CN104427782A - 电子装置 - Google Patents

电子装置 Download PDF

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Publication number
CN104427782A
CN104427782A CN201410418466.3A CN201410418466A CN104427782A CN 104427782 A CN104427782 A CN 104427782A CN 201410418466 A CN201410418466 A CN 201410418466A CN 104427782 A CN104427782 A CN 104427782A
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China
Prior art keywords
pad
salient point
area
solder
detent mechanism
Prior art date
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Granted
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CN201410418466.3A
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CN104427782B (zh
Inventor
石井克实
山浦正志
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication of CN104427782A publication Critical patent/CN104427782A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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Abstract

本发明涉及电子装置。在利用第1凸点、以及剖面面积大于第1凸点的第2凸点来进行倒装芯片安装的电子装置中，提高凸点与焊盘的连接性。电子装置包括：安装元器件、以及安装有安装元器件的被安装元器件，安装元器件在与被安装元器件相对的面上具备第1凸点、以及在该相对的面方向上的剖面面积大于第1凸点的第2凸点，被安装元器件在与安装元器件相对的面上具备与第1凸点焊料连接的第1焊盘、以及与第2凸点焊料连接的第2焊盘，第2焊盘的面积与第2凸点的剖面面积之比要大于第1焊盘的面积与第1凸点的剖面面积之比。

Description

电子装置
技术领域
本发明涉及一种电子装置。
背景技术
作为在安装基板上安装芯片的方法，已知有倒装芯片安装。在倒装芯片安装中，在芯片表面设有突起状端子即凸点，该凸点与安装基板上的焊盘进行焊料连接。利用上述安装方法，相比在芯片外周设置端子的情况，能够减小包含芯片的电子装置的面积，能够降低因布线的电感而造成的损失。
在上述倒装芯片安装中还提出有如下方案：通过在使用剖面大致为圆形的一般的凸点(以下也称作“柱状凸点”)的基础上、还使用剖面面积大于柱状凸点，且剖面大致为椭圆形的凸点(以下也称作“带状凸点”)，从而能提高凸点的散热性(例如，专利文献1)。
现有技术文献
专利文献
专利文献1：国际公开第2005/034237号
发明内容
发明所要解决的技术问题
图13是表示柱状凸点与带状凸点混合存在的芯片的一个示例的图。芯片1300中设有柱状凸点1301(1301a、1301b)以及带状凸点1302。图14是芯片1300的X-X’线的剖视图。由于带状凸点1302的剖面面积大于柱状凸点1301，因此如图14所示，在焊料1401熔融时，因表面张力作用而升高的焊料1401的中央附近的高度可能变得高于柱状凸点1301的焊料1400(1400a、1400b)。另外，出于散热目的，带状凸点1302有时设置于晶体管单元上。该情况下，因晶体管单元的厚度，使得带状凸点1302从芯片1300的表面起的高度可能变得高于柱状凸点1301的高度。在带状凸点1302的高度变高的情况下，将焊料转印至凸点时，转印至带状凸点1302的焊料的高度可能变得高于转印至柱状凸点1301的焊料的高度。
图15是表示将芯片1300安装至安装基板1500的状态的一个示例的图。安装基板1500上设有与柱状凸点1301a、1301b相对应的焊盘1501a、1501b、以及与带状凸点1302相对应的焊盘1502。图15所示的示例中，虽然带状凸点1302利用焊料1401与焊盘1502良好地相连接，但是柱状凸点1301a、1301b与焊盘1501a、1501b的连接不良。上述连接不良是因为焊料1400a、1400b的高度与焊料1401的高度不同而引起的。
本发明鉴于上述情况而完成，其目的在于提供一种电子装置，该电子装置利用第1凸点、以及剖面面积大于第1凸点的第2凸点，来进行倒装芯片安装，从而能够提高凸点与焊盘的连接性。
解决技术问题的技术方案
本发明的一个方面所涉及的电子装置包括：安装元器件、以及安装有安装元器件的被安装元器件，安装元器件在与被安装元器件相对的面上具备第1凸点、以及在该相对的面方向上的剖面面积大于第1凸点的第2凸点，被安装元器件在与安装元器件相对的面上具备与第1凸点焊料连接的第1焊盘、以及与第2凸点焊料连接的第2焊盘，第2焊盘的面积与第2凸点的剖面面积之比要大于第1焊盘的面积与第1凸点的剖面面积之比。
发明效果
根据本发明，在利用第1凸点、以及剖面面积大于第1凸点的第2凸点，来进行倒装芯片安装的电子装置中，能提高凸点与焊盘的连接性。
附图说明
图1是表示本发明的一个实施方式的电子装置的外观的一个示例的图。
图2是表示芯片上的凸点的配置的一个示例的图。
图3是图2的A-A’线的剖视图。
图4是表示安装基板上的焊盘的配置的一个示例的图。
图5是说明将芯片安装到安装基板上的状态的一个示例的图。
图6是图5的A-A’线的剖视图。
图7是表示安装状态与安装前状态下的焊料的外观的一个示例的图。
图8是表示推定出的安装前状态的焊料的形状的一个示例的图。
图9是表示安装状态的焊料的形状的一个示例的图。
图10是表示将安装状态的焊料分割成三个构造的一个示例的图。
图11是表示与焊料的高度相对应的焊盘面积的一个示例的图。
图12A是表示设置于焊盘的定位机构的一个示例的图。
图12B是表示设置于焊盘的定位机构的另一个示例的图。
图12C是表示设置于焊盘的定位机构的另一个示例的图。
图12D是表示设置于焊盘的定位机构的另一个示例的图。
图12E是表示设置于焊盘的定位机构的另一个示例的图。
图12F是表示考虑焊盘位置来进行配置的定位机构的一个示例的图。
图13是表示柱状凸点与带状凸点混合存在的芯片的一个示例的图。
图14是芯片的X-X’线的剖视图。
图15是表示将芯片安装到安装基板上的状态的一个示例的图。
具体实施方式
以下参照附图对本发明实施方式进行说明。图1是表示本发明的一个实施方式的电子装置的外观的一个示例的图。电子装置100将安装元器件安装于被安装元器件上而构成。图1所示的示例中，电子装置100具备芯片101以作为安装元器件，具备安装基板102以作为被安装元器件，芯片101与安装基板102之间由密封树脂103来密封。
图2是表示芯片101上的凸点的配置的一个示例的图。另外，图3是图2的A-A’线的剖视图。表面200是与安装基板102相对的面。该表面200形成有从表面200突出的多个凸点。具体而言，芯片101上设有剖面大致为圆形的凸点(以下称作“柱状凸点”)210(210a、210b)，还设有剖面大致为椭圆形的凸点(以下称作“带状凸点”)211。柱状凸点210(第1凸点)与带状凸点211(第2凸点)的宽度(图2中的上下方向)大致相同，与此相对，带状凸点211的长度(图2的左右方向)比柱状凸点210要长。也就是说，带状凸点211在表面200的剖面面积大于柱状凸点210。此外，若带状凸点211的剖面面积大于柱状凸点210的剖面面积，则凸点的形状并不局限于图2所示的形状。
柱状凸点210及带状凸点211将芯片101内的电路与外部电连接，或者将芯片101所产生的热散出，例如利用铜(Cu)或金(Au)等形成。柱状凸点210(210a、210b)的前端形成有用于与安装基板102上的焊盘相连接的焊料300(300a、300b)。同样，带状凸点211的前段也形成有焊料301。
带状凸点211例如用于降低线路所具有的电感，或用于提高散热性。具体而言，在异质结二极管等晶体管单元上，有时设置带状凸点211用来进行散热。该情况下，如图3所示，由于晶体管单元的厚度，使得带状凸点211从芯片101的表面200起的高度比柱状凸点210的高度要高例如4～6μm左右。因此，可按照使芯片200的表面到焊料前端为止的高度统一的方式，将焊料转印到柱状凸点210及带状凸点211。
图4是表示安装基板102上的焊盘的配置的一个示例的图。安装基板102例如是绝缘性基板即陶瓷基板或印刷电路板(PCB:Printed Circuit Board)。表面400是与芯片101相对的面。该表面400设有与芯片101的凸点焊料连接的多个焊盘。具体而言，如图4所示，设有与芯片101的柱状凸点210a、210b焊料连接的焊盘410a、410b(第1焊盘)。同样，设有与芯片101的带状凸点211焊料连接的焊盘411(第2焊盘)。焊盘410、411例如实施有镍(Ni)镀覆、钯(Pa)镀覆以及金(Au)镀覆。此外，与带状凸点211焊料连接的焊盘411例如连接至接地电位(地)。
图5是说明将芯片101安装到安装基板102上的状态的一个示例的图。图5中，设置于芯片101的凸点由虚线表示。如图5所示，焊盘410、411的截面面积分别大于凸点210、211。作为一个示例，能够将柱状凸点210的半径设为75μm、将焊盘410的半径设为85μm。该情况下，焊盘410的面积与柱状凸点210的剖面面积之比约为1.3倍。与此相对，将焊盘411的面积与带状凸点211的剖面面积之比设置为例如2倍左右。也就是说，焊盘411的面积与带状凸点211的剖面面积之比要大于焊盘410的面积与柱状凸点210的剖面面积之比。
图6是图5的A-A'线的剖视图。如上所述，由于焊盘411的面积与带状凸点211的剖面面积之比较大，因此形成于带状凸点211的焊料301的涂抹宽度比形成于柱状凸点210的焊料300也要大。由此，对比在柱状凸点210与带状凸点211中凸点与焊盘的面积比大致相同的情况，带状凸点211的下沉量较大，柱状凸点210与焊盘410的连接性提高。
参照图7～图11，对用于决定焊料连接有带状凸点211的焊盘411的尺寸的模拟例进行说明。图7是表示芯片101安装于安装基板102的状态(安装状态)、以及安装前的状态(安装前状态)下的焊料300的外观的一个示例的图。此处，作为一个示例，将柱状凸点210的剖面半径(柱状半径：r1)设为37.5μm，将焊盘410的半径(焊盘半径：r2)设为42.5μm，将安装状态下的焊料300的高度(焊料厚度：h1)设为14μm。安装状态下，若将焊料300涂布在焊盘410的整个面上，则焊料300的形状如图7左侧所示。该情况下，焊盘410的面积与柱状凸点的剖面面积的比约为1.3倍。该条件下，安装状态的焊料300(圆锥台)的体积计算为70463μm3。然后，基于该体积，求得焊料300的安装前状态下的高度(镀覆厚度：t)为15.9μm。
图8是表示根据安装前状态的焊料300的形状推定出的、安装前状态的焊料301的形状的一个示例的图。此外，为了简化仿真，设形成于凸点单位面积上的焊料300、301的量相等。另外，设焊料300、301的短边方向的长度(宽度)相同(r1×2)。另外，作为一个示例，将带状凸点211的从长边方向的除去两端(r1×2)的长度(中央长度：d)设为99.5μm。若焊料301的安装前状态下的高度(镀覆厚度：t)与焊料300相同，则安装前状态下的焊料301与带状凸点211相接触的面的面积(带状面积)为11880μm2，体积为189487μm3。
图9是表示安装状态的焊料301的形状的一个示例的图。安装状态下，若将焊料301涂布在焊盘411的整个面上，则焊料301的形状如图9所示。该形状下，将焊料301的体积设为189487μm3，求出焊盘411的面积。图10是表示将安装状态的焊料301分割成三个构造的一个示例的图。左右构造分别是将上表面半径为r1、下表面半径(焊盘半径)为r3的圆锥台一分为二的构造。另外，中央构造是上表面上、横向长度为d、深度方向长度为r1×2，下表面上、横向长度为d、深度方向长度(焊盘宽度)为r3×2的棱锥台。
图11示出了基于上述条件计算出的、与焊料301的高度(焊料厚度：h2)相对应的焊盘411的面积(焊盘面积)。焊料301的高度(焊料厚度：h2)与焊料300的高度(焊料厚度：h1)相同且为14μm的情况下，焊盘411的面积(焊盘面积)为15246μm2。该情况下，焊盘411的面积(焊盘面积)与带状凸点211的剖面面积(带状面积)的比(面积比)约为1.3。
实际上，如上所述，有时带状凸点211从芯片101的表面200起的高度比柱状凸点210的高度要高。例如，若将该高度差设为4μm，则焊料301的高度(焊料厚度：h2)降低与该高度差相对应的量。也就是说，本仿真中，焊料301的高度(焊料厚度：h2)为10μm。该情况下，焊盘411的面积(焊盘面积)为26873m2，面积比约为2.3。也就是说，焊盘411的面积与带状凸点211的剖面面积之比要大于焊盘410的面积与柱状凸点210的剖面面积之比。
由此，通过形成使得焊盘411的面积与带状凸点211的剖面面积之比要大于焊盘410的面积与柱状凸点210的剖面面积之比的、焊盘411，从而能扩大带状凸点211的下沉量，从而能提高柱状凸点210与焊盘410的连接性。
接下来，参照图12A～图12F，对用于将带状凸点211的移动限制在焊盘411的规定范围的定位机构进行说明。
图12A是表示设置于焊盘411的定位机构的一个示例的图。如图12A所示，在焊盘411上的与长边方向的侧面平行的位置(规定范围的周围)上，设有定位机构1200(1200a、1200b)。定位机构1200例如在焊盘411的表面上由阻焊剂(抗蚀剂)形成。如图12A的下方所示，通过利用定位机构1200在图12A的左右方向限制焊料301的流动，从而能将带状凸点211的移动限制在定位机构1200a、1200b之间(规定范围)。此外，定位机构1200a、1200b形成用于使焊料301涂布扩散的通路(例如图12A的上下方向)。由此，与图6所示的示例相同，带状凸点211的下沉量增大，能提高柱状凸点210与焊盘410的连接性。
图12B是表示设置于焊盘411的定位机构的另一个示例的图。图12B所示的结构中，设有定位机构1200c、1200d以代替图12A所示的定位机构1200b。此外，定位机构1200c、1200d之间形成有间隙1201(通路)。由此，与图12A的情况相同，带状凸点211的移动被限制在定位机构1200a、1200c、1200d之间(规定范围)。此外，如图12B下方所示，焊料301也从定位机构1200c、1200d之间的间隙1201涂布扩散，因此能增大焊料301涂布扩散的面积。
图12C是表示设置于焊盘411的定位机构的另一个示例的图。图12C所示的结构中，设有定位机构1200e、1200f以代替图12B所示的定位机构1200a。此外，定位机构1200e、1200f之间形成有间隙1202(通路)。由此，与图12A的情况相同，带状凸点211的移动被限制在定位机构1200c～1200f之间(规定范围)。此外，如图12C下方所示，焊料301从定位机构1200c、1200d之间的间隙1201涂布扩散之外，也从定位机构1200e、1200f之间的间隙1202涂布扩散，因此能增大焊料301涂布扩散的面积。
图12D是表示设置于焊盘411的定位机构的另一个示例的图。图12D所示的结构中，沿着焊盘411外周的位置上(规定范围周围)设有多个定位机构1200g～1200n。多个定位机构1200g～1200n中的定位机构1200g～1200j与图12C所示的定位机构1200c～1200f相同，能够在图12D的左右方向上限制带状凸点211的移动。此外，在图12D所示的结构中，也能够利用定位机构1200k～1200n在图12D的上下方向上限制带状凸点211的移动。
图12E是表示设置于焊盘411的定位机构的另一个示例的图。如图12E所示，焊盘411外周(规定范围的周围)上，设有定位机构1210a～1210h。定位机构1210是形成于焊盘411外周的开口部(切口)。定位机构1210a～1210f与图12D所示的定位机构1200g～1200j相同，能够在图12E的左右方向上限制带状凸点211的移动。此外，定位机构1210g、1210h与图12D所示的定位机构1200k～1200n相同，能够在图12E的上下方向上限制带状凸点211的移动。
图12F是表示考虑焊盘410的位置来进行配置的定位机构的一个示例的图。如图12F所示，焊盘410与焊盘411接近来进行配置的情况下，能够在焊盘411上的靠近焊盘410的一侧设置定位机构1200。由此，通过在焊盘411上的靠近焊盘410的一侧设置定位机构1200，从而能防止焊料301超过焊盘411而涂布扩散至焊盘410。设置图12E所示的定位机构1210的情况下也相同。
以上对本实施方式进行了说明。根据本实施方式，焊盘411的面积与带状凸点211的剖面面积之比要大于焊盘410的面积与柱状凸点210的剖面面积之比。由此，形成于带状凸点211的焊料301的涂布扩散要大于形成于柱状凸点210的焊料300。因此，对比在柱状凸点210与带状凸点211中凸点与焊盘的面积比大致相同的情况，带状凸点211的下沉量较大，能够提高柱状凸点210与焊盘410的连接性。此外，例如能够利用图7～图11所示的仿真来计算出焊盘411的面积。
另外，如图12A～图12F所示例的那样，通过在焊盘411上设置定位机构，能够将凸点211的移动限制在焊盘411的规定范围内。因此，能够提高凸点211与焊盘411的连接性。
另外，如图12A～图12E所示例的那样，通过沿着相对的两条边设置定位机构，能够将焊盘411的移动限制在由两条边包围的范围(规定范围)内。
此外，如图12B～图12E所示例的那样，通过沿着相对的两条边的至少一条边侧形成焊料301的通路，能够扩大焊料301的涂布扩散面积。
另外，如图12F所示例的那样，通过在焊盘411上的接近焊盘410一侧设置定位机构，从而能防止焊料301超过焊盘411而涂布扩散至焊盘410。
此外，本实施方式用于帮助对本发明的理解，而并不用于对本发明进行限定性解释。在不脱离本发明的发明思想的前提下，可以对本发明进行变更/改良，并且本发明的同等发明也包含在本发明内。
例如，在本实施方式中，将芯片101作为安装元器件、将安装基板102作为被安装元器件来进行说明，但安装元器件与被安装元器件的组合并不局限于此，只要是能进行倒装芯片连接的元器件，则可以使用任意的元器件。例如，也可以适用于作为倒装芯片连接的一个方式的芯片上芯片(Chip onChip)连接。也就是说，安装元器件及被安装元器件可以均为芯片。
另外，例如在本实施方式中，将剖面面积较小的凸点设为柱状凸点，而将剖面面积较大的凸点设为带状凸点，但凸点的形状并不局限于此，可以是任意形状。
标号说明
100电子装置
101,1300芯片
102,1500安装基板
103密封树脂
200表面
210,1301凸点(柱状凸点)
211,1302凸点(带状凸点)
300,301,1400,1401焊料
400表面
410,411,1501,1502焊盘
1200定位机构(阻焊剂)
1210定位机构(开口部)

Claims (9)

1.一种电子装置，包括安装元器件、以及安装所述安装元器件的被安装元器件，其特征在于，
所述安装元器件在与所述被安装元器件相对的面上具备第1凸点、以及在该相对的面方向上的剖面面积大于所述第1凸点的第2凸点，
所述被安装元器件在与所述安装元器件相对的面上具备与所述第1凸点焊料连接的第1焊盘、以及与所述第2凸点焊料连接的第2焊盘，
所述第2焊盘的面积与所述第2凸点的剖面面积之比要大于所述第1焊盘的面积与所述第1凸点的剖面面积之比。
2.如权利要求1所述的电子装置，其特征在于，
所述第1凸点的剖面大致为圆形，
所述第2凸点的剖面大致为椭圆形。
3.如权利要求1或2所述的电子装置，其特征在于，
所述被安装元器件为安装基板，
所述第2凸点为了将所述安装元器件所产生的热散出至所述安装基板而设置。
4.如权利要求1至3的任一项所述的电子装置，其特征在于，
所述第2焊盘具有定位机构，该定位机构将所述第2凸点的移动限制在所述第2焊盘的规定范围，并且形成使焊料流至所述规定范围外的通路。
5.如权利要求4所述的电子装置，其特征在于，
所述定位机构是设置于所述第2焊盘的所述规定范围的周围的阻焊剂。
6.如权利要求4所述的电子装置，其特征在于，
所述定位机构是设置于所述第2焊盘的所述规定范围的周围的开口部。
7.如权利要求4至6的任一项所述的电子装置，其特征在于，
所述定位机构至少沿着所述规定范围的相对的两条边而设置。
8.如权利要求7所述的电子装置，其特征在于，
所述定位机构在所述两条边的至少一条边侧形成所述通路。
9.如权利要求4至8的任一项所述的电子装置，其特征在于，
所述定位机构至少设置于所述第2焊盘上的接近所述第1焊盘的一侧。
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