JP6335436B2 - 液体吐出ヘッドの製造方法 - Google Patents
液体吐出ヘッドの製造方法 Download PDFInfo
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- JP6335436B2 JP6335436B2 JP2013094634A JP2013094634A JP6335436B2 JP 6335436 B2 JP6335436 B2 JP 6335436B2 JP 2013094634 A JP2013094634 A JP 2013094634A JP 2013094634 A JP2013094634 A JP 2013094634A JP 6335436 B2 JP6335436 B2 JP 6335436B2
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- 238000000034 method Methods 0.000 title claims description 39
- 239000007788 liquid Substances 0.000 title claims description 30
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 238000010438 heat treatment Methods 0.000 claims description 89
- 239000011241 protective layer Substances 0.000 claims description 58
- 239000010410 layer Substances 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 29
- 239000011229 interlayer Substances 0.000 claims description 27
- 229910052710 silicon Inorganic materials 0.000 claims description 24
- 239000004065 semiconductor Substances 0.000 claims description 22
- 239000010703 silicon Substances 0.000 claims description 21
- 229910052799 carbon Inorganic materials 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 238000000059 patterning Methods 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 2
- 238000005469 granulation Methods 0.000 claims 1
- 230000003179 granulation Effects 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 19
- 229910000878 H alloy Inorganic materials 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 10
- 229910052814 silicon oxide Inorganic materials 0.000 description 10
- 239000000463 material Substances 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 238000001312 dry etching Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- MXSJNBRAMXILSE-UHFFFAOYSA-N [Si].[P].[B] Chemical compound [Si].[P].[B] MXSJNBRAMXILSE-UHFFFAOYSA-N 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 238000001505 atmospheric-pressure chemical vapour deposition Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/13—Heads having an integrated circuit
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Description
Claims (10)
- 液体吐出ヘッドの製造方法であって、
半導体素子が配された基板の上に、発熱抵抗体を形成する工程と、
前記基板の上に、第1層間絶縁層を形成する工程と、
前記第1層間絶縁層の上に、前記半導体素子に接続された第1配線パターンを形成する工程と、
前記第1配線パターンの上に、第2層間絶縁層を形成する工程と、
前記第2層間絶縁層及び前記発熱抵抗体の上に、第2配線パターンを形成する工程であって、前記発熱抵抗体のうち前記第2配線パターンに覆われていない部分が発熱素子となる、工程と、
前記発熱素子及び前記第2配線パターンの上に、少なくともシリコン及び炭素を含む保護層を形成し、パターニングする工程と、を有し、
前記保護層を形成する工程の前に、水素を含む雰囲気において熱処理を行い、
前記発熱素子は、前記第2層間絶縁層の上に形成され、かつ、前記第1配線パターンに接続され、
前記熱処理は、前記第2配線パターンを形成する工程の前に行われることを特徴とする製造方法。 - 前記熱処理は、前記第1配線パターンを形成する工程の後に行われることを特徴とする請求項1に記載の製造方法。
- 前記熱処理は、前記第2層間絶縁層を形成する工程の後に行われることを特徴とする請求項1又は2に記載の製造方法。
- 前記半導体素子はMOSトランジスタを含み、
前記第1配線パターンを形成する工程において、前記MOSトランジスタのゲート電極が、前記第1配線パターンを介して前記基板に電気的に接続されることを特徴とする請求項1乃至3の何れか1項に記載の製造方法。 - 液体吐出ヘッドの製造方法であって、
半導体素子が配された基板の上に、発熱抵抗体を形成する工程と、
前記基板の上に、第1層間絶縁層を形成する工程と、
前記第1層間絶縁層の上に、前記半導体素子に接続された第1配線パターンを形成する工程と、
前記第1配線パターンの上に、第2層間絶縁層を形成する工程と、
前記第2層間絶縁層及び前記発熱抵抗体の上に、第2配線パターンを形成する工程であって、前記発熱抵抗体のうち前記第2配線パターンに覆われていない部分が発熱素子となる、工程と、
前記発熱素子及び前記第2配線パターンの上に、少なくともシリコン及び炭素を含む保護層を形成し、パターニングする工程と、を有し、
前記保護層を形成する工程の前に、水素を含む雰囲気において熱処理を行い、
前記発熱素子は、前記第2層間絶縁層の上に形成され、かつ、前記第1配線パターンに接続され、
前記熱処理は、前記第1配線パターンを形成する工程の後であって前記第2配線パターンを形成する工程の前に行われ、
前記半導体素子はMOSトランジスタを含み、
前記第1配線パターンを形成する工程において、前記MOSトランジスタのゲート電極が、前記第1配線パターンを介して前記基板に電気的に接続されることを特徴とする製造方法。 - 前記熱処理の前に行われる前記工程の何れかにおいて、プラズマが用いられることを特徴とする請求項1乃至5の何れか1項に記載の製造方法。
- 前記熱処理は、400℃以上の温度で30分以上行われることを特徴とする請求項1乃至6の何れか1項に記載の製造方法。
- 前記保護層を形成する工程の後に行われる工程において、前記熱処理よりも熱負荷が高い処理が行われないことを特徴とする請求項1乃至7の何れか1項に記載の製造方法。
- 前記保護層を形成する工程の後に、前記保護層の上に耐キャビテーション層を形成する工程を更に有することを特徴とする請求項1乃至8の何れか1項に記載の製造方法。
- 前記保護層は、窒素を含むことを特徴とする請求項1乃至9の何れか1項に記載の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013094634A JP6335436B2 (ja) | 2013-04-26 | 2013-04-26 | 液体吐出ヘッドの製造方法 |
US14/247,445 US9073318B2 (en) | 2013-04-26 | 2014-04-08 | Method of manufacturing liquid discharge head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013094634A JP6335436B2 (ja) | 2013-04-26 | 2013-04-26 | 液体吐出ヘッドの製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014213575A JP2014213575A (ja) | 2014-11-17 |
JP2014213575A5 JP2014213575A5 (ja) | 2016-04-14 |
JP6335436B2 true JP6335436B2 (ja) | 2018-05-30 |
Family
ID=51789557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2013094634A Expired - Fee Related JP6335436B2 (ja) | 2013-04-26 | 2013-04-26 | 液体吐出ヘッドの製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US9073318B2 (ja) |
JP (1) | JP6335436B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102659138B1 (ko) * | 2016-10-19 | 2024-04-22 | 시크파 홀딩 에스에이 | 열 잉크젯 프린트헤드를 형성하는 방법, 열 잉크젯 프린트헤드, 및 반도체 웨이퍼 |
JP7037334B2 (ja) * | 2017-02-17 | 2022-03-16 | キヤノン株式会社 | 液体吐出ヘッド用基板、その製造方法、液体吐出ヘッド及び液体吐出装置 |
CN108396313B (zh) * | 2018-01-26 | 2019-11-15 | 华南理工大学 | 一种减少喷墨打印薄膜表面裂纹的热处理方法 |
JP7166776B2 (ja) * | 2018-04-04 | 2022-11-08 | キヤノン株式会社 | 液体吐出ヘッド用基板の製造方法 |
Family Cites Families (25)
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JPH01210352A (ja) * | 1988-02-18 | 1989-08-23 | Ricoh Co Ltd | 液体噴射記録ヘッド |
JPH04142942A (ja) * | 1990-10-05 | 1992-05-15 | Canon Inc | 薄膜抵抗ヒータ、その製造方法、該薄膜抵抗ヒータを使用したインクジェット記録ヘッド及びインクジェット記録装置 |
JPH05251693A (ja) * | 1992-03-04 | 1993-09-28 | Kawasaki Steel Corp | 半導体装置の製造方法 |
JPH05267205A (ja) * | 1992-03-24 | 1993-10-15 | Miyazaki Oki Electric Co Ltd | 半導体装置の製造方法 |
JPH0774167A (ja) * | 1993-06-30 | 1995-03-17 | Kawasaki Steel Corp | 半導体装置の製造方法 |
JPH09252131A (ja) * | 1996-01-10 | 1997-09-22 | Yamaha Corp | 半導体装置の製法 |
JP2000021892A (ja) * | 1998-06-26 | 2000-01-21 | Nec Corp | 半導体装置の製造方法 |
US6474769B1 (en) * | 1999-06-04 | 2002-11-05 | Canon Kabushiki Kaisha | Liquid discharge head, liquid discharge apparatus and method for manufacturing liquid discharge head |
US6361150B1 (en) | 1999-08-30 | 2002-03-26 | Hewlett-Packard Company | Electrostatic discharge protection of electrically-inactive components in a thermal ink jet printing system |
US6467864B1 (en) * | 2000-08-08 | 2002-10-22 | Lexmark International, Inc. | Determining minimum energy pulse characteristics in an ink jet print head |
JP3503611B2 (ja) * | 2001-04-13 | 2004-03-08 | ソニー株式会社 | プリンタヘッド、プリンタ及びプリンタヘッドの製造方法 |
JP3695530B2 (ja) * | 2001-12-03 | 2005-09-14 | ソニー株式会社 | プリンタヘッドの製造方法 |
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JP4646602B2 (ja) | 2004-11-09 | 2011-03-09 | キヤノン株式会社 | インクジェット記録ヘッド用基板の製造方法 |
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JP4847360B2 (ja) * | 2006-02-02 | 2011-12-28 | キヤノン株式会社 | 液体吐出ヘッド基体、その基体を用いた液体吐出ヘッドおよびそれらの製造方法 |
US8147036B2 (en) * | 2006-06-23 | 2012-04-03 | Canon Kabushiki Kaisha | Polyfunctional epoxy compound, epoxy resin, cationic photopolymerizable epoxy resin composition, micro structured member, producing method therefor and liquid discharge head |
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JP5147282B2 (ja) | 2007-05-02 | 2013-02-20 | キヤノン株式会社 | インクジェット記録用基板、該基板を備えた記録ヘッド及び記録装置 |
JP4963679B2 (ja) | 2007-05-29 | 2012-06-27 | キヤノン株式会社 | 液体吐出ヘッド用基体及びその製造方法、並びに該基体を用いる液体吐出ヘッド |
US8075102B2 (en) | 2008-06-19 | 2011-12-13 | Canon Kabushiki Kaisha | Substrate for ink jet head and ink jet head |
JP2013069804A (ja) * | 2011-09-21 | 2013-04-18 | Hitachi Kokusai Electric Inc | 半導体製造装置および成膜方法 |
-
2013
- 2013-04-26 JP JP2013094634A patent/JP6335436B2/ja not_active Expired - Fee Related
-
2014
- 2014-04-08 US US14/247,445 patent/US9073318B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20140322835A1 (en) | 2014-10-30 |
US9073318B2 (en) | 2015-07-07 |
JP2014213575A (ja) | 2014-11-17 |
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