JP2014028427A - 化学機械研磨層のプレテクスチャリングの方法 - Google Patents
化学機械研磨層のプレテクスチャリングの方法 Download PDFInfo
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- JP2014028427A JP2014028427A JP2013155866A JP2013155866A JP2014028427A JP 2014028427 A JP2014028427 A JP 2014028427A JP 2013155866 A JP2013155866 A JP 2013155866A JP 2013155866 A JP2013155866 A JP 2013155866A JP 2014028427 A JP2014028427 A JP 2014028427A
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- 238000005498 polishing Methods 0.000 title claims abstract description 209
- 239000000126 substance Substances 0.000 title claims abstract description 133
- 238000000034 method Methods 0.000 title claims abstract description 56
- 239000000463 material Substances 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 230000001747 exhibiting effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 22
- 239000000758 substrate Substances 0.000 description 14
- 230000003750 conditioning effect Effects 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 238000005096 rolling process Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 229920006254 polymer film Polymers 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/18—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
【解決手段】搬送ベルト32、搬送フィードローラ34および軸受36、搬送支持ローラ及び搬送ベルトドライバを含む化学機械研磨層搬送モジュール30と化学機械研磨層10の研磨表面をプレテクスチャリングする較正サンダーベルト42、非駆動ローラ44および軸受45、駆動ローラ46、および軸受47、48、較正サンダーベルトドライバ50を含む較正サンダーモジュール40であり、少なくとも2つの駆動ローラ軸受が、付勢されることによって、研磨層がローラに係合し、表面をプレテクスチュアリングする。
【選択図】図1
Description
化学機械研摩パッド又は研摩パッド構成要素(例えば、研磨層10)に関連して、本明細書及び特許請求の範囲で用いられる用語「実質的に円形の断面」は、中心軸12から研摩パッド構成要素の外周15までの断面の最も長い半径rが、中心軸12から外周15までの断面の最も短い半径より20%未満長い長さであることを意味する(図5参照)。
Claims (10)
- 化学機械研磨層の研磨表面をプレテクスチャリングする方法であり、
研磨表面及び最初の平均厚さTIAを有する化学機械研磨層を提供するステップと、
搬送ベルト、搬送フィードローラ、少なくとも2つの搬送フィードローラ軸受、少なくとも1つの搬送支持ローラ及び搬送ベルトドライバを含む化学機械研磨層搬送モジュールであって、搬送フィードローラ軸受が、搬送フィードローラ回転軸Atfrの周りの、搬送フィードローラの回転運動を容易にし、搬送ベルトが、搬送フィードローラ及び少なくとも1つの搬送支持ローラの周囲に装着され、そして、搬送ベルトドライバが、搬送ベルトの運動を容易にするために、搬送ベルトと機械的に連結している、化学機械研磨層搬送モジュールと、
較正サンダーベルト、非駆動ローラ、少なくとも2つの非駆動ローラ軸受、駆動ローラ、少なくとも2つの駆動ローラ軸受であって、ラジアル隙間を有する駆動ローラ軸受、較正サンダーベルトドライバであって、較正サンダーベルトの運動を容易にするために、駆動ローラと機械的に連結している較正サンダーベルトドライバ、を含む較正サンダーモジュールであり、較正サンダーベルトが、非駆動ローラ及び駆動ローラの周囲に装着され、少なくとも2つの非駆動ローラ軸受が、非駆動ローラ回転軸Andrの周りの、非駆動ローラの回転運動を容易にし、そして、少なくとも2つの駆動ローラ軸受が、駆動ローラ回転軸Adrの周りの、駆動ローラの回転運動を容易にし、駆動ローラ回転軸Adrが、搬送フィードローラ回転軸Atfrと実質的に平行である、較正サンダーモジュールと、
を含んだベルトサンダー機械を提供するステップと、
化学機械研磨層を搬送ベルトに配置するステップと、
搬送ベルトと較正サンダーベルトの間の間隙に化学機械研磨層を供給するステップと、
を含む方法であって、
研磨表面が、較正サンダーベルトと接触し、
化学機械研磨層が間隙を通過するとき、ラジアル隙間が、化学機械研磨層に対して駆動ローラの同側に設定されるように、少なくとも2つの駆動ローラ軸受が、付勢され、
間隙が、化学機械研磨層の、最初の平均厚さTIAより狭く、
化学機械研磨層が、間隙を通過した後に、最終の平均厚さTFAを呈し、
そして、最終の平均厚さTFAが、最初の平均厚さTIAより薄い、方法。 - 少なくとも2つの駆動ローラ軸受が、ラジアル玉軸受である、請求項1に記載の方法。
- 較正サンダーベルトが、25μmから300μmの粒度を呈する研削表面を有する、請求項1に記載の方法。
- 平均厚さTCAを有するキャリアを提供するステップと、
化学機械研磨層をキャリア上に配置するステップと、
を更に含み、
化学機械研磨層が、キャリア上で間隙に供給され、
そして、間隙が、平均厚さTCAと最初の平均厚さTIAの合計より小さい、請求項1に記載の方法。 - キャリアが、2.54mmから5.1mmの平均厚さTCAを有する、請求項4に記載の方法。
- キャリアが、アルミニウム及びアクリル板から選択される材料で構成される、請求項4に記載の方法。
- キャリアが、実質的に円形の断面を有する、請求項4に記載の方法。
- 提供されるベルトサンダー機械が、駆動ローラ付勢部材を更に含み、駆動ローラ付勢部材が、少なくとも2つの駆動ローラ軸受のラジアル隙間が、間隙を通過する化学機械研磨層に対して駆動ローラの同側に設定されるように、駆動ローラに係合する、請求項1に記載の方法。
- 提供されるベルトサンダー機械が、駆動ローラ上に同軸で取り付けられた駆動ローラ付勢軸受を更に含み、
駆動ローラ付勢部材が、駆動ローラ付勢軸受に対して圧力をかけることによって、駆動ローラに係合する、請求項8に記載の方法。 - 駆動ローラ付勢軸受が、玉軸受である、請求項9に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US13/561,282 US9108293B2 (en) | 2012-07-30 | 2012-07-30 | Method for chemical mechanical polishing layer pretexturing |
US13/561,282 | 2012-07-30 |
Publications (3)
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JP2014028427A true JP2014028427A (ja) | 2014-02-13 |
JP2014028427A5 JP2014028427A5 (ja) | 2016-09-01 |
JP6164963B2 JP6164963B2 (ja) | 2017-07-19 |
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JP2013155866A Active JP6164963B2 (ja) | 2012-07-30 | 2013-07-26 | 化学機械研磨層のプレテクスチャリングの方法 |
Country Status (7)
Country | Link |
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US (1) | US9108293B2 (ja) |
JP (1) | JP6164963B2 (ja) |
KR (1) | KR102115010B1 (ja) |
CN (1) | CN103567839B (ja) |
DE (1) | DE102013012549A1 (ja) |
FR (1) | FR2993808B1 (ja) |
TW (1) | TWI589399B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US9108293B2 (en) * | 2012-07-30 | 2015-08-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for chemical mechanical polishing layer pretexturing |
KR102110979B1 (ko) * | 2015-09-01 | 2020-05-15 | 삼성전자주식회사 | 스테인레스 코일용 가로 헤어라인 가공장치 및 이에 의해 형성된 스테인레스 코일 |
CN105881159B (zh) * | 2016-04-12 | 2018-04-17 | 阳江市伟艺抛磨材料有限公司 | 一种基于抛光轮不织布修正热压板外形的方法 |
US9802293B1 (en) | 2016-09-29 | 2017-10-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method to shape the surface of chemical mechanical polishing pads |
KR101871246B1 (ko) * | 2016-10-13 | 2018-06-28 | 주식회사 포스코 | 강판 표면처리장치 |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59212513A (ja) * | 1983-05-17 | 1984-12-01 | Mitsubishi Heavy Ind Ltd | 軸受装置 |
JPH02269552A (ja) * | 1989-04-06 | 1990-11-02 | Rodeele Nitta Kk | ポリッシング方法およびポリッシング装置 |
JPH0529663U (ja) * | 1991-09-24 | 1993-04-20 | アミテツク株式会社 | ベルトサンダー |
JPH07310742A (ja) * | 1994-05-18 | 1995-11-28 | Ntn Corp | 円筒ころ軸受及びその軸受を用いたスピンドル装置 |
US5547448A (en) * | 1993-10-28 | 1996-08-20 | Grant W. Robertson | Journal equipped rotational devices and methods of making and balancing the same |
US6089958A (en) * | 1999-05-13 | 2000-07-18 | Costa; Alessandro | Belt sander with orbitally translated abrasive belt |
JP2000296457A (ja) * | 1999-02-25 | 2000-10-24 | Obsidian Inc | パッドレス基板キャリヤ |
US20040157531A1 (en) * | 2000-06-30 | 2004-08-12 | Lam Research Corporation | End-point detection apparatus |
JP2004322243A (ja) * | 2003-04-23 | 2004-11-18 | Arai Pump Mfg Co Ltd | キャリアプレートおよびその製造方法ならびに該方法に使用する研削盤 |
JP2005333121A (ja) * | 2004-04-21 | 2005-12-02 | Jsr Corp | 化学機械研磨パッド及びその製造方法並びに化学機械研磨方法 |
JP2008057657A (ja) * | 2006-08-31 | 2008-03-13 | Citizen Seimitsu Co Ltd | Nc自動旋盤の主軸軸受構造 |
JP2010208017A (ja) * | 2009-03-06 | 2010-09-24 | Lg Chem Ltd | フロートガラス研磨システム用下部ユニット及びそれを用いたフロートガラスの研磨方法 |
Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3701219A (en) * | 1972-01-14 | 1972-10-31 | Timesavers Inc | Apparatus for effecting superior sanding |
US3777442A (en) * | 1972-04-03 | 1973-12-11 | Timesavers Inc | Wide belt sanding machine with improved support for outboard end of cantilevered center bar |
US4178721A (en) * | 1977-12-28 | 1979-12-18 | Kimwood Corporation | Apparatus for sizing and finishing batches of lumber |
DE3041377C2 (de) * | 1980-11-03 | 1982-12-30 | Bison-Werke Bähre & Greten GmbH & Co KG, 3257 Springe | Breitbandschleifmaschine zum Bearbeiten von Span-, Faser-, Furnier- o.dgl. Platten |
DE3217935C2 (de) * | 1982-05-13 | 1984-12-13 | Küsters, Eduard, 4150 Krefeld | Bandschleifmaschine für Spanplatten u.dgl. |
DE3316154C2 (de) * | 1983-05-03 | 1986-06-19 | Bison-Werke Bähre & Greten GmbH & Co KG, 3257 Springe | Bandschleifmaschine |
US4594815A (en) * | 1983-07-01 | 1986-06-17 | Timesavers, Inc. | Abrasive surfacer |
US4742650A (en) * | 1986-11-07 | 1988-05-10 | Conestoga Wood Specialities, Inc. | Sanding machine |
US5512009A (en) * | 1994-03-01 | 1996-04-30 | Minnesota Mining And Manufacturing Company | Method and apparatus for attenuating optical chatter marks on a finished surface |
US5527424A (en) * | 1995-01-30 | 1996-06-18 | Motorola, Inc. | Preconditioner for a polishing pad and method for using the same |
US7097544B1 (en) * | 1995-10-27 | 2006-08-29 | Applied Materials Inc. | Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion |
US5895312A (en) * | 1996-10-30 | 1999-04-20 | International Business Machines Corporation | Apparatus for removing surface irregularities from a flat workpiece |
US6328642B1 (en) * | 1997-02-14 | 2001-12-11 | Lam Research Corporation | Integrated pad and belt for chemical mechanical polishing |
US6126532A (en) * | 1997-04-18 | 2000-10-03 | Cabot Corporation | Polishing pads for a semiconductor substrate |
US6117000A (en) * | 1998-07-10 | 2000-09-12 | Cabot Corporation | Polishing pad for a semiconductor substrate |
US6645050B1 (en) * | 1999-02-25 | 2003-11-11 | Applied Materials, Inc. | Multimode substrate carrier |
US6300247B2 (en) * | 1999-03-29 | 2001-10-09 | Applied Materials, Inc. | Preconditioning polishing pads for chemical-mechanical polishing |
US6406363B1 (en) * | 1999-08-31 | 2002-06-18 | Lam Research Corporation | Unsupported chemical mechanical polishing belt |
US6435952B1 (en) * | 2000-06-30 | 2002-08-20 | Lam Research Corporation | Apparatus and method for qualifying a chemical mechanical planarization process |
US6520833B1 (en) * | 2000-06-30 | 2003-02-18 | Lam Research Corporation | Oscillating fixed abrasive CMP system and methods for implementing the same |
US6800020B1 (en) * | 2000-10-02 | 2004-10-05 | Lam Research Corporation | Web-style pad conditioning system and methods for implementing the same |
US6641470B1 (en) * | 2001-03-30 | 2003-11-04 | Lam Research Corporation | Apparatus for accurate endpoint detection in supported polishing pads |
US6620031B2 (en) * | 2001-04-04 | 2003-09-16 | Lam Research Corporation | Method for optimizing the planarizing length of a polishing pad |
US6761619B1 (en) * | 2001-07-10 | 2004-07-13 | Cypress Semiconductor Corp. | Method and system for spatial uniform polishing |
US7037177B2 (en) * | 2001-08-30 | 2006-05-02 | Micron Technology, Inc. | Method and apparatus for conditioning a chemical-mechanical polishing pad |
US6852020B2 (en) * | 2003-01-22 | 2005-02-08 | Raytech Innovative Solutions, Inc. | Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making same |
US7118461B2 (en) * | 2002-03-25 | 2006-10-10 | Thomas West Inc. | Smooth pads for CMP and polishing substrates |
US6722960B2 (en) * | 2002-08-30 | 2004-04-20 | Cemco, Inc | Apparatus for planing and sizing a workpiece |
DE10255652B4 (de) * | 2002-11-28 | 2005-07-14 | Infineon Technologies Ag | Schleifkissen, Vorrichtung zum chemisch-mechanischen Polieren und Verfahren zum nasschemischen Schleifen einer Substratoberfläche |
US6931330B1 (en) * | 2003-06-30 | 2005-08-16 | Lam Research Corporation | Methods for monitoring and controlling chemical mechanical planarization |
US6843709B1 (en) * | 2003-12-11 | 2005-01-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method for reducing slurry reflux |
EP1715979A4 (en) * | 2004-01-26 | 2010-03-31 | Tbw Ind Inc | SYSTEM AND METHOD FOR MULTIPLE IN-SITU TOWEL CONDITIONING FOR CHEMICAL-MECHANICAL PLANARIZATION |
US6955587B2 (en) * | 2004-01-30 | 2005-10-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc | Grooved polishing pad and method |
US6935938B1 (en) * | 2004-03-31 | 2005-08-30 | Lam Research Corporation | Multiple-conditioning member device for chemical mechanical planarization conditioning |
KR100640141B1 (ko) * | 2004-04-21 | 2006-10-31 | 제이에스알 가부시끼가이샤 | 화학 기계 연마 패드 및 그 제조 방법 및 화학 기계 연마방법 |
TW200720017A (en) * | 2005-09-19 | 2007-06-01 | Rohm & Haas Elect Mat | Water-based polishing pads having improved adhesion properties and methods of manufacture |
JP5611214B2 (ja) * | 2008-10-16 | 2014-10-22 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 渦電流利得の補償 |
KR20120039523A (ko) * | 2009-06-18 | 2012-04-25 | 제이에스알 가부시끼가이샤 | 폴리우레탄 및 그것을 함유하는 연마층 형성용 조성물, 및 화학 기계 연마용 패드 및 그것을 사용한 화학 기계 연마 방법 |
JP2011077413A (ja) * | 2009-09-30 | 2011-04-14 | Noritake Co Ltd | シリコンウェハーの製造方法 |
US8595921B2 (en) * | 2010-11-17 | 2013-12-03 | Rsr Technologies, Inc. | Electrodes made using surfacing technique and method of manufacturing the same |
US9108293B2 (en) * | 2012-07-30 | 2015-08-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for chemical mechanical polishing layer pretexturing |
-
2012
- 2012-07-30 US US13/561,282 patent/US9108293B2/en active Active
-
2013
- 2013-07-25 TW TW102126617A patent/TWI589399B/zh active
- 2013-07-26 JP JP2013155866A patent/JP6164963B2/ja active Active
- 2013-07-29 DE DE102013012549.9A patent/DE102013012549A1/de not_active Withdrawn
- 2013-07-30 FR FR1357542A patent/FR2993808B1/fr not_active Expired - Fee Related
- 2013-07-30 KR KR1020130090114A patent/KR102115010B1/ko active IP Right Grant
- 2013-07-30 CN CN201310491353.1A patent/CN103567839B/zh active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59212513A (ja) * | 1983-05-17 | 1984-12-01 | Mitsubishi Heavy Ind Ltd | 軸受装置 |
JPH02269552A (ja) * | 1989-04-06 | 1990-11-02 | Rodeele Nitta Kk | ポリッシング方法およびポリッシング装置 |
JPH0529663U (ja) * | 1991-09-24 | 1993-04-20 | アミテツク株式会社 | ベルトサンダー |
US5547448A (en) * | 1993-10-28 | 1996-08-20 | Grant W. Robertson | Journal equipped rotational devices and methods of making and balancing the same |
JPH07310742A (ja) * | 1994-05-18 | 1995-11-28 | Ntn Corp | 円筒ころ軸受及びその軸受を用いたスピンドル装置 |
JP2000296457A (ja) * | 1999-02-25 | 2000-10-24 | Obsidian Inc | パッドレス基板キャリヤ |
US6089958A (en) * | 1999-05-13 | 2000-07-18 | Costa; Alessandro | Belt sander with orbitally translated abrasive belt |
US20040157531A1 (en) * | 2000-06-30 | 2004-08-12 | Lam Research Corporation | End-point detection apparatus |
JP2004322243A (ja) * | 2003-04-23 | 2004-11-18 | Arai Pump Mfg Co Ltd | キャリアプレートおよびその製造方法ならびに該方法に使用する研削盤 |
JP2005333121A (ja) * | 2004-04-21 | 2005-12-02 | Jsr Corp | 化学機械研磨パッド及びその製造方法並びに化学機械研磨方法 |
JP2008057657A (ja) * | 2006-08-31 | 2008-03-13 | Citizen Seimitsu Co Ltd | Nc自動旋盤の主軸軸受構造 |
JP2010208017A (ja) * | 2009-03-06 | 2010-09-24 | Lg Chem Ltd | フロートガラス研磨システム用下部ユニット及びそれを用いたフロートガラスの研磨方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI589399B (zh) | 2017-07-01 |
US20140030961A1 (en) | 2014-01-30 |
DE102013012549A1 (de) | 2014-01-30 |
CN103567839A (zh) | 2014-02-12 |
JP6164963B2 (ja) | 2017-07-19 |
FR2993808A1 (fr) | 2014-01-31 |
FR2993808B1 (fr) | 2016-09-09 |
TW201412458A (zh) | 2014-04-01 |
KR20140016202A (ko) | 2014-02-07 |
CN103567839B (zh) | 2017-04-12 |
KR102115010B1 (ko) | 2020-05-26 |
US9108293B2 (en) | 2015-08-18 |
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