JP6224531B2 - 配線基板の製造方法 - Google Patents

配線基板の製造方法 Download PDF

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Publication number
JP6224531B2
JP6224531B2 JP2014119261A JP2014119261A JP6224531B2 JP 6224531 B2 JP6224531 B2 JP 6224531B2 JP 2014119261 A JP2014119261 A JP 2014119261A JP 2014119261 A JP2014119261 A JP 2014119261A JP 6224531 B2 JP6224531 B2 JP 6224531B2
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JP
Japan
Prior art keywords
resist layer
solder resist
exposed
wiring board
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014119261A
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English (en)
Japanese (ja)
Other versions
JP2016006809A (ja
JP2016006809A5 (enrdf_load_stackoverflow
Inventor
豊田　裕二
裕二 豊田
寛彦 後閑
寛彦 後閑
川合　宣行
宣行 川合
中川　邦弘
邦弘 中川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Paper Mills Ltd
Original Assignee
Mitsubishi Paper Mills Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Paper Mills Ltd filed Critical Mitsubishi Paper Mills Ltd
Priority to JP2014119261A priority Critical patent/JP6224531B2/ja
Publication of JP2016006809A publication Critical patent/JP2016006809A/ja
Publication of JP2016006809A5 publication Critical patent/JP2016006809A5/ja
Application granted granted Critical
Publication of JP6224531B2 publication Critical patent/JP6224531B2/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0505—Double exposure of the same photosensitive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0588—Second resist used as pattern over first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0594—Insulating resist or coating with special shaped edges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2014119261A 2013-06-14 2014-06-10 配線基板の製造方法 Active JP6224531B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014119261A JP6224531B2 (ja) 2013-06-14 2014-06-10 配線基板の製造方法

Applications Claiming Priority (15)

Application Number Priority Date Filing Date Title
JP2013125179 2013-06-14
JP2013125179 2013-06-14
JP2013131839 2013-06-24
JP2013131839 2013-06-24
JP2013139706 2013-07-03
JP2013139706 2013-07-03
JP2013150825 2013-07-19
JP2013150824 2013-07-19
JP2013150825 2013-07-19
JP2013150824 2013-07-19
JP2013151335 2013-07-22
JP2013151335 2013-07-22
JP2014111574 2014-05-29
JP2014111574 2014-05-29
JP2014119261A JP6224531B2 (ja) 2013-06-14 2014-06-10 配線基板の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017102667A Division JP6416324B2 (ja) 2013-06-14 2017-05-24 配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2016006809A JP2016006809A (ja) 2016-01-14
JP2016006809A5 JP2016006809A5 (enrdf_load_stackoverflow) 2016-05-26
JP6224531B2 true JP6224531B2 (ja) 2017-11-01

Family

ID=52022186

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2014119261A Active JP6224531B2 (ja) 2013-06-14 2014-06-10 配線基板の製造方法
JP2017102667A Active JP6416324B2 (ja) 2013-06-14 2017-05-24 配線基板の製造方法
JP2018093702A Active JP6514808B2 (ja) 2013-06-14 2018-05-15 配線基板の製造方法

Family Applications After (2)

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JP2017102667A Active JP6416324B2 (ja) 2013-06-14 2017-05-24 配線基板の製造方法
JP2018093702A Active JP6514808B2 (ja) 2013-06-14 2018-05-15 配線基板の製造方法

Country Status (5)

Country Link
JP (3) JP6224531B2 (enrdf_load_stackoverflow)
KR (1) KR102082641B1 (enrdf_load_stackoverflow)
CN (3) CN105309053B (enrdf_load_stackoverflow)
TW (1) TWI700974B (enrdf_load_stackoverflow)
WO (1) WO2014199890A1 (enrdf_load_stackoverflow)

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* Cited by examiner, † Cited by third party
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JP2016012702A (ja) * 2014-06-30 2016-01-21 ファナック株式会社 ソルダコートの濡れ性と耐食性を両立させたプリント基板およびその製造方法
TWI645760B (zh) * 2017-10-27 2018-12-21 南亞電路板股份有限公司 電路板及其製造方法
CN108289388A (zh) * 2017-12-07 2018-07-17 江门崇达电路技术有限公司 一种预防上锡不良的pcb制作方法
JP7142604B2 (ja) 2019-05-15 2022-09-27 日本特殊陶業株式会社 配線基板およびその製造方法
TWI731376B (zh) * 2019-07-22 2021-06-21 頎邦科技股份有限公司 具有粗化防焊層的軟質線路基板及其製造方法
JP7498550B2 (ja) * 2019-09-11 2024-06-12 太陽ホールディングス株式会社 積層硬化体、硬化性樹脂組成物、ドライフィルム、および、積層硬化体の製造方法
JP7498549B2 (ja) * 2019-09-11 2024-06-12 太陽ホールディングス株式会社 積層硬化体、硬化性樹脂組成物、ドライフィルム、および、積層硬化体の製造方法
JP2021163851A (ja) * 2020-03-31 2021-10-11 三菱製紙株式会社 ソルダーレジストパターンの形成方法
KR20210129410A (ko) 2020-04-20 2021-10-28 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
CN113747681B (zh) * 2020-05-27 2023-01-17 庆鼎精密电子（淮安）有限公司 嵌埋元件的软硬结合电路板及其制作方法
KR20210155981A (ko) 2020-06-17 2021-12-24 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
US11551939B2 (en) 2020-09-02 2023-01-10 Qualcomm Incorporated Substrate comprising interconnects embedded in a solder resist layer
KR20220039385A (ko) 2020-09-22 2022-03-29 삼성전자주식회사 인터포저 및 이를 포함하는 반도체 패키지
US12230562B2 (en) * 2021-04-07 2025-02-18 Mediatek Inc. Three-dimensional pad structure and interconnection structure for electronic devices
TWI780783B (zh) * 2021-06-18 2022-10-11 大陸商律勝科技（蘇州）有限公司 印刷電路板之製造方法及具保護層之印刷電路板
CN114486887A (zh) * 2022-01-10 2022-05-13 珠海市龙昌电路科技有限公司 不同阻焊层厚度的无铅喷锡制程能力测试方法及管控方法
CN116801482B (zh) * 2022-03-18 2024-05-10 华为技术有限公司 电路板组件及其加工方法、电子设备
CN116113159A (zh) * 2022-12-30 2023-05-12 沪士电子股份有限公司 一种不变更叠层降低pcb板外层损耗方法
KR102674312B1 (ko) * 2023-01-13 2024-06-12 엘지이노텍 주식회사 반도체 패키지

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JPS61256789A (ja) * 1985-05-10 1986-11-14 株式会社日立製作所 プリント配線板製造方法
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JP5255545B2 (ja) 2009-09-29 2013-08-07 三菱製紙株式会社 ソルダーレジストの形成方法
KR101047139B1 (ko) * 2009-11-11 2011-07-07 삼성전기주식회사 단층 보드온칩 패키지 기판 및 그 제조방법
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JP5830925B2 (ja) 2011-05-10 2015-12-09 日立化成株式会社 プリント配線板の製造方法
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Also Published As

Publication number Publication date
JP6416324B2 (ja) 2018-10-31
CN107846786A (zh) 2018-03-27
JP2016006809A (ja) 2016-01-14
TW201513758A (zh) 2015-04-01
CN105309053A (zh) 2016-02-03
KR102082641B1 (ko) 2020-02-28
CN107809854A (zh) 2018-03-16
JP6514808B2 (ja) 2019-05-15
TWI700974B (zh) 2020-08-01
KR20160020407A (ko) 2016-02-23
WO2014199890A1 (ja) 2014-12-18
CN107846786B (zh) 2021-03-05
JP2017195380A (ja) 2017-10-26
JP2018139319A (ja) 2018-09-06
CN105309053B (zh) 2018-03-09

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