FR2993808B1 - Procede pour la pre-texturation d'une couche de polissage mecano-chimique - Google Patents

Procede pour la pre-texturation d'une couche de polissage mecano-chimique

Info

Publication number
FR2993808B1
FR2993808B1 FR1357542A FR1357542A FR2993808B1 FR 2993808 B1 FR2993808 B1 FR 2993808B1 FR 1357542 A FR1357542 A FR 1357542A FR 1357542 A FR1357542 A FR 1357542A FR 2993808 B1 FR2993808 B1 FR 2993808B1
Authority
FR
France
Prior art keywords
texturation
mecano
polishing layer
chemical polishing
chemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1357542A
Other languages
English (en)
Other versions
FR2993808A1 (fr
Inventor
John Henry Nunley Jr
Andrew M Geiger
Jeffrey H Benedict
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials CMP Holdings Inc
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of FR2993808A1 publication Critical patent/FR2993808A1/fr
Application granted granted Critical
Publication of FR2993808B1 publication Critical patent/FR2993808B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/18—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
FR1357542A 2012-07-30 2013-07-30 Procede pour la pre-texturation d'une couche de polissage mecano-chimique Expired - Fee Related FR2993808B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/561,282 US9108293B2 (en) 2012-07-30 2012-07-30 Method for chemical mechanical polishing layer pretexturing

Publications (2)

Publication Number Publication Date
FR2993808A1 FR2993808A1 (fr) 2014-01-31
FR2993808B1 true FR2993808B1 (fr) 2016-09-09

Family

ID=49912321

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1357542A Expired - Fee Related FR2993808B1 (fr) 2012-07-30 2013-07-30 Procede pour la pre-texturation d'une couche de polissage mecano-chimique

Country Status (7)

Country Link
US (1) US9108293B2 (fr)
JP (1) JP6164963B2 (fr)
KR (1) KR102115010B1 (fr)
CN (1) CN103567839B (fr)
DE (1) DE102013012549A1 (fr)
FR (1) FR2993808B1 (fr)
TW (1) TWI589399B (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9108293B2 (en) * 2012-07-30 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing layer pretexturing
KR102110979B1 (ko) * 2015-09-01 2020-05-15 삼성전자주식회사 스테인레스 코일용 가로 헤어라인 가공장치 및 이에 의해 형성된 스테인레스 코일
CN105881159B (zh) * 2016-04-12 2018-04-17 阳江市伟艺抛磨材料有限公司 一种基于抛光轮不织布修正热压板外形的方法
US9802293B1 (en) 2016-09-29 2017-10-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method to shape the surface of chemical mechanical polishing pads
KR101871246B1 (ko) * 2016-10-13 2018-06-28 주식회사 포스코 강판 표면처리장치
KR20230077918A (ko) * 2021-11-26 2023-06-02 삼성전자주식회사 웨이퍼 연마 장치 및 이를 이용한 반도체 장치의 제조 방법

Family Cites Families (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3701219A (en) * 1972-01-14 1972-10-31 Timesavers Inc Apparatus for effecting superior sanding
US3777442A (en) * 1972-04-03 1973-12-11 Timesavers Inc Wide belt sanding machine with improved support for outboard end of cantilevered center bar
US4178721A (en) * 1977-12-28 1979-12-18 Kimwood Corporation Apparatus for sizing and finishing batches of lumber
DE3041377C2 (de) * 1980-11-03 1982-12-30 Bison-Werke Bähre & Greten GmbH & Co KG, 3257 Springe Breitbandschleifmaschine zum Bearbeiten von Span-, Faser-, Furnier- o.dgl. Platten
DE3217935C2 (de) * 1982-05-13 1984-12-13 Küsters, Eduard, 4150 Krefeld Bandschleifmaschine für Spanplatten u.dgl.
DE3316154C2 (de) * 1983-05-03 1986-06-19 Bison-Werke Bähre & Greten GmbH & Co KG, 3257 Springe Bandschleifmaschine
JPS59212513A (ja) * 1983-05-17 1984-12-01 Mitsubishi Heavy Ind Ltd 軸受装置
US4594815A (en) * 1983-07-01 1986-06-17 Timesavers, Inc. Abrasive surfacer
US4742650A (en) * 1986-11-07 1988-05-10 Conestoga Wood Specialities, Inc. Sanding machine
JP2525892B2 (ja) * 1989-04-06 1996-08-21 ロデール・ニッタ 株式会社 ポリッシング方法およびポリッシング装置
JP2514193Y2 (ja) * 1991-09-24 1996-10-16 アミテック株式会社 ベルトサンダ―
US5547448A (en) * 1993-10-28 1996-08-20 Grant W. Robertson Journal equipped rotational devices and methods of making and balancing the same
US5512009A (en) * 1994-03-01 1996-04-30 Minnesota Mining And Manufacturing Company Method and apparatus for attenuating optical chatter marks on a finished surface
JPH07310742A (ja) * 1994-05-18 1995-11-28 Ntn Corp 円筒ころ軸受及びその軸受を用いたスピンドル装置
US5527424A (en) * 1995-01-30 1996-06-18 Motorola, Inc. Preconditioner for a polishing pad and method for using the same
US7097544B1 (en) * 1995-10-27 2006-08-29 Applied Materials Inc. Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
US5895312A (en) * 1996-10-30 1999-04-20 International Business Machines Corporation Apparatus for removing surface irregularities from a flat workpiece
US6328642B1 (en) * 1997-02-14 2001-12-11 Lam Research Corporation Integrated pad and belt for chemical mechanical polishing
US6126532A (en) * 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
US6117000A (en) * 1998-07-10 2000-09-12 Cabot Corporation Polishing pad for a semiconductor substrate
US6276998B1 (en) * 1999-02-25 2001-08-21 Applied Materials, Inc. Padless substrate carrier
US6645050B1 (en) * 1999-02-25 2003-11-11 Applied Materials, Inc. Multimode substrate carrier
US6300247B2 (en) * 1999-03-29 2001-10-09 Applied Materials, Inc. Preconditioning polishing pads for chemical-mechanical polishing
US6089958A (en) * 1999-05-13 2000-07-18 Costa; Alessandro Belt sander with orbitally translated abrasive belt
US6406363B1 (en) * 1999-08-31 2002-06-18 Lam Research Corporation Unsupported chemical mechanical polishing belt
US6375540B1 (en) * 2000-06-30 2002-04-23 Lam Research Corporation End-point detection system for chemical mechanical posing applications
US6520833B1 (en) * 2000-06-30 2003-02-18 Lam Research Corporation Oscillating fixed abrasive CMP system and methods for implementing the same
US6435952B1 (en) * 2000-06-30 2002-08-20 Lam Research Corporation Apparatus and method for qualifying a chemical mechanical planarization process
US6800020B1 (en) * 2000-10-02 2004-10-05 Lam Research Corporation Web-style pad conditioning system and methods for implementing the same
US6641470B1 (en) * 2001-03-30 2003-11-04 Lam Research Corporation Apparatus for accurate endpoint detection in supported polishing pads
US6620031B2 (en) * 2001-04-04 2003-09-16 Lam Research Corporation Method for optimizing the planarizing length of a polishing pad
US6761619B1 (en) * 2001-07-10 2004-07-13 Cypress Semiconductor Corp. Method and system for spatial uniform polishing
US7037177B2 (en) * 2001-08-30 2006-05-02 Micron Technology, Inc. Method and apparatus for conditioning a chemical-mechanical polishing pad
US6852020B2 (en) * 2003-01-22 2005-02-08 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making same
AU2003225999A1 (en) * 2002-03-25 2003-10-13 Thomas West, Inc Smooth pads for cmp and polishing substrates
US6722960B2 (en) * 2002-08-30 2004-04-20 Cemco, Inc Apparatus for planing and sizing a workpiece
DE10255652B4 (de) * 2002-11-28 2005-07-14 Infineon Technologies Ag Schleifkissen, Vorrichtung zum chemisch-mechanischen Polieren und Verfahren zum nasschemischen Schleifen einer Substratoberfläche
JP2004322243A (ja) * 2003-04-23 2004-11-18 Arai Pump Mfg Co Ltd キャリアプレートおよびその製造方法ならびに該方法に使用する研削盤
US6931330B1 (en) * 2003-06-30 2005-08-16 Lam Research Corporation Methods for monitoring and controlling chemical mechanical planarization
US6843709B1 (en) * 2003-12-11 2005-01-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method for reducing slurry reflux
WO2005072338A2 (fr) * 2004-01-26 2005-08-11 Tbw Industries, Inc. Systeme et procede de traitement d'un tampon in situ et en plusieurs etapes, destines a une planarisation par polissage chimique et mecanique
US6955587B2 (en) * 2004-01-30 2005-10-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc Grooved polishing pad and method
US6935938B1 (en) * 2004-03-31 2005-08-30 Lam Research Corporation Multiple-conditioning member device for chemical mechanical planarization conditioning
JP2005333121A (ja) * 2004-04-21 2005-12-02 Jsr Corp 化学機械研磨パッド及びその製造方法並びに化学機械研磨方法
KR100640141B1 (ko) * 2004-04-21 2006-10-31 제이에스알 가부시끼가이샤 화학 기계 연마 패드 및 그 제조 방법 및 화학 기계 연마방법
TW200720017A (en) * 2005-09-19 2007-06-01 Rohm & Haas Elect Mat Water-based polishing pads having improved adhesion properties and methods of manufacture
JP2008057657A (ja) * 2006-08-31 2008-03-13 Citizen Seimitsu Co Ltd Ｎｃ自動旋盤の主軸軸受構造
JP5611214B2 (ja) * 2008-10-16 2014-10-22 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 渦電流利得の補償
JP5388212B2 (ja) * 2009-03-06 2014-01-15 エルジー・ケム・リミテッド フロートガラス研磨システム用下部ユニット
JP5725300B2 (ja) * 2009-06-18 2015-05-27 Jsr株式会社 研磨層形成用組成物、ならびに化学機械研磨用パッドおよびそれを用いた化学機械研磨方法
JP2011077413A (ja) * 2009-09-30 2011-04-14 Noritake Co Ltd シリコンウェハーの製造方法
US8595921B2 (en) * 2010-11-17 2013-12-03 Rsr Technologies, Inc. Electrodes made using surfacing technique and method of manufacturing the same
US9108293B2 (en) * 2012-07-30 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing layer pretexturing

Also Published As

Publication number Publication date
TWI589399B (zh) 2017-07-01
JP2014028427A (ja) 2014-02-13
KR102115010B1 (ko) 2020-05-26
US9108293B2 (en) 2015-08-18
FR2993808A1 (fr) 2014-01-31
DE102013012549A1 (de) 2014-01-30
KR20140016202A (ko) 2014-02-07
JP6164963B2 (ja) 2017-07-19
US20140030961A1 (en) 2014-01-30
CN103567839A (zh) 2014-02-12
CN103567839B (zh) 2017-04-12
TW201412458A (zh) 2014-04-01

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