JP6214600B2 - 接合材料および接合体 - Google Patents
接合材料および接合体 Download PDFInfo
- Publication number
- JP6214600B2 JP6214600B2 JP2015146197A JP2015146197A JP6214600B2 JP 6214600 B2 JP6214600 B2 JP 6214600B2 JP 2015146197 A JP2015146197 A JP 2015146197A JP 2015146197 A JP2015146197 A JP 2015146197A JP 6214600 B2 JP6214600 B2 JP 6214600B2
- Authority
- JP
- Japan
- Prior art keywords
- acid
- silver
- bonding
- bonding material
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/64—Manufacture or treatment of solid state devices other than semiconductor devices, or of parts thereof, not peculiar to a single device provided for in groups H01L31/00 - H10K99/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/14—Treatment of metallic powder
- B22F1/148—Agglomerating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10L—SPEECH ANALYSIS OR SYNTHESIS; SPEECH RECOGNITION; SPEECH OR VOICE PROCESSING; SPEECH OR AUDIO CODING OR DECODING
- G10L19/00—Speech or audio signals analysis-synthesis techniques for redundancy reduction, e.g. in vocoders; Coding or decoding of speech or audio signals, using source filter models or psychoacoustic analysis
- G10L2019/0001—Codebooks
- G10L2019/0002—Codebook adaptations
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10L—SPEECH ANALYSIS OR SYNTHESIS; SPEECH RECOGNITION; SPEECH OR VOICE PROCESSING; SPEECH OR AUDIO CODING OR DECODING
- G10L19/00—Speech or audio signals analysis-synthesis techniques for redundancy reduction, e.g. in vocoders; Coding or decoding of speech or audio signals, using source filter models or psychoacoustic analysis
- G10L2019/0001—Codebooks
- G10L2019/0011—Long term prediction filters, i.e. pitch estimation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04026—Bonding areas specifically adapted for layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
- H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/05638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/05639—Silver [Ag] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/273—Manufacturing methods by local deposition of the material of the layer connector
- H01L2224/2731—Manufacturing methods by local deposition of the material of the layer connector in liquid form
- H01L2224/27318—Manufacturing methods by local deposition of the material of the layer connector in liquid form by dispensing droplets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/273—Manufacturing methods by local deposition of the material of the layer connector
- H01L2224/2731—Manufacturing methods by local deposition of the material of the layer connector in liquid form
- H01L2224/2732—Screen printing, i.e. using a stencil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/275—Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material
- H01L2224/27505—Sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/278—Post-treatment of the layer connector
- H01L2224/27848—Thermal treatments, e.g. annealing, controlled cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29199—Material of the matrix
- H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29199—Material of the matrix
- H01L2224/29294—Material of the matrix with a principal constituent of the material being a liquid not provided for in groups H01L2224/292 - H01L2224/29291
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29338—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/29339—Silver [Ag] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/2939—Base material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29399—Coating material
- H01L2224/2949—Coating material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/83053—Bonding environment
- H01L2224/83054—Composition of the atmosphere
- H01L2224/83075—Composition of the atmosphere being inert
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/832—Applying energy for connecting
- H01L2224/83201—Compression bonding
- H01L2224/83203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
- H01L2224/83204—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding with a graded temperature profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83399—Material
- H01L2224/834—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/83438—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/83439—Silver [Ag] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8384—Sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/83905—Combinations of bonding methods provided for in at least two different groups from H01L2224/838 - H01L2224/83904
- H01L2224/83907—Intermediate bonding, i.e. intermediate bonding step for temporarily bonding the semiconductor or solid-state body, followed by at least a further bonding step
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/83986—Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
- H01L2924/13033—TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/203—Ultrasonic frequency ranges, i.e. KHz
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12479—Porous [e.g., foamed, spongy, cracked, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Die Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Conductive Materials (AREA)
Description
複数の被接合部材が、金属として銀のみを含む接合層により接合された接合体であって、当該接合層に存在するボイド率が2.0%以下である接合体である。
本発明に係る接合材料を構成する銀ナノ粒子は、平均一次粒子径が200nm以下、好ましくは1〜150nm、一層好ましくは10〜100nmのものである。当該粒子径を有する銀ナノ粒子を使用することで、強い接合力を有した接合体を形成することができる。
還元性を有する物質を溶解させた還元液と、原料である金属塩(特に銀塩)が溶解された原料液とを準備する。
還元液と原料液とを昇温し、反応温度まで上昇させる。このとき、還元液と原料液とを、同様に加熱しておけば、反応時において反応の不均一が防止される効果があり、粒子の均一性を保つことができるので好ましい。このときに昇温させる温度は40〜80℃の範囲である。
還元液と原料液とが目的温度まで上昇したら、還元液に対して原料液を添加する。添加は突沸に注意した上で、一挙に添加することが好ましい。
還元液と原料液とを混合した後、10〜30分間程度攪拌を続け、粒子の成長を完結させる。
得られたスラリーは濾過法により固液分離する。洗浄工程は、当該濾過工程で得られたケーキに対して純水を加え、再び該純水を濾過することによって行う。本発明の製造法によれば、ナノオーダーの一次微粒子が緩やかな凝集体を形成し、反応液中に自然に沈降するため、容易に回収できる。
得られた金属(銀)塊へ60〜90℃、6〜24時間の乾燥工程を施すことで、乾燥した金属(銀)粒子塊が得られる。
銀ナノ粒子の粒子径は、透過型電子顕微鏡(TEM)写真から算出される。
具体的には、金属ナノ粒子2質量部を、シクロヘキサン96質量部とオレイン酸2質量部との混合溶液に添加し、超音波によって分散させて分散溶液を得る。得られた分散溶液を、支持膜付きCuマイクログリッドに滴下し、乾燥させることでTEM試料を作成する。作成したTEM試料であるマイクログリッドを、透過型電子顕微鏡(日本電子株式会社製JEM−100CXMark−II型)を用い、100kVの加速電圧にて、明視野で粒子を観察した像を、倍率300,000倍で撮影すれば良い。
本発明に係る接合材料を構成する銀粒子は、平均粒子径の範囲が0.5〜10μm、好ましくは0.5〜9.0μm、一層好ましくは0.5〜8.0μmの範囲の銀粒子である。銀粒子の形態については、特に制限はない。銀粒子の形態としては、球状、フレーク(鱗片)状、直方体状、立方体状、凝集体状といった様々な形態が使用できる。
本発明の接合材料は、有機物からなるフラックス成分(焼結促進成分)を添加することを特徴とする。ここでフラックス成分とは、具体的に述べれば、2以上のカルボキシル基を有する有機物質である。より好ましくは、さらにエーテル結合を有するジカルボン酸である。接合材料へ当該構成を有するフラックス成分を添加することにより、窒素を初めとした不活性雰囲気下における500℃以下の熱処理操作であっても、上述した有機物質で被覆された銀ナノ粒子を、バルク態の銀に変化させることが出来る。
本発明に係る接合材料を構成する分散媒は、銀ナノ粒子を分散させる観点から蒸気圧が低い極性溶媒とすることが好ましい。なお、この時分散媒は必ずしも一種類で構成する必要はなく、併用混合することも出来る。
上述した分散媒へ、銀ナノ粒子の焼結温度低下や密着の促進を図る添加剤や、粘度調整剤を添加することも好ましい構成である。
粘度調整剤の例としては、炭化水素溶剤、各種の脂肪酸、水溶化樹脂、水性分散樹脂、および無機バインダーがある。具体的には、ナフテン系炭化水素溶剤、オレイン酸、アクリル樹脂、マレイン酸樹脂、フマル酸樹脂、スチレン・マレイン酸共重合樹脂の高酸価樹脂、ポリエステル樹脂、ポリオレフィン樹脂、フェノキシ樹脂、ポリイミド樹脂、ポリアミド樹脂あるいは酢酸ビニル系エマルション、アクリルエマルション、合成ゴムラテックス、エポキシ樹脂、フェノール樹脂、DAP樹脂、ウレタン樹脂、フッ素樹脂、シリコーン樹脂、エチルセルロースおよびポリビニルアルコール等を添加することができる。無機バインダーの例としては、シリカゾル、アルミナゾル、ジルコニアゾル、チタニアゾルといったものを挙げることが出来る。
尤も、こうした粘度調整剤は、焼結性を改善する観点から添加量が少ない方が好ましい。そこで、当該粘度調整剤の添加剤の総量は、他成分との兼ね合いもあるが、ペーストの総質量に対して0.2〜2.0質量%、好ましくは0.3〜1.5質量%、一層好ましくは0.3〜1.0質量%とするのがよい。
本発明に係る接合材料の製造方法について説明する。当該混合物を混練脱泡機へ導入して混練し混練物を形成させる。その後、当該混練物へ機械的分散処理を行い本発明に係る接合材料を得る。
接合体の形成は、接合部が形成される一の被接合部材である基板表面へ、例えばメタルマスク、ディスペンサーまたはスクリーン印刷法により、20μm〜200μm程度の厚みで接合材料を塗布する。塗布後、低温による熱処理(以降、予備焼成という)を経た後、二の被接合部材である被接合物を貼付し、高温による熱処理工程(以降は、本焼成という。)により接合材料を金属化する。
<銀ナノ粒子の合成>
500mLビーカーを用い、硝酸銀(東洋化学株式会社製)13.4gを純水72.1gへ溶解させて原料液を調製した。
得られたソルビン酸が被覆された銀ナノ粒子凝集体乾燥粉(平均一次粒子径:100nm)45.0g(全銀中の割合は50.00質量%)を銀ナノ粒子粉とし、球状銀粒子の粉末(DOWAエレクトロニクス株式会社製 2−1C球状銀粉末:平均一次粒子径(D50)1.0μm)45.0g(全銀中の割合は50.00質量%)と、フラックスとしてオキシジ酢酸(和光純薬株式会社製:ジグリコール酸)0.05gと、分散媒としてオクタンジオール(協和発酵ケミカル社製:2−エチル−1,3−ヘキサンジオール)9.95gとを、混合し、混合物とした。
尚、オクタンジオールの沸点は244℃であり、引火点は135℃である。
メタルマスク(マスク厚50μmt)を準備し、銀めっきされた銅基板上にメタルスキージによる手印刷で、実施例1に係る接合材料(ペースト)を印刷法により塗布した。パターンは□5.5mm、50μm厚とした。
実施例1に係る接合材料の分散媒であるオクタンジオールの添加量を7.95gに変更し、さらに、粘度調整を目的としてEXXSOL D130 FLUID(エクソンモービル社製)を2.0g添加した以外は、実施例1と同様の製造工程を経て、実施例2に係る接合材料を製造した。そして、実施例1と同様の工程を経て、実施例2に係る接合体を形成し、実施例1と同様の評価を行った。評価結果を表1、2に示す。
実施例1に係る接合材料の銀粉を球状銀粒子から、フレーク銀粒子粉末(DOWAエレクトロニクス株式会社製FA−D−6:平均一次粒子径(D50)8.3μm)へ変更した以外は、実施例1と同様の製造工程を経て、実施例3に係る接合材料を製造した。そして、実施例1と同様の工程を経て、実施例3に係る接合体を形成し、実施例1と同様の評価を行った。評価結果を表1、2に示す。
実施例1に係る接合材料のソルビン酸が被覆された銀ナノ粒子凝集体乾燥粉(平均一次粒子径:100nm)から、ソルビン酸が被覆された銀ナノ粒子凝集体乾燥粉(平均一次粒子径:60nm)へ変更し、フラックスをオキシジ酢酸(和光純薬株式会社製:ジグリコール酸)0.1g、分散媒としてオクタンジオール(協和発酵ケミカル株式会社製:2−エチル−1,3−ヘキサンジオール)の添加量を9.9gと変更した以外は、実施例1と同様の製造工程を経て、実施例4に係る接合材料を製造した。そして、実施例1と同様の工程を経て、実施例4に係る接合体を形成し、実施例1と同様の評価を行った。評価結果を表1、2に示す。
実施例1に係る接合材料の分散媒であるオクタンジオールの添加量を7.45gに変更し、さらに、粘度調整を目的としてEXXSOL D130 FLUID(エクソンモービル社製)を2.0g添加し、さらに、粘度調整を目的としてオレイン酸(キシダ化学株式会社製)を0.5g添加した以外は、実施例1と同様の製造工程を経て、実施例5に係る接合材料を製造した。そして、実施例1と同様の工程を経て、実施例5に係る接合体を形成し、実施例1と同様の評価を行った。評価結果を表1、2に示す。
実施例1に係る接合材料を準備した。
そして、チップマウント前の予備焼成を実施せず、接合材料が塗布された銅基板にチップをマウントし、10MPaの加圧を施して、予備乾燥として100℃10分間加熱後、250℃まで昇温速度1℃/秒で昇温し、本焼成として250℃に達してから5分間保持することで、比較例1に係る接合体を形成し、実施例1と同様の評価を行った。評価結果を表1、2に示す。
実施例2に係る接合材料を用い、比較例1と同様の工程を経て、比較例2に係る接合体を形成し、実施例1と同様の評価を行った。評価結果を表1、2に示す。
実施例3に係る接合材料を用い、比較例1と同様の工程を経て、比較例3に係る接合体を形成し、実施例1と同様の評価を行った。評価結果を表1、2に示す。
図1に、実施例1〜3および比較例1〜3に係る接合体の接合強度を示す。図1は縦軸に接合強度(シェア強度)をとり、横軸に、実施例1−比較例1、実施例2−比較例2、実施例3−比較例3をとった棒グラフである。
実施例1−比較例1と、実施例2−比較例2と、実施例3−比較例3とは、接合材料として同組成のペーストを用い、実施例1〜3においてはチップマウント前の予備焼成を実施し、比較例1〜3においてはチップマウント前の予備焼成を実施しなかったものである。
図1より、チップマウント前の予備焼成を実施した実施例1〜3に係る接合体は、予備焼成を実施しなかった比較例1〜3に係る接合体より2.3〜6.2の接合強度を発揮することが判明した。
Claims (1)
- 複数の被接合部材が、金属として銀のみを含む接合層により接合された接合体であって、当該接合層に存在するボイド率が2.0%以下である接合体。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015146197A JP6214600B2 (ja) | 2010-11-22 | 2015-07-23 | 接合材料および接合体 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010260617 | 2010-11-22 | ||
JP2010260617 | 2010-11-22 | ||
JP2015146197A JP6214600B2 (ja) | 2010-11-22 | 2015-07-23 | 接合材料および接合体 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012545628A Division JP5986929B2 (ja) | 2010-11-22 | 2011-05-13 | 接合方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016000861A JP2016000861A (ja) | 2016-01-07 |
JP6214600B2 true JP6214600B2 (ja) | 2017-10-18 |
Family
ID=46145624
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012545628A Active JP5986929B2 (ja) | 2010-11-22 | 2011-05-13 | 接合方法 |
JP2015146197A Active JP6214600B2 (ja) | 2010-11-22 | 2015-07-23 | 接合材料および接合体 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012545628A Active JP5986929B2 (ja) | 2010-11-22 | 2011-05-13 | 接合方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9486879B2 (ja) |
EP (1) | EP2645408B1 (ja) |
JP (2) | JP5986929B2 (ja) |
KR (3) | KR102158290B1 (ja) |
CN (1) | CN103250236B (ja) |
HU (1) | HUE043602T2 (ja) |
WO (1) | WO2012070262A1 (ja) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2455179B1 (en) * | 2009-07-14 | 2021-04-14 | DOWA Electronics Materials Co., Ltd. | Bonding material and bonding method each using metal nanoparticles |
WO2012169076A1 (ja) * | 2011-06-10 | 2012-12-13 | Dowaエレクトロニクス株式会社 | 接合材およびそれを用いて作成された接合体 |
JP5887086B2 (ja) * | 2011-08-11 | 2016-03-16 | 株式会社タムラ製作所 | 導電性材料 |
US10000670B2 (en) * | 2012-07-30 | 2018-06-19 | Henkel IP & Holding GmbH | Silver sintering compositions with fluxing or reducing agents for metal adhesion |
JP6121804B2 (ja) * | 2013-06-04 | 2017-04-26 | Dowaエレクトロニクス株式会社 | 接合材およびその接合材を用いて電子部品を接合する方法 |
JP6118192B2 (ja) * | 2013-06-21 | 2017-04-19 | Dowaエレクトロニクス株式会社 | 接合材およびそれを用いた接合方法 |
EP3151270B1 (en) * | 2014-05-27 | 2022-06-01 | Denka Company Limited | Semiconductor package and method for manufacturing same |
JP6373066B2 (ja) | 2014-05-30 | 2018-08-15 | Dowaエレクトロニクス株式会社 | 接合材およびそれを用いた接合方法 |
CN104014947A (zh) * | 2014-06-25 | 2014-09-03 | 北京理工大学 | 一种纳米Ag3Sn颗粒增强的复合无铅焊锡膏及制备方法 |
WO2016103528A1 (en) * | 2014-12-26 | 2016-06-30 | Henkel Japan Ltd. | Sinterable bonding material and semiconductor device using the same |
JP6624445B2 (ja) * | 2015-03-27 | 2019-12-25 | 国立大学法人大阪大学 | 半導体装置 |
US20180065324A1 (en) * | 2015-05-15 | 2018-03-08 | Konica Minolta, Inc. | Powder material, method for producing three-dimensional molded article, and three-dimensional molding device |
JP6796937B2 (ja) * | 2016-03-16 | 2020-12-09 | 日東電工株式会社 | 接合体の製造方法 |
JP6706818B2 (ja) * | 2016-06-30 | 2020-06-10 | 国立大学法人大阪大学 | 半導体装置 |
EP3296054B1 (de) * | 2016-09-19 | 2020-12-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur herstellung eines mikrobearbeiteten werkstücks mittels laserabtrag |
JP7007140B2 (ja) * | 2016-09-30 | 2022-01-24 | Dowaエレクトロニクス株式会社 | 接合材およびそれを用いた接合方法 |
MY193333A (en) * | 2016-09-30 | 2022-10-05 | Dowa Electronics Materials Co | Bonding material and bonding method using same |
JP2018109232A (ja) * | 2016-12-28 | 2018-07-12 | Dowaエレクトロニクス株式会社 | 接合材及びそれを用いた接合方法 |
TWI655693B (zh) | 2017-02-28 | 2019-04-01 | 日商京瓷股份有限公司 | 半導體裝置之製造方法 |
CN107123459B (zh) * | 2017-03-09 | 2019-04-19 | 苏州工业园区英纳电子材料有限公司 | 导电银浆 |
JP2018165387A (ja) * | 2017-03-28 | 2018-10-25 | Dowaエレクトロニクス株式会社 | 接合材およびそれを用いた接合体 |
US10730150B2 (en) * | 2017-08-07 | 2020-08-04 | Honeywell International Inc. | Flowable brazing compositions and methods of brazing metal articles together using the same |
JP6677231B2 (ja) * | 2017-09-22 | 2020-04-08 | 日亜化学工業株式会社 | 電子部品の接合方法および接合体の製造方法 |
EP3687716A1 (en) * | 2017-09-25 | 2020-08-05 | Eastman Kodak Company | Method of making silver-containing dispersions with nitrogenous bases |
JP6958434B2 (ja) | 2018-03-06 | 2021-11-02 | 三菱マテリアル株式会社 | 金属粒子凝集体及びその製造方法並びにペースト状金属粒子凝集体組成物及びこれを用いた接合体の製造方法 |
JP7155654B2 (ja) * | 2018-06-22 | 2022-10-19 | 三菱マテリアル株式会社 | 接合体の製造方法 |
JP6869274B2 (ja) * | 2019-01-11 | 2021-05-12 | Jx金属株式会社 | 導電性塗布材料 |
JP6869275B2 (ja) * | 2019-01-11 | 2021-05-12 | Jx金属株式会社 | 導電性塗布材料 |
US11515281B2 (en) | 2019-04-22 | 2022-11-29 | Panasonic Holdings Corporation | Bonded structure and bonding material |
JP7443948B2 (ja) | 2020-06-15 | 2024-03-06 | Jsr株式会社 | 組成物、銀焼結物の形成方法、接合方法、物品及び物品の製造方法 |
CN117334655A (zh) * | 2023-09-30 | 2024-01-02 | 江苏富乐华功率半导体研究院有限公司 | 一种应用银烧结焊片的低孔隙率界面结构及制备方法 |
Family Cites Families (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5841197A (en) * | 1994-11-18 | 1998-11-24 | Adamic, Jr.; Fred W. | Inverted dielectric isolation process |
JPH08164494A (ja) * | 1994-12-10 | 1996-06-25 | Kokusai Electric Co Ltd | ろうペースト及びこれを用いた溶接方法 |
JPH10162647A (ja) * | 1996-11-28 | 1998-06-19 | Asahi Chem Ind Co Ltd | 導電性ペースト |
JP3435006B2 (ja) * | 1997-02-27 | 2003-08-11 | 京セラ株式会社 | 半導体素子収納用パッケージの製造方法 |
JP3385272B2 (ja) * | 1998-06-10 | 2003-03-10 | 昭和電工株式会社 | はんだ粉末、フラックス、はんだペースト、はんだ付け方法、はんだ付けした回路板、及びはんだ付けした接合物 |
JP2001105180A (ja) * | 1999-10-05 | 2001-04-17 | Showa Denko Kk | はんだ付けフラックス |
US20020046627A1 (en) * | 1998-06-10 | 2002-04-25 | Hitoshi Amita | Solder powder, flux, solder paste, soldering method, soldered circuit board, and soldered joint product |
JP4223648B2 (ja) * | 1999-12-02 | 2009-02-12 | 昭和電工株式会社 | はんだ付けフラックス |
JP3316464B2 (ja) * | 1998-12-28 | 2002-08-19 | 株式会社中村自工 | ブレージングペースト |
JP2001085828A (ja) * | 1999-09-13 | 2001-03-30 | Suzuka Fuji Xerox Co Ltd | 部分はんだ付けプロセスおよびシステム |
JP4748292B2 (ja) * | 2000-03-15 | 2011-08-17 | 信越化学工業株式会社 | フィルム状電子部品用接着剤及び電子部品 |
US6645632B2 (en) * | 2000-03-15 | 2003-11-11 | Shin-Etsu Chemical Co., Ltd. | Film-type adhesive for electronic components, and electronic components bonded therewith |
JP2002001520A (ja) * | 2000-06-16 | 2002-01-08 | Uchihashi Estec Co Ltd | はんだ付け方法及びはんだ付け構造 |
JP3942816B2 (ja) | 2000-10-25 | 2007-07-11 | ハリマ化成株式会社 | 金属間のロウ付け接合方法 |
JP3764349B2 (ja) | 2001-05-07 | 2006-04-05 | ハリマ化成株式会社 | 金属微粒子分散液を用いたメッキ代替導電性金属皮膜の形成方法 |
JP2004082667A (ja) * | 2002-08-29 | 2004-03-18 | Yoshizawa Kk | 複合鉛板及びその製造方法 |
JP2004107728A (ja) * | 2002-09-18 | 2004-04-08 | Ebara Corp | 接合材料及び接合方法 |
KR20080020691A (ko) * | 2005-07-20 | 2008-03-05 | 히다치 가세고교 가부시끼가이샤 | 반도체용 열가소성 수지 조성물, 이것을 이용한 접착필름, 리드 프레임, 반도체장치 및 반도체장치의 제조방법 |
US20070090170A1 (en) * | 2005-10-20 | 2007-04-26 | Endicott Interconnect Technologies, Inc. | Method of making a circuitized substrate having a plurality of solder connection sites thereon |
JP2007227493A (ja) * | 2006-02-22 | 2007-09-06 | Mitsubishi Materials Corp | 金錫合金ハンダペーストを用いたハンダ付け方法 |
JP4638382B2 (ja) * | 2006-06-05 | 2011-02-23 | 田中貴金属工業株式会社 | 接合方法 |
JP4963393B2 (ja) * | 2006-10-03 | 2012-06-27 | 三ツ星ベルト株式会社 | 低温焼成型銀ペースト |
JP4872663B2 (ja) * | 2006-12-28 | 2012-02-08 | 株式会社日立製作所 | 接合用材料及び接合方法 |
JP5238215B2 (ja) * | 2007-10-19 | 2013-07-17 | 三菱製紙株式会社 | 導電性発現方法および導電性部材 |
EP3042727B1 (en) | 2007-10-24 | 2017-08-30 | DOWA Electronics Materials Co., Ltd. | Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles |
WO2009069273A1 (ja) * | 2007-11-28 | 2009-06-04 | Panasonic Corporation | 導電性ペーストおよびこれを用いた電気電子機器 |
JP5256281B2 (ja) * | 2008-03-18 | 2013-08-07 | 株式会社応用ナノ粒子研究所 | 複合銀ナノペースト、その製法及びナノペースト接合方法 |
US8513534B2 (en) | 2008-03-31 | 2013-08-20 | Hitachi, Ltd. | Semiconductor device and bonding material |
JP4936192B2 (ja) * | 2008-03-31 | 2012-05-23 | パナソニック株式会社 | 熱硬化性樹脂組成物及びその製造方法 |
JP5399110B2 (ja) | 2008-04-23 | 2014-01-29 | トヨタ自動車株式会社 | 接合材料及び接合材料の成分算出方法 |
JP5033047B2 (ja) * | 2008-04-24 | 2012-09-26 | パナソニック株式会社 | 熱硬化性樹脂組成物及びその製造方法 |
EP2305402B1 (en) * | 2008-06-26 | 2017-11-29 | DIC Corporation | Method for producing silver-containing powder and conductive paste using the same |
JP2010053377A (ja) * | 2008-08-26 | 2010-03-11 | Nippon Handa Kk | 金属製部材の接合方法および金属製部材接合体の製造方法 |
JP5475976B2 (ja) * | 2008-09-25 | 2014-04-16 | パナソニック株式会社 | 熱硬化性樹脂組成物及びその製造方法並びに回路基板 |
JP5464463B2 (ja) * | 2008-09-25 | 2014-04-09 | パナソニック株式会社 | 熱硬化性樹脂組成物及び回路基板 |
JP4893720B2 (ja) * | 2008-09-25 | 2012-03-07 | パナソニック電工株式会社 | 熱硬化性樹脂組成物及びその製造方法 |
JP5430922B2 (ja) * | 2008-12-24 | 2014-03-05 | 三ツ星ベルト株式会社 | 導電性基材の製造方法 |
JP5268717B2 (ja) * | 2009-03-10 | 2013-08-21 | 日本発條株式会社 | 大気接合用ろう材及び接合体 |
JP5611537B2 (ja) * | 2009-04-28 | 2014-10-22 | 日立化成株式会社 | 導電性接合材料、それを用いた接合方法、並びにそれによって接合された半導体装置 |
EP2455179B1 (en) * | 2009-07-14 | 2021-04-14 | DOWA Electronics Materials Co., Ltd. | Bonding material and bonding method each using metal nanoparticles |
JP5620122B2 (ja) * | 2010-02-24 | 2014-11-05 | 地方独立行政法人 大阪市立工業研究所 | 接合用材料及び接合方法 |
HUE039370T2 (hu) * | 2010-03-15 | 2018-12-28 | Dowa Electronics Materials Co | Kötõanyag és rögzítési eljárás annak használatával |
JP4928639B2 (ja) * | 2010-03-15 | 2012-05-09 | Dowaエレクトロニクス株式会社 | 接合材およびそれを用いた接合方法 |
JP2011243721A (ja) * | 2010-05-18 | 2011-12-01 | Dainippon Printing Co Ltd | 太陽電池用集電電極、太陽電池及びその製造方法 |
WO2011155055A1 (ja) * | 2010-06-11 | 2011-12-15 | Dowaエレクトロニクス株式会社 | 低温焼結性接合材および該接合材を用いた接合方法 |
-
2011
- 2011-05-13 KR KR1020187000257A patent/KR102158290B1/ko active IP Right Grant
- 2011-05-13 CN CN201180056112.3A patent/CN103250236B/zh active Active
- 2011-05-13 KR KR1020137016031A patent/KR20130129392A/ko active Application Filing
- 2011-05-13 JP JP2012545628A patent/JP5986929B2/ja active Active
- 2011-05-13 KR KR1020207016150A patent/KR102188054B1/ko active IP Right Grant
- 2011-05-13 US US13/988,387 patent/US9486879B2/en active Active
- 2011-05-13 EP EP11842826.7A patent/EP2645408B1/en active Active
- 2011-05-13 WO PCT/JP2011/061089 patent/WO2012070262A1/ja active Application Filing
- 2011-05-13 HU HUE11842826A patent/HUE043602T2/hu unknown
-
2015
- 2015-07-23 JP JP2015146197A patent/JP6214600B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2016000861A (ja) | 2016-01-07 |
US9486879B2 (en) | 2016-11-08 |
KR20180004853A (ko) | 2018-01-12 |
JP5986929B2 (ja) | 2016-09-06 |
KR102188054B1 (ko) | 2020-12-07 |
CN103250236A (zh) | 2013-08-14 |
HUE043602T2 (hu) | 2019-08-28 |
US20130323529A1 (en) | 2013-12-05 |
EP2645408A4 (en) | 2016-06-08 |
EP2645408B1 (en) | 2019-02-27 |
KR20200067952A (ko) | 2020-06-12 |
KR20130129392A (ko) | 2013-11-28 |
JPWO2012070262A1 (ja) | 2014-05-19 |
KR102158290B1 (ko) | 2020-09-21 |
WO2012070262A1 (ja) | 2012-05-31 |
CN103250236B (zh) | 2016-09-14 |
EP2645408A1 (en) | 2013-10-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6214600B2 (ja) | 接合材料および接合体 | |
JP4928639B2 (ja) | 接合材およびそれを用いた接合方法 | |
JP5860876B2 (ja) | 接合材およびそれを用いた銀塗布膜と接合体の製造方法 | |
KR101709302B1 (ko) | 저온 소결성 접합재 및 상기 접합재를 이용한 접합 방법 | |
US10008471B2 (en) | Bonding material and bonding method using the same | |
JP5824201B2 (ja) | 接合材およびそれを用いた接合方法 | |
JP6423416B2 (ja) | 焼結が難しい貴金属表面および非貴金属表面上に酸化銀が被覆された焼結ペースト | |
EP2669344A1 (en) | Adhesive composition and semiconductor device using same | |
WO2012043545A1 (ja) | 接着剤組成物及びそれを用いた半導体装置 | |
JP5487301B2 (ja) | 低温焼結性接合材および該接合材を用いた接合方法 | |
US20230311249A1 (en) | Metal paste for bonding and bonding method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20160418 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160421 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160617 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20160705 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20161004 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20161012 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20161104 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170919 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6214600 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |