JP6164963B2 - 化学機械研磨層のプレテクスチャリングの方法 - Google Patents

化学機械研磨層のプレテクスチャリングの方法 Download PDF

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Publication number
JP6164963B2
JP6164963B2 JP2013155866A JP2013155866A JP6164963B2 JP 6164963 B2 JP6164963 B2 JP 6164963B2 JP 2013155866 A JP2013155866 A JP 2013155866A JP 2013155866 A JP2013155866 A JP 2013155866A JP 6164963 B2 JP6164963 B2 JP 6164963B2
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Japan
Prior art keywords
sander
belt
chemical mechanical
mechanical polishing
roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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JP2013155866A
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English (en)
Japanese (ja)
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JP2014028427A (ja
JP2014028427A5 (zh
Inventor
ジョン・ヘンリー・ナンリー・ジュニア
アンドリュー・エム・ガイガー
ジェフリー・エイチ・ベネディクト
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials CMP Holdings Inc
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Rohm and Haas Electronic Materials CMP Holdings Inc
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Publication of JP2014028427A5 publication Critical patent/JP2014028427A5/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/18—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2013155866A 2012-07-30 2013-07-26 化学機械研磨層のプレテクスチャリングの方法 Active JP6164963B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/561,282 US9108293B2 (en) 2012-07-30 2012-07-30 Method for chemical mechanical polishing layer pretexturing
US13/561,282 2012-07-30

Publications (3)

Publication Number Publication Date
JP2014028427A JP2014028427A (ja) 2014-02-13
JP2014028427A5 JP2014028427A5 (zh) 2016-09-01
JP6164963B2 true JP6164963B2 (ja) 2017-07-19

Family

ID=49912321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013155866A Active JP6164963B2 (ja) 2012-07-30 2013-07-26 化学機械研磨層のプレテクスチャリングの方法

Country Status (7)

Country Link
US (1) US9108293B2 (zh)
JP (1) JP6164963B2 (zh)
KR (1) KR102115010B1 (zh)
CN (1) CN103567839B (zh)
DE (1) DE102013012549A1 (zh)
FR (1) FR2993808B1 (zh)
TW (1) TWI589399B (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9108293B2 (en) * 2012-07-30 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing layer pretexturing
KR102110979B1 (ko) * 2015-09-01 2020-05-15 삼성전자주식회사 스테인레스 코일용 가로 헤어라인 가공장치 및 이에 의해 형성된 스테인레스 코일
CN105881159B (zh) * 2016-04-12 2018-04-17 阳江市伟艺抛磨材料有限公司 一种基于抛光轮不织布修正热压板外形的方法
US9802293B1 (en) 2016-09-29 2017-10-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method to shape the surface of chemical mechanical polishing pads
KR101871246B1 (ko) * 2016-10-13 2018-06-28 주식회사 포스코 강판 표면처리장치

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Also Published As

Publication number Publication date
TWI589399B (zh) 2017-07-01
JP2014028427A (ja) 2014-02-13
US20140030961A1 (en) 2014-01-30
DE102013012549A1 (de) 2014-01-30
CN103567839A (zh) 2014-02-12
FR2993808A1 (fr) 2014-01-31
FR2993808B1 (fr) 2016-09-09
TW201412458A (zh) 2014-04-01
KR20140016202A (ko) 2014-02-07
CN103567839B (zh) 2017-04-12
KR102115010B1 (ko) 2020-05-26
US9108293B2 (en) 2015-08-18

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