JP6259270B2 - 熱硬化型導電性ペースト組成物 - Google Patents

熱硬化型導電性ペースト組成物 Download PDF

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Publication number
JP6259270B2
JP6259270B2 JP2013251243A JP2013251243A JP6259270B2 JP 6259270 B2 JP6259270 B2 JP 6259270B2 JP 2013251243 A JP2013251243 A JP 2013251243A JP 2013251243 A JP2013251243 A JP 2013251243A JP 6259270 B2 JP6259270 B2 JP 6259270B2
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Japan
Prior art keywords
silver
powder
thermosetting
conductive paste
paste composition
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JP2013251243A
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English (en)
Japanese (ja)
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JP2015109195A (ja
Inventor
豊治 松原
豊治 松原
留河　悟
悟 留河
貴光 新井
貴光 新井
裕太 元久
裕太 元久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyoto Elex Co Ltd
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Kyoto Elex Co Ltd
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Publication date
Application filed by Kyoto Elex Co Ltd filed Critical Kyoto Elex Co Ltd
Priority to JP2013251243A priority Critical patent/JP6259270B2/ja
Priority to PCT/JP2014/005777 priority patent/WO2015083332A1/fr
Priority to CN201480064513.7A priority patent/CN105793931B/zh
Publication of JP2015109195A publication Critical patent/JP2015109195A/ja
Application granted granted Critical
Publication of JP6259270B2 publication Critical patent/JP6259270B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/58—Epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Conductive Materials (AREA)
  • Paints Or Removers (AREA)
JP2013251243A 2013-12-04 2013-12-04 熱硬化型導電性ペースト組成物 Active JP6259270B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013251243A JP6259270B2 (ja) 2013-12-04 2013-12-04 熱硬化型導電性ペースト組成物
PCT/JP2014/005777 WO2015083332A1 (fr) 2013-12-04 2014-11-18 Composition de pâte conductrice thermodurcie
CN201480064513.7A CN105793931B (zh) 2013-12-04 2014-11-18 热固化型导电浆料组成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013251243A JP6259270B2 (ja) 2013-12-04 2013-12-04 熱硬化型導電性ペースト組成物

Publications (2)

Publication Number Publication Date
JP2015109195A JP2015109195A (ja) 2015-06-11
JP6259270B2 true JP6259270B2 (ja) 2018-01-10

Family

ID=53273117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013251243A Active JP6259270B2 (ja) 2013-12-04 2013-12-04 熱硬化型導電性ペースト組成物

Country Status (3)

Country Link
JP (1) JP6259270B2 (fr)
CN (1) CN105793931B (fr)
WO (1) WO2015083332A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6383183B2 (ja) * 2014-06-03 2018-08-29 太陽インキ製造株式会社 導電性接着剤およびそれを用いた電子部品
JP6804286B2 (ja) * 2015-12-28 2020-12-23 Ｄｏｗａエレクトロニクス株式会社 銀合金粉末およびその製造方法
WO2017115462A1 (fr) * 2015-12-28 2017-07-06 Ｄｏｗａエレクトロニクス株式会社 Poudre d'alliage d'argent et procédé pour la produire
CN110012617A (zh) * 2019-04-03 2019-07-12 东莞塘厦裕华电路板有限公司 一种电路板导通孔制作方法
CN113066600B (zh) * 2021-03-24 2023-03-14 北京梦之墨科技有限公司 一种导电浆料及电子器件
CN113782252B (zh) * 2021-11-15 2022-03-01 西安宏星电子浆料科技股份有限公司 一种uv加热双重固化导电浆料及其制备方法
CN116913576B (zh) * 2023-07-10 2024-05-28 乐凯胶片股份有限公司 导电浆料和异质结太阳能电池

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6345702A (ja) * 1986-08-11 1988-02-26 東亞合成株式会社 金属含有ペ−スト
JP3010843B2 (ja) * 1991-10-28 2000-02-21 日立化成工業株式会社 導電性樹脂ペースト組成物およびこの組成物を用いた半導体装置
JPH10330611A (ja) * 1997-06-02 1998-12-15 Asahi Chem Ind Co Ltd 樹脂組成物
JP3558593B2 (ja) * 2000-11-24 2004-08-25 京都エレックス株式会社 加熱硬化型導電性ペースト組成物
JP2002294145A (ja) * 2001-03-28 2002-10-09 Nippon Paint Co Ltd 無鉛性カチオン電着塗料組成物
JP4089368B2 (ja) * 2002-09-18 2008-05-28 住友電気工業株式会社 導電性ペースト
JP4481734B2 (ja) * 2004-06-10 2010-06-16 三菱樹脂株式会社 多層配線基板用導電性ペースト組成物
JP5402350B2 (ja) * 2009-07-24 2014-01-29 藤倉化成株式会社 導電性ペーストの製造方法および導電性ペースト
JP2011086397A (ja) * 2009-10-13 2011-04-28 Asahi Kasei E-Materials Corp 導電性ペースト及び半導体装置
KR20140079268A (ko) * 2012-12-18 2014-06-26 솔브레인 주식회사 전도성 페이스트 조성물, 이를 이용하여 제조한 전도층, 상기 전도층을 포함하는 전자 소자 또는 디스플레이
WO2014104053A1 (fr) * 2012-12-27 2014-07-03 荒川化学工業株式会社 Pâte conductrice destinée à la sérigraphie, procédé de production de ligne de câblage et procédé de production d'électrode
KR102142744B1 (ko) * 2013-01-18 2020-08-07 도요보 가부시키가이샤 도전성 페이스트, 도전성 막, 전기 회로 및 터치 패널

Also Published As

Publication number Publication date
CN105793931B (zh) 2018-09-28
JP2015109195A (ja) 2015-06-11
WO2015083332A1 (fr) 2015-06-11
CN105793931A (zh) 2016-07-20

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