JP6073573B2 - 薄膜蒸着用マスクフレームアセンブリー - Google Patents

薄膜蒸着用マスクフレームアセンブリー Download PDF

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Publication number
JP6073573B2
JP6073573B2 JP2012121818A JP2012121818A JP6073573B2 JP 6073573 B2 JP6073573 B2 JP 6073573B2 JP 2012121818 A JP2012121818 A JP 2012121818A JP 2012121818 A JP2012121818 A JP 2012121818A JP 6073573 B2 JP6073573 B2 JP 6073573B2
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Japan
Prior art keywords
mask
support base
fastening
bent
mask frame
Prior art date
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JP2012121818A
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English (en)
Japanese (ja)
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JP2013004520A5 (enExample
JP2013004520A (ja
Inventor
澤 ▲教▼ 姜
澤 ▲教▼ 姜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Display Co Ltd
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Samsung Display Co Ltd
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Application filed by Samsung Display Co Ltd filed Critical Samsung Display Co Ltd
Publication of JP2013004520A publication Critical patent/JP2013004520A/ja
Publication of JP2013004520A5 publication Critical patent/JP2013004520A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
JP2012121818A 2011-06-21 2012-05-29 薄膜蒸着用マスクフレームアセンブリー Active JP6073573B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110060229A KR101833234B1 (ko) 2011-06-21 2011-06-21 박막 증착용 마스크 프레임 어셈블리
KR10-2011-0060229 2011-06-21

Publications (3)

Publication Number Publication Date
JP2013004520A JP2013004520A (ja) 2013-01-07
JP2013004520A5 JP2013004520A5 (enExample) 2015-06-25
JP6073573B2 true JP6073573B2 (ja) 2017-02-01

Family

ID=47360600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012121818A Active JP6073573B2 (ja) 2011-06-21 2012-05-29 薄膜蒸着用マスクフレームアセンブリー

Country Status (3)

Country Link
US (1) US8631761B2 (enExample)
JP (1) JP6073573B2 (enExample)
KR (1) KR101833234B1 (enExample)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5258278B2 (ja) * 2007-12-13 2013-08-07 キヤノントッキ株式会社 成膜用マスク及びマスク密着方法
KR101030030B1 (ko) * 2009-12-11 2011-04-20 삼성모바일디스플레이주식회사 마스크 조립체
KR101813549B1 (ko) * 2011-05-06 2018-01-02 삼성디스플레이 주식회사 분할 마스크와 그 분할 마스크를 포함한 마스크 프레임 조립체의 조립장치
KR20130028165A (ko) * 2011-06-21 2013-03-19 삼성디스플레이 주식회사 마스크 유닛
KR20130081528A (ko) * 2012-01-09 2013-07-17 삼성디스플레이 주식회사 증착 마스크 및 이를 이용한 증착 설비
KR101995500B1 (ko) * 2012-11-20 2019-10-02 삼성디스플레이 주식회사 단위 마스크 및 마스크 조립체
KR102079170B1 (ko) * 2013-04-09 2020-02-20 삼성디스플레이 주식회사 증착 장치 및 그에 적용되는 마스크 조립체
KR102106331B1 (ko) * 2013-07-08 2020-05-06 삼성디스플레이 주식회사 마스크 조립체 및 이의 제조 방법
JP2015069806A (ja) * 2013-09-27 2015-04-13 株式会社ジャパンディスプレイ 有機エレクトロルミネッセンス表示装置の製造方法
KR20150043908A (ko) * 2013-10-15 2015-04-23 삼성디스플레이 주식회사 트레이 조립체 및 이를 이용한 도너필름의 제조방법
KR102100296B1 (ko) * 2013-10-28 2020-04-13 엘지디스플레이 주식회사 분할 마스크 조립체
CN103757588B (zh) * 2013-12-30 2016-02-03 昆山工研院新型平板显示技术中心有限公司 一种掩膜板及该掩膜板的制备方法和应用
KR102273049B1 (ko) * 2014-07-04 2021-07-06 삼성디스플레이 주식회사 박막 증착용 마스크 프레임 어셈블리
KR102273050B1 (ko) * 2014-09-17 2021-07-06 삼성디스플레이 주식회사 증착용 마스크 어셈블를 포함하는 증착 장치 및 증착 방법
CN104611668B (zh) * 2015-01-29 2017-03-01 京东方科技集团股份有限公司 用于掩膜板的框架和掩膜板
KR102334410B1 (ko) * 2015-04-13 2021-12-03 삼성디스플레이 주식회사 박막 증착용 마스크 어셈블리
KR102366570B1 (ko) * 2015-06-19 2022-02-25 삼성디스플레이 주식회사 마스크 프레임 조립체 및 그 제조방법
KR102366569B1 (ko) * 2015-07-01 2022-02-25 삼성디스플레이 주식회사 박막 증착용 마스크 인장 용접 장치
KR102401484B1 (ko) * 2015-08-31 2022-05-25 삼성디스플레이 주식회사 마스크 조립체, 표시 장치의 제조장치 및 표시 장치의 제조 방법
KR102549358B1 (ko) * 2015-11-02 2023-06-29 삼성디스플레이 주식회사 증착 마스크 조립체 및 이를 이용한 표시 장치의 제조 방법
KR102532305B1 (ko) * 2016-06-15 2023-05-15 삼성디스플레이 주식회사 마스크 프레임 조립체 및 그 제조방법
KR102616578B1 (ko) * 2016-06-24 2023-12-22 삼성디스플레이 주식회사 박막 증착용 마스크 어셈블리와, 이의 제조 방법
CN106480404B (zh) * 2016-12-28 2019-05-03 京东方科技集团股份有限公司 一种掩膜集成框架及蒸镀装置
US20190044068A1 (en) * 2017-08-01 2019-02-07 Wuhan China Star Optoelectronics Semiconductor Dis play Technology Co., Ltd. Mask plate
KR102191388B1 (ko) 2018-06-12 2020-12-15 어플라이드 머티어리얼스, 인코포레이티드 마스크프레임 및 마스크조립체
KR102514115B1 (ko) * 2018-06-12 2023-03-28 삼성디스플레이 주식회사 증착용 마스크 및 이를 포함하는 마스크 조립체
KR102080297B1 (ko) 2018-06-12 2020-02-21 어플라이드 머티어리얼스, 인코포레이티드 마스크프레임 및 마스크조립체
KR102630638B1 (ko) * 2018-08-29 2024-01-30 삼성디스플레이 주식회사 마스크 조립체, 표시 장치의 제조장치 및 표시 장치의 제조방법
JP7487481B2 (ja) 2019-02-06 2024-05-21 大日本印刷株式会社 蒸着マスク装置、マスク支持機構及び蒸着マスク装置の製造方法
US11613802B2 (en) * 2020-04-17 2023-03-28 Rockwell Collins, Inc. Additively manufactured shadow masks for material deposition control
CN111394692B (zh) * 2020-05-09 2022-05-13 京东方科技集团股份有限公司 掩膜版
CN111876725A (zh) * 2020-07-31 2020-11-03 京东方科技集团股份有限公司 组合掩膜板及其支撑掩膜板
KR102868862B1 (ko) * 2020-12-10 2025-10-13 삼성디스플레이 주식회사 증착용 마스크 및 이를 포함하는 증착 장치
KR20230139566A (ko) 2022-03-28 2023-10-05 스템코 주식회사 증착 마스크, 그 제조 방법 및 그 제조용 금속판
KR20230140975A (ko) 2022-03-30 2023-10-10 스템코 주식회사 증착 마스크 및 그 제조 방법

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US7006202B2 (en) 2002-02-21 2006-02-28 Lg.Philips Lcd Co., Ltd. Mask holder for irradiating UV-rays
JP4439203B2 (ja) * 2003-05-09 2010-03-24 大日本印刷株式会社 多面付けマスク装置及びその組立方法
KR100603400B1 (ko) 2004-11-18 2006-07-20 삼성에스디아이 주식회사 평판표시장치의 박막 증착용 마스크
JP4795842B2 (ja) * 2006-04-26 2011-10-19 日本冶金工業株式会社 蒸着用治具
JP2008156686A (ja) 2006-12-22 2008-07-10 Seiko Epson Corp マスクおよびマスク蒸着装置
KR101117645B1 (ko) * 2009-02-05 2012-03-05 삼성모바일디스플레이주식회사 마스크 조립체 및 이를 이용한 평판표시장치용 증착 장치
KR101049804B1 (ko) 2009-02-19 2011-07-15 삼성모바일디스플레이주식회사 증착 장치용 마스크 밀착 수단 및 이를 이용한 증착 장치
KR20100008826U (ko) 2009-02-27 2010-09-06 주식회사 디엠에스 마스크글라스 지지유닛

Also Published As

Publication number Publication date
US8631761B2 (en) 2014-01-21
KR20120140473A (ko) 2012-12-31
JP2013004520A (ja) 2013-01-07
US20120325143A1 (en) 2012-12-27
KR101833234B1 (ko) 2018-03-02

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