JP6066324B2 - 電子装置 - Google Patents
電子装置 Download PDFInfo
- Publication number
- JP6066324B2 JP6066324B2 JP2013174002A JP2013174002A JP6066324B2 JP 6066324 B2 JP6066324 B2 JP 6066324B2 JP 2013174002 A JP2013174002 A JP 2013174002A JP 2013174002 A JP2013174002 A JP 2013174002A JP 6066324 B2 JP6066324 B2 JP 6066324B2
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- bump
- pad
- solder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- Engineering & Computer Science (AREA)
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- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
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Description
101,1300 チップ
102,1500 実装基板
103 封止樹脂
200 表面
210,1301 バンプ(ピラーバンプ)
211,1302 バンプ(ストライプバンプ)
300,301,1400,1401 半田
400 表面
410,411,1501,1502 パッド
1200 位置決め機構(ソルダーレジスト)
1210 位置決め機構(開口部)
Claims (8)
- 実装部品と、前記実装部品が実装される被実装部品とを備える電子装置であって、
前記実装部品は、
前記被実装部品と対向する面に、当該面の面内方向における断面が円状である第1のバンプと、前記面内方向における断面積が前記第1のバンプより大きく、前記面内方向における断面が長円状である第2のバンプとを備え、
前記被実装部品は、
前記実装部品と対向する面に、前記第1のバンプと半田接続される第1のパッドと、前記第2のバンプと半田接続される第2のパッドとを備え、
前記面内方向における前記第2のバンプの断面積に対する前記第2のパッドの面積の比が、前記面内方向における前記第1のバンプの断面積に対する前記第1のパッドの面積の比より大きい、
電子装置。 - 請求項1に記載の電子装置であって、
前記被実装部品は実装基板であり、
前記第2のバンプは、前記実装部品において発生する熱を前記実装基板に放熱するために設けられている、
電子装置。 - 請求項1または2に記載の電子装置であって、
前記第2のパッドは、前記第2のバンプの移動を前記第2のパッド内の第1の領域に制限するとともに前記第1の領域の外への半田の流路を形成する位置決め機構を有する、
電子装置。 - 請求項3に記載の電子装置であって、
前記位置決め機構は、前記第2のパッドの前記第1の領域の周囲に設けられたレジストである、
電子装置。 - 請求項3に記載の電子装置であって、
前記位置決め機構は、前記第2のパッドの前記第1の領域の周囲に設けられた開口部である、
電子装置。 - 請求項3〜5の何れか一項に記載の電子装置であって、
前記第1の領域は、長手方向及び短手方向を有し、
前記位置決め機構は、少なくとも、前記第1の領域の長手方向において対向する2つの辺に沿って設けられている、
電子装置。 - 請求項6に記載の電子装置であって、
前記位置決め機構は、前記2つの辺の少なくとも一方の側に前記流路を形成する、
電子装置。 - 請求項3〜7の何れか一項に記載の電子装置であって、
前記位置決め機構は、少なくとも、前記第2のパッドにおける前記第1のパッドに近接する側に設けられている、
電子装置。
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