CN1601736A - 半导体集成电路装置及电子设备 - Google Patents

半导体集成电路装置及电子设备 Download PDF

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Publication number
CN1601736A
CN1601736A CNA2004100874064A CN200410087406A CN1601736A CN 1601736 A CN1601736 A CN 1601736A CN A2004100874064 A CNA2004100874064 A CN A2004100874064A CN 200410087406 A CN200410087406 A CN 200410087406A CN 1601736 A CN1601736 A CN 1601736A
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pad
signal
reinforcing
integrated circuit
projection
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Inventor
长尾充大
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Rohm Co Ltd
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Rohm Co Ltd
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Abstract

本发明提供一种IC和安装有这种IC的电子设备，在端子以格栅阵列状配置的IC中，能以高机械强度向安装基板进行接合的同时，将用于此目的的加固凸块以与信号凸块相同的尺寸、相同的配置构成。多个焊盘中除了最外周的焊盘以外的其它焊盘用作与内部电路连接的信号用焊盘，最外周的焊盘用作与其内周侧的接近的信号用焊盘连接的加固用焊盘。能将设置在这些加固用焊盘和与其连接的信号用焊盘上的凸块一起接合在安装基板上。

Description

半导体集成电路装置及电子设备
技术领域
本发明涉及一种端子以格栅阵列状设置的半导体集成电路装置以及安装了这种半导体集成电路装置的电子设备。
背景技术
半导体集成电路装置(以下称为IC)容纳封装有半导体集成电路芯片本体。在这种IC的端子构造中具有球栅阵列(BGA)电极构造。BGA电极构造是这样的：在IC的一个主表面上以格栅阵列形状设置由焊球形成的电极凸块(以下称为凸块)。对于BGA电极构造的IC，多端子化是容易的，能以近似芯片尺寸来构成外形尺寸。因此，BGA电极构造的IC被称为芯片尺寸组件(CSP)。此外，用于安装BGA电极构造的IC的印刷布线板等安装用基板(以下称为安装基板)的面积能以芯片尺寸完成。这种安装基板能用在卡用、便携式电话用、个人电脑用等的电气设备上。
这种BGA电极构造的IC通过电气和机械连接以高密度同其它半导体装置和电容器、电阻器等电子部件一起安装在这种电气机器的安装基板上。
通过进行回流处理将BGA电极构造的IC安装在安装基板上。由于这种回流时的加热，安装基板和IC存在受热变形。此外，由于安装基板和IC组件的热膨胀系数不同，会因使用中的热循环而产生热应变。在制造这种电气设备时和其后使用中的热变形和热应变导致在安装基板和IC的BGA接合部产生应力，存在接合剥离。
为了防止BGA接合部剥离，有人提出了一种在4角形组件的4个角上设置加固用的凸块(加固凸块)，从而提高机械强度的方案(参见专利文献1)。
专利文献1：特开2001-68594号公报
但是，在现有的加固方法中，为了提高机械强度而在4个角上使用一个大的加固凸块，或将多个加固凸块集中设置。这样，通过使用与信号凸块形状以及配置不同的加固凸块来提高机械强度。但是，在信号凸块和加固凸块的凸块的形状和配置上是不同的。因此，BGA电极构造IC的制造变得复杂，这种制造变复杂恐怕将产生新的问题。
发明内容
因此，本发明的目的是提供一种IC和安装这种IC的可靠性高的电子设备，在端子以格栅阵列状配置的IC中，能以高的机械强度在安装基板上接合，并且将用于此目的的加固凸块以与信号凸块相同的尺寸，相同的配置构成。
本发明之1的IC，为一种将实质上尺寸相同的多个焊盘以及在这些焊盘上设置的实质上尺寸相同的多个凸块在一面的预定区域上以格栅状排列的格栅阵列型IC，其特征在于：所述多个焊盘中，除了最外周的焊盘以外的其它焊盘用作与内部电路连接的信号用焊盘，所述最外周的焊盘用作通过焊盘间连接布线与其内周侧的接近的所述信号用焊盘连接的加固用焊盘，在每个所述信号用焊盘和加固用焊盘上设置有凸块。
本发明之2的IC，其特征在于：在本发明之1的IC中，所述最外周的焊盘中，各角部的3个加固用焊盘通过焊盘间连接布线与该角部的内周部的1个信号用焊盘连接，所述最外周的焊盘中，角部以外的边缘部的加固用焊盘分别通过连接布线与内周部的对应的信号用焊盘连接。
本发明之3的IC，其特征在于：在本发明之2的IC中，连接所述角部的3个加固用焊盘和信号用焊盘之间的焊盘间连接布线是X字形布线，连接所述角部以外的边缘部的加固用焊盘和内周部的对应的信号用焊盘的连接布线是直线状布线。
本发明之4的安装有IC的电子设备，其特征在于：具有IC和安装基板，其中，IC为一种将实质上尺寸相同的多个焊盘以及在这些焊盘上设置的实质上尺寸相同的多个凸块在一面的预定区域上以格栅状排列的格栅阵列型IC，并且所述多个焊盘中，除了最外周的焊盘以外的其它焊盘用作与内部电路连接的信号用焊盘，所述最外周的焊盘用作通过焊盘间连接布线与其内周侧的接近的所述信号用焊盘连接的加固用焊盘，在每个所述信号用焊盘和加固用焊盘上设置有凸块；安装基板，设置有与所述加固用焊盘以及与该加固用焊盘连接的所述信号用焊盘这两者相对应的尺寸的周缘电极、和与每个不与所述加固用焊盘连接的信号用焊盘相对应的尺寸的中心电极；每个所述中心电极与对应的各个所述凸块分别接合，每个所述周缘电极与对应的多个所述凸块一起接合。
本发明之5的安装有IC的电子设备，其特征在于：在本发明之4所述的安装有IC的电子设备中，在所述IC中，所述最外周的焊盘当中各角部的3个加固用焊盘通过焊盘间连接布线与该角部的内周部的1个信号用焊盘连接，所述最外周的焊盘当中角部以外的边缘部的加固用焊盘通过各个连接布线与内周部的对应的信号用焊盘连接，所述安装基板具有尺寸对应于所述角部的3个加固用焊盘和与其连接的信号用焊盘的角部电极、以及尺寸对应于所述边缘部的加固用焊盘和与其连接的信号用焊盘的边缘电极，各个所述中心电极与对应的各个所述凸块分别接合，各个所述角部电极与对应的4个所述凸块一起接合，各个所述边缘电极与对应的2个所述凸块一起接合。
本发明之6的安装有IC的电子设备，其特征在于：在本发明之5所述的安装有IC的电子设备中，连接所述角部的3个加固用焊盘和信号用焊盘之间的焊盘间连接布线是X字形布线，连接所述角部以外的边缘部的加固用焊盘和内周部的对应的信号用焊盘的连接布线是直线状布线。
本发明之7的IC，为一种将实质上尺寸相同的多个焊盘以及在这些焊盘上设置的实质上尺寸相同的多个凸块在一面的预定区域上以格栅状排列的格栅阵列型IC，其特征在于：所述多个焊盘中，除了相对的两边的最外周的焊盘之外的其它焊盘用作与内部电路连接的信号用焊盘，所述两边的最外周的焊盘用作通过直线状焊盘间连接布线与其内周侧的接近的所述信号用焊盘连接的加固用焊盘，在每个所述信号用焊盘和加固用焊盘上设置有凸块。
本发明之8的安装有IC的电子设备，其特征在于：具有IC和安装基板，其中，IC，为一种将实质上尺寸相同的多个焊盘以及在这些焊盘上设置的实质上尺寸相同的多个凸块在一面的预定区域上以格栅状排列的格栅阵列型IC，并且所述多个焊盘中，除了相对的两边的最外周的焊盘之外的其它焊盘用作与内部电路连接的信号用焊盘，所述两边的最外周的焊盘用作通过直线状焊盘间连接布线与其内周侧的接近的所述信号用焊盘连接的加固用焊盘，在每个所述信号用焊盘和加固用焊盘上设置有凸块；安装基板，设置有与所述加固用焊盘以及与该加固用焊盘连接的所述信号用焊盘这两者相对应的尺寸的周缘电极、和与每个不与所述加固用焊盘连接的信号用焊盘相对应的尺寸的中心电极；每个所述中心电极与对应的各个所述凸块分别接合，每个所述周缘电极与对应的多个所述凸块一起接合。
本发明之9的安装有IC的电子设备，其特征在于：在本发明之4、5、6或8所述的安装有IC的电子设备中，省略所述周缘电极或所述边缘电极内的至少一个周缘电极或边缘电极，形成用于所述中心电极的布线区域。
根据本发明，在BGA(球栅阵列)和PGA(网格针阵列)型IC中，使用相同形状、均匀配置的凸块(球状电极、柱状电极等)和针状电极，可以以高机械强度向安装基板(成品基板)进行接合。因此，即使在安装基板因受到制造时的热应力的影响而产生变形的情况下，也可以降低凸块从安装基板上剥离等的问题。
此外，以格栅阵列状配置的所有凸块由于以相同形状、均匀配置，所以使IC的封装工艺变得容易。
此外，将加固用凸块和与其连接的信号用凸块视作一个凸块，相对应地加大在安装基板上的电极(凸块)，从而在更大的面积上通过焊料进行接合。因此，安装强度提高了。
此外，测试IC时，使用在加固焊盘上设置的凸块以及在其接近的内周侧的信号用焊盘上设置的凸块，可以很容易地确认凸块和焊盘间的电连接状况是否良好。因此，在凸块从焊盘剥离下来的情况下，在测试IC时能被发现。
附图说明
图1是表示本发明第一实施例的IC的焊盘图形的示意图。
图2是表示本发明第一实施例的IC的凸块图形的示意图。
图3是表示安装图1和图2的IC的安装基板上的电极图形的示意图。
图4是本发明的IC被安装在安装基板上的状态模式剖面图。
图5是本发明第二实施例的IC的焊盘图形的示意图。
图6是本发明第二实施例的IC的凸块图形的示意图。
图7是安装图5和图6的IC的安装基板上的电极图形的示意图。
符号说明：100、100A-IC，110S-信号用焊盘，100F-加固用焊盘，120-焊盘间连接布线，130-凸块，200、200A-安装基板，210-中心电极，220-边缘电极，230-角部电极，240-接合用焊料，250-通孔，260-布线，270-多层布线。
具体实施方式
下面参照附图说明本发明的IC、以及安装了该IC的电子设备的实施例。图1-4示出了本发明第一实施例。
图1示出了在本发明的IC的一个主面侧上以格栅阵列状设置的焊盘的图形，图2示出了在这种焊盘上设置的凸块的图形。图3示出了安装图1和图2的IC的安装基板上的电极(焊盘)图形。图4示出了本发明的IC安装在安装基板上的状态的模式剖面图。
参见图1，在IC 100中，实质上尺寸相同的多个焊盘110在一面的预定区域上以格栅状排列。该区域形成为矩形形状。作为矩形，如图所示可以是正方形，也可以是长方形。焊盘110的数量不限于图1的例子，可以是任意数量。
这种格栅状排列的多个焊盘110当中，除了最外周焊盘以外的其它焊盘用作用于与IC的内部电路连接的信号用焊盘110S。如图1所示，对这些信号用焊盘110S用1-25编号。
多个焊盘110当中，最外周的焊盘用作加固用焊盘110F。这些加固用焊盘110F通过焊盘间连接布线120与其内周侧的接近的信号用焊盘110S连接。这样，多个焊盘110内的一部分由信号用焊盘110S和加固用焊盘110F组成。
4个各角部的3个加固用焊盘110F通过焊盘间连接布线120与该角部的内周部的1个信号用焊盘110S(编号1、5、9、13)连接。该角部的焊盘间连接布线120是X字形的布线。
角部以外的边缘部加固用焊盘110F通过焊盘间连接布线120分别与内周部的对应的信号用焊盘110S(编号2-4、6-8、10-12、14-16)连接。这些边缘部焊盘间连接布线120是直线状的布线。
如图2所示，在图1的每个焊盘110上设置着分别形成为球状电极(球电极)的凸块130。这些凸块130的形状全都大致相同，并且与焊盘110一样均匀地以格栅状排列。由此，构成球栅阵列构造(BGA)的IC。此外，也可以代替凸块，而使用针状电极(针电极)，在这种情况下形成网格针阵列构造(PGA)的IC。这些球电极和针电极用通常使用的电极材料来形成。例如，用焊料、金、合金等形成。从图2看出，在焊盘间连接布线120上不形成凸块，因此各个凸块间的尺寸的偏差变小。
这些凸块130与设置它们的焊盘110是信号用焊盘110S，或者还是加固用焊盘100F无关，与各个焊盘110对应设置。加固用焊盘110F通过焊盘间连接布线120与分别对应的信号用焊盘110S连接。
因此，如图2所示，作为凸块130的端子的编号与信号用焊盘110S的编号对应，也是编号1-25。在加固用焊盘110F上设置的凸块130成为与连接加固用焊盘110F的信号用焊盘110S的编号相同的端子编号1-16。
这样，IC100的加固用焊盘110F通过连接布线120与信号用焊盘110连接。测试IC100时，使用在加固用焊盘110F上设置的凸块以及在其接近内周侧的信号用焊盘上设置的凸块，就可以很容易地确认凸块130和焊盘110间的电气连接状况是否良好。因此，在凸块130从焊盘110剥离下来的情况下，测试IC时很容易发现。
图3表示设置了用于安装图1、图2的IC100的电极(焊盘)图形的安装基板200的结构。在该图3中以对应IC100的同样尺寸的虚线示出了安装基板200。但是，实际上，作为承载其它IC和其它部件等的基板，它比IC100大很多。
如图3所示，在安装基板200上设置着用于接合IC100的凸块130的电极(焊盘)210、220、230。即，用于接合的电极是设置在中心部分的中心电极210和作为周缘电极设置在周缘部的边缘电极220和角部电极230。
每个中心电极210与相对应的各个凸块130分别接合。每个中心电极210通过接合材料一对一地接合未连接加固用焊盘110F的凸块130、即用编号表示的编号17-25的凸块。此外，一般情况下使用多层布线技术等将中心电极210与其它IC和部件连接。
每个边缘电极220具有与边缘部的加固用焊盘110F及与其连接的信号用焊盘110S相应的尺寸的面积。每个边缘电极220通过接合材料与设置在其边缘部的加固用焊盘110F上的凸块130以及设置在连接其边缘部的加固用焊盘110F的信号用焊盘110S上的凸块130这2个凸块一起接合。
每个角部电极230具有对应于角部的3个加固用焊盘110F和与其连接的信号用焊盘110S的尺寸的面积。每个角部电极230通过接合材料与设置在其角部的加固用焊盘110F上的凸块130以及设置在与该角部的加固用焊盘110F连接的信号用焊盘110S上的凸块130的合计4个凸块一起接合。作为接合材料，只要能将IC100的凸块130与安装基板200的电极210、220、230电气和机械接合即可。例如，作为这种接合材料，可以是通过过热而熔融、能将凸块130与焊盘接合的焊糊。
边缘电极220和角部电极230一般通过安装基板200表面的布线260与其它IC、部件连接。其边缘电极220和角部电极230也可以通过安装基板200内部的多层布线270(参照图4)来连接。此外，希望中心电极210借助通孔250和多层布线270与其它IC和部件连接。
此外，如图3所示，省略一部分边缘电极220(图中，对应于编号8的信号用焊盘110S)而作为用于中心电极的布线区域(即布线用空间)。通过该布线空间，引出来自一部分中心电极(图中，对应于编号20、21的信号用焊盘110S)的布线260。这样，也可以按照需要省略一部分边缘电极(或周缘电极)220。
图4示出了本发明第一实施例的IC100安装在安装基板200上的状态的模式剖面图。该图4模式化地示出了在安装状态下沿着图3的A-A线的剖面。
如图4所示，在安装基板200的电极210、220、230(但是，图中没有示出电极230)上设置用作接合材料的焊料240。另一方面，IC200使其按格栅状排列的凸块130与各个中心电极210、边缘电极220、角部电极230相对向地定位，并承载在各个焊盘上的焊料240上。这种状态下，通过加热，使焊料240和凸块130回流焊接。由此，电极210、220、230和凸块130就可以进行接合。
根据本发明的第一实施例，在BGA和PGA型的IC100中，通过使用相同形状、均匀配置的凸块130(例如，球状电极、针状电极和柱状电极等)，可以以高的机械强度接合在安装基板200上。因此，即使在安装基板200因制造上的热应力而导致变形的情况下，也可以降低凸块130从安装基板200剥离等问题。
此外，以格栅阵列状配置的所有凸块130由于以相同形状均匀配置，因此可以利用与通常的BGA和PGA型IC相同的工艺进行封装。因此，封装工艺容易。
此外，将在加固用焊盘110F上设置的凸块130以及在与加固用焊盘110F连接的信号用焊盘110S上设置的凸块130当作一块凸块。对应于这些凸块来设置安装基板200上的周缘电极220、230。周缘电极220、230对应于这些当作一个凸块的多个凸块(2个或4个)而变大。而且，该周缘电极220、230在比该多个凸块大的面积上通过焊料等接合材料进行接合。由此提高了安装强度。
此外，图4示出了使用多层布线技术在基板中具有布线的情况，但是也可以为使用通孔，仅在基板的背面和表面布线的基板。
图5-图7示出了本发明的第二实施例。图5是表示在本发明的IC的一个主面侧以格栅阵列状配置的焊盘的图形，图6是在其电极上设置的凸块的图形。图7是表示安装了图5和图6的IC的安装基板上的电极图形的示意图。
在该第二实施例中，IC100A是这样一种格栅阵列型IC：在其一面的规定矩形区域以格栅状排列着实质上相同尺寸的多个焊盘和在这些焊盘上设置的实质上相同尺寸的多个凸块。这与第一实施例相同。
如图5所示，该第二实施例中，IC100A构成这样的结构：只将相对两边的最外周的焊盘作为加固用焊盘110F来使用。而且，这两边的最外周加固用焊盘110F通过直线状焊盘间连接布线120与其内周侧的接近信号用焊盘110S连接。
另一方面，在格栅状排列的多个焊盘110当中，除了两边的最外周焊盘以外的其它焊盘用作用于与IC的内部电路连接的信号用焊盘110S。如图5所示，该信号用焊盘110S被编号为1-35。
如6所示，凸块130对应于各焊盘110分别设置。因此，凸块130的构成与图2所示相同。作为凸块130的端子的编号与信号用焊盘110S的编号对应，如图6所示，为编号1-35。加固用焊盘110F上设置的凸块130为与连接加固用焊盘110F的信号用焊盘110S的编号相同的端子编号1-7、11-17。其它构成与第一实施例的相同。
图7是表示设置有用于安装图5、图6的IC100A的电极图形的安装基板200A的构成的图。图7中，以对应IC100A的相同尺寸示出了安装基板200A。但是，安装基板200A承载着其它IC和其它部件等，它实际上比IC100A大很多。
如图7所示，在安装基板200A上设置着用于接合IC100A的凸块130的电极图形。即，用于接合的电极是作为周缘电极在相对两边上设置的边缘电极220和在中心部分设置的中心电极210。
每个中心电极210与对应的各个凸块130接合。每个中心电极210通过接合材料与不与加固用焊盘110F连接的凸块130、即用编号表示为编号8-10和编号18-35的凸块一对一地接合。
边缘电极220具有对应于边缘部的加固用焊盘110F以及与其连接的信号用焊盘110S的尺寸的面积。每个边缘电极220通过接合材料与在该边缘部的加固用焊盘110F上设置的凸块130以及在与该边缘部加固用焊盘110F连接的信号用焊盘110S上设置的凸块130的2个凸块接合在一起。第二实施例中不存在角部电极。
在安装基板200A上安装第二实施例的IC100A的状态下，图7的A-A线模式剖面图与图4相同。
第二实施例中，IC100A的加固用焊盘100F只设置在相对两边的最外周部上。如此，只在相对的两边的最外周部上设置有加固用焊盘的ID，在特定方向发生安装基板变形的情况下，可以降低凸块从安装基板上剥离下来的问题。因此，可以有效地适用于在格栅状配置的凸块中，不作为外部端子使用的凸块少的情况。此外，可获得与第一实施例相同的效果。
另外，虽然只说明了在电极220、230上承载用作接合材料的焊料的情况，但是也可以在电极220、230上形成与凸块130相同的凸块，并连接这些凸块之间。

Claims (9)

1.一种半导体集成电路装置，为一种将实质上尺寸相同的多个焊盘以及在这些焊盘上设置的实质上尺寸相同的多个凸块在一面的预定区域上以格栅状排列的格栅阵列型半导体集成电路装置，其特征在于：所述多个焊盘中，除了最外周的焊盘以外的其它焊盘用作与内部电路连接的信号用焊盘，所述最外周的焊盘用作通过焊盘间连接布线与其内周侧的接近的所述信号用焊盘连接的加固用焊盘，在每个所述信号用焊盘和加固用焊盘上设置有凸块。
2.根据权利要求1所述的半导体集成电路装置，其特征在于：所述最外周的焊盘中，各角部的3个加固用焊盘通过焊盘间连接布线与该角部的内周部的1个信号用焊盘连接，所述最外周的焊盘中，角部以外的边缘部的加固用焊盘分别通过连接布线与内周部的对应的信号用焊盘连接。
3.根据权利要求2所述的半导体集成电路装置，其特征在于：连接所述角部的3个加固用焊盘和信号用焊盘之间的焊盘间连接布线是X字形布线，连接所述角部以外的边缘部的加固用焊盘和内周部的对应的信号用焊盘的连接布线是直线状布线。
4.一种安装有半导体集成电路装置的电子设备，其特征在于：具有半导体集成电路装置和安装基板，
其中，半导体集成电路装置，为一种将实质上尺寸相同的多个焊盘以及在这些焊盘上设置的实质上尺寸相同的多个凸块在一面的预定区域上以格栅状排列的格栅阵列型半导体集成电路装置，并且所述多个焊盘中，除了最外周的焊盘以外的其它焊盘用作与内部电路连接的信号用焊盘，所述最外周的焊盘用作通过焊盘间连接布线与其内周侧的接近的所述信号用焊盘连接的加固用焊盘，在每个所述信号用焊盘和加固用焊盘上设置有凸块；
安装基板，设置有与所述加固用焊盘以及与该加固用焊盘连接的所述信号用焊盘这两者相对应的尺寸的周缘电极、和与每个不与所述加固用焊盘连接的信号用焊盘相对应的尺寸的中心电极；
每个所述中心电极与对应的各个所述凸块分别接合，每个所述周缘电极与对应的多个所述凸块一起接合。
5.根据权利要求4所述的安装有半导体集成电路装置的电子设备，其特征在于：
在所述半导体集成电路装置中，所述最外周的焊盘当中各角部的3个加固用焊盘通过焊盘间连接布线与该角部的内周部的1个信号用焊盘连接，所述最外周的焊盘当中角部以外的边缘部的加固用焊盘通过各个连接布线与内周部的对应的信号用焊盘连接，
所述安装基板具有尺寸对应于所述角部的3个加固用焊盘和与其连接的信号用焊盘的角部电极、以及尺寸对应于所述边缘部的加固用焊盘和与其连接的信号用焊盘的边缘电极，
各个所述中心电极与对应的各个所述凸块分别接合，各个所述角部电极与对应的4个所述凸块一起接合，各个所述边缘电极与对应的2个所述凸块一起接合。
6.根据权利要求5所述的安装有半导体集成电路装置的电子设备，其特征在于：连接所述角部的3个加固用焊盘和信号用焊盘之间的焊盘间连接布线是X字形布线，连接所述角部以外的边缘部的加固用焊盘和内周部的对应的信号用焊盘的连接布线是直线状布线。
7.一种半导体集成电路装置，为一种将实质上尺寸相同的多个焊盘以及在这些焊盘上设置的实质上尺寸相同的多个凸块在一面的预定区域上以格栅状排列的格栅阵列型半导体集成电路装置，其特征在于：
所述多个焊盘中，除了相对的两边的最外周的焊盘之外的其它焊盘用作与内部电路连接的信号用焊盘，
所述两边的最外周的焊盘用作通过直线状焊盘间连接布线与其内周侧的接近的所述信号用焊盘连接的加固用焊盘，
在每个所述信号用焊盘和加固用焊盘上设置有凸块。
8.一种安装有半导体集成电路装置的电子设备，其特征在于：具有半导体集成电路装置和安装基板，
其中，半导体集成电路装置，为一种将实质上尺寸相同的多个焊盘以及在这些焊盘上设置的实质上尺寸相同的多个凸块在一面的预定区域上以格栅状排列的格栅阵列型半导体集成电路装置，并且所述多个焊盘中，除了相对的两边的最外周的焊盘之外的其它焊盘用作与内部电路连接的信号用焊盘，所述两边的最外周的焊盘用作通过直线状焊盘间连接布线与其内周侧的接近的所述信号用焊盘连接的加固用焊盘，在每个所述信号用焊盘和加固用焊盘上设置有凸块；
安装基板，设置有与所述加固用焊盘以及与该加固用焊盘连接的所述信号用焊盘这两者相对应的尺寸的周缘电极、和与每个不与所述加固用焊盘连接的信号用焊盘相对应的尺寸的中心电极；
每个所述中心电极与对应的各个所述凸块分别接合，每个所述周缘电极与对应的多个所述凸块一起接合。
9.根据权利要求4、5、6或8所述的安装有半导体集成电路装置的电子设备，其特征在于：省略所述周缘电极或所述边缘电极内的至少一个周缘电极或边缘电极，形成用于所述中心电极的布线区域。
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