質的に0になると、接続後の個々の導電粒子の独立性が高まり、接続時に導電粒子が互いに連結することを防止し易くなる。
次に、図4に示すように、第1接続層1の導電粒子4側表面に、主として絶縁性樹脂からなる第2接続層2を形成する。これにより、第1接続層と第2接続層の境界が起伏した状態、換言すればその形状が波型ないしは凹凸型となる。このように、フィルム内に存在する層に起伏のある形状を適用することで、接合時の主にバンプに対しての接触面積を増加させる確率を高めることができ、その結果、接着強度の向上が期待できる。
次に、剥離フィルム22を取り除いたのち、第2接続層2と反対側の第1接続層1の表面に、主として絶縁性樹脂からなる第3接続層3を形成する。これにより、図5に示す異方性導電フィルム100が得られる。
また、本発明の異方性導電フィルムの別の製造方法の例を説明する。この製造方法は、剥離フィルム22に代えて第3接続層3を使用する態様であり、以下の工程(a)〜(c)を有する。以下工程毎に説明する。
図6Aに示すように、開口21が形成された転写型20の開口21内に導電粒子4を配置し、図6Bに示すように、開口21が形成された転写型20の表面に、予め第3接続層3が貼り合わされた絶縁性樹脂層10を対向させる。
次に、図7Aに示すように、第3接続層3側から絶縁性樹脂層10に対して圧力をかけ、開口21内に絶縁性樹脂を押し込んで絶縁性樹脂層10の表面に導電粒子4を転着させる。これにより、図7Bに示すような、絶縁性樹脂層10の平面方向に導電粒子4が単層で配列された構造であって、隣接する導電粒子4間の中央領域の絶縁性樹脂層厚が、導電粒子近傍の絶縁性樹脂層厚よりも薄くなっている第1接続層1を形成する。この場合、隣接する導電粒子4間で絶縁性樹脂層厚が実施的に0となってもよい(図1C参照)。実質的に0になると、接続後の個々の導電粒子の独立性が高まり、接続時に導電粒子が互いに連結することを防止し易くなる。
次に、第1接続層1の導電粒子4側表面に、主として絶縁性樹脂からなる第2接続層2を形成する。これにより、図8に示す異方性導電フィルム100が得られる。
このようにして得られた異方性導電フィルムは、ICチップ、ICモジュールなどの第1電子部品と、フレキシブル基板、ガラス基板などの第2電子部品とを熱又は光により異方性導電接続する際に好ましく適用することができる。このようにして得られる接続構造体も本発明の一部である。この場合、配線基板などの第2電子部品に対し、異方性導電フィルムをその第3接続層側から仮貼りし、仮貼りされた異方性導電フィルムに対し、ICチップなどの第1電子部品を搭載し、第1電子部品側から熱圧着することが、接続信頼性を高める点から好ましい。また、光硬化を利用して接続することもできる。
表1又は表2に記載された配合に従って、アクリレート及び光ラジカル重合開始剤等を酢酸エチル又はトルエンにて固形分が50質量%となるように混合液を調製した。この混合液を、厚さ50μmのポリエチレンテレフタレートフィルム(PETフィルム)に、乾燥厚が5μmとなるように塗布し、80℃のオーブン中で5分間乾燥することにより、第1接続層となる光ラジカル重合型の絶縁性樹脂層を形成した。
表1に記載された配合に従って、実施例1と同様に第1接続層の前駆層である光ラジカル重合型の絶縁性樹脂層を形成した。
表1の第1接続層用の樹脂組成物に実施例1で使用したものと同じ導電粒子を1平方mm当たり20000個となるように均一に分散した混合物から、厚さ6μmの導電粒子含有樹脂フィルムを作成した。このフィルムに対し、実施例1と同様に作成した厚さ12μmの第2接続層を、60℃で0.5MPaという条件で貼り付けることにより2層構造の異方性導電フィルムを作成した。
得られた異方性導電フィルムにおける導電粒子間の平面方向均等配列について、平面均等配列が形成されている場合にはその適用があり(有)とし、それ以外を適用なし(無)とする。また、導電粒子近傍の絶縁性樹脂層厚について、導電粒子間の中間領域の絶縁性樹脂層厚(層厚0も含む)よりも大きい場合には、導電粒子近傍の絶縁性樹脂層厚の増大があり(有)とし、それ以外の場合をなし(無)とした。その結果を表1又は表2に示す。なお、異方性導電フィルムの構成層数も併せて示す。
接続構造サンプル体を構成する第1接続層及び第2接続層のそれぞれの最低溶融粘度を、回転式レオメータ(TA Instruments社)を用い、昇温速度10℃/分;測定圧力5g一定;使用測定プレート直径8mmという条件で測定した。
“加熱・加圧前の接続構造サンプル体のバンプ上に存在する理論粒子量”に対する“加熱・加圧後(実際の実装後)の接続構造サンプル体のバンプ上で実際に捕捉されている粒子量”の割合を以下の数式に従って求めた。実用上、50%以上であることが望ましい。
接続構造サンプル体を、85℃、85%RHの高温高湿環境下に放置し、初期と500時間経過後の導通抵抗値を測定した。実用上、500時間経過後でも抵抗値10Ω以下であることが望ましい。
7.5μmスペースの櫛歯TEGパターンのショート発生率を求めた。実用上、100ppm以下であることが望ましい。
1X 第1接続層における硬化率の低い領域
1Y 第1接続層における硬化率の高い領域
1d 被覆層
2 第2接続層
3 第3接続層
3a 第3接続層の表面
4 導電粒子
10 絶縁性樹脂層
20 転写型
21 開口
22 剥離フィルム
100 異方性導電フィルム
L 導電粒子間距離
P 導電粒子間距離の中間点
t1、t2 絶縁性樹脂層厚
Claims (5)
- 主として絶縁性樹脂からなる第1接続層と第2接続層とが積層された、異方性導電フィルムを製造するための中間生成物フィルムであって、
第1接続層中に導電粒子が配列しており、
第1接続層における導電粒子近傍の絶縁性樹脂は、第2接続層の方向に起伏を有している中間生成物フィルム。 - 第1接続層における導電粒子近傍の絶縁性樹脂が、中間生成物フィルムの平面方向に対し傾斜している請求項1記載の中間生成物フィルム。
- 第1接続層における導電粒子近傍の絶縁性樹脂が、山型になっている請求項1又は2記載の中間生成物フィルム。
- 第1接続層中に導電粒子が、孤立して配列している請求項1〜3のいずれかに記載の中間生成物フィルム。
- 導電粒子が、第2接続層に食い込んでいる請求項1〜4のいずれかに記載の中間生成物フィルム。
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