JP6355561B2 - 化学蒸着による高品質の単層および多層グラフェンの大規模な製造 - Google Patents
化学蒸着による高品質の単層および多層グラフェンの大規模な製造 Download PDFInfo
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- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- C01B32/00—Carbon; Compounds thereof
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
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Description
本明細書において想定され、開示される本発明は、化学蒸着(CVD)による単層および多層グラフェンの多結晶ならびに単結晶の製造のためのシステムおよび方法を含む。後述されるように、このシステムおよび方法は、触媒基材を、加熱された化学蒸着チャンバに通す工程と、任意に常圧で、この基材を、メタンと水素との反応ガス混合物に曝露して、所望のサイズ、形状および密度を有する連続した単層および多層グラフェングレインを得る工程とを含む。
ここで、図1を参照すると、本発明の一実施形態に係る化学蒸着チャンバの概略図が示され、全体的に表されている(10)。化学蒸着チャンバ10は、触媒基材16の連続した流入のための入口14と、内部蒸着領域18と、触媒基材16および新たに形成されたグラフェン層の連続した流出のための出口20とを有する石英ハウジング12を含む。(例えば、抵抗性、電磁および/または誘導)外部加熱体22、24は、石英ハウジング12内で、触媒基材16を所定の温度まで加熱する。基材16が銅箔を含む場合、加熱体22、24は、銅箔を、約800℃〜約1080℃、任意に約1000℃まで加熱することができる。
図4〜10を参照して後述される、水素分圧に応じたグレイン成長を例示するために、本発明の実施形態に従ってグラフェンを合成した。
Cu+H2⇔2Hs (1)
Cu+CH4→(CH3)s+Hs−低速 (2)
Cu+CH4⇔(CH4)s (3)
(CH4)s+Hs⇔(CH3)s+H2 (4)
(CH3)s+グラフェン⇔(グラフェン+C)+H2 (5)
Hs+グラフェン⇔(グラフェン−C)+(CHx)s (6)
Claims (21)
- 単層または多層グラフェンの多結晶および単結晶を作製する方法であって、
常圧で互いに流体連通している蒸着前領域と蒸着領域とを含む化学蒸着チャンバを提供する工程と、
前記化学蒸着チャンバを通って移動する連続した銅基材を提供する工程であって、前記銅基材が上面を含む、工程と、
常圧の前記化学蒸着チャンバの前記蒸着前領域に、水素ガスの存在下、前記銅基材を通して、前記銅基材をアニールする工程と、
前記銅基材の幅にわたって横方向に延在している前記蒸着領域と同一の広がりを有するノズル開口部で炭化水素ガスおよび緩衝ガスを導入し、前記蒸着前領域から流出する水素ガスと前記ノズル開口部で混合して、常圧の反応ガス混合物を前記蒸着領域に形成する工程と、
前記銅基材の前記上面が前記蒸着領域内の前記銅基材の幅にわたって前記反応ガス混合物と連続的に反応するように、前記ノズル開口部で炭化水素ガスを導入しながら前記化学蒸着チャンバの前記蒸着領域に前記銅基材を通す工程であって、六角形の結晶粒を含む単層または多層グラフェンが形成されるように前記反応ガス混合物は炭化水素ガス分圧に対する水素ガス分圧の比が400を超えるとともに10〜20Torr(1.3332×103〜2.6664×103Pa)の水素ガス分圧と23〜100mTorr(3.0664〜1.3332×10Pa)の炭化水素ガス分圧とを有し、前記水素ガスは前記蒸着前領域において前記銅基材のアニールに寄与し且つ前記蒸着領域において活性な表面結合炭素種の形成に寄与する工程と、
前記銅基材を、前記化学蒸着チャンバから連続的に取り出す工程であって、取り出された前記銅基材が、六角形の結晶粒を含む前記単層または多層グラフェンを担持している工程と、
を含む方法。 - 前記炭化水素ガスが、30ppmのメタンガスを含む、請求項1に記載の方法。
- 前記銅基材を、多結晶グラフェンまたは単結晶グラフェンとともに、前記化学蒸着チャンバから連続的に取り出す工程をさらに含む、請求項1に記載の方法。
- 前記六角形の結晶粒が、3μm〜1000μmの平均粒径を有する、請求項1に記載の方法。
- グラフェンの連続した多層の数が2〜6である、請求項1に記載の方法。
- 赤外線ランプまたはプラズマアークランプを用いて、前記銅基材を1000℃まで加熱する工程をさらに含む、請求項1に記載の方法。
- 誘導コイルを用いて、前記銅基材を加熱する工程をさらに含む、請求項1に記載の方法。
- グラフェンを合成する方法であって、
常圧で互いに流体連通している蒸着前領域と蒸着領域とを含む化学蒸着チャンバを提供する工程と、
前記化学蒸着チャンバを通って移動する連続した触媒基材を提供する工程であって、前記触媒基材が上面を含む、工程と、
常圧の前記化学蒸着チャンバの前記蒸着前領域内の水素ガス中で、水素ガスの存在下、前記触媒基材を通過させながら、前記触媒基材をアニールする工程と、
前記触媒基材の幅にわたって横方向に延在している前記蒸着領域と同一の広がりを有するノズル開口部で炭化水素ガスおよび緩衝ガスを導入し、前記蒸着前領域から流出する水素ガスと前記ノズル開口部で混合して、常圧の反応ガス混合物を前記蒸着領域に形成する工程と、
アニールされた前記触媒基材の前記上面が前記触媒基材の幅にわたって前記反応ガス混合物と連続的に反応するように、前記ノズル開口部で炭化水素ガスを導入しながら前記化学蒸着チャンバの前記蒸着領域に前記触媒基材を通す工程であって、前記反応ガス混合物は炭化水素ガス分圧に対する水素ガス分圧の比が400を超えるとともに23mTorr〜100mTorr(3.0664Pa〜1.3332×10Pa)の炭化水素分圧と10Torr〜20Torr(1.3332×103Pa〜2.6664×103Pa)の水素ガス分圧とを有し、前記水素ガスは前記蒸着前領域において前記触媒基材のアニールに寄与し且つ前記蒸着領域において活性な表面結合炭素種の形成に寄与する工程と、
前記触媒基材を、前記化学蒸着チャンバから連続的に取り出す工程であって、取り出された前記触媒基材が、六角形の結晶粒を含む単層または多層グラフェンを担持している工程と、
を含む方法。 - 前記炭化水素ガスが、メタン、エタン、プロパン、ブタン、ペンタン、ヘキサン、ヘプタン、オクタン、ベンゼン、トルエンおよびそれらの組合せからなる群から選択される、請求項8に記載の方法。
- 前記触媒基材が銅箔を含む、請求項8に記載の方法。
- 前記触媒基材をアニールする工程が、前記触媒基材を1000℃まで加熱する工程を含む、請求項8に記載の方法。
- 前記触媒基材を加熱する工程が、プラズマアークランプ、抵抗炉、赤外線ランプおよび誘導コイルのうちの1つを用いて行われる、請求項11に記載の方法。
- 前記化学蒸着チャンバ内の常圧を維持するために、前記緩衝ガスが、ヘリウムを含む、請求項8に記載の方法。
- 合成された前記グラフェンを、ポリマー基材または誘電体基材に結合させる工程をさらに含む、請求項8に記載の方法。
- 合成された前記グラフェンを、前記ポリマー基材または前記誘電体基材に結合させた後、前記触媒基材を分離する工程をさらに含む、請求項14に記載の方法。
- グラフェンを合成する方法であって、
常圧で互いに流体連通している蒸着前領域と横方向に延在する蒸着領域とを含む化学蒸着チャンバを提供する工程と、
常圧の前記化学蒸着チャンバの前記蒸着前領域に、連続した銅基材を通す工程であって、前記銅基材が上面を含む、工程と、
前記化学蒸着チャンバの前記蒸着前領域内で、前記銅基材を通過させながらH2ガス中で前記銅基材をアニールする工程と、
前記銅基材の幅にわたって横方向に延在している前記蒸着領域と同一の広がりを有するノズル開口部で炭化水素ガスおよび緩衝ガスを導入し、前記蒸着前領域から流出する水素ガスと前記ノズル開口部で混合して、常圧の反応ガス混合物を前記蒸着領域に形成する工程と、
前記銅基材の前記上面が前記蒸着領域内の前記銅基材の幅にわたって前記反応ガス混合物と連続的に反応して、アニールされた前記銅基材上に多結晶グラフェンまたは単結晶グラフェンが形成されるように、前記ノズル開口部で炭化水素ガスを導入しながら前記化学蒸着チャンバの前記蒸着領域にアニールされた前記銅基材を通す工程であって、前記炭化水素ガスは23mTorr〜100mTorr(3.0664Pa〜1.3332×10Pa)の分圧を有し、前記H2ガスは10Torr〜20Torr(1.3332×103Pa〜2.6664×103Pa)の分圧を有し、炭化水素ガス分圧に対するH2ガス分圧の比が400を超え、前記H2ガスは前記蒸着前領域において前記銅基材のアニールに寄与し且つ前記蒸着領域において活性な表面結合炭素種の形成に寄与する工程と、
前記銅基材を、前記化学蒸着チャンバから連続的に取り出す工程であって、取り出された前記銅基材が、六角形の結晶粒を含む単層または多層グラフェンを担持している工程と、
を含む方法。 - 前記銅基材を、多結晶グラフェンまたは単結晶グラフェンとともに、前記化学蒸着チャンバから連続的に取り出す工程をさらに含む、請求項16に記載の方法。
- 前記銅基材をアニールする工程が、前記銅基材を1000℃まで加熱する工程を含む、請求項16に記載の方法。
- アニールされた前記銅基材が、炭化水素ガスに少なくとも5分間曝露されてから、前記化学蒸着チャンバから取り出される、請求項16に記載の方法。
- 前記六角形の結晶粒が、3μm〜20μmの平均粒径を有する、請求項16に記載の方法。
- 前記炭化水素ガスが、CH4、C2H6、C3H8およびC4H10からなる群から選択される、請求項16に記載の方法。
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