JP6320201B2 - 半導体装置の作製方法 - Google Patents
半導体装置の作製方法 Download PDFInfo
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- JP6320201B2 JP6320201B2 JP2014135815A JP2014135815A JP6320201B2 JP 6320201 B2 JP6320201 B2 JP 6320201B2 JP 2014135815 A JP2014135815 A JP 2014135815A JP 2014135815 A JP2014135815 A JP 2014135815A JP 6320201 B2 JP6320201 B2 JP 6320201B2
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- semiconductor layer
- oxide semiconductor
- insulating layer
- transistor
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- 229910052720 vanadium Inorganic materials 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
- AKJVMGQSGCSQBU-UHFFFAOYSA-N zinc azanidylidenezinc Chemical compound [Zn++].[N-]=[Zn].[N-]=[Zn] AKJVMGQSGCSQBU-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66969—Multistep manufacturing processes of devices having semiconductor bodies not comprising group 14 or group 13/15 materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4908—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
Description
本実施の形態では、半導体層と電子捕獲層とゲート電極とを有する半導体装置の構成および動作原理、および、それを応用する回路について説明する。図1(A)は、半導体層101と電子捕獲層102とゲート電極103を有する半導体装置である。
本実施の形態では、本発明の一態様の半導体装置について図面を用いて説明する。なお、以下では、主として、トップゲート構造のトランジスタ(基板とゲート電極の間に半導体層が存在するトランジスタ)について説明するが、ボトムゲート構造のトランジスタ(基板と半導体層の間にゲート電極が存在するトランジスタ)であってもよい。また、第1のゲート電極と第2のゲート電極とを有し、基板と半導体層の間に第1のゲート電極を、第1のゲート電極と第2のゲート電極の間に半導体層を有するトランジスタでもよい。
本実施の形態では、実施の形態2で説明した図9に示すトランジスタ450の作製方法について、図13および図14を用いて説明する。
本実施の形態では、プレナー構造のトランジスタについて説明する。
本実施の形態では、CAAC−OS及びnc−OSの成膜モデルについて説明する。
本実施の形態では、本発明の一態様のトランジスタを利用した回路の一例について、図面を参照して説明する。
本実施の形態では、本発明の一態様であるトランジスタを使用し、電力が供給されない状況でも記憶内容の保持が可能で、かつ、書き込み回数にも制限が無い半導体装置(記憶装置)の一例を、図面を用いて説明する。
本実施の形態では、先の実施の形態で説明したトランジスタを用いることができ、先の実施の形態で説明した記憶装置を含むCPUについて説明する。
本発明の一態様に係る半導体装置は、表示機器、パーソナルコンピュータ、記録媒体を備えた画像再生装置(代表的にはDVD:Digital Versatile Disc等の記録媒体を再生し、その画像を表示しうるディスプレイを有する装置)に用いることができる。その他に、本発明の一態様に係る半導体装置を用いることができる電子機器として、携帯電話、携帯型を含むゲーム機、携帯データ端末、電子書籍、ビデオカメラ、デジタルスチルカメラ等のカメラ、ゴーグル型ディスプレイ(ヘッドマウントディスプレイ)、ナビゲーションシステム、音響再生装置(カーオーディオ、デジタルオーディオプレイヤー等)、複写機、ファクシミリ、プリンタ、プリンタ複合機、現金自動預け入れ払い機(ATM)、自動販売機などが挙げられる。これら電子機器の具体例を図21に示す。
102 電子捕獲層
102a 第1の絶縁層
102b 第2の絶縁層
102c 第3の絶縁層
102d 導電層
103 ゲート電極
106 電子捕獲準位
107 電子
108 曲線
109 曲線
110 トランジスタ
111 容量素子
121 トランジスタ
122 トランジスタ
123 容量素子
124 トランジスタ
125 容量素子
200 ペレット
200a ペレット
200b ペレット
201 イオン
220 基板
230 ターゲット
400 基板
402 下地絶縁層
403c 酸化物半導体層
404 多層半導体層
404a 酸化物半導体層
404b 酸化物半導体層
404c 酸化物半導体層
406a ソース電極
406b ドレイン電極
407 絶縁層
408 ゲート絶縁層
409 導電層
410 ゲート電極
411 絶縁層
412 酸化物絶縁層
450 トランジスタ
470 トランジスタ
501 筐体
502 筐体
503 表示部
504 表示部
505 マイクロフォン
506 スピーカー
507 操作キー
508 スタイラス
511 筐体
512 筐体
513 表示部
514 表示部
515 接続部
516 操作キー
521 筐体
522 表示部
523 キーボード
524 ポインティングデバイス
531 筐体
532 冷蔵室用扉
533 冷凍室用扉
541 筐体
542 筐体
543 表示部
544 操作キー
545 レンズ
546 接続部
550 トランジスタ
551 車体
552 車輪
553 ダッシュボード
554 ライト
602 フォトダイオード
640 トランジスタ
656 トランジスタ
658 フォトダイオードリセット信号線
659 ゲート信号線
672 フォトセンサ基準信号線
700 記憶素子
701 回路
702 回路
703 スイッチ
704 スイッチ
706 論理素子
707 容量素子
708 容量素子
709 トランジスタ
710 トランジスタ
713 トランジスタ
714 トランジスタ
720 回路
1189 ROMインターフェース
1190 基板
1191 ALU
1192 ALUコントローラ
2200 トランジスタ
2201 絶縁層
2202 配線
2203 プラグ
2204 絶縁層
2205 配線
2206 配線
3001 配線
3002 配線
3003 配線
3004 配線
3005 配線
3200 トランジスタ
3300 トランジスタ
3400 容量素子
Claims (5)
- 半導体層と、
前記半導体層と電気的に接続された電極と、
ゲート電極と、
前記ゲート電極と前記半導体層との間に設けられた電子捕獲層と、を有し、
前記電子捕獲層は、第1の絶縁層と第2の絶縁層を有し、
前記第1の絶縁層は、前記半導体層と接し、
前記第2の絶縁層は、前記第1の絶縁層と前記ゲート電極との間に設けられ、
前記第2の絶縁層は、前記第1の絶縁層よりも電子捕獲密度が高い半導体装置の作製方法であって、
125℃以上450℃以下の加熱処理を行いながら、前記ゲート電極の電位を前記電極の電位より高い状態に、1秒以上維持することを特徴とする半導体装置の作製方法。 - 酸化物半導体層と、
前記酸化物半導体層と電気的に接続された電極と、
ゲート電極と、
前記ゲート電極と前記酸化物半導体層との間に設けられた電子捕獲層と、を有し、
前記電子捕獲層は、第1の絶縁層と第2の絶縁層を有し、
前記第1の絶縁層は、前記酸化物半導体層と接し、
前記第2の絶縁層は、前記第1の絶縁層と前記ゲート電極との間に設けられ、
前記第2の絶縁層は、前記第1の絶縁層よりも電子捕獲密度が高い半導体装置の作製方法であって、
125℃以上450℃以下の加熱処理を行いながら、前記ゲート電極の電位を前記電極の電位より高い状態に、1秒以上維持することを特徴とする半導体装置の作製方法。 - 第1の酸化物半導体層と、
前記第1の酸化物半導体層の上に設けられた第2の酸化物半導体層と、
前記第2の酸化物半導体層の上に設けられたソース電極及びドレイン電極と、
前記ソース電極及び前記ドレイン電極の上に設けられ、前記第2の酸化物半導体層と接する領域を有する第3の酸化物半導体層と、
前記第3の酸化物半導体層の上に設けられたゲート絶縁層と、
前記ゲート絶縁層の上に設けられたゲート電極と、を有し、
前記ゲート絶縁層は、第1の絶縁層と第2の絶縁層を有し、
前記第2の絶縁層は、前記第1の絶縁層の上に設けられ、
前記第2の絶縁層は、前記第1の絶縁層よりも電子捕獲密度が高い半導体装置の作製方法であって、
125℃以上450℃以下の加熱処理を行いながら、前記ゲート電極の電位を前記ソース電極又は前記ドレイン電極の電位より高い状態に、1秒以上維持することを特徴とする半導体装置の作製方法。 - 請求項3において、
前記ゲート電極に維持される電位は、前記ソース電極又は前記ドレイン電極の電位より1V以上高く、前記半導体装置で使用される最高電位よりも低いことを特徴とする半導体装置の作製方法。 - 請求項1乃至4のいずれか一において、
前記第2の絶縁層は、酸化ハフニウム、酸化アルミニウム、アルミニウムシリケートのいずれか一を含むことを特徴とする半導体装置の作製方法。
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