TWI579337B - 樹脂組合物及其應用 - Google Patents

樹脂組合物及其應用 Download PDF

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Publication number
TWI579337B
TWI579337B TW105124063A TW105124063A TWI579337B TW I579337 B TWI579337 B TW I579337B TW 105124063 A TW105124063 A TW 105124063A TW 105124063 A TW105124063 A TW 105124063A TW I579337 B TWI579337 B TW I579337B
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Taiwan
Prior art keywords
resin
resin composition
organic compound
group
resin system
Prior art date
Application number
TW105124063A
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English (en)
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TW201809141A (zh
Inventor
Shur Fen Liu
Meng Huei Chen
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Taiwan Union Tech Corp
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Application filed by Taiwan Union Tech Corp filed Critical Taiwan Union Tech Corp
Priority to TW105124063A priority Critical patent/TWI579337B/zh
Priority to CN201610631564.4A priority patent/CN107663374B/zh
Priority to US15/298,568 priority patent/US10513607B2/en
Application granted granted Critical
Publication of TWI579337B publication Critical patent/TWI579337B/zh
Publication of TW201809141A publication Critical patent/TW201809141A/zh
Priority to US16/246,766 priority patent/US10774216B2/en

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Description

樹脂組合物及其應用
本發明係關於一種樹脂組合物，尤其係關於一種包含特定有機化合物的樹脂組合物，及使用該樹脂組合物所提供之半硬化片(prepreg)與積層板(laminate)。
印刷電路板(printed circuit board，PCB)為電子裝置之電路基板，其搭載其他電子構件並將該等構件電性連通，以提供安穩的電路工作環境。常見之PCB基板為銅箔披覆之積層板(copper clad laminate，CCL)，其主要是由樹脂、補強材與銅箔所組成。常見之樹脂如環氧樹脂、酚醛樹脂、聚胺甲醛、矽酮及鐵氟龍等；常用之補強材則如玻璃纖維布、玻璃纖維蓆、絕緣紙、亞麻布等。
一般而言，印刷電路板可以如下方法製得。將一如玻璃織物之補強材含浸於一樹脂(例如環氧樹脂)中，並將經含浸樹脂之玻璃織物硬化至半硬化狀態(即B-階段(B-stage))以獲得一半硬化片。隨後，將預定層數之半硬化片層疊，並於該層疊半硬化片之至少一外側層疊一金屬箔以提供一層疊物，接著對該 層疊物進行一熱壓操作(即C-階段(C-stage))而得到一金屬披覆積層板。蝕刻該金屬披覆積層板表面的金屬箔以形成特定之電路圖案(circuit pattern)。而後，在該金屬披覆積層板上鑿出複數個孔洞，並在此等孔洞中鍍覆導電材料以形成通孔(via holes)，藉此完成印刷電路板之製備。
隨著電子儀器的小型化，印刷電路板亦存在薄型化及高密度化的需求。然而在使用已知樹脂組合物製備薄型印刷電路板之積層板時，可能產生的問題為樹脂組合物與金屬箔之間的黏合性不佳，造成印刷電路板的可靠性下降。因此，需要一種對金屬箔具有優異剝離強度及黏合性的樹脂組合物。
本發明之一目的在於提供一種樹脂組合物，包含：(a)一可熱硬化之樹脂系統，其於10GHz(吉赫)頻率之介電損耗(Df)係不大於0.008，其中該樹脂系統(a)係包含具下式(I)結構之雙馬來醯亞胺樹脂，
其中M1為一有機基團、且Z1各自獨立為H、鹵素、或C1至C5烷基；以及(b)一具下式(II)結構或下式(III)結構之有機化合物，
其中R'為一有機基團，且R11至R19及R21至R28各自獨立為H、Br、或C1至C6烴基，其中，以該樹脂系統(a)及該有機化合物(b)之總重量計，該有機化合物(b)之含量為1重量%至30重量%。
本發明之另一目的在於提供一種半硬化片，其係藉由將一基材含浸如上述之樹脂組合物並進行乾燥而製得。
本發明之再一目的在於提供一種積層板，包含一合成層及一金屬層，該合成層係由上述之半硬化片所提供。
為使本發明之上述目的、技術特徵及優點能更明顯易懂，下文係以部分具體實施態樣進行詳細說明。
以下將具體地描述根據本發明之部分具體實施態樣；惟，在不背離本發明之精神下，本發明尚可以多種不同形式 之態樣來實踐，不應將本發明保護範圍解釋為限於說明書所陳述者。此外，除非文中有另外說明，於本說明書中(尤其是在後述專利申請範圍中)所使用之「一」、「該」及類似用語應理解為包含單數及複數形式。且除非文中有另外說明，於本說明書中描述溶液、混合物或組合物中所含之成分時，係以該成分所含之固形物計算，即，未納入溶劑之重量。
樹脂組合物
本發明提供一種具優異耐燃性的樹脂組合物，其中係組合使用具特定電學性質之樹脂系統及具特定結構之有機化合物，以製得在各項物化性質均可達到令人滿意之程度且尤其具有優異之耐燃性、耐熱性與抗撕強度的積層板材料，同時不會不利地影響積層板材料之電學性質。特定言之，本發明樹脂組合物係包含一可熱硬化之樹脂系統(a)及一有機化合物(b)，以下茲就樹脂組合物之各成分提供詳細說明。
[樹脂系統(a)]
於本發明樹脂組合物中，樹脂系統(a)於10GHz頻率之介電損耗(Df)係不大於0.008，且包含具下式(I)結構之雙馬來醯亞胺樹脂。
於式(I)中，M1為一有機基團、且Z1各自獨立為H、鹵素、或C1至C5烷基。較佳地，M1為C2至C40之2價脂族、脂環族、芳族或雜環基團，更佳為經或未經取代之伸甲基(-CH2-)、4,4'- 二苯甲烷基(4,4'-diphenylmethane，)、間伸苯基 (m-phenylene，)、雙酚A二苯醚基(bisphenol A diphenyl ether，)、3,3'-二甲基-5,5'-二乙基-4,4'-二苯甲 烷基(3,3'-dimethyl-5,5'-diethyl-4,4'-diphenyl methane， )、4-甲基-1,3-伸苯基(4-methyl-1,3-phenylene， )或(2,2,4-三甲基)己烷基((2,2,4-trimethyl)hexane， )。於本發明之部分實施態樣中，M1為，且 Z1各自為H。
具式(I)結構之雙馬來醯亞胺樹脂的具體實例包括但不限於：1,2-雙馬來醯亞胺基乙烷、1,6-雙馬來醯亞胺基己烷、1,3-雙馬來醯亞胺基苯、1,4-雙馬來醯亞胺基苯、2,4-雙馬來醯亞胺基甲苯、4,4'-雙馬來醯亞胺基二苯基甲烷、4,4'-雙馬來醯亞胺基二苯基醚、3,3'-雙馬來醯亞胺基二苯基碸、4,4'-雙馬來醯亞胺基二苯基碸、4,4'-雙馬來醯亞胺基二環己基甲烷、3,5-雙(4-馬來醯亞胺基苯基)吡啶、2,6-雙馬來醯亞胺基吡啶、1,3-雙(馬來醯亞胺基甲基)環己烷、1,3-雙(馬來醯亞胺基甲基)苯、1,1-雙(4-馬 來醯亞胺基苯基)環己烷、1,3-雙(二氯馬來醯亞胺基)苯、4,4'-雙檸康醯亞胺基二苯基甲烷(4,4'-biscitraconimidodiphenylmethane)、2,2-雙(4-馬來醯亞胺基苯基)丙烷、1-苯基-1,1-雙(4-馬來醯亞胺基苯基)乙烷、α,α-雙(4-馬來醯亞胺基苯基)甲苯、3,5-雙馬來醯亞胺基-1,2,4-三唑、N,N'-伸乙基雙馬來醯亞胺、N,N'-六亞甲基雙馬來醯亞胺、N,N'-間-伸苯基雙馬來醯亞胺、N,N'-對-伸苯基雙馬來醯亞胺、N,N'-4,4'-二苯基甲烷雙馬來醯亞胺、N,N'-4,4'-二苯基醚雙馬來醯亞胺、N,N'-4,4'-二苯基碸雙馬來醯亞胺、N,N'-4,4'-二環己基甲烷雙馬來醯亞胺、N,N'-α,α'-4,4'-二亞甲基環己烷雙馬來醯亞胺、N,N'-間二甲苯雙馬來醯亞胺、N,N'-4,4'-二苯基環己烷雙馬來醯亞胺、及N,N'-亞甲基雙(3-氯-對-伸苯基)雙馬來醯亞胺。
除具式(I)結構之雙馬來醯亞胺樹脂外，樹脂系統(a)尚可進一步包含其他在受熱後能夠形成網狀結構而逐漸硬化的可熱硬化樹脂成分，只要樹脂系統(a)整體而言滿足於10GHz頻率之介電損耗(Df)係不大於0.008之條件即可。所述其他可熱硬化樹脂成分之實例包括但不限於聚苯醚衍生物樹脂、含乙烯基或烯丙基之異氰脲酸酯、含丁二烯及/或苯乙烯且具有官能基之彈性體、及環氧樹脂，且樹脂系統(a)可包含其中之一或多者。於本發明之部分實施態樣中，樹脂系統(a)係包含雙馬來醯亞胺樹脂、聚苯醚衍生物樹脂、以及含乙烯基或烯丙基之異氰脲酸酯、含丁二烯及/或苯乙烯且具有官能基之彈性體、及環氧樹脂之至 少一者。
聚苯醚衍生物樹脂之實例包括但不限於具有丙烯酸基之聚苯醚衍生物樹脂、具有乙烯基之聚苯醚衍生物樹脂、及具有羥基之聚苯醚衍生物樹脂，且各該聚苯醚衍生物樹脂可單獨使用或合併使用。舉例言之，聚苯醚衍生物樹脂可具有下式(IV)結構： 於式(IV)中，X與Y各自獨立為、具有烯基之基團或不存在， 且X與Y較佳為不存在、，或者X具有下式(IV-1)且Y具有下 式(IV-2)之結構：
於式(IV-1)及式(IV-2)中，*表示與式(IV)之氧(-O-)相接之一端； B1與B2各自獨立為、、、 R5與R6各自獨立為-O-、-SO2-或-C(CH3)2-，或不存在；以及p與q各自獨立為一整數，且1≦p+q<20，較佳為1≦p+q<10，更佳為1≦p+q<3；R1至R4各自獨立為H或經或未經取代之C1至C5烷基，例如甲基、乙基、正丙基、異丙基、正丁基等；m及n各自獨立為0至100之整數，且m及n不同時為0；m及n較佳為10至60之整數； A1與A2各自獨立為、、、、 或；以及 Z為不存在、-O-、、或，其中R7與R8各自獨立為H 或C1至C12烷基。
含乙烯基或烯丙基之異氰脲酸酯之具體實例包括但不限於三烯丙基異氰脲酸酯(triallyl isocyanurate，TAIC)、及三烯丙基氰脲酸酯(triallyl cyanurate，TAC)，且各該含乙烯基或烯丙基之異氰脲酸酯可單獨使用或合併使用。於本發明之部分實施態樣中，係使用三烯丙基異氰脲酸酯(TAIC)。
含丁二烯及/或苯乙烯且具有官能基之彈性體的實 例包括但不限於丁二烯均聚物、苯乙烯丁二烯共聚物(SBR)、苯乙烯丁二烯苯乙烯共聚物(SBS)、丙烯腈丁二烯共聚物、氫化苯乙烯丁二烯苯乙烯共聚物、苯乙烯異戊二烯苯乙烯共聚物(SIS)、氫化苯乙烯異戊二烯苯乙烯共聚物、氫化苯乙烯(丁二烯/異戊二烯)苯乙烯共聚物、及聚苯乙烯，且各該彈性體可單獨使用或合併使用。於本發明之部分實施態樣中，係使用丁二烯均聚物與苯乙烯丁二烯共聚物之至少一者。
環氧樹脂之實例包括但不限於具有下式(V)之結構之環氧樹脂：
於式(V)中，A為n1價的有機或無機基團、R9為H或C1至C6烷基、X1為氧或氮、m1為1或2並符合X1的化學價、且n1為1至100之整數。較佳地，n1為2至8之整數，且n1最佳為2至4之整數。
合適的環氧樹脂可包括經由表氯醇(epichlorohydrin)或表溴醇(epibromohydrin)與酚類化合物反應所得之產物。合適的酚類化合物例如包括但不限於間苯二酚(resorcinol)、兒茶酚、氫醌(hydroquinone)、2,6-二羥基萘、2,7-二羥基萘、2-(二苯基磷醯基)氫醌(2-(diphenylphosphoryl)hydroquinone)、雙(2,6-二甲基苯酚)、 2,2'-聯苯酚(2,2'-biphenol)、4,4-聯苯酚、2,2',6,6'-四甲基聯苯酚、2,2',3,3',6,6'-六甲基聯苯酚、3,3',5,5'-四溴-2,2',6,6'-四甲基聯苯酚、3,3'-二溴-2,2',6,6'-四甲基聯苯酚、2,2',6,6'-四甲基-3,3'-二溴聯苯酚、4,4'-亞異丙基二苯酚(雙酚A)(4,4'-isopropylidenediphenol(bisphenol A))、4,4'-亞異丙基雙(2,6-二溴苯酚)(四溴雙酚A)、4,4'-亞異丙基雙(2,6-二甲基苯酚)(四甲基雙酚A)、4,4'-亞異丙基雙(2-甲基苯酚)、4,4'-亞異丙基雙(2-烯丙基苯酚)、4,4'(1,3-伸苯基二亞異丙基)雙酚(雙酚M)、4,4'-亞異丙基雙(3-苯基苯酚)、4,4'-(1,4-伸苯基二亞異丙基)雙酚(雙酚P)、4,4'-亞乙基二苯酚(雙酚E)、4,4'-氧代二苯酚(4,4'-oxydiphenol)、4,4'-硫代二苯酚、4,4'-硫代雙(2,6-二甲基苯酚)、4,4'-磺醯基二苯酚、4,4'-磺醯基雙(2,6-二甲基苯酚)、4,4'-亞硫醯基二苯酚、4,4'-(六氟亞異丙基)雙酚(雙酚AF)、4,4'-(1-苯基亞乙基)雙酚(雙酚AP)、雙(4-羥基苯基)-2,2-二氯乙烯(雙酚C)、雙(4-羥基苯基)甲烷(雙酚-F)、雙(2,6-二甲基-4-羥基苯基)甲烷、4,4'-(亞環戊基)二苯酚、4,4'-(亞環己基)二苯酚(雙酚Z)、4,4'-(亞環十二烷基)二苯酚、4,4'-(雙環[2.2.1]亞庚基)二苯酚、4,4'-(9H-茀-9,9-二基)二苯酚(4,4'-(9H-fluorene-9,9-diyl)diphenol)、3,3-雙(4-羥基苯基)異苯并呋喃-1(3H)-酮(3,3-bis(4-hydroxyphenyl)isobenzofuran-1(3H)-one)、1-(4-羥基苯基)-3,3-二甲基-2,3-二氫-1H-茚-5-酚(1-(4-hydroxyphenyl)-3,3-dimethyl-2,3-dihydro-1H-inden-5-ol)、1-(4-羥基-3,5-二甲基苯基)-1,3,3,4,6-五甲基-2,3- 二氫-1H-茚-5-酚、3,3,3',3'-四甲基-2,2',3,3'-四氫-1,1'-螺雙[茚]-5,6'-二酚(螺二茚烷(Spirobiindane))、二羥基二苯基酮(雙酚K)、三(4-羥基苯基)甲烷、三(4-羥基苯基)乙烷、三(4-羥基苯基)丙烷、三(4-羥基苯基)丁烷、三(3-甲基-4-羥基苯基)甲烷、三(3,5-二甲基-4-羥基苯基)甲烷、四(4-羥基苯基)乙烷、四(3,5-二甲基-4-羥基苯基)乙烷、雙(4-羥基苯基)苯基氧化膦、二環戊二烯基二(2,6-二甲基苯酚)、二環戊二烯基二(2-甲基苯酚)、及二環戊二烯基雙酚(dicyclopentadienyl bisphenol)。環氧樹脂之具體合成方式乃本發明所屬技術領域具通常知識者於觀得本案說明書揭露後，可基於所具備之通常知識而實施者，且非本發明之技術重點所在，於此不加贅述。
除前述可熱硬化樹脂外，樹脂系統(a)亦可在不違反指定之介電損耗(Df)條件之前提下視需要進一步包含其他習知可熱硬化樹脂，諸如酚醛樹脂(phenolic resin)與苯乙烯馬來酸酐(styrene maleic anhydride，SMA)樹脂，且該其他可熱硬化樹脂可進一步具有反應性基團。所稱「反應性基團」可為任何可供反應硬化之基團，例如羥基、羧基、烯基、胺基等，但不以此為限。
樹脂系統(a)尚可視需要添加硬化劑及/或催化劑，以改良硬化效果與促進硬化反應。以樹脂系統(a)包含環氧樹脂之情況為例，可採用之硬化劑包括但不限於胺化合物、酸酐、苯二酚化合物、雙酚樹脂、多元酚樹脂(polyhydric phenol resin)、 及酚醛樹脂，且各該硬化劑可單獨使用或合併使用。所述胺化合物之實例包括：脂族胺化合物，如二伸乙基三胺(diethylene triamine，DETA)、三伸乙基四胺(triethylene tetramine，TETA)、四伸乙基五胺(tetraethylene pentamine，TEPA)、二乙基胺基丙基胺(diethylaminopropylamine，DEAPA)、亞甲基二胺、哌啶、4,4'-二胺基二環己基甲烷、1,4-二胺基環己烷、六亞甲基二胺；及芳族胺化合物，如間伸苯基二胺(m-phenylene diamine，MPDA)、4,4'-二胺基二苯基甲烷(4,4'-diaminodiphenylmethane，MDA)、二胺基二苯基碸(diaminodiphenylsulfone，DADPS)、間苯二甲基二胺(m-xylylene diamine，MXDA)、N-胺基乙基吡(N-aminoethylpyrazine，AEP)、苯基甲基二甲基胺(phenylmethyldimethylamine，BDMA)、二甲基胺基甲基苯酚(dimethylaminomethylphenol，DMP-10)、三(二甲基胺基甲基)苯酚(tris(dimethylaminomethyl)phenol，DMP-30)、對伸苯基二胺、2,2'-雙(4-胺基苯基)丙烷、2,6-二胺基吡啶、聯苯胺、4,4'-二胺基苯基氧化物、雙(4-胺基苯基)苯基氧化膦、雙(4-胺基苯基)甲基胺、1,5-二胺基萘、對二甲苯二胺、6,6'-二胺-2,2'-吡啶基、4,4'-二胺基二苯甲酮、4,4'-二胺基偶氮苯、雙(4-胺基苯基)苯基甲烷、1,1-雙(4-胺基苯基)環己烷、1,1-雙(4-胺基-3-甲基苯基)環己烷、2,5-雙(間-胺基苯基)-1,3,4-二唑、2,5-雙(對-胺基苯基)-1,3,4-二唑、2,5-雙(間-胺基苯基)噻唑并(4,5-d)噻唑(2,5-bis(m-aminophenyl)thiazo(4,5-d)thiazole)、5,5'-二(間-胺基 苯基)-(2,2')-雙-(1,3,4-二唑基)、4,4'-雙(對-胺基苯基)-2,2'-二噻唑、間-雙(4-對-胺基苯基-2-噻唑基)苯、4,4'-二胺基苯甲醯苯胺(4,4'-diaminobenzanilide)、4,4'-二胺基苯基苯甲酸酯、N,N'-雙(4-胺基苄基)-對-伸苯基二胺、4,4'-亞甲基雙(2-氯苯胺)、二胺基二苯基醚、三聚氰胺、2-胺基-s-三、2-胺基-4-苯基-s-三、2-胺基-4,6-二乙基-s-三，2-胺基-4,6-二苯基-s-三、2-胺基-4,6-雙(對-甲氧基苯基)-s-三、2-胺基-4-苯胺基-s-三、2-胺基-4-苯氧基-s-三、2-胺基-4-氯-s-三、2-胺基-4-胺基甲基-6-氯-s-三、2-(對-胺基苯基)-4,6-二氯-s-三、2,4-二胺基-s-三、2,4-二胺基-6-甲基-s-三、2,4-二胺基-6-苯基-s-三、2,4-二胺基-6-苄基-s-三、2,4-二胺基-6-(對-胺基苯基)-s-三、2,4-二胺基-6-(間-胺基苯基)-s-三、4-胺基-6-苯基-s-三-2-酚、或6-胺基-s-三-2,4-二酚。至於催化劑，可為本領域習用之任何催化劑，其實例包括但不限於過氧化苯甲醯(benzoyl peroxide，BPO)、過氧化二異丙苯(dicumyl peroxide，DCP)、及α,α'-雙(三級丁基過氧)二異丙苯(α,α'-bis(t-butylperoxy)diisopropyl benzene)，且各該催化劑可單獨使用或合併使用。
相關硬化劑/催化劑之選擇及用量乃本發明所屬技術領域具通常知識者於觀得本案說明書揭露後，可基於所具備之通常知識而視情況選用者，且非本發明之技術重點所在，於此不加贅述。
[有機化合物(b)]
於本發明樹脂組合物中，有機化合物(b)係具下式(II)結構或下式(III)結構之化合物。
於式(II)及式(III)中，R'為一有機基團，較佳為 -C2H4-、-C3H7-、、、、 、、或；以及R11 至R19及R21至R28各自獨立為H、Br、或C1至C6烴基，較佳為Br，於不受理論限制下，咸信於R19及R21至R28各自為Br之情形可額外為樹脂組合物提供阻燃效果。於本發明之部分實施態樣中，R'為-C2H4-，且R11至R19及R21至R28各自為Br。
於本發明之樹脂組合物中，有機化合物(b)係呈粉末狀且不溶於樹脂系統(a)中，若有機化合物(b)之粒徑過大時，可能導致所製得積層板之外觀不佳。因此，有機化合物(b)之粒徑大小較佳為0.1微米至20微米，更佳為0.5微米至10微米。
於本發明樹脂組合物中，以樹脂系統(a)及有機化合物(b)之總重量計，有機化合物(b)之含量為1重量%至30重量%，較佳為10重量%至25重量%，例如11重量%、12重量%、15重量%、17重量%、20重量%、或24重量%。若有機化合物(b)之含量高於指定範圍(高於30重量%)，將不利地影響積層板材料之性質，尤其是抗撕強度將明顯變差；若有機化合物(b)之含量低於指定範圍(例如低於1重量%)，則可能無法提供具所欲優異性質之積層板。
視需要之添加劑
本發明之樹脂組合物除樹脂系統(a)及有機化合物(b)之外，可視需要進一步包含其他添加劑，諸如本領域具通常知識者所熟知之硬化促進劑、阻燃劑、填料、分散劑、增韌劑等。添加硬化促進劑可促進樹脂組合物硬化；添加阻燃劑可提高所製材料之難燃性；而添加填料則可針對性地改良材料之物化性質。
阻燃劑之實例包括但不限於：含磷阻燃劑、含溴阻燃劑及其組合。含磷阻燃劑之實例包括磷酸脂類、磷腈類、聚磷酸銨類、磷酸三聚氰胺類及氰尿酸三聚氰胺類。含溴阻燃劑之實例包括四溴雙酚A(tetrabromobisphenol A)、十溴二苯基氧化物(decabromodiphenyloxide)、十溴化二苯基乙烷(decabrominated diphenyl ethane)、1,2-二(三溴苯基)乙烷(1,2-bis(tribromophenyl)ethane)、溴化環氧寡聚合物(brominated epoxy oligomer)、八溴三甲基苯基茚烷(octabromotrimethylphenyl indane)、二(2,3-二溴丙醚)(bis(2,3-dibromopropyl ether))、三(三溴苯基)三(tris(tribromophenyl)triazine)、溴化脂肪碳氫化合物及溴化芳香碳氫化合物(brominated aliphatic or aromatic hydrocarbon)。
填料之實例包括但不限於：二氧化矽、氧化鋁、氧化鎂、氫氧化鎂、碳酸鈣、滑石、黏土、氮化鋁、氮化硼、氫氧化鋁、碳化鋁矽、碳化矽、碳酸鈉、二氧化鈦、氧化鋅、氧化鋯、石英、鑽石、類鑽石、石墨、煅燒高嶺土、白嶺土、雲母、水滑石、中空二氧化矽、聚四氟乙烯(PTFE)粉末、玻璃珠、陶瓷晶鬚、奈米碳管、奈米級無機粉體及其組合。
前述各種添加劑之用量，乃本發明所屬技術領域中具有通常知識者於觀得本說明書之揭露內容後，可依其通常知識視需要調整，並無特殊限制。
樹脂組合物之製備
關於本發明樹脂組合物之製備，可藉由將樹脂組合 物各成分，包括樹脂系統(a)、有機化合物(b)及其他視需要的添加劑，以攪拌器均勻混合並溶解或分散於溶劑中而製成清漆狀的形式，供後續加工利用。所述溶劑可為任何可溶解或分散樹脂組合物各成分、但不與該等成分反應的惰性溶劑。舉例言之，可用以溶解或分散樹脂組合物各成分之溶劑包含但不限於：甲苯、γ-丁內酯、甲乙酮、環己酮、丁酮、丙酮、二甲苯、甲基異丁基酮、N,N-二甲基甲醯胺(N,N-dimethyl formamide，DMF)、N,N-二甲基乙醯胺(N,N-dimethyl acetamide，DMAc)、N-甲基吡咯烷酮(N-methyl-pyrolidone，NMP)、及其組合。溶劑之用量並無特殊限制，原則上只要能使樹脂組合物各組分均勻溶解或分散於其中即可。於本發明之部分實施態樣中，係使用甲苯、甲乙酮及γ-丁內酯之混合物作為溶劑。
半硬化片
本發明亦提供一種由上述樹脂組合物製得半硬化片，其中係藉由將一基材含浸如上述之樹脂組合物，並進行乾燥而製得。常用之基材包含玻璃纖維布(玻璃織物、玻璃紙、玻璃氈等)、牛皮紙、短絨棉紙、天然纖維布、有機纖維布等。於本發明之部分實施態樣中，係使用2116強化玻璃纖維布作為補強材，並在175℃下加熱乾燥2至15分鐘(B-階段)，從而製得半硬化狀態的半硬化片。
積層板
本發明亦提供一種由上述半硬化片製得之積層板， 其包含一合成層及一金屬層，其中該合成層係由如上述之半硬化片所提供。其中，可層疊複數層之上述半硬化片，且於層疊該半硬化片所構成的合成層之至少一外側表面層疊一金屬箔(如銅箔)以提供一層疊物，並對該層疊物進行一熱壓操作而得到該積層板。此外，可經由進一步圖案化該積層板之外側金屬箔，而製得印刷電路板。
茲以下列具體實施態樣進一步例示說明本發明，其中，所採用之量測儀器及方法分別如下：
[吸水性測試]
進行壓力鍋蒸煮試驗(pressure cooker test，PCT)試驗，將積層板置於壓力容器中，在121℃、飽和相對濕度(100%R.H.)及1.2大氣壓的環境下2小時，測試積層板的耐濕能力。
[耐浸焊性測試]
將乾燥過的積層板在288℃的錫焊浴中浸泡一定時間後，觀察是否出現爆板情形，例如觀察積層板是否產生分層或脹泡情形。
[抗撕強度測試]
抗撕強度係指金屬箔對經層合之半硬化片的附著力而言，通常以1/8英寸寬度的銅箔自板面上垂直撕起，以其所需力量的大小來表達附著力的強弱。
[玻璃轉移溫度(Tg)測試]
利用動態機械分析儀(Differential Scanning Calorimeter，DSC)量測玻璃轉移溫度(Tg)。玻璃轉移溫度的測試規範為電子電路互聯與封裝學會(The Institute for Interconnecting and Packaging Electronic Circuits，IPC)之IPC-TM-650.2.4.25C及24C號檢測方法。
[難燃性測試]
利用UL94V：垂直燃燒測試方法，將積層板以垂直位置固定，以本生燈燃燒，比較其自燃熄滅與助燃特性。
[介電常數(Dk)與散逸因子(Df)量測]
根據ASTM D150規範，在工作頻率10GHz下，計算介電常數(Dk)與散逸因子(Df)
實施例
<樹脂系統(a)之製備>
<樹脂系統一>
以表1所示之比例，將具式(I)結構之雙馬來醯亞 胺樹脂(M1為，且Z1各自為H；型號BMI，購自K．I CHEMICAL公司)、具式(IV)結構之聚苯醚衍生物樹脂(X具式 (IV-1)之結構，Y具式(IV-2)之結構，其中B1與B2為、 R5與R6為不存在、及1≦p+q<3，R1、R2、R3與R4為甲基，A1與 A2為，Z為不存在，且20(m+n)25；型號PP807，購自 晉一公司)、及TAIC(購自Evonik公司)於室溫下使用攪拌器混合， 並加入甲苯、甲乙酮及γ-丁內酯(皆購自Fluka公司)。將所得混合物於室溫下攪拌60至120分鐘後，製得樹脂系統一。
<樹脂系統二>
以表1所示之比例，將雙馬來醯亞胺樹脂BMI、聚苯醚衍生物樹脂PP807、購自Sabic公司之聚苯醚衍生物樹脂(型號SA9000)、異氰脲酸酯TAIC、作為彈性體之丁二烯均聚物(homopolymer of butadiene)(型號Ricon 130，購自CRAY VALLEY公司)、及作為催化劑之二苯甲醯過氧化物(BPO，購自Fluka公司)於室溫下使用攪拌器混合，並加入甲苯、甲乙酮及γ-丁內酯(皆購自Fluka公司)。將所得混合物於室溫下攪拌60至120分鐘後，製得樹脂系統二。
<樹脂系統三>
以與製備樹脂系統二相同之方式來製備樹脂系統三，惟以購自Mitsubishi Gas Chemical公司之聚苯醚衍生物樹脂(型號OPE-2st)取代聚苯醚衍生物樹脂PP807與聚苯醚衍生物樹脂SA9000，另添加作為彈性體之丁二烯-苯乙烯無規共聚物(型號Ricon 181，購自CRAY VALLEY公司)，並調整雙馬來醯亞胺樹脂、聚苯醚衍生物樹脂、及彈性體的用量，如表1所示。
<樹脂系統四>
以與製備樹脂系統二相同之方式來製備樹脂系統四，惟不使用聚苯醚衍生物樹脂PP807，另添加雙酚A型環氧樹脂(型號BE-188EL，購自CCP公司)、及作為硬化劑之亞甲基雙(2- 乙基-6-甲苯胺)(Methylenebis(2-ethyl-6-methylaniline)，MED)(購自IHARA CHEMICAL Ind.)，並調整聚苯醚衍生物樹脂及彈性體的用量，如表1所示。
<樹脂系統五>
以與製備樹脂系統二相同之方式來製備樹脂系統五，惟以聚苯醚衍生物樹脂OPE-2st取代聚苯醚衍生物樹脂SA9000，另添加二環戊二烯型環氧樹脂(型號HP-7200H，購自DIC公司)、及作為硬化劑之苯酚(Phenol)(購自長春化工公司)，並調整彈性體的用量，如表1所示。
<樹脂系統六>
以與製備樹脂系統三相同之方式來製備樹脂系統六，惟另添加聚苯醚衍生物樹脂SA9000，並調整雙馬來醯亞胺樹脂、聚苯醚衍生物樹脂、及彈性體的用量，如表1所示。
<樹脂系統七>
以與製備樹脂系統一相同之方式來製備樹脂系統七，惟不添加TAIC，並另添加彈性體Ricon 130及催化劑BPO，如表1所示。
為測試各樹脂系統之Df值，分別使用樹脂系統一至七來製備電測樣品。將樹脂系統一至七藉由水平塗佈機之水平刮刀分別塗佈於銅箔上，再將經塗佈之銅箔置於175℃之烘箱中加熱乾燥2至10分鐘，藉此製得半硬化狀態的背膠銅箔。接著將半硬化狀態背膠銅箔與另一張0.5盎司之銅箔進行熱壓，其熱壓條件為： 以3.0℃/分鐘之升溫速度升溫至200至220℃，並於該溫度下，以全壓15公斤/平方公分(初壓8公斤/平方公分)之壓力熱壓180分鐘。隨後在頻率10GHz下量測樹脂系統一至七之Df值。如表1所示，樹脂系統一至七在頻率為10GHz時之Df值皆小於0.008。
<樹脂組合物之製備>
<實施例1>
依據表2所示之比例，將作為樹脂系統(a)之樹脂系統一、具式(III)的有機化合物(b)(R'為乙基且R21至R28為Br；化學名：乙基-雙(四溴鄰苯二甲醯亞胺)(ethylene-bis(tetrabromo phthalimide))；型號：BT-93，購自Albemarle公司)、及作為填料之二氧化矽粉末(購自Sibelco公司)於室溫下使用攪拌器混合120分鐘，製得樹脂組合物1。
<實施例2>
以與實施例1相同之方式製備樹脂組合物2，惟改以樹脂系統三作為樹脂系統(a)，並調整有機化合物(b)及填料的用量，如表2所示。
<實施例3>
依據表2所示之比例，將作為樹脂系統(a)之樹脂系統二、具式(II)的有機化合物(b)(R11至R19為Br；化學名：2,4,6-三(2,4,6-三溴苯氧基)-1,3,5-三(2,4,6-Tris(2,4,6-tribromophenoxy)-1,3,5 triazine)；型號：FR-245，購自ICL公司)、及作為填料之二氧化矽粉末於室溫下使用攪拌器混合120分鐘，製得樹脂組合物3。
<實施例4>
以與實施例3相同之方式製備樹脂組合物4，惟改以樹脂系統三作為樹脂系統(a)，並調整有機化合物(b)及填料的用量，如表2所示。
<實施例5>
以與實施例1相同之方式製備樹脂組合物5，惟改以樹脂系統四作為樹脂系統(a)，並調整有機化合物(b)及填料的用量，如表2所示。
<實施例6>
以與實施例1相同之方式製備樹脂組合物6，惟改以樹脂系統五作為樹脂系統(a)，並調整有機化合物(b)及填料的用量，如表2所示。
<實施例7>
以與實施例1相同之方式製備樹脂組合物7，惟改以樹脂系統六作為樹脂系統(a)，並調整有機化合物(b)及填料的用量，如表2所示
<實施例8>
以與實施例3相同之方式製備樹脂組合物8，惟改以樹脂系統六作為樹脂系統(a)，並調整有機化合物(b)及填料的用量，如表2所示。
<實施例9>
以與實施例3相同之方式製備樹脂組合物9，惟改以樹脂系統七作為樹脂系統(a)，並調整有機化合物(b)及填料的用量，如表2所示。
<比較實施例1>
以與實施例3相同之方式製備比較樹脂組合物1，惟調整有機化合物(b)的用量至高於本發明指定範圍(1至30重量 %)，並調整填料的用量，如表2所示。
<比較實施例2>
依據表2所示之比例，將作為樹脂系統(a)之樹脂系統三、十溴二苯乙烷(decabromodiphenyl ethane；型號：SAYTEX 8010，購自Albemarle公司)、及作為填料之二氧化矽粉末於室溫下使用攪拌器混合120分鐘，製得比較樹脂組合物2。
<比較實施例3>
以與比較實施例2相同之方式製備比較樹脂組合物3，惟調整十溴二苯乙烷的用量，如表2所示。
<比較實施例4>
以與實施例7相同之方式製備比較樹脂組合物4，惟調整有機化合物(b)的用量至高於本發明指定範圍(1至30重量%)，如表2所示。
[積層板之製備]
分別使用樹脂組合物1至9及比較樹脂組合物1至4來製備積層板1至9及比較積層板1至4。首先，經由輥式塗佈機，分別將該等樹脂組合物塗佈於2116強化玻璃纖維布上，再將經塗佈 之強化玻璃纖維布置於175℃之乾燥機中加熱乾燥2至15分鐘，藉此製得半硬化狀態的半硬化片(半硬化片之樹脂含量為53%)。接著將四片半硬化片層合，並在其二側的最外層各層合一張0.5盎司之銅箔。然後對其進行熱壓，其熱壓條件為：以3.0℃/分鐘之升溫速度升溫至200℃至220℃，並在該溫度下，以全壓15公斤/平方公分(初壓8公斤/平方公分)之壓力熱壓180分鐘。
測量積層板1至9與比較積層板1至4之吸水性、耐浸焊性、抗撕強度、玻璃轉移溫度(Tg)、難燃性、散逸因子(Df)及介電常數(Dk)，並將結果紀錄於表3中。
如表3所示，採用本發明樹脂組合物所製得之積層板1至9，在所有物化性質(如吸水性、難燃性、Dk、Df等)上均可達到令人滿意的程度，且具有優異的耐熱性質(高玻璃轉移溫度(Tg)及優異耐浸焊性)，應用範圍更為廣泛。尤其，使用本發明樹脂組合物所製得之積層板可具有優異的抗撕強度(達3.8磅/英寸以上)。相較於此，如比較實施例1及4所示，若有機化合物(b)之用量超出本發明指定範圍之外，即使是增加有機化合物(b)之 用量，所製得積層板的抗撕強度意外地將大幅下降(比較積層板1僅2.9磅/英寸，比較積層板4甚至低至2.0磅/英寸)。此外，如比較積層板2及3所示，於樹脂組合物中不含有機化合物(b)之情況中，雖然可透過加入阻燃劑(十溴二苯乙烷)使得積層板的難燃性達到V-0等級，但所製得之積層板並不具備優異抗撕強度(比較積層板2僅3.3磅/英寸，比較積層板3甚至低至2.4磅/英寸)。
上述實施例僅為例示性說明本發明之原理及其功效，並闡述本發明之技術特徵，而非用於限制本發明之保護範疇。任何熟悉本技術者在不違背本發明之技術原理及精神下，可輕易完成之改變或安排，均屬本發明所主張之範圍。因此，本發明之權利保護範圍係如後附申請專利範圍所列。

Claims (11)

  1. 一種樹脂組合物，包含：(a)一可熱硬化之樹脂系統，其於10GHz(吉赫)頻率之介電損耗(Df)係不大於0.008，其中該樹脂系統(a)係包含具下式(I)結構之雙馬來醯亞胺樹脂， 其中M1為經或未經取代之伸甲基、4,4'-二苯甲烷基(4,4'-diphenylmethane)、間伸苯基(m-phenylene)、雙酚A二苯醚基(bisphenol A diphenyl ether)、3,3'-二甲基-5,5'-二乙基-4,4'-二苯甲烷基(3,3'-dimethyl-5,5'-diethyl-4,4'-diphenyl methane)、4-甲基-1,3-伸苯基(4-methyl-1,3-phenylene)或(2,2,4-三甲基)己烷基((2,2,4-trimethyl)hexane)，且Z1各自獨立為H、鹵素、或C1至C5烷基；以及(b)一具下式(II)結構或下式(III)結構之有機化合物， 其中R'為-C2H4-、-C3H7-、、、 、或，且R11 至R19及R21至R28各自獨立為H、Br、或C1至C6烴基，其中，以該樹脂系統(a)及該有機化合物(b)之總重量計，該有機化合物(b)之含量為1重量%至30重量%。
  2. 如請求項1之樹脂組合物，其中以該樹脂系統(a)及該有機化合物(b)之總重量計，該有機化合物(b)之含量為10重量%至25重量%。
  3. 如請求項1之樹脂組合物，其中該有機化合物(b)之平均粒徑(D50)為0.1微米至20微米。
  4. 如請求項1至3中任一項之樹脂組合物，其中該樹脂系統(a)係進一步包含選自以下群組之可熱硬化樹脂：聚苯醚衍生物樹脂、含乙烯基或烯丙基之異氰脲酸酯、含丁二烯及/或苯乙烯且具有官能基之彈性體、環氧樹脂、及其組合。
  5. 如請求項4之樹脂組合物，其中該聚苯醚衍生物樹脂係具下式(IV)之結構： 其中， X與Y各自獨立為、具有烯基之基團或不存在； R1至R4各自獨立為H或經或未經取代之C1至C5烷基；m及n各自獨立為0至100之整數，且m及n不同時為0； A1與A2各自獨立為、、、、 或；以及 Z為不存在、-O-、、或，其中R7與R8各自獨立 為H或C1至C12烷基。
  6. 如請求項4之樹脂組合物，其中該含乙烯基或烯丙基之異氰脲酸酯為三烯丙基異氰脲酸酯(triallyl isocyanurate，TAIC)或三烯丙基氰脲酸酯(triallyl cyanurate，TAC)。
  7. 如請求項1至3中任一項之樹脂組合物，更包含選自以下群組之一或多種添加劑：硬化促進劑、阻燃劑、填料、分散劑、增韌劑及其組合。
  8. 如請求項7之樹脂組合物，其中該阻燃劑係含磷阻燃劑、含溴阻燃劑或其組合。
  9. 如請求項7之樹脂組合物，其中該填料係選自以下群組：二氧化矽、氧化鋁、氧化鎂、氫氧化鎂、碳酸鈣、滑石、黏土、氮化鋁、氮化硼、氫氧化鋁、碳化鋁矽、碳化矽、碳酸鈉、二氧化鈦、氧化鋅、氧化鋯、石英、鑽石、類鑽石、石墨、煅燒高嶺土、白嶺土、雲母、水滑石、中空二氧化矽、聚四氟乙烯(PTFE)粉末、玻璃珠、陶瓷晶鬚、奈米碳管、奈米級無機粉體及其組合。
  10. 一種半硬化片(prepreg)，其係藉由將一基材含浸如請求項1至9中任一項之樹脂組合物，並進行乾燥而製得。
  11. 一種積層板，其包含一合成層及一金屬層，其中該合成層係由如請求項10之半硬化片所提供。
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