JP6668022B2 - 発光モジュールおよび発光モジュールの製造方法 - Google Patents
発光モジュールおよび発光モジュールの製造方法 Download PDFInfo
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- JP6668022B2 JP6668022B2 JP2015184169A JP2015184169A JP6668022B2 JP 6668022 B2 JP6668022 B2 JP 6668022B2 JP 2015184169 A JP2015184169 A JP 2015184169A JP 2015184169 A JP2015184169 A JP 2015184169A JP 6668022 B2 JP6668022 B2 JP 6668022B2
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- 238000004519 manufacturing process Methods 0.000 title description 9
- 239000000758 substrate Substances 0.000 claims description 45
- 238000007789 sealing Methods 0.000 claims description 32
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 18
- 239000011521 glass Substances 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 238000005304 joining Methods 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 238000001746 injection moulding Methods 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000003566 sealing material Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 229910001020 Au alloy Inorganic materials 0.000 claims description 2
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 claims description 2
- 230000005496 eutectics Effects 0.000 claims description 2
- 239000005350 fused silica glass Substances 0.000 claims description 2
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 claims description 2
- RZVXOCDCIIFGGH-UHFFFAOYSA-N chromium gold Chemical compound [Cr].[Au] RZVXOCDCIIFGGH-UHFFFAOYSA-N 0.000 claims 1
- 238000012986 modification Methods 0.000 description 17
- 230000004048 modification Effects 0.000 description 17
- 238000002844 melting Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 6
- 239000010453 quartz Substances 0.000 description 5
- 238000013461 design Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/095—Refractive optical elements
- G02B27/0955—Lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Description
図5は、変形例に係る発光モジュール110を示す断面図である。発光モジュール110は、窓部材130のレンズ部132が球体ではなく、球体の一部を切り取ったような形状を有する点で上述の実施の形態と相違する。以下、上述の実施の形態との相違点を中心に述べる。
図6は、変形例に係る発光モジュール210を示す断面図である。発光モジュール210は、窓部材230の光入射面234がフレネル面で構成される点で、上述の変形例1と相違する。以下、変形例1との相違点を中心に述べる。
図7は、変形例に係る発光モジュール310を示す断面図である。発光モジュール310は、窓部材330の光入射面334と光出射面336の双方がフレネル面で構成される点で上述の実施の形態と相違する。以下、実施の形態との相違点を中心に述べる。
Claims (10)
- 上面に開口を有する凹部が設けられるパッケージ基板と、
前記凹部に収容される発光素子と、
前記開口を覆うように前記上面に設けられる窓部材と、
前記パッケージ基板と前記窓部材の間を接合する封止部と、を備え、
前記窓部材は、前記発光素子と対向するレンズ部と、前記レンズ部から突出して前記封止部と接合されるフランジ部とを含み、
前記レンズ部および前記フランジ部は、同じガラス材料で構成され、
前記フランジ部は、前記封止部と接合される接合部と、前記レンズ部および前記接合部の間をつなぐ接続部とを有し、前記フランジ部の突出方向と直交する方向の前記接続部の厚さが前記接合部の厚さより小さく、前記接合部は、前記パッケージ基板の上面と対向し、前記接続部は、前記パッケージ基板の上面から離れることを特徴とする発光モジュール。 - 前記レンズ部および前記フランジ部は、石英ガラスで構成されることを特徴とする請求項1に記載の発光モジュール。
- 前記発光素子は、波長200nm以上360nm以下の帯域に含まれる紫外光を発することを特徴とする請求項1または2に記載の発光モジュール。
- 前記レンズ部は、前記発光素子からの光を平行光に変換して外部に出射させることを特徴とする請求項1から3のいずれか一項に記載の発光モジュール。
- 前記レンズ部は、球体または球体の一部であることを特徴とする請求項1から4のいずれか一項に記載の発光モジュール。
- 前記レンズ部は、フレネルレンズであることを特徴とする請求項1から4のいずれか一項に記載の発光モジュール。
- 前記レンズ部は球体であり、球の中心が前記フランジ部より外側に位置することを特徴とする請求項1から4のいずれか一項に記載の発光モジュール。
- 前記接合部は、前記上面と対向する接合面を有し、前記接合面にチタン(Ti)/銅(Cu)/ニッケル(Ni)/金(Au)の積層膜またはクロム(Cr)/Cu/Ni/Auの積層膜が形成されており、
前記封止部は、金錫(AuSn)または銀錫(AgSn)の合金を含み、前記接合面との間で共晶結合を形成することを特徴とする請求項1から7のいずれか一項に記載の発光モジュール。 - 前記接続部は、前記封止部と接合するためのメタライズ処理が施されていないことを特徴とする請求項8に記載の発光モジュール。
- 溶融石英を材料として、請求項1から9のいずれか一項に記載の窓部材を射出成形する工程と、
上面に開口を有する凹部が設けられるパッケージ基板の前記凹部に発光素子を収容する工程と、
前記レンズ部と前記発光素子が対向するようにして前記上面に前記窓部材を配置する工程と、
前記パッケージ基板と前記フランジ部の間を封止材で接合する工程と、を備えることを特徴とする発光モジュールの製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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JP2015184169A JP6668022B2 (ja) | 2015-09-17 | 2015-09-17 | 発光モジュールおよび発光モジュールの製造方法 |
PCT/JP2016/075012 WO2017047358A1 (ja) | 2015-09-17 | 2016-08-26 | 発光モジュールおよび発光モジュールの製造方法 |
EP16846229.9A EP3352231B1 (en) | 2015-09-17 | 2016-08-26 | Light emitting module and method for manufacturing light emitting module |
CN201680050639.8A CN108140704B (zh) | 2015-09-17 | 2016-08-26 | 发光模块及发光模块的制造方法 |
US15/912,043 US10883680B2 (en) | 2015-09-17 | 2018-03-05 | Light-emitting module and method of manufacturing light-emitting module |
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JP2015184169A JP6668022B2 (ja) | 2015-09-17 | 2015-09-17 | 発光モジュールおよび発光モジュールの製造方法 |
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JP6668022B2 true JP6668022B2 (ja) | 2020-03-18 |
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US (1) | US10883680B2 (ja) |
EP (1) | EP3352231B1 (ja) |
JP (1) | JP6668022B2 (ja) |
CN (1) | CN108140704B (ja) |
WO (1) | WO2017047358A1 (ja) |
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KR102337364B1 (ko) * | 2016-06-01 | 2021-12-09 | 신에쯔 세끼에이 가부시키가이샤 | 자외선smd형 led소자의 기밀봉지용 석영유리 부재 및 자외선led용 석영유리 부재의 제조방법 |
JP2017216389A (ja) * | 2016-06-01 | 2017-12-07 | 信越石英株式会社 | 紫外線smd型led素子の気密封止用シリカガラス部材 |
JP6966556B2 (ja) * | 2017-08-23 | 2021-11-17 | 日本碍子株式会社 | 光学部品の製造方法及び透明封止部材の製造方法 |
JP6644745B2 (ja) * | 2017-08-25 | 2020-02-12 | エーディーワイ株式会社 | 紫外線光素子、紫外線光素子用パッケージ及び紫外線光素子に用いられる光学部材並びにその光学部材の製造方法 |
JP6871184B2 (ja) * | 2018-01-31 | 2021-05-12 | 日機装株式会社 | 半導体発光装置の製造方法 |
JP7107692B2 (ja) * | 2018-02-13 | 2022-07-27 | スタンレー電気株式会社 | 光源用パッケージ及び光源用パッケージの製造方法 |
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EP3352231B1 (en) | 2020-09-09 |
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EP3352231A4 (en) | 2019-02-13 |
US20180195677A1 (en) | 2018-07-12 |
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