JP6164963B2 - 化学機械研磨層のプレテクスチャリングの方法 - Google Patents
化学機械研磨層のプレテクスチャリングの方法 Download PDFInfo
- Publication number
- JP6164963B2 JP6164963B2 JP2013155866A JP2013155866A JP6164963B2 JP 6164963 B2 JP6164963 B2 JP 6164963B2 JP 2013155866 A JP2013155866 A JP 2013155866A JP 2013155866 A JP2013155866 A JP 2013155866A JP 6164963 B2 JP6164963 B2 JP 6164963B2
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- JP
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- Prior art keywords
- sander
- belt
- chemical mechanical
- mechanical polishing
- roller
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/18—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
化学機械研摩パッド又は研摩パッド構成要素(例えば、研磨層10)に関連して、本明細書及び特許請求の範囲で用いられる用語「実質的に円形の断面」は、中心軸12から研摩パッド構成要素の外周15までの断面の最も長い半径rが、中心軸12から外周15までの断面の最も短い半径より20%未満長い長さであることを意味する(図5参照)。
Claims (8)
- 化学機械研磨層の研磨表面をプレテクスチャリングする方法であり、
研磨表面及び最初の平均厚さTIAを有する化学機械研磨層を提供するステップと、
搬送ベルト、搬送フィードローラ、少なくとも2つの搬送フィードローラ軸受、少なくとも1つの搬送支持ローラ及び搬送ベルトドライバを含む化学機械研磨層搬送モジュールであって、搬送フィードローラ軸受が、搬送フィードローラ回転軸Atfrの周りの、搬送フィードローラの回転運動を容易にし、搬送ベルトが、搬送フィードローラ及び少なくとも1つの搬送支持ローラの周囲に装着され、そして、搬送ベルトドライバが、搬送ベルトの運動を容易にするために、搬送ベルトと機械的に連結している、化学機械研磨層搬送モジュールと、
較正サンダーベルト、非駆動ローラ、少なくとも2つの非駆動ローラ軸受、駆動ローラ、少なくとも2つの駆動ローラ軸受であって、ラジアル隙間を有する駆動ローラ軸受、駆動ローラ付勢部材、駆動ローラ上に同軸で取り付けられた駆動ローラ付勢軸受であって、少なくとも2つの駆動ローラ軸受のラジアル隙間が、間隙を通過する化学機械研磨層に対して駆動ローラの同側に設定されるように、駆動ローラ付勢部材が、駆動ローラ付勢軸受に対して圧力をかけることによって、駆動ローラに係合する、駆動ローラ付勢軸受、較正サンダーベルトドライバであって、較正サンダーベルトの運動を容易にするために、駆動ローラと機械的に連結している較正サンダーベルトドライバ、を含む較正サンダーモジュールであり、較正サンダーベルトが、非駆動ローラ及び駆動ローラの周囲に装着され、少なくとも2つの非駆動ローラ軸受が、非駆動ローラ回転軸Andrの周りの、非駆動ローラの回転運動を容易にし、そして、少なくとも2つの駆動ローラ軸受が、駆動ローラ回転軸Adrの周りの、駆動ローラの回転運動を容易にし、駆動ローラ回転軸Adrが、搬送フィードローラ回転軸Atfrと実質的に平行である、較正サンダーモジュールと、
を含んだベルトサンダー機械を提供するステップと、
化学機械研磨層を搬送ベルトに配置するステップと、
搬送ベルトと較正サンダーベルトの間の間隙に化学機械研磨層を供給するステップと、
を含む方法であって、
研磨表面が、較正サンダーベルトと接触し、
化学機械研磨層が間隙を通過するとき、ラジアル隙間が、化学機械研磨層に最も近い駆動ローラの側とは反対の駆動ローラの同側に設定されるように、少なくとも2つの駆動ローラ軸受が、付勢され、
間隙が、化学機械研磨層の、最初の平均厚さTIAより狭く、
化学機械研磨層が、間隙を通過した後に、最終の平均厚さTFAを呈し、
そして、最終の平均厚さTFAが、最初の平均厚さTIAより薄い、方法。 - 少なくとも2つの駆動ローラ軸受が、ラジアル玉軸受である、請求項1に記載の方法。
- 較正サンダーベルトが、25μmから300μmの粒度を呈する研削表面を有する、請求項1に記載の方法。
- 平均厚さTCAを有するキャリアを提供するステップと、
化学機械研磨層をキャリア上に配置するステップと、
を更に含み、
化学機械研磨層が、キャリア上で間隙に供給され、
そして、間隙が、平均厚さTCAと最初の平均厚さTIAの合計より小さい、請求項1に記載の方法。 - キャリアが、2.54mmから5.1mmの平均厚さTCAを有する、請求項4に記載の方法。
- キャリアが、アルミニウム及びアクリル板から選択される材料で構成される、請求項4に記載の方法。
- キャリアが、実質的に円形の断面を有する、請求項4に記載の方法。
- 駆動ローラ付勢軸受が、玉軸受である、請求項1に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/561,282 | 2012-07-30 | ||
US13/561,282 US9108293B2 (en) | 2012-07-30 | 2012-07-30 | Method for chemical mechanical polishing layer pretexturing |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014028427A JP2014028427A (ja) | 2014-02-13 |
JP2014028427A5 JP2014028427A5 (ja) | 2016-09-01 |
JP6164963B2 true JP6164963B2 (ja) | 2017-07-19 |
Family
ID=49912321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013155866A Active JP6164963B2 (ja) | 2012-07-30 | 2013-07-26 | 化学機械研磨層のプレテクスチャリングの方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9108293B2 (ja) |
JP (1) | JP6164963B2 (ja) |
KR (1) | KR102115010B1 (ja) |
CN (1) | CN103567839B (ja) |
DE (1) | DE102013012549A1 (ja) |
FR (1) | FR2993808B1 (ja) |
TW (1) | TWI589399B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US9108293B2 (en) * | 2012-07-30 | 2015-08-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for chemical mechanical polishing layer pretexturing |
KR102110979B1 (ko) * | 2015-09-01 | 2020-05-15 | 삼성전자주식회사 | 스테인레스 코일용 가로 헤어라인 가공장치 및 이에 의해 형성된 스테인레스 코일 |
CN105881159B (zh) * | 2016-04-12 | 2018-04-17 | 阳江市伟艺抛磨材料有限公司 | 一种基于抛光轮不织布修正热压板外形的方法 |
US9802293B1 (en) | 2016-09-29 | 2017-10-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method to shape the surface of chemical mechanical polishing pads |
KR101871246B1 (ko) * | 2016-10-13 | 2018-06-28 | 주식회사 포스코 | 강판 표면처리장치 |
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-
2012
- 2012-07-30 US US13/561,282 patent/US9108293B2/en active Active
-
2013
- 2013-07-25 TW TW102126617A patent/TWI589399B/zh active
- 2013-07-26 JP JP2013155866A patent/JP6164963B2/ja active Active
- 2013-07-29 DE DE102013012549.9A patent/DE102013012549A1/de not_active Withdrawn
- 2013-07-30 CN CN201310491353.1A patent/CN103567839B/zh active Active
- 2013-07-30 KR KR1020130090114A patent/KR102115010B1/ko active IP Right Grant
- 2013-07-30 FR FR1357542A patent/FR2993808B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN103567839A (zh) | 2014-02-12 |
KR102115010B1 (ko) | 2020-05-26 |
FR2993808B1 (fr) | 2016-09-09 |
FR2993808A1 (fr) | 2014-01-31 |
TW201412458A (zh) | 2014-04-01 |
DE102013012549A1 (de) | 2014-01-30 |
TWI589399B (zh) | 2017-07-01 |
JP2014028427A (ja) | 2014-02-13 |
CN103567839B (zh) | 2017-04-12 |
US9108293B2 (en) | 2015-08-18 |
US20140030961A1 (en) | 2014-01-30 |
KR20140016202A (ko) | 2014-02-07 |
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