JP6372542B2 - 異方性導電フィルムの製造方法及び異方性導電フィルム - Google Patents
異方性導電フィルムの製造方法及び異方性導電フィルム Download PDFInfo
- Publication number
- JP6372542B2 JP6372542B2 JP2016201405A JP2016201405A JP6372542B2 JP 6372542 B2 JP6372542 B2 JP 6372542B2 JP 2016201405 A JP2016201405 A JP 2016201405A JP 2016201405 A JP2016201405 A JP 2016201405A JP 6372542 B2 JP6372542 B2 JP 6372542B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive particles
- connection layer
- insulating resin
- layer
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/20—Making multilayered or multicoloured articles
- B29C43/203—Making multilayered articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D7/00—Producing flat articles, e.g. films or sheets
- B29D7/01—Films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/263—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer having non-uniform thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/28—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer comprising a deformed thin sheet, i.e. the layer having its entire thickness deformed out of the plane, e.g. corrugated, crumpled
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/08—Interconnection of layers by mechanical means
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2505/00—Use of metals, their alloys or their compounds, as filler
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0005—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/412—Transparent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2363/00—Epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2398/00—Unspecified macromolecular compounds
- B32B2398/10—Thermosetting resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/27001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/27003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the layer preform
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/27001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/27005—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for aligning the layer connector, e.g. marks, spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/271—Manufacture and pre-treatment of the layer connector preform
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29075—Plural core members
- H01L2224/29076—Plural core members being mutually engaged together, e.g. through inserts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29075—Plural core members
- H01L2224/2908—Plural core members being stacked
- H01L2224/29083—Three-layer arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29199—Material of the matrix
- H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29499—Shape or distribution of the fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/832—Applying energy for connecting
- H01L2224/83201—Compression bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24612—Composite web or sheet
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Wire Bonding (AREA)
- Laminated Bodies (AREA)
Description
開口が形成された光透過性の転写型の開口内に導電粒子を配置し、開口が形成された転写型の表面に、剥離フィルム上に形成された光重合性絶縁性樹脂層を対向させる工程。
剥離フィルム側から光重合性絶縁性樹脂層に対して圧力をかけ、開口内に光重合性絶縁性樹脂を押し込んで光重合性絶縁性樹脂層の表面に導電粒子を転着させ、それにより、光重合性絶縁性樹脂層の平面方向に導電粒子が単層で配列された構造であって、隣接する導電粒子間の中央領域の光重合性絶縁性樹脂層厚が、導電粒子近傍の光重合性絶縁性樹脂層厚よりも薄くなっている構造の第1接続層を形成する工程。
光透過性の転写型側から、第1接続層に対して紫外線を照射する工程。
剥離フィルムを第1接続層から除去する工程。
光透過性の転写型と反対側の第1接続層の表面に主として絶縁性樹脂からなる第2接続層を形成する工程。
第2接続層と反対側の第1接続層の表面に、主として絶縁性樹脂からなる第3接続層を形成する工程。
第2電子部品に対し、異方性導電フィルムをその第3接続層側から仮貼りし、仮貼りされた異方性導電フィルムに対し、第1電子部品を搭載し、第1電子部品側から熱圧着する接続方法、及びこの接続方法により得られる異方性導電接続構造体を提供する。
第1接続層と第3接続層の境界が起伏しており、
第1接続層が、絶縁性樹脂層の第3接続層側の平面方向に導電粒子が単層で配列された構造を有し、隣接する導電粒子間の中央領域の絶縁性樹脂層厚が、導電粒子近傍の絶縁性樹脂層厚よりも薄くなっている異方性導電フィルムを提供する。
以下、本発明の異方性導電フィルムの製造方法を工程毎に詳細に説明する。
図1Aに示すように、開口21が形成された光透過性の転写型20の開口21内に導電粒子4を配置し、図1Bに示すように、開口21が形成された転写型20の表面に、剥離処理したポリエチレンテレフタレートフィルム等の剥離フィルム22上に形成された光重合性絶縁性樹脂層10を対向させる。
次に、図2Aに示すように、剥離フィルム22側から光重合性絶縁性樹脂層10に対して圧力をかけ、開口21内に光重合性絶縁性樹脂を押し込んで光重合性絶縁性樹脂層10の表面に導電粒子4を埋め込むように転着させる。これにより、図2Bに示すように、光重合性絶縁性樹脂層10の平面方向に導電粒子4が単層で配列された構造であって、隣接する導電粒子4間の中央領域の光重合性絶縁性樹脂層厚t1が、導電粒子4の近傍の光重合性絶縁性樹脂層厚t2よりも薄くなっている第1接続層1を形成する。
次に、図3に示すように、光透過性の転写型20側から、第1接続層1に対し、紫外線を照射する。これにより、第1接続層1を構成する光重合性絶縁性樹脂10を重合硬化させて導電粒子4を第1接続層1に安定的に保持させることができ、しかも、導電粒子4で紫外線が遮られていた導電粒子4の下方領域1Xの光重合性絶縁性樹脂の硬化率を、その周囲の領域1Yの硬化率に比べ相対的に低くすることができ、異方性導電接続の際の導電粒子4の押し込み性を向上させることができる。こうすることにより、異方性導電接続の際に、導電粒子の位置ズレを防止しつつ(換言すれば、粒子捕捉効率を向上させつつ)、導電粒子の押し込み性を向上させ、導通抵抗値を低下させ、良好な導通信頼性を実現することができる。
次に、図4に示すように、剥離フィルム22を第1接続層1から除去する。除去の手法には特に制限はない。
続いて、図5に示すように、光透過性の転写型20と反対側の第1接続層1の表面に主として絶縁性樹脂からなる第2接続層2を形成する。
次に、図6に示すように、第2接続層2と反対側の第1接続層1の表面(導電粒子が突出している面)に、主として絶縁性樹脂からなる第3接続層3を形成することにより異方性導電フィルム100が得られる。これにより、第1接続層と第3接続層の境界が起伏した状態、換言すればその形状が波型ないしは凹凸型となる。このように、フィルム内に存在する層に起伏のある形状を適用することで、接合時の主にバンプに対しての接触面積を増加させる確率を高めることができ、その結果、接着強度の向上が期待できる。また、このように起伏が存在することによって、上述した第3接続層3に粒子が存在する状態が得られやすくなる。第1接続層1の起伏が隆起していない部分に存在する粒子が、第3接続層3を設ける過程でそちらに移動するからである。
本発明の製造方法により得られた図6に示す異方性導電フィルム100は、既に説明したように、第1接続層1が、主として絶縁性樹脂からなる第2接続層2と第3接続層3とに挟持された3層構造を有する。この第1接続層1は、異方性導電フィルム100の製造の際に使用した転写型の開口パターンに応じて、光重合性絶縁性樹脂層10の第3接続層3側に突出するように平面方向に導電粒子4が単層で配列されている構造を有する。この場合、導電粒子が平面方向に一定の間隔をあけて規則的に配列されている均等の状態で配列されていることが好ましい。また、隣接する導電粒子4間の中央領域の光重合性絶縁性樹脂層厚t1が、導電粒子4の近傍の光重合性絶縁性樹脂層厚t2よりも薄くなっている構造を有する。このため、接続すべき端子間に存在せずに利用されなかった導電粒子4は、図7に示すような挙動を示す。即ち、異方性導電接続の際の加熱加圧により、導電粒子4間の相対的に薄い絶縁性樹脂層は、溶断して導電粒子4を被覆して被覆層1dを形成する。よって、ショートの発生が大きく抑制される。
このような第1接続層1を構成する光重合性絶縁性樹脂層10としては、公知の絶縁性樹脂層を適宜採用することができる。例えば、アクリレート化合物と熱又は光ラジカル重合開始剤とを含む熱又は光ラジカル重合型樹脂層又はそれを熱又は光ラジカル重合させたもの、またはエポキシ化合物と熱又は光カチオン若しくはアニオン重合開始剤とを含む熱又は光カチオン若しくはアニオン重合型樹脂層又はそれを熱又は光カチオン重合若しくはアニオン重合させたものを採用することができる。
第1接続層1を構成する光重合性絶縁性樹脂層10に使用するアクリレート化合物としては、従来公知のラジカル重合性アクリレートを使用することができる。例えば、単官能(メタ)アクリレート(ここで、(メタ)アクリレートにはアクリレートとメタクリレートとが包含される)、二官能以上の多官能(メタ)アクリレートを使用することができる。本発明においては、接着剤を熱硬化性とするために、アクリル系モノマーの少なくとも一部に多官能(メタ)アクリレートを使用することが好ましい。
光ラジカル重合開始剤としては、公知の光ラジカル重合開始剤の中から適宜選択して使用することができる。たとえは、アセトフェノン系光重合開始剤、ベンジルケタール系光重合開始剤、リン系光重合開始剤等が挙げられる。具体的には、アセトフェノン系光重合開始剤として、2−ヒドロキシ−2−シクロへキシルアセトフェノン(イルガキュア(IRGACURE)184、BASFジャパン社製)、α−ヒドロキシ−α,α′−ジメチルアセトフェノン(ダロキュア(DAROCUR)1173、BASFジャパン社製)、2,2−ジメトキシ−2−フェニルアセトフェノン(イルガキュア(IRGACURE)651、BASFジャパン社製)、4−(2−ヒドロキシエトキシ)フェニル(2−ヒドロキシ−2−プロピル)ケトン(ダロキュア(DAROCUR)2959、BASFジャパン社製)、2−ヒドロキシ−1−{4−[2−ヒドロキシ−2−メチル−プロピオニル]−ベンジル}フェニル}−2−メチル−プロパン−1−オン(イルガキュア(IRGACURE)127、BASFジャパン社製)等が挙げられる。ベンジルケタール系光重合開始剤として、ベンゾフェノン、フルオレノン、ジベンゾスベロン、4−アミノベンゾフェノン、4,4′−ジアミノベンゾフェノン、4−ヒドロキシベンゾフェノン、4−クロロベンゾフェノン、4,4′−ジクロロベンゾフェノン等が挙げられる。また、2−ベンジル−2−ジメチルアミノ−1−(4−モルフォリノフェニル)−ブタノン−1(イルガキュア(IRGACURE)369、BASFジャパン社製)も使用することができる。リン系光重合開始剤として、ビス(2,4,6−トリメチルベンゾイル)−フェニルフォスフィンオキサイド(イルガキュア(IRGACURE)819、BASFジャパン社製)、(2,4,6−トリメチルベンゾイル−ジフェニルフォスフィンオキサイド(ダロキュア(DAROCUR)TPO、BASFジャパン社製)等が挙げられる。
また、熱ラジカル重合開始剤としては、例えば、有機過酸化物やアゾ系化合物等が挙げられるが、気泡の原因となる窒素を発生しない有機過酸化物を好ましく使用することができる。
また、第1接続層1を構成する光重合性絶縁性樹脂層10を、エポキシ化合物と熱又は光カチオン若しくはアニオン重合開始剤とを含有する熱又は光カチオン若しくはアニオン重合型樹脂層、又はそれらを熱又は光ラジカル重合させたものから構成してもよい。
熱カチオン重合開始剤としては、エポキシ化合物の熱カチオン重合開始剤として公知のものを採用することができ、例えば、熱により、カチオン重合型化合物をカチオン重合させ得る酸を発生するものであり、公知のヨードニウム塩、スルホニウム塩、ホスホニウム塩、フェロセン類等を用いることができ、温度に対して良好な潜在性を示す芳香族スルホニウム塩を好ましく使用することができる。熱カチオン系重合開始剤の好ましい例としては、ジフェニルヨードニウムヘキサフルオロアンチモネート、ジフェニルヨードニウムヘキサフルオロホスフェート、ジフェニルヨードニウムヘキサフルオロボレート、トリフェニルスルフォニウムヘキサフルオロアンチモネート、トリフェニルスルフォニウムヘキサフルオロホスフェート、トリフェニルスルフォニウムヘキサフルオロボレートが挙げられる。具体的には、(株)ADEKA製のSP−150、SP−170、CP−66、CP−77;日本曹達(株)製のCI−2855、CI−2639;三新化学工業(株)製のサンエイドSI−60、SI−80;ユニオンカーバイド社製のCYRACURE−UVI−6990、UVI−6974等が挙げられる。
向があり、多すぎると剛性低下の原因となることが懸念されるので、エポキシ化合物10
0質量部に対し、好ましくは0.1〜25質量部、より好ましくは0.5〜15質量部で
ある。
熱アニオン重合開始剤としては、エポキシ化合物の熱アニオン重合開始剤として公知のものを採用することができ、例えば、熱により、アニオン重合性化合物をアニオン重合させ得る塩基を発生するものであり、公知の脂肪族アミン系化合物、芳香族アミン系化合物、二級又は三級アミン系化合物、イミダゾール系化合物、ポリメルカプタン系化合物、三フッ化ホウ素−アミン錯体、ジシアンジアミド、有機酸ヒドラジッド等を用いることができ、温度に対して良好な潜在性を示すカプセル化イミダゾール系化合物を好ましく使用することができる。具体的には、旭化成イーマテリアルズ(株)製ノバキュアHX3941HP等が挙げられる。
エポキシ化合物用の光カチオン重合開始剤又は光アニオン重合開始剤としては、公知のものを適宜使用することができる。
第1接続層1を構成する導電粒子4としては、従来公知の異方性導電フィルムに用いられているものの中から適宜選択して使用することができる。例えばニッケル、コバルト、銀、銅、金、パラジウムなどの金属粒子、金属被覆樹脂粒子などが挙げられる。2種以上を併用することもできる。
第1接続層1には、必要に応じて、フェノキシ樹脂、エポキシ樹脂、不飽和ポリエステル樹脂、飽和ポリエステル樹脂、ウレタン樹脂、ブタジエン樹脂、ポリイミド樹脂、ポリアミド樹脂、ポリオレフィン樹脂などの膜形成樹脂を併用することができる。
第2接続層2及び第3接続層3は、いずれも主として絶縁性樹脂から形成されるものである。絶縁性樹脂としては、公知の絶縁性樹脂の中から、適宜選択して使用することができる。第1接続層1の光重合性絶縁性樹脂層10と同様な材質から形成することができる。
このようにして得られた異方性導電フィルムは、ICチップ、ICモジュールなどの第1電子部品と、フレキシブル基板、ガラス基板などの第2電子部品とを熱又は光により異方性導電接続する際に好ましく適用することができる。このようにして得られる接続構造体も本発明の一部である。この場合、配線基板などの第2電子部品に対し、異方性導電フィルムをその第2接続層側から仮貼りし、仮貼りされた異方性導電フィルムに対し、ICチップなどの第1電子部品を搭載し、第1電子部品側から熱圧着することが、接続信頼性を高める点から好ましい。光により接続する場合は、熱圧着と併用させてもよい。
表1に示す配合組成に従い、アクリレート及び光ラジカル重合開始剤等を酢酸エチル又はトルエンにて固形分が50質量%となるように混合液を調製した。この混合液を、厚さ50μmの剥離処理ポリエチレンテレフタレートフィルム(剥離PETフィルム)に、乾燥厚が5μmとなるように塗布し、80℃のオーブン中で5分間乾燥することにより、第1接続層となる光ラジカル重合型の絶縁性樹脂層を形成した。
実施例1と同様に第1接続層の前駆層である光ラジカル重合型の絶縁性樹脂層を形成した。
表1の第1接続層用の樹脂組成物に実施例1で使用したものと同じ導電粒子を均一に分散した混合物から、厚さ6μmの導電粒子含有樹脂フィルムを作成した。この導電粒子含有樹脂フィルム中の導電粒子の存在量は、1平方mm当たり20000個であった。このフィルムに対し、実施例1と同様に作成した厚さ12μmの第2接続層を、60℃で0.5MPaという条件で貼り付けることにより2層構造の異方性導電フィルムを作成した。
得られた異方性導電フィルムにおける導電粒子間の平面方向均等配列について、平面均等配列が形成されている場合にはその適用があり(有)とし、それ以外を適用なし(無)とする。また、導電粒子近傍の絶縁性樹脂層厚について、導電粒子間の中間領域の絶縁性樹脂層厚(層厚0も含む)よりも大きい場合には、導電粒子近傍の絶縁性樹脂層厚の増大があり(有)とし、それ以外の場合をなし(無)とした。その結果を表1に示す。なお、異方性導電フィルムの構成層数も併せて示す。
接続構造サンプル体を構成する第1接続層及び第2接続層のそれぞれの最低溶融粘度を、回転式レオメータ(TA Instruments社)を用い、昇温速度10℃/分;測定圧力5g一定;使用測定プレート直径8mmという条件で測定した。
“加熱・加圧前の接続構造サンプル体のバンプ上に存在する理論粒子量”に対する“加熱・加圧後(実際の実装後)の接続構造サンプル体のバンプ上で実際に捕捉されている粒子量”の割合を以下の数式に従って求めた。実用上、40%以上であることが望ましい。
接続構造サンプル体を、85℃、85%RHの高温高湿環境下に放置し、初期と500時間経過後の導通抵抗値を測定した。実用上、500時間経過後でも抵抗値10Ω以下であることが望ましい。
7.5μmスペースの櫛歯TEGパターンのショート発生率を求めた。実用上、100ppm以下であることが望ましい。
表2に示すように第1接続層を形成する際に、剥離フィルム側からの加圧条件を調整することにより、隣接する導電粒子間の中央領域の光重合性絶縁性樹脂層厚t1(図2B参照)を、導電粒子近傍の光重合性絶縁性樹脂層厚t2(図2B参照)に対して表2の割合[t1/t2]となるようにすること以外、実施例1と同様に異方性導電フィルムを製造した。
得られた異方性導電フィルムにおける導電粒子間の平面方向均等配列について、実施例1と同様に評価した。得られた結果を表2に示す。なお、異方性導電フィルムの構成層数も併せて示す。
接続構造サンプル体を、85℃、85%RHの高温高湿環境下に放置し、100時間間隔で取り出して導通抵抗の上昇を確認した。導通抵抗が50Ωを超えた時間を不良発生時間とした。実用上、1000時間以上であることが望ましい。
表3に示すように第1接続層を形成する際に、剥離フィルム側からの加圧条件を調整することにより、隣接する導電粒子間の中央領域の光重合性絶縁性樹脂層厚t1(図2B参照)を、導電粒子近傍の光重合性絶縁性樹脂層厚t2(図2B参照)に対して表2の割合[t1/t2]となるように、必要に応じて第1接続層形成後に、公知のワイプ手段、例えばスキージなどを用いて、第1接続層の表面をワイプすること以外、実施例1と同様に異方性導電フィルムを製造した。
得られた異方性導電フィルムにおける導電粒子間の平面方向均等配列について、平面均等配列が形成されている場合にはその適用があり(有)とし、それ以外を適用なし(無)とする。また、導電粒子近傍の絶縁性樹脂層厚について、導電粒子間の中間領域の絶縁性樹脂層厚(層厚0も含む)よりも大きい場合には、導電粒子近傍の絶縁性樹脂層厚の増大があり(有)とし、それ以外の場合をなし(無)とした。その結果を表1又は表2に示す。なお、異方性導電フィルムの構成層数も併せて示す。
接続構造サンプル体を、85℃、85%RHの高温高湿環境下に放置し、100時間間隔で取り出して導通抵抗の上昇を確認した。導通抵抗が50Ωを超えた時間を不良発生時間とした。実用上、1000時間以上であることが望ましい。
1X 第1接続層における硬化率の低い領域
1Y 第1接続層における硬化率の高い領域
2 第2接続層
3 第3接続層
4 導電粒子
10 光重合性絶縁性樹脂層
20 光透過性の転写型
21 開口
22 剥離フィルム
100 異方性導電フィルム
Claims (3)
- 主として絶縁性樹脂からなる第1接続層と第2接続層とが積層された、異方性導電フィルムを製造するための中間生成物フィルムであって、
第1接続層中に導電粒子が配列しており、
第1接続層における導電粒子近傍の絶縁性樹脂は、第2接続層が設けられていない方向に起伏を有している中間生成物フィルム。 - 第1接続層における導電粒子近傍の絶縁性樹脂が、中間生成物フィルムの平面方向に対し傾斜している請求項1記載の中間生成物フィルム。
- 導電粒子が第1接続層から突出している請求項1又は2記載の中間生成物フィルム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012184886 | 2012-08-24 | ||
JP2012184886 | 2012-08-24 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013173698A Division JP6024621B2 (ja) | 2012-08-24 | 2013-08-23 | 異方性導電フィルムの製造方法及び異方性導電フィルム |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018086166A Division JP2018137237A (ja) | 2012-08-24 | 2018-04-27 | 異方性導電フィルムの製造方法及び異方性導電フィルム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017027956A JP2017027956A (ja) | 2017-02-02 |
JP6372542B2 true JP6372542B2 (ja) | 2018-08-15 |
Family
ID=50150056
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013173698A Active JP6024621B2 (ja) | 2012-08-24 | 2013-08-23 | 異方性導電フィルムの製造方法及び異方性導電フィルム |
JP2016201405A Active JP6372542B2 (ja) | 2012-08-24 | 2016-10-13 | 異方性導電フィルムの製造方法及び異方性導電フィルム |
JP2018086166A Pending JP2018137237A (ja) | 2012-08-24 | 2018-04-27 | 異方性導電フィルムの製造方法及び異方性導電フィルム |
JP2019168643A Active JP7170612B2 (ja) | 2012-08-24 | 2019-09-17 | 異方性導電フィルムの製造方法及び異方性導電フィルム |
JP2021132546A Pending JP2021184392A (ja) | 2012-08-24 | 2021-08-17 | 異方性導電フィルムの製造方法及び異方性導電フィルム |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013173698A Active JP6024621B2 (ja) | 2012-08-24 | 2013-08-23 | 異方性導電フィルムの製造方法及び異方性導電フィルム |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018086166A Pending JP2018137237A (ja) | 2012-08-24 | 2018-04-27 | 異方性導電フィルムの製造方法及び異方性導電フィルム |
JP2019168643A Active JP7170612B2 (ja) | 2012-08-24 | 2019-09-17 | 異方性導電フィルムの製造方法及び異方性導電フィルム |
JP2021132546A Pending JP2021184392A (ja) | 2012-08-24 | 2021-08-17 | 異方性導電フィルムの製造方法及び異方性導電フィルム |
Country Status (7)
Country | Link |
---|---|
US (3) | US10272598B2 (ja) |
JP (5) | JP6024621B2 (ja) |
KR (5) | KR102259384B1 (ja) |
CN (3) | CN107254263A (ja) |
HK (1) | HK1205364A1 (ja) |
TW (1) | TWI547538B (ja) |
WO (1) | WO2014030753A1 (ja) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102259384B1 (ko) | 2012-08-24 | 2021-06-02 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름의 제조 방법 및 이방성 도전 필름 |
CN104541411B (zh) * | 2012-08-24 | 2018-07-27 | 迪睿合电子材料有限公司 | 各向异性导电膜及其制造方法 |
JP6289831B2 (ja) * | 2013-07-29 | 2018-03-07 | デクセリアルズ株式会社 | 導電性接着フィルムの製造方法、導電性接着フィルム、接続体の製造方法 |
KR101987917B1 (ko) * | 2013-07-31 | 2019-06-11 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름 및 그의 제조 방법 |
KR101659139B1 (ko) * | 2014-01-29 | 2016-09-22 | 제일모직주식회사 | 접착층을 포함하는 이방 도전성 필름 및 상기 필름에 의해 접속된 반도체 장치 |
WO2015141830A1 (ja) * | 2014-03-20 | 2015-09-24 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
KR102430609B1 (ko) * | 2014-03-31 | 2022-08-08 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름 및 그 제조 방법 |
KR101721732B1 (ko) * | 2014-07-25 | 2017-04-10 | 삼성에스디아이 주식회사 | 접착 조성물, 이방 도전성 필름 및 이를 이용한 반도체 장치 |
JP7052254B2 (ja) * | 2016-11-04 | 2022-04-12 | デクセリアルズ株式会社 | フィラー含有フィルム |
JP6967832B2 (ja) | 2014-10-28 | 2021-11-17 | デクセリアルズ株式会社 | エンボスフィルム、枚葉フィルム、転写物、およびエンボスフィルムの製造方法 |
TWI686999B (zh) * | 2014-10-28 | 2020-03-01 | 日商迪睿合股份有限公司 | 異向性導電膜、其製造方法及連接構造體 |
TWI732746B (zh) | 2014-11-17 | 2021-07-11 | 日商迪睿合股份有限公司 | 異向性導電膜之製造方法 |
KR102542797B1 (ko) * | 2015-01-13 | 2023-06-14 | 데쿠세리아루즈 가부시키가이샤 | 이방 도전성 필름 |
KR102090450B1 (ko) * | 2016-02-15 | 2020-03-18 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름, 그 제조 방법 및 접속 구조체 |
JP6945276B2 (ja) * | 2016-03-31 | 2021-10-06 | デクセリアルズ株式会社 | 異方性導電接続構造体 |
KR102445646B1 (ko) | 2016-05-02 | 2022-09-21 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름의 제조 방법 및 이방성 도전 필름 |
JP6889020B2 (ja) * | 2016-05-02 | 2021-06-18 | デクセリアルズ株式会社 | 異方性導電フィルムの製造方法、及び異方性導電フィルム |
WO2017191772A1 (ja) * | 2016-05-05 | 2017-11-09 | デクセリアルズ株式会社 | フィラー配置フィルム |
JP7081097B2 (ja) * | 2016-09-13 | 2022-06-07 | デクセリアルズ株式会社 | フィラー含有フィルム |
KR20190010879A (ko) | 2016-09-13 | 2019-01-31 | 데쿠세리아루즈 가부시키가이샤 | 필러 함유 필름 |
WO2018074318A1 (ja) | 2016-10-18 | 2018-04-26 | デクセリアルズ株式会社 | フィラー含有フィルム |
US20200299474A1 (en) | 2016-10-18 | 2020-09-24 | Dexerials Corporation | Filler-containing film |
JP6935702B2 (ja) * | 2016-10-24 | 2021-09-15 | デクセリアルズ株式会社 | 異方性導電フィルム |
CN113078486B (zh) * | 2016-10-24 | 2023-10-20 | 迪睿合株式会社 | 各向异性导电膜的制造方法 |
JP7066998B2 (ja) | 2017-08-23 | 2022-05-16 | デクセリアルズ株式会社 | スペーサ含有テープ |
JP7062389B2 (ja) | 2017-08-23 | 2022-05-06 | デクセリアルズ株式会社 | 異方性導電フィルム |
JP7260829B2 (ja) * | 2017-08-23 | 2023-04-19 | デクセリアルズ株式会社 | スペーサ含有テープ |
TWI826476B (zh) * | 2018-06-26 | 2023-12-21 | 日商力森諾科股份有限公司 | 各向異性導電膜及其製造方法以及連接結構體的製造方法 |
JPWO2021177375A1 (ja) * | 2020-03-04 | 2021-09-10 | ||
WO2023219356A1 (ko) * | 2022-05-09 | 2023-11-16 | 주식회사 마이다스에이치앤티 | 도전볼을 포함하는 연신성 이방 전도성 필름 및 이의 제조방법 |
Family Cites Families (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6034331A (en) * | 1996-07-23 | 2000-03-07 | Hitachi Chemical Company, Ltd. | Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet |
KR100643640B1 (ko) * | 1997-02-27 | 2007-06-07 | 세이코 엡슨 가부시키가이샤 | 접속구조체,액정장치,전자기기와이방도전성접착제및그제조방법 |
JP4289319B2 (ja) * | 1997-03-31 | 2009-07-01 | 日立化成工業株式会社 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
JP3678547B2 (ja) * | 1997-07-24 | 2005-08-03 | ソニーケミカル株式会社 | 多層異方導電性接着剤およびその製造方法 |
US20010008169A1 (en) * | 1998-06-30 | 2001-07-19 | 3M Innovative Properties Company | Fine pitch anisotropic conductive adhesive |
JP2001052778A (ja) * | 1999-08-06 | 2001-02-23 | Hitachi Chem Co Ltd | 異方導電性接着フィルムおよびその製造方法 |
JP3491595B2 (ja) | 2000-02-25 | 2004-01-26 | ソニーケミカル株式会社 | 異方導電性接着フィルム |
CN1227319C (zh) * | 2001-05-30 | 2005-11-16 | 长春光学精密机械学院 | 各向异性导电粘接薄膜 |
JP3995942B2 (ja) * | 2002-01-29 | 2007-10-24 | 旭化成株式会社 | 異方性を有する導電性接着シートの製造方法 |
US20030178221A1 (en) | 2002-03-21 | 2003-09-25 | Chiu Cindy Chia-Wen | Anisotropically conductive film |
JP4130747B2 (ja) * | 2002-03-28 | 2008-08-06 | 旭化成エレクトロニクス株式会社 | 異方導電性接着シートおよびその製造方法 |
JP4130746B2 (ja) * | 2002-03-28 | 2008-08-06 | 旭化成エレクトロニクス株式会社 | 異方性を有する導電性接着シートおよびその製造方法 |
KR101131229B1 (ko) * | 2004-01-30 | 2012-03-28 | 세키스이가가쿠 고교가부시키가이샤 | 도전성 미립자 및 이방성 도전 재료 |
JP2005235530A (ja) * | 2004-02-18 | 2005-09-02 | Hitachi Chem Co Ltd | 回路接続材料 |
JP4385794B2 (ja) * | 2004-02-26 | 2009-12-16 | ソニーケミカル&インフォメーションデバイス株式会社 | 異方性導電接続方法 |
JP2006040632A (ja) * | 2004-07-23 | 2006-02-09 | Jsr Corp | 異方導電性コネクターおよびその製造方法、アダプター装置並びに回路装置の電気的検査装置 |
EP1693905B1 (de) * | 2005-02-17 | 2008-08-20 | European High Temperature Superconductors GmbH & Co. KG | Verfahren zur Herstellung biaxial orientierter Dünnschichten |
KR100673778B1 (ko) * | 2005-08-19 | 2007-01-24 | 제일모직주식회사 | 저온 속경화형 이방성 도전 필름용 조성물, 그로부터제조된 이방성 도전 필름 및 그 제조방법 |
JP2007217503A (ja) * | 2006-02-15 | 2007-08-30 | Asahi Kasei Electronics Co Ltd | 異方導電性接着フィルム |
JP5388572B2 (ja) * | 2006-04-27 | 2014-01-15 | デクセリアルズ株式会社 | 導電粒子配置シート及び異方導電性フィルム |
JP4789738B2 (ja) | 2006-07-28 | 2011-10-12 | 旭化成イーマテリアルズ株式会社 | 異方導電性フィルム |
US7923488B2 (en) * | 2006-10-16 | 2011-04-12 | Trillion Science, Inc. | Epoxy compositions |
JP5143449B2 (ja) * | 2007-03-02 | 2013-02-13 | 株式会社ダイセル | 熱又は活性エネルギー線硬化型接着剤 |
EP2001047A1 (en) * | 2007-06-07 | 2008-12-10 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device |
CN101897245B (zh) | 2007-12-17 | 2013-03-13 | 日立化成工业株式会社 | 电路连接材料及电路部件的连接结构 |
JP5549103B2 (ja) | 2008-07-11 | 2014-07-16 | デクセリアルズ株式会社 | 異方性導電フィルム |
JP2010033793A (ja) | 2008-07-28 | 2010-02-12 | Tokai Rubber Ind Ltd | 粒子転写膜の製造方法 |
JP5558140B2 (ja) * | 2009-06-10 | 2014-07-23 | デクセリアルズ株式会社 | 絶縁性樹脂フィルム、並びにこれを用いた接合体及びその製造方法 |
JP4673933B2 (ja) * | 2009-08-26 | 2011-04-20 | 積水化学工業株式会社 | 異方性導電材料及び接続構造体 |
JP5400545B2 (ja) * | 2009-09-25 | 2014-01-29 | 積水化学工業株式会社 | 異方性導電材料、接続構造体の製造方法及び接続構造体 |
KR101666214B1 (ko) | 2009-11-05 | 2016-10-14 | 삼성디스플레이 주식회사 | 이방성 도전 필름, 이의 제조 방법 및 이를 포함하는 표시 장치 |
KR101342255B1 (ko) * | 2009-11-16 | 2013-12-16 | 히타치가세이가부시끼가이샤 | 회로 접속 재료 및 이를 이용한 회로 부재의 접속 구조 |
JP5565277B2 (ja) | 2010-11-09 | 2014-08-06 | デクセリアルズ株式会社 | 異方性導電フィルム |
JP5690648B2 (ja) * | 2011-04-28 | 2015-03-25 | デクセリアルズ株式会社 | 異方性導電フィルム、接続方法及び接続構造体 |
TWI613684B (zh) | 2012-08-01 | 2018-02-01 | Dexerials Corp | 異向性導電膜之製造方法、異向性導電膜、及連接結構體 |
CN104541411B (zh) | 2012-08-24 | 2018-07-27 | 迪睿合电子材料有限公司 | 各向异性导电膜及其制造方法 |
KR102259384B1 (ko) | 2012-08-24 | 2021-06-02 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름의 제조 방법 및 이방성 도전 필름 |
KR20140139902A (ko) * | 2013-05-28 | 2014-12-08 | 삼성디스플레이 주식회사 | 이방성 도전 필름 적층체, 이를 포함하는 표시 장치 및 표시 장치 제조 방법 |
JP2016201405A (ja) | 2015-04-08 | 2016-12-01 | 三菱電機株式会社 | 炭化珪素半導体装置の製造方法 |
US10462431B2 (en) * | 2015-04-10 | 2019-10-29 | Visera Technologies Company Limited | Image sensors |
-
2013
- 2013-08-23 KR KR1020217002168A patent/KR102259384B1/ko active IP Right Grant
- 2013-08-23 KR KR1020197025499A patent/KR102208591B1/ko active IP Right Grant
- 2013-08-23 KR KR1020157001171A patent/KR101716987B1/ko active IP Right Grant
- 2013-08-23 CN CN201710413040.2A patent/CN107254263A/zh active Pending
- 2013-08-23 CN CN201710413926.7A patent/CN107267076B/zh active Active
- 2013-08-23 KR KR1020217016075A patent/KR20210064433A/ko not_active IP Right Cessation
- 2013-08-23 WO PCT/JP2013/072617 patent/WO2014030753A1/ja active Application Filing
- 2013-08-23 TW TW102130401A patent/TWI547538B/zh active
- 2013-08-23 CN CN201380043932.8A patent/CN104541416B/zh active Active
- 2013-08-23 JP JP2013173698A patent/JP6024621B2/ja active Active
- 2013-08-23 US US14/422,470 patent/US10272598B2/en active Active
- 2013-08-23 KR KR1020177006541A patent/KR102018558B1/ko active IP Right Grant
-
2015
- 2015-06-24 HK HK15105976.0A patent/HK1205364A1/xx unknown
-
2016
- 2016-10-13 JP JP2016201405A patent/JP6372542B2/ja active Active
-
2018
- 2018-04-27 JP JP2018086166A patent/JP2018137237A/ja active Pending
-
2019
- 2019-03-29 US US16/369,539 patent/US11136476B2/en active Active
- 2019-09-17 JP JP2019168643A patent/JP7170612B2/ja active Active
-
2021
- 2021-08-16 US US17/403,072 patent/US11787976B2/en active Active
- 2021-08-17 JP JP2021132546A patent/JP2021184392A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
KR20210064433A (ko) | 2021-06-02 |
US10272598B2 (en) | 2019-04-30 |
KR102018558B1 (ko) | 2019-09-05 |
JP2018137237A (ja) | 2018-08-30 |
KR102259384B1 (ko) | 2021-06-02 |
CN104541416A (zh) | 2015-04-22 |
US11787976B2 (en) | 2023-10-17 |
CN107267076B (zh) | 2021-06-29 |
TW201422762A (zh) | 2014-06-16 |
TWI547538B (zh) | 2016-09-01 |
KR20210011077A (ko) | 2021-01-29 |
HK1205364A1 (en) | 2015-12-11 |
JP2017027956A (ja) | 2017-02-02 |
JP2014060151A (ja) | 2014-04-03 |
CN107267076A (zh) | 2017-10-20 |
KR20150047475A (ko) | 2015-05-04 |
JP2021184392A (ja) | 2021-12-02 |
JP7170612B2 (ja) | 2022-11-14 |
JP6024621B2 (ja) | 2016-11-16 |
JP2020074267A (ja) | 2020-05-14 |
WO2014030753A1 (ja) | 2014-02-27 |
KR20190104252A (ko) | 2019-09-06 |
KR20170029665A (ko) | 2017-03-15 |
US20150231803A1 (en) | 2015-08-20 |
CN104541416B (zh) | 2017-07-04 |
CN107254263A (zh) | 2017-10-17 |
US20190224889A1 (en) | 2019-07-25 |
US20210371706A1 (en) | 2021-12-02 |
KR102208591B1 (ko) | 2021-01-27 |
US11136476B2 (en) | 2021-10-05 |
KR101716987B1 (ko) | 2017-03-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6372542B2 (ja) | 異方性導電フィルムの製造方法及び異方性導電フィルム | |
JP6372543B2 (ja) | 異方性導電フィルム及びその製造方法 | |
JP6056700B2 (ja) | 異方性導電フィルム及びその製造方法 | |
WO2015016207A1 (ja) | 異方性導電フィルム及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20170615 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A132 Effective date: 20170627 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170828 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20180130 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180427 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20180508 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180619 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180702 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6372542 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |