JP6048880B2 - 発光素子用パッケージ及びそれを用いた発光装置 - Google Patents

発光素子用パッケージ及びそれを用いた発光装置 Download PDF

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Publication number
JP6048880B2
JP6048880B2 JP2013012369A JP2013012369A JP6048880B2 JP 6048880 B2 JP6048880 B2 JP 6048880B2 JP 2013012369 A JP2013012369 A JP 2013012369A JP 2013012369 A JP2013012369 A JP 2013012369A JP 6048880 B2 JP6048880 B2 JP 6048880B2
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JP
Japan
Prior art keywords
light emitting
emitting element
reflector
mounting substrate
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013012369A
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English (en)
Japanese (ja)
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JP2014143374A (ja
Inventor
真太郎 林
真太郎 林
耕一朗 松岡
耕一朗 松岡
拓巳 井場
拓巳 井場
福島　博司
博司 福島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to JP2013012369A priority Critical patent/JP6048880B2/ja
Priority to PCT/JP2013/006148 priority patent/WO2014115202A1/ja
Priority to TW102139613A priority patent/TW201432960A/zh
Publication of JP2014143374A publication Critical patent/JP2014143374A/ja
Application granted granted Critical
Publication of JP6048880B2 publication Critical patent/JP6048880B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
JP2013012369A 2013-01-25 2013-01-25 発光素子用パッケージ及びそれを用いた発光装置 Expired - Fee Related JP6048880B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013012369A JP6048880B2 (ja) 2013-01-25 2013-01-25 発光素子用パッケージ及びそれを用いた発光装置
PCT/JP2013/006148 WO2014115202A1 (ja) 2013-01-25 2013-10-16 発光素子用パッケージ及びそれを用いた発光装置
TW102139613A TW201432960A (zh) 2013-01-25 2013-10-31 發光元件用封裝體及利用此封裝體之發光裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013012369A JP6048880B2 (ja) 2013-01-25 2013-01-25 発光素子用パッケージ及びそれを用いた発光装置

Publications (2)

Publication Number Publication Date
JP2014143374A JP2014143374A (ja) 2014-08-07
JP6048880B2 true JP6048880B2 (ja) 2016-12-21

Family

ID=51227023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013012369A Expired - Fee Related JP6048880B2 (ja) 2013-01-25 2013-01-25 発光素子用パッケージ及びそれを用いた発光装置

Country Status (3)

Country Link
JP (1) JP6048880B2 (zh)
TW (1) TW201432960A (zh)
WO (1) WO2014115202A1 (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6365187B2 (ja) * 2014-09-30 2018-08-01 日亜化学工業株式会社 発光装置
KR102220505B1 (ko) * 2015-01-29 2021-02-25 엘지이노텍 주식회사 발광 모듈
US10121770B2 (en) * 2015-02-18 2018-11-06 Koninklijke Philips N.V. Device with multiple, stacked light emitting devices
JP2016207739A (ja) 2015-04-17 2016-12-08 株式会社東芝 半導体発光装置及びその製造方法
JP6521443B2 (ja) * 2015-06-29 2019-05-29 国立研究開発法人情報通信研究機構 深紫外光を放射する半導体発光素子、該半導体発光素子を備える発光モジュール、及び該半導体発光素子の製造方法
JP6668022B2 (ja) 2015-09-17 2020-03-18 日機装株式会社 発光モジュールおよび発光モジュールの製造方法
JP6915236B2 (ja) * 2016-06-29 2021-08-04 セイコーエプソン株式会社 光源装置およびプロジェクター
TWI626771B (zh) 2016-07-26 2018-06-11 宏齊科技股份有限公司 發光二極體單元和薄型平面光源模組
JP6776879B2 (ja) * 2016-12-22 2020-10-28 日亜化学工業株式会社 セラミック基板の製造方法、発光装置の製造方法
JP6680705B2 (ja) * 2017-02-10 2020-04-15 キオクシア株式会社 半導体装置及びその製造方法
TWI710147B (zh) * 2017-04-13 2020-11-11 宏齊科技股份有限公司 發光二極體的封裝結構
JP7211311B2 (ja) * 2019-09-13 2023-01-24 豊田合成株式会社 紫外光照射装置
WO2023042792A1 (ja) * 2021-09-16 2023-03-23 旭化成株式会社 紫外線照射装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04226095A (ja) * 1990-04-27 1992-08-14 Omron Corp 半導体発光装置
JP2002117702A (ja) * 2000-10-11 2002-04-19 Toyoda Gosei Co Ltd 光源装置
JP2004242166A (ja) * 2003-02-07 2004-08-26 Seiko Epson Corp 光モジュール及びその製造方法並びに電子機器
JP4773048B2 (ja) * 2003-09-30 2011-09-14 シチズン電子株式会社 発光ダイオード
JP2005235864A (ja) * 2004-02-17 2005-09-02 Hamamatsu Photonics Kk 光半導体装置
JP3963188B2 (ja) * 2005-09-20 2007-08-22 松下電工株式会社 発光装置
JP5697252B2 (ja) * 2011-07-12 2015-04-08 株式会社エンプラス 照明装置

Also Published As

Publication number Publication date
WO2014115202A1 (ja) 2014-07-31
TW201432960A (zh) 2014-08-16
JP2014143374A (ja) 2014-08-07

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