JP6859897B2 - 樹脂組成物 - Google Patents
樹脂組成物 Download PDFInfo
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- JP6859897B2 JP6859897B2 JP2017158461A JP2017158461A JP6859897B2 JP 6859897 B2 JP6859897 B2 JP 6859897B2 JP 2017158461 A JP2017158461 A JP 2017158461A JP 2017158461 A JP2017158461 A JP 2017158461A JP 6859897 B2 JP6859897 B2 JP 6859897B2
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 7
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- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 125000006615 aromatic heterocyclic group Chemical group 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 125000000732 arylene group Chemical group 0.000 description 1
- RRZKHZBOZDIQJG-UHFFFAOYSA-N azane;manganese Chemical compound N.[Mn] RRZKHZBOZDIQJG-UHFFFAOYSA-N 0.000 description 1
- 229910021523 barium zirconate Inorganic materials 0.000 description 1
- DQBAOWPVHRWLJC-UHFFFAOYSA-N barium(2+);dioxido(oxo)zirconium Chemical compound [Ba+2].[O-][Zr]([O-])=O DQBAOWPVHRWLJC-UHFFFAOYSA-N 0.000 description 1
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- 229910002115 bismuth titanate Inorganic materials 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910001593 boehmite Inorganic materials 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- XSEUMFJMFFMCIU-UHFFFAOYSA-N buformin Chemical compound CCCC\N=C(/N)N=C(N)N XSEUMFJMFFMCIU-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- DAQREMPZDNTSMS-UHFFFAOYSA-M butyl(triphenyl)phosphanium;thiocyanate Chemical compound [S-]C#N.C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CCCC)C1=CC=CC=C1 DAQREMPZDNTSMS-UHFFFAOYSA-M 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 150000004700 cobalt complex Chemical class 0.000 description 1
- FCEOGYWNOSBEPV-FDGPNNRMSA-N cobalt;(z)-4-hydroxypent-3-en-2-one Chemical compound [Co].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O FCEOGYWNOSBEPV-FDGPNNRMSA-N 0.000 description 1
- JUPWRUDTZGBNEX-UHFFFAOYSA-N cobalt;pentane-2,4-dione Chemical compound [Co].CC(=O)CC(C)=O.CC(=O)CC(C)=O.CC(=O)CC(C)=O JUPWRUDTZGBNEX-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 150000004696 coordination complex Chemical class 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 150000004699 copper complex Chemical class 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- ZKXWKVVCCTZOLD-FDGPNNRMSA-N copper;(z)-4-hydroxypent-3-en-2-one Chemical compound [Cu].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O ZKXWKVVCCTZOLD-FDGPNNRMSA-N 0.000 description 1
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- 238000003851 corona treatment Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- OJLGWNFZMTVNCX-UHFFFAOYSA-N dioxido(dioxo)tungsten;zirconium(4+) Chemical compound [Zr+4].[O-][W]([O-])(=O)=O.[O-][W]([O-])(=O)=O OJLGWNFZMTVNCX-UHFFFAOYSA-N 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000001543 furan-2,5-diyl group Chemical group O1C(=CC=C1*)* 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- BDAGIHXWWSANSR-NJFSPNSNSA-N hydroxyformaldehyde Chemical compound O[14CH]=O BDAGIHXWWSANSR-NJFSPNSNSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- AQBLLJNPHDIAPN-LNTINUHCSA-K iron(3+);(z)-4-oxopent-2-en-2-olate Chemical compound [Fe+3].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O AQBLLJNPHDIAPN-LNTINUHCSA-K 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
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- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 150000002696 manganese Chemical class 0.000 description 1
- ZQZQURFYFJBOCE-FDGPNNRMSA-L manganese(2+);(z)-4-oxopent-2-en-2-olate Chemical compound [Mn+2].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O ZQZQURFYFJBOCE-FDGPNNRMSA-L 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
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- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
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- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- FZZQNEVOYIYFPF-UHFFFAOYSA-N naphthalene-1,6-diol Chemical compound OC1=CC=CC2=CC(O)=CC=C21 FZZQNEVOYIYFPF-UHFFFAOYSA-N 0.000 description 1
- MNZMMCVIXORAQL-UHFFFAOYSA-N naphthalene-2,6-diol Chemical compound C1=C(O)C=CC2=CC(O)=CC=C21 MNZMMCVIXORAQL-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- BMGNSKKZFQMGDH-FDGPNNRMSA-L nickel(2+);(z)-4-oxopent-2-en-2-olate Chemical compound [Ni+2].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O BMGNSKKZFQMGDH-FDGPNNRMSA-L 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- JFOJYGMDZRCSPA-UHFFFAOYSA-J octadecanoate;tin(4+) Chemical compound [Sn+4].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O JFOJYGMDZRCSPA-UHFFFAOYSA-J 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- PRCNQQRRDGMPKS-UHFFFAOYSA-N pentane-2,4-dione;zinc Chemical compound [Zn].CC(=O)CC(C)=O.CC(=O)CC(C)=O PRCNQQRRDGMPKS-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- CUQCMXFWIMOWRP-UHFFFAOYSA-N phenyl biguanide Chemical compound NC(N)=NC(N)=NC1=CC=CC=C1 CUQCMXFWIMOWRP-UHFFFAOYSA-N 0.000 description 1
- LYKRPDCJKSXAHS-UHFFFAOYSA-N phenyl-(2,3,4,5-tetrahydroxyphenyl)methanone Chemical compound OC1=C(O)C(O)=CC(C(=O)C=2C=CC=CC=2)=C1O LYKRPDCJKSXAHS-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 125000004309 pyranyl group Chemical group O1C(C=CC=C1)* 0.000 description 1
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- 229910000018 strontium carbonate Inorganic materials 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- GHPYAGKTTCKKDF-UHFFFAOYSA-M tetraphenylphosphanium;thiocyanate Chemical compound [S-]C#N.C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 GHPYAGKTTCKKDF-UHFFFAOYSA-M 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical class SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 125000005270 trialkylamine group Chemical group 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003751 zinc Chemical class 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- 229910000166 zirconium phosphate Inorganic materials 0.000 description 1
- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical compound [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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Description
すなわち、本発明は、下記のものを含む。
(B)成分の量が、(A)成分100質量%に対して、10質量%〜70質量%である、樹脂組成物。
〔2〕 (A)エポキシ樹脂及び(D)フッ素系充填材を含む樹脂組成物であって、
樹脂組成物を200℃で90分間熱処理して得られる硬化物の−10℃、25℃及び100℃での誘電正接を、それぞれDf(−10℃)、Df(25℃)及びDf(100℃)とした場合、
Df(25℃)に対するDf(−10℃)の比率Df(−10℃)/Df(25℃)が、85%〜115%であり、
Df(25℃)に対するDf(100℃)の比率Df(100℃)/Df(25℃)が、85%〜115%である、樹脂組成物。
〔3〕 (B)マレイミド化合物を含む、〔1〕記載の樹脂組成物。
〔4〕 (D)成分が、フッ素系ポリマー粒子である、〔1〕〜〔3〕のいずれか1項に記載の樹脂組成物。
〔5〕 (D)成分が、ポリテトラフルオロエチレン粒子である、〔1〕〜〔4〕のいずれか1項に記載の樹脂組成物。
〔6〕 (E)不飽和炭化水素基を有する樹脂を含む、〔1〕〜〔5〕のいずれか1項に記載の樹脂組成物。
〔7〕 (E)成分が、アクリル基、メタクリル基、スチリル基、アリル基、ビニル基及びプロペニル基からなる群から選択される1以上の不飽和炭化水素基を有する、〔6〕に記載の樹脂組成物。
〔8〕 (E)成分が、ビニル基を有し、かつ5員環以上の環状エーテル構造を有する、〔6〕又は〔7〕に記載の樹脂組成物。
〔9〕 回路基板の絶縁層形成用である、〔1〕〜〔8〕のいずれか1項に記載の樹脂組成物。
〔10〕 〔1〕〜〔9〕のいずれか1項に記載の樹脂組成物を含む、シート状積層材料。
〔11〕 〔1〕〜〔9〕のいずれか1項に記載の樹脂組成物の硬化物からなる絶縁層を含む、回路基板。
〔12〕 〔11〕に記載の回路基板を備える、半導体装置。
[1.1.樹脂組成物の概要]
本発明の第一実施形態に係る樹脂組成物は、(A)エポキシ樹脂、(B)マレイミド化合物、(C)無機充填材、及び(D)フッ素系充填材を含む。ここで、用語「フッ素系」とは、フッ素原子を含むことをいう。また、用語「フッ素系充填材」とは、フッ素原子を含む化合物を材料として含む充填材をいう。そして、この樹脂組成物において、(B)マレイミド化合物の量は、所定の範囲にある。
(A)成分としてのエポキシ樹脂としては、例えば、ビキシレノール型エポキシ樹脂、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、ビスフェノールAF型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、トリスフェノール型エポキシ樹脂、ナフトールノボラック型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、tert−ブチル−カテコール型エポキシ樹脂、ナフタレン型エポキシ樹脂、ナフトール型エポキシ樹脂、アントラセン型エポキシ樹脂、グリシジルアミン型エポキシ樹脂、グリシジルエステル型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビフェニル型エポキシ樹脂、線状脂肪族エポキシ樹脂、ブタジエン構造を有するエポキシ樹脂、脂環式エポキシ樹脂、複素環式エポキシ樹脂、スピロ環含有エポキシ樹脂、シクロヘキサン型エポキシ樹脂、シクロヘキサンジメタノール型エポキシ樹脂、ナフチレンエーテル型エポキシ樹脂、トリメチロール型エポキシ樹脂、テトラフェニルエタン型エポキシ樹脂が挙げられる。エポキシ樹脂は、1種類単独で用いてもよく、2種類以上を組み合わせて用いてもよい。
(B)成分としてのマレイミド化合物は、下記式(B1)で表されるマレイミド基を分子中に含有する化合物である。
(C)成分としての無機充填材の材料としては、例えば、シリカ、アルミナ、ガラス、コーディエライト、シリコン酸化物、硫酸バリウム、炭酸バリウム、タルク、クレー、雲母粉、酸化亜鉛、ハイドロタルサイト、ベーマイト、水酸化アルミニウム、水酸化マグネシウム、炭酸カルシウム、炭酸マグネシウム、酸化マグネシウム、窒化ホウ素、窒化アルミニウム、窒化マンガン、ホウ酸アルミニウム、炭酸ストロンチウム、チタン酸ストロンチウム、チタン酸カルシウム、チタン酸マグネシウム、チタン酸ビスマス、酸化チタン、酸化ジルコニウム、チタン酸バリウム、チタン酸ジルコン酸バリウム、ジルコン酸バリウム、ジルコン酸カルシウム、リン酸ジルコニウム、及びリン酸タングステン酸ジルコニウムが挙げられる。これらの中でも、本発明の所望の効果を顕著に得る観点から、シリカが特に好適である。シリカとしては、例えば、無定形シリカ、溶融シリカ、結晶シリカ、合成シリカ、中空シリカ等が挙げられる。中でも、球形シリカが好ましい。(C)無機充填材は、1種類単独で用いてもよく、2種類以上を組み合わせて用いてもよい。
(D)成分としてのフッ素系充填材は、フッ素原子を含む化合物を材料として含む充填材である。フッ素系充填材は、一般に、粒子となっている。よって、(D)フッ素系充填材として、通常は、フッ素原子を含む化合物を材料として含む粒子を用いる。
樹脂組成物は、上述した成分以外に、任意の成分として、(E)不飽和炭化水素基を有する樹脂を含んでいてもよい。以下の説明において、(E)成分としての「不飽和炭化水素基を有する樹脂」を、「不飽和樹脂」ということがある。炭素−炭素不飽和結合は、(E)不飽和樹脂の1分子中に、1個だけ含まれていてもよく、複数個含まれていてもよい。(E)不飽和樹脂を含む樹脂組成物の硬化物は、通常、(E)不飽和樹脂の不飽和結合部位が反応して形成される分子構造部位を含む。これにより、前記の硬化物の極性が小さくなり、誘電正接の値を小さくできる。また、(E)不飽和樹脂により、通常は、(D)フッ素系充填材の分散性を向上させることができる。そのため、樹脂組成物の組成の均一性が向上するので、硬化物の導体層に対する密着性をより向上させることができる。
不飽和環状エーテル化合物は、環状エーテル構造を1個だけ含んでいてもよく、複数個含んでいてもよい。
式(E2−2)において、R19〜R26は、それぞれ独立に、水素原子、炭素原子数6以下のアルキル基又はフェニル基を表し、好ましくは水素原子又はメチル基を表す。
式(E2−3)において、R27〜R34は、それぞれ独立に、水素原子、炭素原子数6以下のアルキル基又はフェニル基を表し、好ましくは水素原子又はメチル基を表す。また、式(E2−3)において、Eは、炭素原子数20以下の直鎖状、分岐状又は環状の2価の炭化水素基を表す。
樹脂組成物は、上述した成分以外に、任意の成分として、(F)硬化剤を含んでいてもよい。(F)成分としての硬化剤は、通常、(A)エポキシ樹脂と反応して樹脂組成物を硬化させる機能を有する。このような(F)硬化剤としては、例えば、活性エステル系硬化剤、フェノール系硬化剤、ナフトール系硬化剤、ベンゾオキサジン系硬化剤、シアネートエステル系硬化剤、及びカルボジイミド系硬化剤などが挙げられる。また、硬化剤は1種類単独で用いてもよく、又は2種類以上を併用してもよい。
樹脂組成物は、上述した成分以外に、任意の成分として、(G)硬化促進剤を含んでいてもよい。(G)硬化促進剤を用いることにより、樹脂組成物を硬化させる際に硬化を促進できる。
樹脂組成物は、上述した成分以外に、任意の成分として、更に添加剤を含んでいてもよい。このような添加剤としては、例えば、有機銅化合物、有機亜鉛化合物及び有機コバルト化合物等の有機金属化合物;増粘剤;消泡剤;レベリング剤;密着性付与剤;着色剤;難燃剤;熱可塑性樹脂;等が挙げられる。また、添加剤は、1種類単独で用いてもよく、2種類以上を組み合わせて用いてもよい。
樹脂組成物は、例えば、配合成分を、必要により溶剤と混合し、回転ミキサーなどの撹拌装置を用いて撹拌する方法によって製造できる。
上述した樹脂組成物の硬化物は、その誘電率を低くできる。よって、この樹脂組成物の硬化物により、誘電率の低い絶縁層を得ることができる。例えば、実施例に記載の方法で樹脂組成物を硬化させて硬化物を得た場合、当該硬化物の誘電率を、好ましくは3.0以下、より好ましくは2.9以下にできる。ここで、硬化物の誘電率は、実施例に記載の方法で測定できる。
すなわち、誘電正接の比率Df(−10℃)/Df(25℃)は、通常85%以上、好ましくは87%以上、特に好ましくは90%以上であり、通常115%以下、好ましくは114%以下、特に好ましくは113%以下である。
また、誘電正接の比率Df(100℃)/Df(25℃)は、通常85%以上、好ましくは90%以上、より好ましくは95%以上であり、通常115%以下、好ましくは114%以下、特に好ましくは113%以下である。
前記の誘電正接Df(−10℃)、Df(25℃)及びDf(100℃)は、実施例に記載の方法で測定できる。
本発明者の検討によれば、(A)エポキシ樹脂及び(D)フッ素系充填材を含む樹脂組成物の硬化物の誘電正接は、−10℃から100℃までの実用的な温度範囲において、低温であるほど小さく、高温であるほど大きい傾向があることが判明している。逆に、(B)マレイミド化合物の重合体の誘電正接は、前記の実用的な温度範囲において、マレイミド基の作用により、低温であるほど大きく、高温であるほど小さい傾向がある。このように、(A)エポキシ樹脂及び(D)フッ素系充填材を含む樹脂組成物の硬化物の誘電正接の温度依存性と、(B)マレイミド化合物の重合体の誘電正接の温度依存性とは、逆である。よって、(A)エポキシ樹脂及び(D)フッ素系充填材と、(B)マレイミド化合物とを組み合わせると、両者の誘電正接の温度依存性が相殺しあって、低温及び高温のいずれにおいても同程度の誘電正接Dfが得られる。したがって、(A)エポキシ樹脂、(B)マレイミド化合物及び(D)フッ素系充填材を含む樹脂組成物の硬化物の誘電正接は、温度安定性が良好になっている。
本発明の第二実施形態に係る樹脂組成物は(A)エポキシ樹脂及び(D)フッ素系充填材を含む。さらに、第二実施形態に係る樹脂組成物を200℃で90分間熱処理して得られる硬化物の−10℃、25℃及び100℃での誘電正接を、それぞれDf(−10℃)、Df(25℃)及びDf(100℃)とした場合、Df(25℃)に対するDf(−10℃)の比率Df(−10℃)/Df(25℃)が、85%〜115%であり、且つ、Df(25℃)に対するDf(100℃)の比率Df(100℃)/Df(25℃)が、85%〜115%である。
上述した樹脂組成物は、プリント回路基板等の回路基板の絶縁層形成用の樹脂組成物として用いることができ、中でも、ビルドアップ方式による回路基板の製造において絶縁層を形成するためのビルドアップ絶縁層形成用の樹脂組成物として用いることが好ましい。
上述した樹脂組成物は、ワニス状態で塗布して、絶縁層の形成に使用することができる。しかし、工業的には、この樹脂組成物を含むシート状積層材料の形態で用いることが好ましい。シート状積層材料の好ましい例としては、接着フィルム、プリプレグが挙げられる。
プリプレグの厚さは、上述の接着フィルムにおける樹脂組成物層と同様の範囲でありうる。
本発明の回路基板は、上述した樹脂組成物の硬化物で形成された絶縁層を含む。一実施形態において、回路基板は、内層基板と、この内層基板に設けられた絶縁層とを備える。
(I)内層基板に、接着フィルムを、該接着フィルムの樹脂組成物層が内層基板と接合するように積層する工程。
(II)樹脂組成物層を熱硬化して絶縁層を形成する工程。
半導体装置は、前記の回路基板を備える。この半導体装置は、回路基板を用いて製造することができる。
ビキシレノール型エポキシ樹脂(三菱ケミカル社製「YX4000HK」、エポキシ当量約185)20部、及び、フェニルメタンマレイミド樹脂(大和化成工業社製「BMI−2000」)2.5部を、ソルベントナフサ20部に撹拌しながら加熱溶解し、その後、室温にまで冷却して、樹脂溶液を得た。
フェニルメタンマレイミド樹脂(大和化成工業社製「BMI−2000」)の量を、10部に変更した。
また、アクリル樹脂(新中村化学工業社製「A−DOG」)、及び、ジクミルパーオキサイド(日油社製「パークミル D」)を、使用しなかった。
以上の事項以外は、実施例1と同じ操作を行って、樹脂ワニス2を作製した。
フェニルメタンマレイミド樹脂(大和化成工業社製「BMI−2000」)の量を、13.5部に変更した。
以上の事項以外は、実施例1と同じ操作を行って、樹脂ワニス3を作製した。
フェニルメタンマレイミド樹脂(大和化成工業社製「BMI−2000」)2.5部を、m−フェニレンビスマレイミド樹脂(大和化成工業社製「BMI−3000」)2.5部に変更した。
以上の事項以外は、実施例1と同じ操作を行って、樹脂ワニス4を作製した。
フェニルメタンマレイミド樹脂(大和化成工業社製「BMI−2000」)2.5部を、m−フェニレンビスマレイミド樹脂(大和化成工業社製「BMI−3000」)10部に変更した。
また、アクリル樹脂(新中村化学工業社製「A−DOG」)、及び、ジクミルパーオキサイド(日油社製「パークミル D」)を使用しなかった。
以上の事項以外は、実施例1と同じ操作を行って、樹脂ワニス5を作製した。
フェニルメタンマレイミド樹脂(大和化成工業社製「BMI−2000」)2.5部を、m−フェニレンビスマレイミド樹脂(大和化成工業社製「BMI−3000」)13.5部に変更した。
以上の事項以外は、実施例1と同じ操作を行って、樹脂ワニス6を作製した。
フェニルメタンマレイミド樹脂(大和化成工業社製「BMI−2000」)の量を、1部に変更した。
以上の事項以外は、実施例1と同じ操作を行って、樹脂ワニス7を作製した。
フェニルメタンマレイミド樹脂(大和化成工業社製「BMI−2000」)の量を、16部に変更した。
以上の事項以外は、実施例1と同じ操作を行って、樹脂ワニス8を作製した。
フェニルメタンマレイミド樹脂(大和化成工業社製「BMI−2000」)2.5部を、m−フェニレンビスマレイミド樹脂(大和化成工業社製「BMI−3000」)1部に変更した。
以上の事項以外は、実施例1と同じ操作を行って、樹脂ワニス9を作製した。
フェニルメタンマレイミド樹脂(大和化成工業社製「BMI−2000」)2.5部を、m−フェニレンビスマレイミド樹脂(大和化成工業社製「BMI−3000」)16部に変更した。
以上の事項以外は、実施例1と同じ操作を行って、樹脂ワニス10を作製した。
(硬化物の評価サンプルの作製)
表面に離型処理が施されたポリエチレンテレフタレートフィルム(リンテック社製「PET501010」)を、支持体として用意した。この支持体上に、実施例及び比較例で得た樹脂ワニスを、乾燥後の樹脂組成物層の厚みが40μmとなるように、ダイコーターを用いて均一に塗布した。塗布された樹脂ワニスを、80℃〜110℃(平均95℃)で6分間乾燥して、樹脂組成物層を得た。その後、樹脂組成物層を200℃で90分間熱処理して硬化させ、支持体を剥離することで、樹脂組成物の硬化物で形成された硬化物フィルムを得た。この硬化物フィルムを長さ80mm、幅2mmに切り出し、評価サンプルを得た。
この評価サンプルについて、測定装置(アジレントテクノロジーズ(Agilent Technologies)社製「HP8362B」)を用いた空洞共振摂動法により、測定周波数10GHzにて誘電正接及び誘電率を測定した。誘電正接の測定は、−10℃、25℃及び100℃で行った。また、誘電率の測定は、25℃で行った。
誘電率Dkが3.0以下である場合を「良」と評価した。また、誘電率Dkが3.0を超えた場合を「不良」と評価した。
25℃での誘電正接Df(25℃)に対する−10℃での誘電正接Df(−10℃)の比率Df(−10℃)/Df(25℃)を計算した。この比率Df(−10℃)/Df(25℃)が85%〜115%の範囲にある場合に、低温での温度安定性を「良」と判定した。また、比率Df(−10℃)/Df(25℃)が85%〜115%の範囲にない場合に、低温での温度安定性を「不良」と判定した。
上述した実施例及び比較例の結果を、下記の表に示す。下記の表において、各成分の量は、不揮発成分の質量部を表す。また、下記の表において、略称の意味は、下記の通りである。
YX4000HK:ビキシレノール型エポキシ樹脂(三菱ケミカル社製「YX4000HK」、エポキシ当量約185)。
BMI−2000:フェニルメタンマレイミド樹脂(大和化成工業社製「BMI−2000」)。
BMI−3000:m−フェニレンビスマレイミド樹脂(大和化成工業社製「BMI−3000」)。
SO−C2:無機充填材(アドマテックス社製「SO−C2」、平均粒径0.5μm、単位表面積当たりのカーボン量0.38mg/m2)。
ルブロンL−2:ポリテトラフルオロエチレン粒子(ダイキン工業社製「ルブロンL−2」、平均粒子径3μm)。
A−DOG:アクリル樹脂(新中村化学工業社製「A−DOG」)。
HPC−8000−65T:活性エステル系硬化剤(DIC社製「HPC−8000−65T」、活性基当量約223の不揮発分65%のトルエン溶液)。
DMAP:硬化促進剤(4−ジメチルアミノピリジン(DMAP)の5%メチルエチルケトン溶液)。
パークミル D:硬化促進剤(日油社製のジクミルパーオキサイド「パークミル D」)。
(B)/(A):(A)成分100質量%に対する(B)成分の質量割合。
表1から分かるように、実施例においては、低い誘電率が得られている。また、実施例では、誘電正接の比率Df(100℃)/Df(25℃)が100%に近い所定の範囲(100%±15%)に収まっており、高温における誘電正接の温度安定性が良好である。さらに、実施例では、誘電正接の比率Df(−10℃)/Df(25℃)が100%に近い所定の範囲(100%±15%)に収まっており、低温における誘電正接の温度依存性が良好である。よって、この結果から、本発明により、誘電率が低く、誘電正接の温度安定性に優れる絶縁層を得ることができる樹脂組成物を実現できることが確認された。そして、このように誘電正接の温度安定性に優れる絶縁層をレーダーのアンテナ回路基板に適用した場合、そのレーダーの検出可能範囲の温度による変化を抑制できることは、当業者が明確に理解できる。
Claims (10)
- (A)エポキシ樹脂、(B)マレイミド化合物、(C)無機充填材、(D)フッ素系充填材、及び、活性エステル系硬化剤を含む樹脂組成物であって、
(B)成分の量が、(A)成分100質量%に対して、10質量%〜70質量%である、樹脂組成物。 - (A)エポキシ樹脂、(B)マレイミド化合物、(C)無機充填材、(D)フッ素系充填材、及び、(E)不飽和炭化水素基を有する樹脂を含む樹脂組成物であって、
(E)成分が、ビニル基を有し、かつ5員環以上の環状エーテル構造を有し、
(B)成分の量が、(A)成分100質量%に対して、10質量%〜70質量%である、樹脂組成物。 - (E)不飽和炭化水素基を有する樹脂を含む、請求項1に記載の樹脂組成物。
- (E)成分が、アクリル基、メタクリル基、スチリル基、アリル基、ビニル基及びプロペニル基からなる群から選択される1以上の不飽和炭化水素基を有する、請求項3に記載の樹脂組成物。
- (D)成分が、フッ素系ポリマー粒子である、請求項1〜4のいずれか1項に記載の樹脂組成物。
- (D)成分が、ポリテトラフルオロエチレン粒子である、請求項1〜5のいずれか1項に記載の樹脂組成物。
- 回路基板の絶縁層形成用である、請求項1〜6のいずれか1項に記載の樹脂組成物。
- 請求項1〜7のいずれか1項に記載の樹脂組成物を含む、シート状積層材料。
- 請求項1〜7のいずれか1項に記載の樹脂組成物の硬化物からなる絶縁層を含む、回路基板。
- 請求項9に記載の回路基板を備える、半導体装置。
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