JP6301137B2 - 分離装置 - Google Patents
分離装置 Download PDFInfo
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- JP6301137B2 JP6301137B2 JP2014009312A JP2014009312A JP6301137B2 JP 6301137 B2 JP6301137 B2 JP 6301137B2 JP 2014009312 A JP2014009312 A JP 2014009312A JP 2014009312 A JP2014009312 A JP 2014009312A JP 6301137 B2 JP6301137 B2 JP 6301137B2
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- 238000000926 separation method Methods 0.000 title claims description 20
- 239000000758 substrate Substances 0.000 claims description 218
- 239000002131 composite material Substances 0.000 claims description 64
- 238000000407 epitaxy Methods 0.000 claims description 29
- 230000003287 optical effect Effects 0.000 claims description 24
- 238000012546 transfer Methods 0.000 claims description 21
- 230000002093 peripheral effect Effects 0.000 claims description 17
- 238000001514 detection method Methods 0.000 claims description 5
- 238000003384 imaging method Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910002601 GaN Inorganic materials 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/0004—Devices characterised by their operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1126—Using direct fluid current against work during delaminating
- Y10T156/1137—Using air blast directly against work during delaminating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
- Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
- Y10T156/1184—Piercing layer during delaminating [e.g., cutting, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1906—Delaminating means responsive to feed or shape at delamination
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1928—Differential fluid pressure delaminating means
- Y10T156/1933—Spraying delaminating means [e.g., atomizer, etc.
- Y10T156/1939—Air blasting delaminating means]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1961—Severing delaminating means [e.g., chisel, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1961—Severing delaminating means [e.g., chisel, etc.]
- Y10T156/1967—Cutting delaminating means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1961—Severing delaminating means [e.g., chisel, etc.]
- Y10T156/1967—Cutting delaminating means
- Y10T156/1972—Shearing delaminating means
Description
また、光デバイスの輝度を向上させるためにエピタキシー基板の表面に凹凸が形成されている場合には、レーザー光線が凹凸の壁に遮られバッファー層の破壊が抑制されエピタキシー基板の剥離が困難になるという問題がある。
複合基板を水平状態で支持する支持面を備えた支持基台と、
該支持基台に配設され該支持面に載置された複合基板の外周側面を支持する側面支持手段と、
該支持基台の該支持面および該側面支持手段に支持された複合基板を構成する第1の基板と第2の基板との境界部に挿入して第1の基板と第2の基板とを剥離する剥離手段と、を具備し、
該剥離手段は、該側面支持手段と対向する位置に該支持基台の該支持面と平行状態で配設され第1の基板と第2の基板との境界部に挿入するための楔部を備え、該楔部の先端に開口するガス噴出孔を有する剥離部材と、
該剥離部材の該ガス噴出孔にガスを供給するガス供給手段と、
該剥離部材を該支持基台の該支持面に対して垂直な方向に移動して該楔部を第1の基板と第2の基板との境界部に位置付ける剥離部材位置付け手段と、
該剥離部材の該楔部を該支持基台の該支持面および該側面支持手段に支持された複合基板を構成する第1の基板と第2の基板との境界部に進退せしめる剥離部材進退手段と、を具備し、
該第1の基板は、エピタキシー基板であり、該第2の基板は、光デバイス層を含む移設基板が接合されたものであって、該複合基板は、該エピタキシー基板と該移設基板とが、境界部を構成するバッファー層を介して接合され、
該側面支持手段は、少なくとも2個のローラによって構成され、該2個のローラは上部大径部と下部小径部とを備え、該複合基板の外周側面を回動可能に支持するものであり、
該複合基板が該剥離手段により剥離される際には、該複合基板の第2の基板側が支持基台の該支持面に載置され、該複合基板の外周が該支持面と該2個のローラの上部大径部と下部小径部とによって支持される、
ことを特徴とする分離装置が提供される。
そして、上述したように剥離部材の楔部を第1の基板と第2の基板との境界部に進入する際にはガス供給手段から剥離部材のガス噴出孔にガスを供給し、楔部の先端から第1の基板と第2の基板との境界部にガスを噴出するので、第1の基板と第2の基板との剥離が更に容易となる。
図示の実施形態における分離装置は、複合基板を支持する支持基台2と、該支持基台2に配設された複合基板の外周側面を支持する側面支持手段3と、該支持基台2および側面支持手段3に支持された複合基板を剥離する剥離手段4を具備している。
図5には、上述した分離装置によって分離される複合基板の斜視図が示されている。
図5に示す複合基板6は、光デバイスウエーハ61と移設基板62とからなっている。光デバイスウエーハ61は、サファイア基板や炭化珪素等のエピタキシー基板611(第1の基板)の表面にバッファー層612を介して光デバイス層が形成されている。このように形成された光デバイスウエーハ61のエピタキシー基板611(第1の基板)の光デバイス層の表面にモリブデン(Mo)、銅(Cu)、シリコン(Si)等からなる移設基板62(第2の基板)が金錫(AuSn)等の接合金属層を介して接合されている。このように構成された複合基板6は、エピタキシー基板の裏面側からバッファー層612で吸収される波長(例えば257nm)のレーザー光線が照射されバッファー層612が破壊されている。
3:側面支持手段
31:ローラ
4:剥離手段
41剥離部材
412:円錐状の楔部
414:ガス噴出孔
42:剥離部材位置付け手段
421:案内部材
422:移動ブロック
423:移動手段
44:ガス供給手段
5:検出手段
51:撮像手段
52:表示手段
6:複合基板
Claims (2)
- 第1の基板と第2の基板とが接合された複合基板を第1の基板と第2の基板とに分離する分離装置であって、
複合基板を水平状態で支持する支持面を備えた支持基台と、
該支持基台に配設され該支持面に載置された複合基板の外周側面を支持する側面支持手段と、
該支持基台の該支持面および該側面支持手段に支持された複合基板を構成する第1の基板と第2の基板との境界部に挿入して第1の基板と第2の基板とを剥離する剥離手段と、を具備し、
該剥離手段は、該側面支持手段と対向する位置に該支持基台の該支持面と平行状態で配設され第1の基板と第2の基板との境界部に挿入するための楔部を備え、該楔部の先端に開口するガス噴出孔を有する剥離部材と、
該剥離部材の該ガス噴出孔にガスを供給するガス供給手段と、
該剥離部材を該支持基台の該支持面に対して垂直な方向に移動して該楔部を第1の基板と第2の基板との境界部に位置付ける剥離部材位置付け手段と、
該剥離部材の該楔部を該支持基台の該支持面および該側面支持手段に支持された複合基板を構成する第1の基板と第2の基板との境界部に進退せしめる剥離部材進退手段と、を具備し、
該第1の基板は、エピタキシー基板であり、該第2の基板は、光デバイス層を含む移設基板が接合されたものであって、該複合基板は、該エピタキシー基板と該移設基板とが、境界部を構成するバッファー層を介して接合され、
該側面支持手段は、少なくとも2個のローラによって構成され、該2個のローラは上部大径部と下部小径部とを備え、該複合基板の外周側面を回動可能に支持するものであり、
該複合基板が該剥離手段により剥離される際には、該複合基板の第2の基板側が支持基台の該支持面に載置され、該複合基板の外周が該支持面と該2個のローラの上部大径部と下部小径部とによって支持される、ことを特徴とする分離装置。 - 該支持基台の該支持面および該側面支持手段に支持された複合基板を構成する第1の基板と第2の基板との境界部を検出して剥離部材の楔部と位置合わせする検出手段を備えている、請求項1に記載の分離装置。
Priority Applications (5)
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JP2014009312A JP6301137B2 (ja) | 2014-01-22 | 2014-01-22 | 分離装置 |
TW103142139A TWI682435B (zh) | 2014-01-22 | 2014-12-04 | 分離裝置 |
KR1020150001029A KR102126878B1 (ko) | 2014-01-22 | 2015-01-06 | 분리 장치 |
US14/591,339 US9511579B2 (en) | 2014-01-22 | 2015-01-07 | Separation apparatus |
CN201510031095.8A CN104795345B (zh) | 2014-01-22 | 2015-01-21 | 分离装置 |
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JP2014009312A JP6301137B2 (ja) | 2014-01-22 | 2014-01-22 | 分離装置 |
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JP2015136755A JP2015136755A (ja) | 2015-07-30 |
JP6301137B2 true JP6301137B2 (ja) | 2018-03-28 |
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US (1) | US9511579B2 (ja) |
JP (1) | JP6301137B2 (ja) |
KR (1) | KR102126878B1 (ja) |
CN (1) | CN104795345B (ja) |
TW (1) | TWI682435B (ja) |
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CN105047589B (zh) * | 2015-07-08 | 2018-05-29 | 浙江中纳晶微电子科技有限公司 | 晶圆解键合装置 |
US10377118B2 (en) * | 2016-12-05 | 2019-08-13 | The Boeing Company | Preparing laminate materials for testing |
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JPS5818937A (ja) * | 1982-03-31 | 1983-02-03 | Nippon Kogaku Kk <Nikon> | 円板物体の位置決め装置 |
JPS63316450A (ja) * | 1987-06-19 | 1988-12-23 | Hitachi Ltd | ウエハ基準位置決め装置 |
SG68035A1 (en) * | 1997-03-27 | 1999-10-19 | Canon Kk | Method and apparatus for separating composite member using fluid |
SG87916A1 (en) * | 1997-12-26 | 2002-04-16 | Canon Kk | Sample separating apparatus and method, and substrate manufacturing method |
JP4365920B2 (ja) * | 1999-02-02 | 2009-11-18 | キヤノン株式会社 | 分離方法及び半導体基板の製造方法 |
US6221740B1 (en) * | 1999-08-10 | 2001-04-24 | Silicon Genesis Corporation | Substrate cleaving tool and method |
JP2002050749A (ja) * | 2000-07-31 | 2002-02-15 | Canon Inc | 複合部材の分離方法及び装置 |
JP2002075915A (ja) * | 2000-08-25 | 2002-03-15 | Canon Inc | 試料の分離装置及び分離方法 |
FR2823373B1 (fr) * | 2001-04-10 | 2005-02-04 | Soitec Silicon On Insulator | Dispositif de coupe de couche d'un substrat, et procede associe |
TW558743B (en) * | 2001-08-22 | 2003-10-21 | Semiconductor Energy Lab | Peeling method and method of manufacturing semiconductor device |
JP2004072052A (ja) | 2002-08-09 | 2004-03-04 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
TWI440129B (zh) * | 2005-08-29 | 2014-06-01 | Ebara Corp | 基板處理單元、基板搬送方法、基板清洗處理單元及基板鍍覆裝置 |
JP4481946B2 (ja) * | 2006-03-17 | 2010-06-16 | キヤノン株式会社 | 検出素子及び画像形成装置 |
US7846288B2 (en) * | 2006-05-10 | 2010-12-07 | Micron Technology, Inc. | Methods and systems for removing protective films from microfeature workpieces |
CN201898118U (zh) * | 2010-12-06 | 2011-07-13 | 中芯国际集成电路制造(上海)有限公司 | 一种晶圆清洗装置 |
JP2013184177A (ja) * | 2012-03-06 | 2013-09-19 | Disco Corp | レーザー加工装置 |
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2014
- 2014-01-22 JP JP2014009312A patent/JP6301137B2/ja active Active
- 2014-12-04 TW TW103142139A patent/TWI682435B/zh active
-
2015
- 2015-01-06 KR KR1020150001029A patent/KR102126878B1/ko active IP Right Grant
- 2015-01-07 US US14/591,339 patent/US9511579B2/en active Active
- 2015-01-21 CN CN201510031095.8A patent/CN104795345B/zh active Active
Also Published As
Publication number | Publication date |
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TWI682435B (zh) | 2020-01-11 |
KR20150087798A (ko) | 2015-07-30 |
US9511579B2 (en) | 2016-12-06 |
CN104795345B (zh) | 2019-04-19 |
JP2015136755A (ja) | 2015-07-30 |
KR102126878B1 (ko) | 2020-06-25 |
CN104795345A (zh) | 2015-07-22 |
TW201533779A (zh) | 2015-09-01 |
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