JP6227321B2 - プロテクトフィルム付き透明導電性フィルム - Google Patents

プロテクトフィルム付き透明導電性フィルム Download PDF

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Publication number
JP6227321B2
JP6227321B2 JP2013162003A JP2013162003A JP6227321B2 JP 6227321 B2 JP6227321 B2 JP 6227321B2 JP 2013162003 A JP2013162003 A JP 2013162003A JP 2013162003 A JP2013162003 A JP 2013162003A JP 6227321 B2 JP6227321 B2 JP 6227321B2
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Japan
Prior art keywords
transparent conductive
protective film
conductive film
film
value
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JP2013162003A
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English (en)
Japanese (ja)
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JP2015030213A (ja
Inventor
渡邉　卓三
卓三 渡邉
佐藤　慶一
慶一 佐藤
知生 大類
知生 大類
所司　悟
悟 所司
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Lintec Corp
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Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP2013162003A priority Critical patent/JP6227321B2/ja
Priority to KR1020140086549A priority patent/KR102155123B1/ko
Priority to TW103124898A priority patent/TWI631012B/zh
Priority to CN201410378382.1A priority patent/CN104339734B/zh
Publication of JP2015030213A publication Critical patent/JP2015030213A/ja
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Publication of JP6227321B2 publication Critical patent/JP6227321B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208—Touch screens

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Surface Treatment Of Optical Elements (AREA)
JP2013162003A 2013-08-05 2013-08-05 プロテクトフィルム付き透明導電性フィルム Active JP6227321B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013162003A JP6227321B2 (ja) 2013-08-05 2013-08-05 プロテクトフィルム付き透明導電性フィルム
KR1020140086549A KR102155123B1 (ko) 2013-08-05 2014-07-10 프로텍트 필름 부착 투명 도전성 필름
TW103124898A TWI631012B (zh) 2013-08-05 2014-07-21 帶有保護薄膜的透明導電性薄膜
CN201410378382.1A CN104339734B (zh) 2013-08-05 2014-08-01 带有保护薄膜的透明导电性薄膜

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013162003A JP6227321B2 (ja) 2013-08-05 2013-08-05 プロテクトフィルム付き透明導電性フィルム

Publications (2)

Publication Number Publication Date
JP2015030213A JP2015030213A (ja) 2015-02-16
JP6227321B2 true JP6227321B2 (ja) 2017-11-08

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JP2013162003A Active JP6227321B2 (ja) 2013-08-05 2013-08-05 プロテクトフィルム付き透明導電性フィルム

Country Status (4)

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JP (1) JP6227321B2 (zh)
KR (1) KR102155123B1 (zh)
CN (1) CN104339734B (zh)
TW (1) TWI631012B (zh)

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JP5957133B2 (ja) * 2014-11-20 2016-07-27 日東電工株式会社 保護フィルム付き透明導電性フィルム
TWI582873B (zh) * 2015-02-26 2017-05-11 Hitachi Maxell A masking method for manufacturing the same, and a method of manufacturing the solder bump
JP6355824B2 (ja) * 2015-03-26 2018-07-11 富士フイルム株式会社 タッチパネル
JP6563228B2 (ja) * 2015-03-30 2019-08-21 リンテック株式会社 透明導電性フィルム
JP6587405B2 (ja) * 2015-03-30 2019-10-09 リンテック株式会社 透明導電性フィルム
CN104793826B (zh) * 2015-05-01 2022-06-03 张家港康得新光电材料有限公司 双面硬化膜与包括该双面硬化膜的电容式触摸屏
JP6688033B2 (ja) 2015-05-27 2020-04-28 日東電工株式会社 透明導電性フィルム
JP2016225270A (ja) * 2015-05-27 2016-12-28 日東電工株式会社 透明導電性フィルム
CN104991671B (zh) * 2015-06-23 2017-09-29 广州聚达光电有限公司 一种柔性触控屏传感薄膜及其制备方法
JP6552099B2 (ja) * 2015-08-24 2019-07-31 日東電工株式会社 キャリアフィルム付き透明導電性フィルム及びそれを用いたタッチパネル
JP6553451B2 (ja) * 2015-08-25 2019-07-31 日東電工株式会社 透明樹脂フィルム、透明導電性フィルムおよびそれを用いたタッチパネル
WO2017039209A1 (ko) 2015-09-03 2017-03-09 동우화인켐 주식회사 커버 윈도우 기판 및 이를 구비하는 화상표시장치
CN105045456A (zh) * 2015-09-07 2015-11-11 张家港康得新光电材料有限公司 金属网格透明导电体、其制备方法与电容式触摸屏
CN105045455A (zh) * 2015-09-07 2015-11-11 张家港康得新光电材料有限公司 金属网格透明导电膜、其制备方法与电容式触摸屏
JP6669468B2 (ja) * 2015-10-26 2020-03-18 積水化学工業株式会社 光透過性導電フィルム、及び、アニール処理された光透過性導電フィルムの製造方法
JP6560622B2 (ja) * 2016-01-07 2019-08-14 積水化学工業株式会社 光透過性導電フィルム積層体
TWI610376B (zh) * 2016-01-19 2018-01-01 日立麥克賽爾股份有限公司 配列用遮罩及其製造方法、焊料凸塊之形成方法
JP6650770B2 (ja) * 2016-01-29 2020-02-19 日東電工株式会社 導電性積層フィルム
JP7056552B2 (ja) * 2016-03-17 2022-04-19 東洋紡株式会社 導電性皮膜およびレーザーエッチング加工用導電性ペースト
CN109313962A (zh) * 2016-06-10 2019-02-05 日东电工株式会社 透明导电性薄膜及触摸面板
CN113009602B (zh) * 2016-08-23 2023-05-23 琳得科株式会社 硬涂膜
KR102666083B1 (ko) * 2016-10-31 2024-05-13 엘지디스플레이 주식회사 접촉 감응 소자 및 이를 포함하는 표시 장치
CN108062176B (zh) * 2016-11-09 2021-07-09 东友精细化工有限公司 触摸传感器层叠体及其制造方法
JP6378743B2 (ja) * 2016-12-07 2018-08-22 リンテック株式会社 電池用粘着シートおよびリチウムイオン電池
JP6875842B2 (ja) * 2016-12-12 2021-05-26 住友化学株式会社 有機電子デバイスの製造方法、電極付き基板及び有機電子デバイス
TWI633563B (zh) * 2016-12-15 2018-08-21 日商日東電工股份有限公司 Transparent conductive film with carrier film and touch panel using the same
JP7270334B2 (ja) * 2017-10-27 2023-05-10 日東電工株式会社 透明導電性フィルムおよびその製造方法
CN108376042A (zh) * 2018-05-04 2018-08-07 蓝思科技（长沙）有限公司 金属网格传感器和触摸屏及其制备方法与设备
JP7395244B2 (ja) * 2018-06-12 2023-12-11 日東電工株式会社 ハードコートフィルムおよび透明導電性フィルム
CN109765647A (zh) * 2018-12-28 2019-05-17 张家港康得新光电材料有限公司 一种透明聚酰亚胺膜
JP7150628B2 (ja) * 2019-01-31 2022-10-11 日東電工株式会社 透明導電性フィルム積層体
JP7294819B2 (ja) * 2019-01-31 2023-06-20 日東電工株式会社 透明導電性フィルム用基材および透明導電性フィルム
JP7223586B2 (ja) * 2019-01-31 2023-02-16 日東電工株式会社 透明導電性フィルム積層体
JP6816237B1 (ja) * 2019-10-07 2021-01-20 日東電工株式会社 印刷層付フィルム積層体の製造方法
JP6816236B1 (ja) * 2019-10-07 2021-01-20 日東電工株式会社 印刷層付フィルム積層体、該印刷層付フィルム積層体を含む光学積層体、およびこれらを用いた画像表示装置
JP2020104520A (ja) * 2020-02-27 2020-07-09 積水化学工業株式会社 光透過性導電フィルム、及び、アニール処理された光透過性導電フィルムの製造方法
CN115298762A (zh) * 2020-03-19 2022-11-04 日东电工株式会社 透明导电性薄膜

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JP4776754B2 (ja) * 2000-05-22 2011-09-21 日東電工株式会社 保護フィルム付き透明導電性フィルムとその使用方法
JP3995141B2 (ja) * 2000-06-12 2007-10-24 日東電工株式会社 透明導電性フィルムおよびタッチパネル電極
JP4342775B2 (ja) * 2002-07-31 2009-10-14 日東電工株式会社 透明導電性フィルム用表面保護フィルム及びその製造方法並びに表面保護フィルム付き透明導電性フィルム
JP5506011B2 (ja) * 2007-03-02 2014-05-28 日東電工株式会社 粘着剤層付き透明導電性フィルムおよびその製造方法
JP2010032795A (ja) * 2008-07-29 2010-02-12 Fujifilm Corp ハードコートフィルム、ハードコートフィルムの製造方法、反射防止フィルム、偏光板および表示装置
JP5359656B2 (ja) 2009-07-31 2013-12-04 東洋紡株式会社 ハードコートフィルムおよびそれを用いた透明導電性フィルム
JP5516089B2 (ja) * 2010-06-01 2014-06-11 王子ホールディングス株式会社 導電性シート、タッチパネル用導電性積層体、及びタッチパネル
JP5903820B2 (ja) * 2011-09-28 2016-04-13 凸版印刷株式会社 透明導電性フィルムの製造方法及びタッチパネルの製造方法
JP2013123825A (ja) * 2011-12-13 2013-06-24 Keiwa Inc ハードコートフィルム、透明導電性積層体及びタッチパネル
JP6074144B2 (ja) * 2012-02-06 2017-02-01 リンテック株式会社 光学用フィルム、並びにディスプレイ装置

Also Published As

Publication number Publication date
TW201505826A (zh) 2015-02-16
TWI631012B (zh) 2018-08-01
JP2015030213A (ja) 2015-02-16
KR102155123B1 (ko) 2020-09-11
KR20150016893A (ko) 2015-02-13
CN104339734B (zh) 2018-02-13
CN104339734A (zh) 2015-02-11

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