JP6163803B2 - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
JP6163803B2
JP6163803B2 JP2013051478A JP2013051478A JP6163803B2 JP 6163803 B2 JP6163803 B2 JP 6163803B2 JP 2013051478 A JP2013051478 A JP 2013051478A JP 2013051478 A JP2013051478 A JP 2013051478A JP 6163803 B2 JP6163803 B2 JP 6163803B2
Authority
JP
Japan
Prior art keywords
epoxy resin
resin
sheet
resin composition
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013051478A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014177530A (ja
Inventor
嘉生 西村
嘉生 西村
中村　茂雄
茂雄 中村
賢司 川合
賢司 川合
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2013051478A priority Critical patent/JP6163803B2/ja
Priority to TW103107044A priority patent/TWI627224B/zh
Priority to KR1020140028763A priority patent/KR102132148B1/ko
Priority to CN201410091091.4A priority patent/CN104045976B/zh
Publication of JP2014177530A publication Critical patent/JP2014177530A/ja
Application granted granted Critical
Publication of JP6163803B2 publication Critical patent/JP6163803B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
JP2013051478A 2013-03-14 2013-03-14 樹脂組成物 Active JP6163803B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013051478A JP6163803B2 (ja) 2013-03-14 2013-03-14 樹脂組成物
TW103107044A TWI627224B (zh) 2013-03-14 2014-03-03 Resin composition
KR1020140028763A KR102132148B1 (ko) 2013-03-14 2014-03-12 수지 조성물
CN201410091091.4A CN104045976B (zh) 2013-03-14 2014-03-13 树脂组合物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013051478A JP6163803B2 (ja) 2013-03-14 2013-03-14 樹脂組成物

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017083863A Division JP6418273B2 (ja) 2017-04-20 2017-04-20 樹脂組成物

Publications (2)

Publication Number Publication Date
JP2014177530A JP2014177530A (ja) 2014-09-25
JP6163803B2 true JP6163803B2 (ja) 2017-07-19

Family

ID=51499393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013051478A Active JP6163803B2 (ja) 2013-03-14 2013-03-14 樹脂組成物

Country Status (4)

Country Link
JP (1) JP6163803B2 (zh)
KR (1) KR102132148B1 (zh)
CN (1) CN104045976B (zh)
TW (1) TWI627224B (zh)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6538429B2 (ja) * 2014-10-17 2019-07-03 太陽インキ製造株式会社 ドライフィルム、硬化物およびプリント配線板
KR102534679B1 (ko) 2015-07-10 2023-05-19 스미토모 세이카 가부시키가이샤 에폭시 수지 조성물, 그 제조 방법 및 해당 조성물의 용도
JP6648433B2 (ja) * 2015-07-14 2020-02-14 味の素株式会社 樹脂組成物
JP6950732B2 (ja) * 2015-08-07 2021-10-13 味の素株式会社 樹脂組成物
JP6620457B2 (ja) * 2015-08-11 2019-12-18 味の素株式会社 樹脂組成物
US20180213635A1 (en) * 2015-09-30 2018-07-26 Sekisui Chemical Co., Ltd. Resin composition and multilayer substrate
CN108353497A (zh) * 2015-12-18 2018-07-31 Dic株式会社 热固性粘接片、带有增强部的柔性印刷配线板、其制造方法以及电子设备
TWI622139B (zh) * 2016-03-08 2018-04-21 恆勁科技股份有限公司 封裝基板
CN106632154B (zh) * 2016-09-23 2019-01-25 厦门双瑞船舶涂料有限公司 一种二聚酸改性环氧树脂及其制备方法
JP6953709B2 (ja) * 2016-12-14 2021-10-27 味の素株式会社 樹脂組成物
CN110167989B (zh) * 2017-01-10 2022-11-11 住友精化株式会社 环氧树脂组合物
WO2018131571A1 (ja) 2017-01-10 2018-07-19 住友精化株式会社 エポキシ樹脂組成物
KR102512801B1 (ko) 2017-01-10 2023-03-23 스미토모 세이카 가부시키가이샤 에폭시 수지 조성물
CN110191921B (zh) 2017-01-10 2022-04-26 住友精化株式会社 环氧树脂组合物
KR102461514B1 (ko) 2017-01-10 2022-11-08 스미토모 세이카 가부시키가이샤 에폭시 수지 조성물
CN107188672A (zh) * 2017-05-27 2017-09-22 金正大生态工程集团股份有限公司 一种二聚酸基环氧树脂包膜控释肥料及其制备方法
JP7210901B2 (ja) * 2017-06-26 2023-01-24 味の素株式会社 樹脂組成物層
JP6859897B2 (ja) * 2017-08-21 2021-04-14 味の素株式会社 樹脂組成物
JP6801608B2 (ja) * 2017-08-21 2020-12-16 味の素株式会社 樹脂組成物
KR20200079509A (ko) * 2017-11-24 2020-07-03 나믹스 가부시끼가이샤 열경화성 수지 조성물, 절연성 필름, 층간 절연성 필름, 다층 배선판, 및 반도체 장치
CN109599346B (zh) * 2018-12-11 2021-03-09 杰群电子科技（东莞）有限公司 一种智能功率模组加工工艺及功率模组
JP7241389B2 (ja) 2019-02-21 2023-03-17 ナミックス株式会社 液状エポキシ樹脂組成物及びそれを硬化させて得られる硬化物
US20220169827A1 (en) 2019-03-27 2022-06-02 Sekisui Chemical Co., Ltd. Resin material and multilayer printed wiring board
CN110049637B (zh) * 2019-05-22 2020-11-06 昆山欧贝达电子科技有限公司 Pcb基板的棕化处理工艺
CN110804412B (zh) * 2019-12-02 2021-11-05 中国科学院深圳先进技术研究院 一种高频低损耗绝缘胶膜材料及其制备方法
JP7388160B2 (ja) * 2019-12-03 2023-11-29 株式会社レゾナック 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP7474592B2 (ja) * 2019-12-27 2024-04-25 太陽ホールディングス株式会社 硬化性樹脂組成物、ドライフィルム、樹脂付き銅箔、硬化物、および電子部品
JP7489775B2 (ja) * 2019-12-27 2024-05-24 太陽ホールディングス株式会社 硬化性樹脂組成物、ドライフィルム、樹脂付き銅箔、硬化物、および電子部品
JP7402681B2 (ja) * 2019-12-27 2023-12-21 太陽ホールディングス株式会社 硬化性樹脂組成物、ドライフィルム、樹脂付き銅箔、硬化物、及び電子部品
CN113088039A (zh) * 2021-05-26 2021-07-09 深圳市纽菲斯新材料科技有限公司 一种绝缘胶膜及其制备方法和应用
CN115109387B (zh) * 2022-07-11 2023-09-22 陕西生益科技有限公司 一种树脂组合物及其应用
CN116674279B (zh) * 2023-05-29 2023-12-22 珠海市凯拓塑料制品有限公司 一种用于线路板保护的抗摔包装盒及其制备工艺

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001077225A (ja) * 1999-09-06 2001-03-23 Matsushita Electric Ind Co Ltd 積層型キャリア基板
JP2002012650A (ja) * 2000-06-30 2002-01-15 Dainippon Ink & Chem Inc 低誘電性材料用エポキシ樹脂組成物
JP4660912B2 (ja) * 2000-10-25 2011-03-30 東洋製罐株式会社 樹脂配合用酸素吸収材、酸素吸収性樹脂組成物、および酸素吸収性包装材
JP3874108B2 (ja) * 2002-08-13 2007-01-31 信越化学工業株式会社 エポキシ樹脂組成物
JP2006182900A (ja) * 2004-12-27 2006-07-13 Hitachi Chem Co Ltd 複合体、プリプレグ、金属張積層板並びに多層基板及びその製造方法
CN101268146B (zh) * 2005-09-15 2012-01-25 积水化学工业株式会社 树脂组合物、片状成型体、预浸料、固化体、层叠板及多层层叠板
US20110189432A1 (en) * 2008-07-29 2011-08-04 Sekisui Chemical Co., Ltd. Epoxy resin composition, prepreg, cured body, sheet-like molded body, laminate and multilayer laminate
JP2010053334A (ja) * 2008-07-31 2010-03-11 Sekisui Chem Co Ltd エポキシ系樹脂組成物、プリプレグ、硬化体、シート状成形体、積層板及び多層積層板
JP5396805B2 (ja) 2008-10-07 2014-01-22 味の素株式会社 エポキシ樹脂組成物
TWI554541B (zh) * 2011-05-10 2016-10-21 Ajinomoto Kk Resin composition
TWI609917B (zh) * 2011-05-31 2018-01-01 Ajinomoto Co., Inc. 樹脂組成物

Also Published As

Publication number Publication date
KR102132148B1 (ko) 2020-07-09
KR20140113409A (ko) 2014-09-24
CN104045976B (zh) 2018-04-03
CN104045976A (zh) 2014-09-17
TW201443141A (zh) 2014-11-16
JP2014177530A (ja) 2014-09-25
TWI627224B (zh) 2018-06-21

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