JP6352879B2 - 無電解白金めっき液 - Google Patents

無電解白金めっき液 Download PDF

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Publication number
JP6352879B2
JP6352879B2 JP2015203809A JP2015203809A JP6352879B2 JP 6352879 B2 JP6352879 B2 JP 6352879B2 JP 2015203809 A JP2015203809 A JP 2015203809A JP 2015203809 A JP2015203809 A JP 2015203809A JP 6352879 B2 JP6352879 B2 JP 6352879B2
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Japan
Prior art keywords
platinum
electroless
plating solution
platinum plating
electroless platinum
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JP2015203809A
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English (en)
Japanese (ja)
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JP2017075379A5 (https=
JP2017075379A (ja
Inventor
友人 加藤
友人 加藤
秀人 渡邊
秀人 渡邊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kojima Chemicals Co Ltd
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Kojima Chemicals Co Ltd
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=58518047&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP6352879(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Kojima Chemicals Co Ltd filed Critical Kojima Chemicals Co Ltd
Priority to JP2015203809A priority Critical patent/JP6352879B2/ja
Priority to US15/767,817 priority patent/US20180305819A1/en
Priority to PCT/JP2016/056047 priority patent/WO2017064874A1/ja
Priority to EP16855128.1A priority patent/EP3363928A4/en
Priority to TW105106086A priority patent/TWI586833B/zh
Publication of JP2017075379A publication Critical patent/JP2017075379A/ja
Publication of JP2017075379A5 publication Critical patent/JP2017075379A5/ja
Publication of JP6352879B2 publication Critical patent/JP6352879B2/ja
Application granted granted Critical
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP2015203809A 2015-10-15 2015-10-15 無電解白金めっき液 Active JP6352879B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2015203809A JP6352879B2 (ja) 2015-10-15 2015-10-15 無電解白金めっき液
US15/767,817 US20180305819A1 (en) 2015-10-15 2016-02-29 Electroless platinum plating solution
PCT/JP2016/056047 WO2017064874A1 (ja) 2015-10-15 2016-02-29 無電解白金めっき液
EP16855128.1A EP3363928A4 (en) 2015-10-15 2016-02-29 AUTOCATALYTIC PLATE PLATING SOLUTION
TW105106086A TWI586833B (zh) 2015-10-15 2016-03-01 無電解白金電鍍液

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015203809A JP6352879B2 (ja) 2015-10-15 2015-10-15 無電解白金めっき液

Publications (3)

Publication Number Publication Date
JP2017075379A JP2017075379A (ja) 2017-04-20
JP2017075379A5 JP2017075379A5 (https=) 2018-05-17
JP6352879B2 true JP6352879B2 (ja) 2018-07-04

Family

ID=58518047

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015203809A Active JP6352879B2 (ja) 2015-10-15 2015-10-15 無電解白金めっき液

Country Status (5)

Country Link
US (1) US20180305819A1 (https=)
EP (1) EP3363928A4 (https=)
JP (1) JP6352879B2 (https=)
TW (1) TWI586833B (https=)
WO (1) WO2017064874A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10947623B2 (en) 2018-11-30 2021-03-16 C. Uyemura & Co., Ltd. Electroless plating bath

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018211727A1 (ja) * 2017-05-18 2018-11-22 日本高純度化学株式会社 無電解白金めっき液及びそれを用いて得られた白金皮膜
DE102018126804B4 (de) * 2018-10-26 2020-09-24 RF360 Europe GmbH Verfahren zur Herstellung eines elektroakustischen Resonators und elektroakustische Resonatorvorrichtung
JP7506404B2 (ja) * 2019-10-29 2024-06-26 学校法人 工学院大学 金属膜の製造方法、金属膜形成用組成物及び金属膜積層体
KR102293808B1 (ko) * 2019-12-02 2021-08-24 (재)한국건설생활환경시험연구원 무전해 백금 도금액 조성물 및 이를 이용한 도금방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5412435B2 (https=) * 1971-11-22 1979-05-23
JPS54117329A (en) * 1978-03-06 1979-09-12 Ngk Spark Plug Co Electroless plating method
JPH01319683A (ja) * 1988-06-20 1989-12-25 Electroplating Eng Of Japan Co 白金コロイド溶液及びそれを用いた無電解白金メッキ方法ならびに白金担持体の製法
FR2652822B1 (fr) * 1989-10-11 1993-06-11 Onera (Off Nat Aerospatiale) Bain a l'hydrazine pour le depot chimique de platine et/ou de palladium, et procede de fabrication d'un tel bain.
US5041196A (en) * 1989-12-26 1991-08-20 Olin Corporation Electrochemical method for producing chlorine dioxide solutions
JP3101061B2 (ja) * 1992-02-14 2000-10-23 日本エレクトロプレイテイング・エンジニヤース株式会社 白金無電解めっき浴及びそれを用いた白金めっき品の製造方法
DE10048844A1 (de) * 2000-10-02 2002-04-11 Basf Ag Verfahren zur Herstellung von Platinmetall-Katalysatoren
JPWO2004054019A1 (ja) * 2002-12-12 2006-04-13 株式会社ブリヂストン 燃料電池の電解質膜上に反応層を形成する方法及び電解質膜
JP4849930B2 (ja) * 2006-03-28 2012-01-11 日本化学工業株式会社 導電性無電解めっき粉体およびその製造方法
US8317910B2 (en) * 2010-03-22 2012-11-27 Unity Semiconductor Corporation Immersion platinum plating solution
TWI597523B (zh) * 2012-02-28 2017-09-01 Asahi Glass Co Ltd Electrowetting device, display device, lens (2)
DE102014006739B3 (de) * 2014-05-12 2015-06-25 Albert-Ludwigs-Universität Freiburg Verfahren zur Beschichtung von Oberflächen mit Nanostrukturen, nach dem Verfahren her- gestelltes Bauteil und Verwendung des Bauteils

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10947623B2 (en) 2018-11-30 2021-03-16 C. Uyemura & Co., Ltd. Electroless plating bath
DE102019008239B4 (de) 2018-11-30 2024-02-08 C. Uyemura & Co., Ltd. Bad zum stromlosen Plattieren

Also Published As

Publication number Publication date
TW201713798A (zh) 2017-04-16
US20180305819A1 (en) 2018-10-25
JP2017075379A (ja) 2017-04-20
EP3363928A1 (en) 2018-08-22
WO2017064874A1 (ja) 2017-04-20
TWI586833B (zh) 2017-06-11
EP3363928A4 (en) 2019-06-19

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