JP6104570B2 - 発光素子及びこれを備えた照明装置 - Google Patents

発光素子及びこれを備えた照明装置 Download PDF

Info

Publication number
JP6104570B2
JP6104570B2 JP2012249943A JP2012249943A JP6104570B2 JP 6104570 B2 JP6104570 B2 JP 6104570B2 JP 2012249943 A JP2012249943 A JP 2012249943A JP 2012249943 A JP2012249943 A JP 2012249943A JP 6104570 B2 JP6104570 B2 JP 6104570B2
Authority
JP
Japan
Prior art keywords
light emitting
disposed
emitting chip
emitting device
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012249943A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013106047A (ja
JP2013106047A5 (enExample
Inventor
イ・ソンウン
バク・ギュヒョン
ミン・ポンク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of JP2013106047A publication Critical patent/JP2013106047A/ja
Publication of JP2013106047A5 publication Critical patent/JP2013106047A5/ja
Application granted granted Critical
Publication of JP6104570B2 publication Critical patent/JP6104570B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
JP2012249943A 2011-11-16 2012-11-14 発光素子及びこれを備えた照明装置 Expired - Fee Related JP6104570B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110119822A KR101905535B1 (ko) 2011-11-16 2011-11-16 발광 소자 패키지 및 이를 구비한 조명 장치
KR10-2011-0119822 2011-11-16

Publications (3)

Publication Number Publication Date
JP2013106047A JP2013106047A (ja) 2013-05-30
JP2013106047A5 JP2013106047A5 (enExample) 2015-12-24
JP6104570B2 true JP6104570B2 (ja) 2017-03-29

Family

ID=47427206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012249943A Expired - Fee Related JP6104570B2 (ja) 2011-11-16 2012-11-14 発光素子及びこれを備えた照明装置

Country Status (5)

Country Link
US (2) US9231166B2 (enExample)
EP (1) EP2595205B1 (enExample)
JP (1) JP6104570B2 (enExample)
KR (1) KR101905535B1 (enExample)
CN (1) CN103117348B (enExample)

Families Citing this family (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2484713A (en) 2010-10-21 2012-04-25 Optovate Ltd Illumination apparatus
TWI489657B (zh) * 2012-04-12 2015-06-21 隆達電子股份有限公司 發光二極體封裝件
WO2013180365A1 (en) * 2012-05-31 2013-12-05 Lg Innotek Co., Ltd. Member for cotrolling luminous flux, method for fabricating the member, display device, and light emitting device
CN103682028A (zh) * 2012-08-30 2014-03-26 展晶科技(深圳)有限公司 发光二极管封装结构及其制造方法
JP6131664B2 (ja) * 2013-03-25 2017-05-24 日亜化学工業株式会社 発光装置の製造方法および発光装置
TWI559053B (zh) * 2013-05-28 2016-11-21 潘宇翔 適用於直下式背光模組之光源裝置及其顯示器
DE102013213073A1 (de) * 2013-07-04 2015-01-08 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optoelektronischen Bauelementes
US9515241B2 (en) * 2013-07-12 2016-12-06 Lite-On Opto Technology (Changzhou) Co., Ltd. LED structure, metallic frame of LED structure, and carrier module
JP6221456B2 (ja) * 2013-07-23 2017-11-01 日亜化学工業株式会社 発光装置及び照明装置
CN104456428A (zh) * 2013-09-12 2015-03-25 欧司朗有限公司 发光结构的光学单元和发光结构和具有该发光结构的灯箱
KR102098870B1 (ko) * 2013-10-30 2020-04-08 엘지이노텍 주식회사 발광 장치
KR102110477B1 (ko) * 2013-11-26 2020-05-13 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명시스템
DE102013224581A1 (de) 2013-11-29 2015-06-03 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
KR20150081089A (ko) * 2014-01-03 2015-07-13 삼성디스플레이 주식회사 Led 패키지
DE102014101557A1 (de) * 2014-02-07 2015-08-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
KR102203683B1 (ko) * 2014-04-10 2021-01-15 엘지이노텍 주식회사 인쇄회로기판 및 이를 포함하는 발광장치
US9997676B2 (en) 2014-05-14 2018-06-12 Genesis Photonics Inc. Light emitting device and manufacturing method thereof
US10439111B2 (en) 2014-05-14 2019-10-08 Genesis Photonics Inc. Light emitting device and manufacturing method thereof
US9748165B2 (en) * 2014-05-30 2017-08-29 Delta Electronics, Inc. Packaging structure
TWI557952B (zh) 2014-06-12 2016-11-11 新世紀光電股份有限公司 發光元件
KR102218401B1 (ko) * 2014-06-27 2021-02-23 엘지디스플레이 주식회사 광원 패키지 및 이를 장착한 백라이트 유닛
JP6515716B2 (ja) 2014-07-18 2019-05-22 日亜化学工業株式会社 発光装置およびその製造方法
KR101545658B1 (ko) 2014-08-20 2015-08-20 주식회사 루멘스 발광 소자용 렌즈 및 백라이트 유닛
EP2988341B1 (en) * 2014-08-22 2017-04-05 LG Innotek Co., Ltd. Light emitting device package
KR20160054666A (ko) * 2014-11-06 2016-05-17 삼성전자주식회사 광원 모듈 및 조명 장치
DE102014117435A1 (de) * 2014-11-27 2016-06-02 Osram Opto Semiconductors Gmbh Bauteil mit Leiterrahmenabschnitt
KR102294163B1 (ko) * 2014-12-05 2021-08-27 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 모듈
US10340433B2 (en) 2015-01-19 2019-07-02 Lg Innotek Co., Ltd. Light emitting device
CN105990496B (zh) * 2015-03-04 2018-11-16 光宝光电(常州)有限公司 Led封装结构及其制造方法
KR20160112116A (ko) * 2015-03-18 2016-09-28 엘지이노텍 주식회사 발광소자 어레이와 이를 포함하는 조명시스템
KR101629464B1 (ko) * 2015-06-10 2016-06-13 부경대학교 산학협력단 램프캡을 포함하는 led램프
EP3324452B1 (en) * 2015-07-16 2021-04-28 LG Innotek Co., Ltd. Light-emitting element package
JP6590579B2 (ja) * 2015-08-03 2019-10-16 シチズン電子株式会社 Ｌｅｄ発光素子
CN106549092A (zh) 2015-09-18 2017-03-29 新世纪光电股份有限公司 发光装置及其制造方法
KR101831249B1 (ko) * 2015-10-14 2018-02-23 엘지이노텍 주식회사 발광소자 패키지 및 조명 장치
JP6862141B2 (ja) 2015-10-14 2021-04-21 エルジー イノテック カンパニー リミテッド 発光素子パッケージ及び照明装置
KR102486033B1 (ko) * 2015-11-18 2023-01-06 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지 및 이의 제조 방법
KR102486034B1 (ko) * 2015-11-27 2023-01-11 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 조명 장치
CN108575099B (zh) * 2015-11-27 2021-03-16 Lg伊诺特有限公司 发光器件封装和照明装置
KR102528014B1 (ko) * 2015-11-27 2023-05-10 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 조명 장치
JP6524904B2 (ja) 2015-12-22 2019-06-05 日亜化学工業株式会社 発光装置
KR102558280B1 (ko) * 2016-02-05 2023-07-25 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 광원 유닛 및 이를 구비한 라이트 유닛
JP6790416B2 (ja) * 2016-03-31 2020-11-25 日亜化学工業株式会社 発光装置
US11145795B2 (en) * 2016-05-31 2021-10-12 Citizen Electronics Co., Ltd. Light emitting apparatus and method for manufacturing same
US9870985B1 (en) * 2016-07-11 2018-01-16 Amkor Technology, Inc. Semiconductor package with clip alignment notch
US10388838B2 (en) 2016-10-19 2019-08-20 Genesis Photonics Inc. Light-emitting device and manufacturing method thereof
GB201705365D0 (en) * 2017-04-03 2017-05-17 Optovate Ltd Illumination apparatus
WO2018233839A1 (en) * 2017-06-22 2018-12-27 Osram Opto Semiconductors Gmbh Optoelectronic component
US10497827B2 (en) * 2017-07-21 2019-12-03 Lg Innotek Co., Ltd. Light emitting device package
WO2019045513A1 (ko) * 2017-09-01 2019-03-07 엘지이노텍 주식회사 발광소자 패키지 및 이를 포함하는 조명장치
KR102379733B1 (ko) * 2017-09-15 2022-03-28 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
KR102415812B1 (ko) 2017-09-22 2022-07-01 삼성디스플레이 주식회사 발광 장치 및 발광 장치의 제조 방법
CN109755220B (zh) 2017-11-05 2022-09-02 新世纪光电股份有限公司 发光装置及其制作方法
CN109994458B (zh) 2017-11-05 2022-07-01 新世纪光电股份有限公司 发光装置
GB201718307D0 (en) 2017-11-05 2017-12-20 Optovate Ltd Display apparatus
GB201800574D0 (en) 2018-01-14 2018-02-28 Optovate Ltd Illumination apparatus
US20190267526A1 (en) 2018-02-26 2019-08-29 Semicon Light Co., Ltd. Semiconductor Light Emitting Devices And Method Of Manufacturing The Same
GB201803767D0 (en) 2018-03-09 2018-04-25 Optovate Ltd Illumination apparatus
GB201807747D0 (en) 2018-05-13 2018-06-27 Optovate Ltd Colour micro-LED display apparatus
KR102101367B1 (ko) * 2019-01-22 2020-04-17 엘지이노텍 주식회사 발광 소자
JP6974746B2 (ja) 2019-01-31 2021-12-01 日亜化学工業株式会社 発光装置及びその製造方法
JP7181489B2 (ja) * 2019-01-31 2022-12-01 日亜化学工業株式会社 発光装置及びその製造方法
KR102105793B1 (ko) * 2019-06-12 2020-04-28 진명균 지향각이 조절된 발광소자 패키지 및 그를 이용한 발광장치
TW202102883A (zh) 2019-07-02 2021-01-16 美商瑞爾Ｄ斯帕克有限責任公司 定向顯示設備
KR102824741B1 (ko) * 2019-07-04 2025-06-24 엘지이노텍 주식회사 조명 모듈, 조명 장치 및 램프
JP7685306B2 (ja) 2019-08-23 2025-05-29 リアルディー スパーク エルエルシー 指向性照明装置およびプライバシーディスプレイ
WO2021050918A1 (en) 2019-09-11 2021-03-18 Reald Spark, Llc Switchable illumination apparatus and privacy display
KR102893134B1 (ko) 2019-10-03 2025-12-02 리얼디 스파크, 엘엘씨 수동형 광학 나노구조를 포함하는 조명 장치
EP4038313A4 (en) 2019-10-03 2023-11-22 RealD Spark, LLC LIGHTING APPARATUS COMPRISING PASSIVE OPTICAL NANOSTRUCTURES
JP7295437B2 (ja) * 2019-11-29 2023-06-21 日亜化学工業株式会社 発光装置
DE102020101038A1 (de) * 2020-01-17 2021-07-22 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Lichtemittierendes Bauelement
US11287562B2 (en) 2020-02-20 2022-03-29 Reald Spark, Llc Illumination apparatus including mask with plurality of apertures and display apparatus comprising same
DE102020121656A1 (de) * 2020-08-18 2022-02-24 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum herstellen eines optoelektronischen bauelements und optoelektronisches bauelement
US12125953B2 (en) * 2020-11-30 2024-10-22 Nichia Corporation Method for manufacturing light emitting device, light emitting device, and light emitting module
JP2022120339A (ja) * 2021-02-05 2022-08-18 スタンレー電気株式会社 基板構造体、発光装置及び基板構造体の製造方法
WO2022271582A1 (en) 2021-06-22 2022-12-29 Reald Spark, Llc Illumination apparatus
DE102023200102A1 (de) * 2023-01-09 2024-07-11 Volkswagen Aktiengesellschaft Elektronik-Modul und Verfahren zur Herstellung eines Elektronik-Moduls

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002050797A (ja) 2000-07-31 2002-02-15 Toshiba Corp 半導体励起蛍光体発光装置およびその製造方法
JP2005294736A (ja) * 2004-04-05 2005-10-20 Stanley Electric Co Ltd 半導体発光装置の製造方法
KR100631992B1 (ko) * 2005-07-19 2006-10-09 삼성전기주식회사 측면 방출형 이중 렌즈 구조 ｌｅｄ 패키지
KR100632002B1 (ko) * 2005-08-02 2006-10-09 삼성전기주식회사 보호 소자를 포함하는 측면형 발광 다이오드
JP2007142289A (ja) * 2005-11-21 2007-06-07 Sharp Corp 発光装置
US7524098B2 (en) * 2006-10-12 2009-04-28 Dicon Fiberoptics, Inc. Solid-state lateral emitting optical system
CN101603636B (zh) * 2008-06-10 2012-05-23 展晶科技(深圳)有限公司 光源装置
US8258526B2 (en) * 2008-07-03 2012-09-04 Samsung Led Co., Ltd. Light emitting diode package including a lead frame with a cavity
JP2010080464A (ja) * 2008-09-24 2010-04-08 C I Kasei Co Ltd プラスチックパッケージおよびプラスチックパッケージ作製方法ならびに発光装置
DE102008053489A1 (de) * 2008-10-28 2010-04-29 Osram Opto Semiconductors Gmbh Trägerkörper für ein Halbleiterbauelement, Halbleiterbauelement und Verfahren zur Herstellung eines Trägerkörpers
KR100888236B1 (ko) 2008-11-18 2009-03-12 서울반도체 주식회사 발광 장치
JP2010238833A (ja) 2009-03-31 2010-10-21 Panasonic Corp 光半導体装置用パッケージおよび光半導体装置
KR101007134B1 (ko) * 2009-06-05 2011-01-10 엘지이노텍 주식회사 조명 장치
CN102804426B (zh) * 2009-06-22 2016-12-07 日亚化学工业株式会社 发光装置
KR101028304B1 (ko) * 2009-10-15 2011-04-11 엘지이노텍 주식회사 발광 장치
KR101064090B1 (ko) 2009-11-17 2011-09-08 엘지이노텍 주식회사 발광소자 패키지
JP2011119557A (ja) * 2009-12-07 2011-06-16 Sony Corp 発光装置及びその製造方法
KR101661684B1 (ko) * 2010-04-12 2016-10-11 삼성디스플레이 주식회사 광원 유닛 및 이를 포함하는 백라이트 어셈블리
KR101103674B1 (ko) * 2010-06-01 2012-01-11 엘지이노텍 주식회사 발광 소자
TWI408794B (zh) * 2011-01-26 2013-09-11 柏友照明科技股份有限公司 混光式多晶封裝結構
EP2489930B1 (en) * 2011-02-21 2015-03-25 LG Innotek Co., Ltd. Lighting module and lighting device

Also Published As

Publication number Publication date
EP2595205A2 (en) 2013-05-22
US20160079507A1 (en) 2016-03-17
CN103117348A (zh) 2013-05-22
JP2013106047A (ja) 2013-05-30
KR20130054040A (ko) 2013-05-24
US9231166B2 (en) 2016-01-05
US10128423B2 (en) 2018-11-13
KR101905535B1 (ko) 2018-10-10
US20130121000A1 (en) 2013-05-16
CN103117348B (zh) 2017-08-18
EP2595205A3 (en) 2015-12-02
EP2595205B1 (en) 2020-04-15

Similar Documents

Publication Publication Date Title
JP6104570B2 (ja) 発光素子及びこれを備えた照明装置
JP5788539B2 (ja) 発光素子
JP5745578B2 (ja) 発光素子
JP6283483B2 (ja) 発光素子及びこれを備えた照明システム
US8916887B2 (en) Light emitting device package and lighting system using the same
JP6306842B2 (ja) 発光素子及びこれを具備した照明システム
JP5745495B2 (ja) 発光素子及びこれを備えた照明システム
JP6312999B2 (ja) 発光素子及びこれを備えた照明システム
KR101997257B1 (ko) 발광 소자 및 이를 구비한 조명 장치
KR102075561B1 (ko) 발광 소자, 발광 모듈 및 조명 시스템
KR20140095722A (ko) 발광 소자 및 이를 구비한 조명 장치
KR101976547B1 (ko) 발광 소자 및 이를 구비한 조명 시스템
KR101926531B1 (ko) 발광 소자, 발광 소자 제조방법 및 조명 시스템
KR102053287B1 (ko) 발광 소자 및 이를 구비한 조명 시스템
KR102019498B1 (ko) 발광 소자 및 조명 시스템
KR102142718B1 (ko) 발광 소자 및 이를 구비한 조명 장치
KR102063508B1 (ko) 발광 소자 및 이를 구비한 조명 시스템
KR101966110B1 (ko) 발광 소자, 발광 소자 제조방법 및 조명 시스템
KR101896691B1 (ko) 발광 소자 및 조명 시스템
KR20130119132A (ko) 발광 소자, 발광 모듈 및 조명 시스템
KR20140072538A (ko) 발광 소자 및 이를 구비한 조명 시스템

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151104

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20151104

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160621

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20160622

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160915

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20170214

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170301

R150 Certificate of patent or registration of utility model

Ref document number: 6104570

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees