JP6233724B2 - ヘテロ接合バイポーラトランジスタ - Google Patents
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- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 57
- 239000000463 material Substances 0.000 claims description 46
- 239000004065 semiconductor Substances 0.000 claims description 27
- 229910005542 GaSb Inorganic materials 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 16
- 238000009826 distribution Methods 0.000 claims description 9
- 230000007423 decrease Effects 0.000 claims description 6
- 239000003574 free electron Substances 0.000 claims description 5
- 238000005304 joining Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 455
- 230000008859 change Effects 0.000 description 18
- 238000010586 diagram Methods 0.000 description 17
- 230000004888 barrier function Effects 0.000 description 16
- 239000013078 crystal Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 13
- 230000006866 deterioration Effects 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 230000009467 reduction Effects 0.000 description 8
- 230000001629 suppression Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 230000005684 electric field Effects 0.000 description 5
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- QOSATHPSBFQAML-UHFFFAOYSA-N hydrogen peroxide;hydrate Chemical compound O.OO QOSATHPSBFQAML-UHFFFAOYSA-N 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 238000000927 vapour-phase epitaxy Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 240000002329 Inga feuillei Species 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000005424 photoluminescence Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000012887 quadratic function Methods 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- 230000026683 transduction Effects 0.000 description 1
- 238000010361 transduction Methods 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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Description
本発明の第1実施形態に係るダブルヘテロ接合バイポーラトランジスタ(DHBT)は、主として、基板上にコレクタ層、ベース層、及びエミッタ層を備え、コレクタ層とベース層、及び、ベース層とエミッタ層がそれぞれへテロ接合されて構成されている。このDHBTは、シングルヘテロ接合バイポーラトランジスタ(以下、SHBTと称す。)に比べてオフセット電圧の低減が図られている。
まず、第1実施形態に係るDHBTの構造について説明する。図1は第1実施形態に係るDHBT10Aの平面図であり、図2は図1のI−I断面図である。
次に、以上の構造を備えたDHBT10Aの各構成の材料やバンド構造等について説明する。
また、コレクタ層16の主成分とされるGaAsは、従来から使用されている秩序化InGaPに比べて熱伝導率が良いため、コレクタ層16側への放熱性が向上し、高温動作或いは高出力動作でのトランジスタ特性が改善するという効果もある。
一方で、エミッタ層20と第2ベース層18Bとのヘテロ接合19のタイプは、所謂「タイプI」、「タイプII」及び「タイプIII」と呼ばれるもののうち、いずれであってもよい。この接合タイプは、好ましくは、電子の走行が速くなるという観点(例えば図8Aの伝導帯下端のエネルギーEc参照)から、所謂「タイプI」と呼ばれるものがよい。
「Ec」:DHBTのバンド構造における伝導帯下端のエネルギー
「Ev」:DHBTのバンド構造における価電子帯上端のエネルギー
「Ecc」:コレクタ層16の伝導帯下端のエネルギー
「Ecb1」:第1ベース層18Aの伝導帯下端のエネルギー
「Ecb2」:第2ベース層18Bの伝導帯下端のエネルギー
「Ece」:エミッタ層20の伝導帯下端のエネルギー
「Evc」:コレクタ層16の価電子帯上端のエネルギー
「Evb1」:第1ベース層18Aの価電子帯上端のエネルギー
「Evb2」:第2ベース層18Bの価電子帯上端のエネルギー
「Eve」:エミッタ層20の価電子帯上端のエネルギー
このような条件を満たす一例として、他の実施形態で説明するが例えば、図9、図10A及び図12Bに示すように、第1ベース層18Aの材料(主成分)としてGaSbxAs1−xを選択し、第2ベース層18Bの材料(主成分)としてAlyGa1−yAsを選択すればよい。
以上、本発明の第1実施形態に係るDHBT10Aによれば、コレクタ層16の主成分をGaAsとすることで、DHBT10Aの低コスト化を図ることができる。また、DHBT10Aによれば、第1ベース層18Aの膜厚を臨界膜厚T1未満とすることで、電気的特性及び信頼性の劣化抑制ができる。これにより、DHBT10Aでは、低コスト化と、電気的特性及び信頼性の劣化抑制を両立させることができる。
次に、本発明の第2実施形態に係るDHBTについて説明する。
次に、本発明の第3実施形態に係るDHBTについて説明する。
次に、本発明の第4実施形態に係るDHBTについて説明する。
次に、本発明の第5実施形態に係るDHBTについて説明する。
次に、本発明の第6実施形態に係るDHBTについて説明する。
次に、本発明の第7実施形態に係るDHBTについて説明する。
次に、本発明の第8実施形態について説明する。
Claims (6)
- GaAsを主成分とした半導体で構成されたコレクタ層と、
前記コレクタ層とタイプIIのヘテロ接合で接合され、前記コレクタ層の主成分と格子不整合する材料を主成分とした半導体で構成され、且つミスフィット転位が導入される臨界膜厚未満の膜厚である第1ベース層と、
前記第1ベース層と接合され、前記コレクタ層の主成分と格子整合するAl y Ga 1-y As(y:Alの組成比、y>0)を主成分とした半導体で構成された第2ベース層と、
前記第2ベース層とヘテロ接合されたInGaPエミッタ層と、
前記エミッタ層を貫通し、前記第2ベース層の膜厚方向の一部にまで延在するベース電極と、
を有し、
前記コレクタ層は、前記GaAsを含有するn型半導体で構成され、前記第1ベース層及び前記第2ベース層は、それぞれの前記主成分を含有するp型半導体で構成され、
前記エミッタ層は、n型半導体で構成され、
前記第2ベース層では、前記第1ベース層との接合の前の状態で、伝導帯下端のエネルギーが、前記第1ベース層の伝導帯下端のエネルギーから室温での自由電子の持つ熱エネルギー分差し引いた値以上に高い値を示す、
ヘテロ接合バイポーラトランジスタ。 - 第1ベース層と第2ベース層の接合の前の状態で、第1ベース層の価電子帯上端のエネルギーから第2ベース層の価電子帯上端のエネルギーを差し引いた値から、第1ベース層の伝導帯下端のエネルギーから第2ベース層の伝導帯下端のエネルギーを差し引いた値、を差し引いた値が正の値を示す、
請求項1に記載のヘテロ接合バイポーラトランジスタ。 - 前記第1ベース層の主成分は、GaSbxAs1-x(x:Sbの組成比、x>0)である、
請求項1又は請求項2に記載のヘテロ接合バイポーラトランジスタ。 - 前記コレクタ層に対して前記第1ベース層及び前記第2ベース層を含むベース層の反対側に設けられ、Siを主成分とした半導体基板を有する、
請求項1〜請求項3の何れか1項に記載のヘテロ接合バイポーラトランジスタ。 - 前記第1ベース層及び前記第2ベース層の少なくとも一方のキャリア濃度は、前記エミッタ層側から前記コレクタ層側に向かって小さくなる分布を示す、
請求項1又は請求項2に記載のヘテロ接合バイポーラトランジスタ。 - 前記第1ベース層のSb組成は前記エミッタ層側から前記コレクタ層側に向かって大きくなる分布を示す、
請求項3に記載のヘテロ接合バイポーラトランシスタ。
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PCT/JP2014/054085 WO2014148194A1 (ja) | 2013-03-19 | 2014-02-20 | ヘテロ接合バイポーラトランジスタ |
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JP2018101652A (ja) * | 2016-12-19 | 2018-06-28 | 株式会社村田製作所 | バイポーラトランジスタ及びその製造方法 |
JP2018137259A (ja) * | 2017-02-20 | 2018-08-30 | 株式会社村田製作所 | ヘテロ接合バイポーラトランジスタ |
US10134881B1 (en) * | 2017-05-18 | 2018-11-20 | Qualcomm Incorporated | Quantum well thermal sensing for power amplifier |
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WO2014148194A1 (ja) | 2014-09-25 |
US20160005841A1 (en) | 2016-01-07 |
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CN105051873B (zh) | 2017-06-13 |
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