JP6048880B2 - LIGHT EMITTING ELEMENT PACKAGE AND LIGHT EMITTING DEVICE USING THE SAME - Google Patents

Description

  The present invention relates to a light emitting element package and a light emitting device using the same.

  As a light emitting element package for accommodating a light emitting element, for example, a light emitting element accommodating package having a configuration shown in FIG. 8 has been proposed (Patent Document 1).

  The light emitting element storage package having the configuration shown in FIG. 8 includes a base body 101, a frame body 102, and a lid body 103.

  The base 101 is made of ceramics. In addition, the base 101 has a mounting portion 101 a for mounting the light emitting element 106.

  A metallized wiring (not shown) is formed on the base 101, and a part of the metallized wiring is exposed on the lower surface of the base 101.

  The frame body 102 is made of a metal such as Al, Ag, or Au having high reflectivity with respect to light in the ultraviolet light region to the visible light region, ceramics, or resin. A through-hole 102a is formed at the center of the frame body 102. The through-hole 102a expands outward as the inner peripheral surface moves upward. Further, when the frame body 102 is formed of ceramics or resin, a reflective layer made of a metal such as Al, Ag, Au, Pt, or Cu is formed on the surface thereof.

  The frame body 102 has a convex portion 105 a formed on the entire inner periphery of the lower surface, and the convex portion 105 a is joined to the upper surface of the base 101. Accordingly, the frame body 102 has a gap between the outer peripheral portion of the lower surface and the upper surface of the base body 101 over the entire periphery.

  The lid 103 is made of a translucent material such as glass, sapphire, quartz, or resin. Patent Document 1 describes that the function of an optical lens may be added by making the lid 103 into a lens shape.

  Note that Patent Document 1 also describes a light-emitting device that includes the above-described light-emitting element storage package and the light-emitting element 106 mounted on the mounting portion 101a.

  As a light emitting element package, for example, a light emitting element storage package 210 having a configuration shown in FIG. 9 has been proposed (Patent Document 2).

  The light emitting element storage package 210 includes a ceramic insulating substrate 211 and a reflector frame 212 joined to the outer peripheral upper surface of the insulating substrate 211.

  The reflector frame 212 is made of the same composition or different material as the insulating substrate 211, and is integrated with the upper surface of the insulating substrate 211 by sintering. Here, the reflector frame 212 is made of white nitride ceramics.

  On the lower surface of the insulating substrate 211, a supply wiring pattern layer 215 for electrical connection to a circuit board or the like is deposited. In addition, a light emitting element connecting wiring pattern layer 214 is formed on the upper surface of the insulating substrate 211.

  The insulating substrate 211 is formed with wiring through holes 216 that penetrate through the upper and lower surfaces. The wiring through-hole 216 is filled with a conductive member 217 to form a conductive portion 222. In the light emitting element storage package 210, the light emitting element connection wiring pattern layer 214 and the supply wiring pattern layer 215 are electrically connected to each other through the conductive portion 222. The light emitting element storage package 210 is configured such that the light emitting element 206 is electrically connected to the light emitting element connecting wiring pattern layer 214 via the bump electrode 220.

  As a light emitting device, for example, a light emitting device 300 having a configuration shown in FIG. 10 has been proposed (Patent Document 3).

  The light emitting device 300 includes an LED chip 306, a mounting substrate 301, a submount member 313, a bonding wire 317, a reflector 302, a sealing portion 305, a lens 307, an air layer 309, and a color conversion member 308. It has.

Japanese Patent No. 4454237 International Publication No. 2006/013899 JP 2007-88081 A

The structure of the light-emitting element storing package 8, since only the protrusions 105a formed over the entire periphery of the inner peripheral portion of the lower surface of the frame 102 is joined to the upper surface of the base body 101, the upper surface of the lid 103 The strength against the load from is likely to be low.

  In the light emitting element storage package 210 having the configuration of FIG. 9, the reflector frame 212 is made of the same composition or different material as the insulating substrate 211, and is integrated with the upper surface of the insulating substrate 211 by sintering. For this reason, in the light emitting element storage package 210, a metal having higher reflectivity cannot be adopted as the material of the reflector frame 212, and it is difficult to improve the light extraction efficiency.

  In the light emitting device 300 of FIG. 10, there is a concern that a part of the light emitted from the side surface of the LED chip 306 is blocked by the bonding wire 317 and the light extraction efficiency is lowered.

  Further, in the light emitting device 300 of FIG. 10, since the bonding wire 317 is provided between the reflector 302 and the LED chip 306, the reduction of the opening area of the reflector 302 is limited, and the light emitted from the side surface of the LED chip 306 is reduced. Among them, there is a concern that the amount of light that does not directly enter the reflector 302 increases and the light extraction efficiency decreases.

  The present invention has been made in view of the above reasons, and an object of the present invention is to provide a package for a light emitting device capable of improving reliability and improving light extraction efficiency, and the same. The object is to provide a light emitting device.

The light emitting device package of the present invention includes a mounting substrate on which the light emitting device is mounted, a reflector disposed on one surface side of the mounting substrate so as to surround the mounting region of the light emitting device, and the mounting substrate. A lid that covers the reflector on one surface side and is joined to the mounting substrate, and the lid covers the lid body and a window hole formed in front of the mounting area in the lid body. A light extraction window member bonded to the metal plate, and the mounting substrate includes a metal plate, an electric insulation layer formed on the one surface side of the metal plate, and the metal plate formed on the electric insulation layer. A hole exposing a part of the one surface, a first power supply layer formed on the electrical insulating layer, and disposed inside the hole and joined to the one surface side of the metal plate A submount member, A base member having a thermal conductivity higher than that of the electrical insulation layer and having electrical insulation, and a second conductor layer for feeding formed on the surface side of the base material opposite to the metal plate side The first conductor layer is formed across the projection area of the lid and the outside of the projection area on the mounting substrate, and the first terminal portion for internal connection is formed in the projection area of the reflector. A second terminal portion for external connection on the outside of the lid, and the second conductor layer is formed across the mounting region and the projection region of the reflector on the mounting substrate. A wiring portion; and the wiring portion and the first terminal portion are electrically connected via a wire, and the reflector is a concave portion that accommodates the wire on a surface facing the mounting substrate. where is formed, said reflector, said Sabumaun In the region overlapping the members in contact without being bonded to the mounting board, characterized that you have been joined via a joint to the mounting board in the area overlapping the electrically insulating layer.

  In the light emitting element package, it is preferable that the recess is separated from both the outer peripheral end and the inner peripheral end of the surface of the reflector on the mounting substrate side.

In this light emitting device package, the recess is preferably a gap .

  In this light emitting device package, it is preferable that the window material is a lens, and the reflector has a convex portion that surrounds the lens and positions the lens on a surface opposite to the mounting substrate side.

  In the light emitting device package, it is preferable that the convex portion is annular, and the opening area gradually increases as the distance from the mounting substrate increases.

In this light emitting device package, the lid body includes a cylinder, a first flange protruding outward from a first end that is an end of the cylinder close to the mounting substrate, and the cylinder. A second flange projecting inward from a second end that is an end far from the mounting substrate, an inner peripheral surface of the second flange being an inner peripheral surface of the window hole, and the lens , A lens part, and a base part protruding outward from the outer peripheral part of the lens part over the entire circumference, the lens part being disposed in the window hole, and the base part being joined to the second flange It is preferable that
In this light emitting device package, it is preferable that the light emitting device can emit light in an ultraviolet wavelength region of 210 nm to 360 nm.

  The light emitting device of the present invention includes the light emitting element package and the light emitting element.

  The light emitting device package of the present invention can improve the reliability and improve the light extraction efficiency.

  The light emitting device of the present invention can improve reliability and improve light extraction efficiency.

FIG. 1 is a schematic cross-sectional view of a light emitting device including the light emitting element package of the embodiment. FIG. 2 is a schematic perspective view of a light emitting device including the light emitting element package of the embodiment. FIG. 3 is a schematic plan view of a light emitting device including the light emitting element package of the embodiment. FIG. 4 is a schematic plan view of a first modification of the light emitting device including the light emitting element package of the embodiment. FIG. 5 is a schematic plan view of a second modification of the light emitting device including the light emitting element package of the embodiment. FIG. 6 is a schematic plan view of a third modification of the light emitting device including the light emitting element package of the embodiment. FIG. 7 is a schematic cross-sectional view of a fourth modification of the light emitting device including the light emitting element package of the embodiment. FIG. 8 is a cross-sectional view of a conventional light emitting element storage package. FIG. 9 is a cross-sectional view of another conventional light emitting element storage package. FIG. 10 is a cross-sectional view of another conventional light emitting device.

  Hereinafter, a light emitting device package (hereinafter referred to as a “package”) 10 according to the present embodiment will be described with reference to FIGS.

  The package 10 includes a mounting substrate 1, a reflector 2, and a lid 3. A light emitting device using the package 10 includes the package 10 and the light emitting element 6 housed in the package 10. The light emitting element 6 is a solid light emitting element and employs an LED chip. However, the present invention is not limited to this, and a semiconductor laser chip can also be employed.

  The mounting substrate 1 is a substrate on which the light emitting element 6 is mounted. “Mounting” is a concept including arranging and mechanically connecting the light emitting elements 6 and electrically connecting them. For this reason, the mounting substrate 1 has a function of mechanically holding the light emitting element 6 and a function of forming a wiring for supplying power to the light emitting element 6. The mounting substrate 1 is configured so that a plurality of (for example, six) light emitting elements 6 can be mounted. The number of the light-emitting elements 6 that can be mounted is not particularly limited, and the mounting substrate 1 may be a plurality other than six, for example.

  The reflector 2 is disposed on one surface side of the mounting substrate 1 so as to surround the mounting region 1 a of the light emitting element 6 on the mounting substrate 1. In other words, in the mounting substrate 1, a region surrounded by the inner peripheral line of the reflector in the plan view constitutes the mounting region 1 a. That is, the mounting area 1 a is defined by the reflector 2.

  The lid 3 covers the reflector 2 on the one surface side of the mounting substrate 1 and is bonded to the mounting substrate 1. As a result, the package 10 can improve the strength against the load from the upper surface side of the lid 3 and can improve the reliability.

  The lid 3 includes a lid main body 31 and a light extraction window member 32 joined so as to close a window hole 31d formed in front of the mounting region 1a in the lid main body 31.

  The mounting substrate 1 includes a metal plate 11, an electric insulating layer 12 a formed on the one surface side of the metal plate 11, and a hole 14 formed in the electric insulating layer 12 a to expose a part of the one surface of the metal plate 11. And a first conductor layer 12b for power feeding formed on the electrical insulating layer 12a, and a submount member 13 disposed inside the hole 14 and joined to the one surface side of the metal plate 11.

  The submount member 13 includes a base material 13a having a higher thermal conductivity than that of the electrical insulating layer 12a and having an electrical insulating property, and a power supply first formed on the surface side of the base material 13a opposite to the metal plate 11 side. Two conductor layers 13b.

  The first conductor layer 12b is formed across the projection area of the lid 3 on the mounting substrate 1 and the outside of the projection area. Two first conductor layers 12b are provided. The first conductor layer 12 b has a first terminal portion 12 ba for internal connection in the projection region of the reflector 2, and has a second terminal portion 12 bb for external connection outside the lid 3. In the mounting substrate 1, one of the two second terminal portions 12bb constitutes an external connection terminal on the high potential side, and the other constitutes an external connection terminal on the low potential side.

  The second conductor layer 13b has a wiring portion 13bb formed across the mounting region 1a and the projection region of the reflector 2 on the mounting substrate 1. Two wiring portions 13bb are provided.

In the mounting substrate 1, the wiring portion 13 bb and the first terminal portion 12 ba arranged adjacent to each other are electrically connected via the wire 17. The mounting substrate 1 includes two wires 17. In the present embodiment, the first conductive layer 12b, the second conductive layer 13b and the wires 17, to form a wiring.

  In the reflector 2, a recess 2 b that houses the wire 17 is formed on the surface facing the mounting substrate 1. As a result, the package 10 can prevent the light emitted from the side surface of the light emitting element 6 from being blocked by the wire 17, and can directly enter the reflector 2 out of the light emitted from the side surface of the light emitting element 6. It is possible to reduce the amount of light that is not. Therefore, the package 10 can improve the light extraction efficiency.

  Hereinafter, each component of the package 10 and the light emitting device will be described in detail.

  As the LED chip constituting the light emitting element 6, an ultraviolet LED chip that emits ultraviolet rays (ultraviolet light) is employed. The ultraviolet LED chip is, for example, an LED chip that employs an AlGaN-based material as a material of the light emitting layer and can emit light in an ultraviolet wavelength region of an emission wavelength of 210 nm to 360 nm.

For example, an ultraviolet LED chip is formed by laminating an AlN layer, an n-type nitride semiconductor layer, a light emitting layer, an electron block layer, a p-type nitride semiconductor layer, and a p-type contact layer on one surface side of a sapphire substrate. An LED chip including a first electrode electrically connected to the physical semiconductor layer and a second electrode electrically connected to the p-type nitride semiconductor layer via the p-type contact layer can be employed. The n-type nitride semiconductor layer is composed of, for example, an n-type Al _x Ga _1-x N (0 <x <1) layer. The light emitting layer has a quantum well structure made of an AlGaN-based material. The quantum well structure includes a barrier layer and a well layer. The quantum well structure may be a multiple quantum well structure or a single quantum well structure. The light emitting layer has an Al composition of the well layer set so as to emit ultraviolet light having a desired light emitting wavelength. In the light emitting layer made of an AlGaN-based material, the light emission wavelength (light emission peak wavelength) can be set to an arbitrary light emission wavelength in the range of 210 to 360 nm by changing the composition of Al. For example, when the desired emission wavelength is around 265 nm, the Al composition may be set to 0.50. In addition, the ultraviolet LED chip has a light emitting layer having a single layer structure, and has a double hetero structure with the light emitting layer and layers on both sides in the thickness direction of the light emitting layer (for example, an n-type nitride semiconductor layer and a p-type nitride semiconductor layer). It may be formed. The structure of the ultraviolet LED chip is not particularly limited.

  The LED chip is not limited to the ultraviolet LED chip, but, for example, a purple LED chip that emits purple light, a blue LED chip that emits blue light, a green LED chip that emits green light, a red LED chip that emits red light, etc. May be. Further, the material of the light emitting layer of the LED chip and the light emission peak wavelength are not particularly limited. In addition, a light emitting device including a plurality of light emitting elements 6 may include a plurality of types of LED chips having different emission peak wavelengths.

  The LED chip has a chip size of 0.39 mm □ (0.39 mm × 0.39 mm). The chip size of the LED chip is not particularly limited, and for example, 0.3 mm □, 0.45 mm □, 1 mm □, etc. can be used. Further, the outer peripheral shape of the LED chip is not limited to a square shape, and may be, for example, a rectangular shape or a regular hexagonal shape.

  The LED chip has a thickness of about 0.16 mm, but is not particularly limited.

In the light emitting element 6, each of the first electrode and the second electrode is disposed on the same surface side, and can be electrically connected to the second conductor layer 13 b via the bump 7. The second conductor layer 13b is patterned so that a portion to which the first electrode is connected and a portion to which the second electrode is connected are electrically insulated. When the light-emitting element 6 takes out light from the one surface side in a configuration in which the first electrode and the second electrode are arranged on one surface side in the thickness direction, each of the first electrode and the second electrode is connected to the first electrode through the wire. You may make it electrically connect with the 2 conductor layer 13b.

The light emitting element 6 is not limited to the LED chip in which the first electrode and the second electrode are provided on one surface side in the thickness direction. For example, the first electrode is provided on one surface side in the thickness direction and the second electrode is provided on the other surface side. The LED chip provided with may be used. In this case, one of the first electrode and the second electrode is die-bonded to the second conductive layer 13b via the conductive bonding material and the other to connect the second to conductive layer 13b and electrically via a wire You can do it.

  As described above, the light-emitting element 6 is not limited to the LED chip, and a semiconductor laser chip can also be employed.

  The outer peripheral shape of the metal plate 11 of the mounting substrate 1 is a rectangular shape. The outer peripheral shape of the metal plate 11 is not limited to a rectangular shape, and may be, for example, a circular shape or a polygonal shape other than a rectangular shape.

  As a material of the metal plate 11, a metal having high thermal conductivity is preferable. For this reason, copper is adopted as the material of the metal plate 11. The material of the metal plate 11 is not limited to copper, and for example, aluminum, aluminum alloy, silver, phosphor bronze, copper alloy (for example, 42 alloy), nickel alloy, or the like can be employed. The metal plate 11 may be provided with a surface treatment layer (not shown) on the surface of a base material made of the above-described material. Examples of the surface treatment layer include an Au film, an Al film, an Ag film, a laminated film of an Ni film, a Pd film, and an Au film, a laminated film of an Ni film, an Au film, an Ag film, a Pd film, and an AuAg alloy film. A laminated film or the like can be employed. The surface treatment layer is preferably composed of a plating layer or the like. In short, the surface treatment layer is preferably formed by a plating method.

  The electrical insulating layer 12 a is formed on the one surface of the metal plate 11, and a hole 14 that exposes the central portion of the one surface of the metal plate 11 is formed. The opening shape of the hole 14 is rectangular. The opening shape of the hole 14 is preferably similar to the outer peripheral shape of the submount member 13. The opening shape of the hole 14 is not particularly limited, and may be appropriately designed based on the outer peripheral shape of the submount member 13. It is preferable that an alignment mark (not shown) for increasing the positioning accuracy of the submount member 13 is formed on the one surface of the metal plate 11.

  As a material of the first conductor layer 12b, for example, copper, phosphor bronze, copper alloy (for example, 42 alloy), nickel alloy, aluminum, aluminum alloy, or the like can be employed. The first conductor layer 12b can be formed using, for example, a metal foil, a metal film, or the like. The first conductor layer 12b preferably has a laminated structure of a Cu layer, a Ni layer, and an Au layer, and the outermost surface side is preferably an Au layer. In addition, each 1st conductor layer 12b is formed in the outer periphery shape a little smaller than the half of the outer periphery shape of the electric insulation layer 12a.

  The electrical insulating layer 12a and the first conductor layer 12b can be formed using, for example, a printed wiring board. The electrical insulating layer 12a can be constituted by an insulating base material of a printed wiring board and a fixing sheet for fixing the insulating base material and the metal plate 11 to each other. As an insulating base material, a polyimide film, a paper phenol board | substrate, a glass epoxy board | substrate etc. are employable, for example. As the fixing sheet, for example, a polyolefin-based fixing sheet can be employed.

  The mounting substrate 1 may be formed by using a metal-based printed wiring board with the metal plate 11, the electrical insulating layer 12a, and the first conductor layer 12b. In this case, the metal plate 11, the electrical insulating layer 12a, and the first conductor layer 12b of the mounting substrate 1 can be formed of the metal plate, the insulating layer, and the copper foil of the metal base printed wiring board.

The mounting substrate 1 is laminated with a protective layer 16 that covers a portion of the first conductor layer 12b and the electrical insulating layer 12a where the first conductor layer 12b is not formed. As the protective layer 16, for example, a white resist layer can be employed. As a material of the resist layer, for example, a white resist made of a resin containing a white pigment such as barium sulfate (BaSO ₄ ) or titanium dioxide (TiO ₂ ) (for example, a silicone resin) can be used. As the white resist, for example, a white resist material “ASA COLOR RESIST INK” made by Asahi Rubber Co., Ltd. can be used. The white resist layer can be formed by, for example, a coating method.

  In the package 10, since the protective layer 16 is made of a white resist layer, light incident on the mounting substrate 1 from the light emitting element 6 is easily reflected on the surface of the protective layer 16. As a result, the package 10 can suppress the light emitted from the light emitting element 6 from being absorbed by the mounting substrate 1, and can improve the light output by improving the light extraction efficiency to the outside. It becomes.

  The protective layer 16 has a first hole portion 16a that exposes the first terminal portion 12ba of the first conductor layer 12b in the vicinity of the hole 14 of the electric insulating layer 12a, and is formed around the electric insulating layer 12a. A second opening portion 16b is formed to expose the second terminal portion 12bb of the first conductor layer 12b. The opening shape of the first opening 16a is rectangular. The opening shape of the first opening 16a is not limited to a rectangular shape, and may be, for example, a circular shape. The opening shape of the second opening portion 16b is rectangular. The opening shape of the second opening portion 16b is not limited to a rectangular shape, and may be a circular shape, for example.

  In the light emitting device, the light emitting element 6 is mounted on the metal plate 11 via the submount member 13. As a result, in the light emitting device, a heat transfer path for transferring heat to the submount member 13 and the metal plate 11 is formed as the heat transfer path of the heat generated in the light emitting element 6 without passing through the electrical insulating layer 12a. Therefore, the package 10 and the light emitting device can improve heat dissipation.

  The base material 13a of the submount member 13 is formed in a plate shape. The base material 13a has a rectangular shape in plan view, but is not limited thereto, and may be, for example, a circular shape or a polygonal shape other than a rectangular shape. The planar size of the submount member 13 is set larger than the size in which a plurality of light emitting elements 6 can be arranged and the plurality of light emitting elements 6 are combined. The planar size of the submount member 13 is 4.3 mm × 3 mm, but is an example and is not particularly limited. As the material of the base material 13 a, a material having high thermal conductivity and a linear expansion coefficient that is between the linear expansion coefficient of the metal plate 11 and the linear expansion coefficient of the light emitting element 6 is preferable. As a result, the light emitting device can suppress the occurrence of cracking due to thermal stress at the joint portion (bump 7 in the example of FIG. 1) between the light emitting element 6 and the submount member 13. As the material of the base material 13a, AlN is adopted.

  The second conductor layer 13b of the submount member 13 is patterned so that a plurality of light emitting elements 6 can be connected in series. The second conductor layer 13b is patterned so that a plurality of light-emitting elements 6 can be arranged on the circumference of one virtual circle at substantially equal intervals. The pattern of the second conductor layer 13b is not particularly limited.

  The second conductor layer 13b may be configured so that a plurality of light emitting elements 6 can be connected in parallel, or may be configured so that series-parallel connection is possible. In short, the light emitting device may have a configuration in which a plurality of light emitting elements 6 are connected in series, a structure in which a plurality of light emitting elements 6 are connected in parallel, or a plurality of light emitting elements 6. You may have the structure by which the light emitting element 6 was connected in series and parallel.

  The submount member 13 is joined to the metal plate 11 via the joint portion 15. As a material of the joining part 15, for example, lead-free solder such as AuSn or SnAgCu is preferable. Here, when AuSn is adopted as the material of the joint portion 15, a pretreatment for forming a metal layer made of Au or Ag in advance on the joint surface of the one surface of the metal plate 11 is necessary. The joint 15 may be formed from a conductive paste. As the conductive paste, for example, a silver paste, a gold paste, a copper paste, or the like can be employed.

  The thickness dimension of the submount member 13 is set so that the surface of the second conductor layer 13 b is farther from the metal plate 11 than the surface of the protective layer 16. Thus, the package 10 can suppress the light emitted from the light emitting element 6 to the side from being absorbed by the electrical insulating layer 12a through the inner peripheral surface of the hole 14 of the electrical insulating layer 12a.

  Although the thickness dimension of the submount member 13 is set to about 0.3 mm, it is not particularly limited. However, since the thermal resistance in the thickness direction increases as the thickness dimension of the submount member 13 increases, the package 10 is preferably set so as not to be too large.

  As the material of the second conductor layer 13b, for example, Au, Ag or the like can be employed. In the light emitting device, when the light emitting element 6 is electrically connected via the bump 7, the material of the second conductor layer 13 b is preferably the same as the material of the bump 7. When the material of the bump 7 is Au, the material of the second conductor layer 13b is also preferably Au. However, the second conductor layer 13b is not limited to a single layer film, and may be a multilayer film. In this case, it is preferable that the outermost layer is formed of the same material as that of the bump 7.

  The material of the base material 13a is not limited to AlN, and for example, Si, CuW, composite SiC, or the like may be employed. When Si, CuW, or the like that is not an insulator is adopted as the material of the base material 13a, an insulating film is provided on the surface of the base material made of the material of the base material 13a, and the second conductor layer 13b is patterned on the insulating film. do it.

  The submount member 13 may form a reflection film that reflects the light emitted from the light emitting element 6 in a region where the second conductor layer 13b is not formed on the surface of the base material 13a. Thereby, the submount member 13 can further suppress the light emitted from the side surface of the light emitting element 6 from being absorbed by the submount member 13, and can improve the light extraction efficiency to the outside. It becomes possible. Here, the reflective film in the submount member 13 can be composed of, for example, a laminated film of a Ni film and an Al film. The material of the reflective film may be appropriately selected according to the emission peak wavelength of the light emitting element 6.

  The submount member 13 may include an insulating layer made of an electrically insulating material in a region where the reflector 2 may come into contact. Thereby, when the reflector 2 is formed of metal or the like, the second conductor layer 13b and the reflector 2 can be electrically insulated. As the electrically insulating material of the insulating layer, for example, silicon oxide can be employed.

  In the light emitting device, when the light emitting element 6 is an LED chip having a first electrode on one side in the thickness direction and a second electrode on the other side, the light emitting element 6 and the submount member 13 are, for example, SnPb, AuSn, SnAgCu. Bonding can be performed using solder such as silver or conductive paste such as silver paste. The light emitting element 6 and the second conductor layer 13b of the submount member 13 are preferably joined using a lead-free solder such as AuSn or SnAgCu. In this case, the second conductor layer 13b is preferably composed of a metal layer such as an Au layer or an Ag layer. The second conductor layer 13b may be formed using, for example, a vapor deposition method, a sputtering method, a CVD (Chemical Vapor Deposition) method, or the like.

  In the light emitting device, for example, when the light emitting element 6 is an LED chip having a first electrode on one surface side in the thickness direction and a second electrode on the other surface side, the submount member 13 is a line between the light emitting element 6 and the metal plate 11. It has a function of relieving stress acting on the light emitting element 6 due to the difference in expansion coefficient. The submount member 13 has not only a function of relieving the stress but also a heat conduction function of transferring heat generated in the light emitting element 6 to a range wider than the chip size of the light emitting element 6 in the metal plate 11. Therefore, the light emitting device can efficiently dissipate the heat generated in the light emitting element 6 through the submount member 13 and the metal plate 11.

As the wire 17, for example, an Au wire is employed. The wire 17 is not limited to the Au wire but may be an Al wire. As the Au wire, for example, a thin wire having a wire diameter of about 18 μm to 25 μm can be used. As the Al wire, for example, a thin wire having a wire diameter of 25 μm to 200 μm can be adopted. When an Al wire is used as the wire 17, a larger current can flow than when an Au wire is used. The depth dimension of the recess 2b is set so that the wire 17 does not contact. Thereby, it can suppress that the wire 17 touches the reflector 2, and it becomes possible to electrically insulate the wire 17 and the reflector 2 from being disconnected. Here, when the Al wire is used as the wire 17, the height of the wire 17 is higher than when the Au wire is used, so the depth dimension of the recess 2 b of the reflector 2 is set larger. There is a need to. For example, when the wire 17 is an Au wire, the package 10 may have a depth of the recess 2b of about 0.2 mm, for example, but when the wire 17 is an Al wire, the depth of the recess 2b is 1 mm. Is preferable. Note that the wire 17 is not limited to an Au wire or an Al wire, but may be an Al—Si wire, a Cu wire, or the like.

The package 10 is provided with a hole 19 penetrating in the thickness direction of the mounting board 1 in the mounting board 1 so that the package 10 can be attached to another member such as a circuit board. The opening shape of the hole 19 is circular. In the package 10, the mounting substrate 1 has a rectangular shape in plan view, and a second terminal portion 12 bb is provided in the vicinity of each of two opposing corners of the four corners of the mounting substrate 1. A hole 19 is provided in the vicinity of each of the two corners. Thereby, the package 10 can also be attached to another member such as a circuit board by a screw or the like. As the screw, a screw whose outer diameter is larger than the inner diameter of the hole 19 and whose outer diameter is smaller than the inner diameter of the hole 19 may be used. As the screw, a metal screw, a resin screw, or the like can be used.

Since the package 10 has the two second terminal portions 12bb and the two holes 19 laid out as described above, the stress applied to the joint between the second terminal portion 12bb and the electric wire, the stress applied due to the screw, etc. It is possible to suppress the occurrence of warpage or the like in the mounting substrate 1 due to the above.

  The reflector 2 is formed in a frame shape in which the opening area gradually increases as the distance from the mounting substrate 1 increases. The reflector 2 has a function of reflecting light emitted from the light emitting element 6 toward the window member 32.

  As the material of the reflector 2, aluminum is adopted. In forming the reflector 2, for example, a plate of pure aluminum (for example, A1003 series) is punched and subjected to press molding processing simultaneously or sequentially, and then the burr is removed and the surface roughness is reduced and the reflectance is increased. Electropolishing for this purpose may be performed. The reflectance of the reflecting surface 2a formed from the inner surface of the reflector 2 is, for example, about 97% for 265 nm ultraviolet rays. The thickness of the pure aluminum plate is set to about 0.6 mm, but is not particularly limited. The angle formed between the surface of the reflector 2 on the mounting substrate 1 side and the reflecting surface of the reflector 2 is set to 55 °, but is only an example and is not particularly limited. The method for forming the reflector 2 is not particularly limited. The material of the reflector 2 is not limited to aluminum, but may be resin (for example, PBT) or the like. In this case, it is preferable to provide a reflective film made of metal such as aluminum on the inner surface of the frame-shaped resin molded product. .

  The recess 2b of the reflector 2 is preferably separated from both the outer peripheral end and the inner peripheral end on the surface of the reflector 2 on the mounting substrate 1 side. That is, the recess 2b of the reflector 2 is formed avoiding the outer peripheral portion and the inner peripheral portion on the surface of the reflector 2 on the mounting substrate 1 side. Thereby, the reflector 2 can improve rigidity and load resistance. Therefore, the package 10 can further improve the load resistance. The recess 2 b is formed over the entire circumference of the reflector 2. Thereby, the package 10 can improve the assemblability. One recess 2 b may be provided for each wire 17.

  The reflector 2 is in contact with the mounting substrate 1 without being joined in the region overlapping the submount member 13, and is joined to the mounting substrate 1 in the region overlapping the electrical insulating layer 12a. That is, the reflector 2 is not bonded to the mounting substrate 1 at the inner peripheral portion of the surface on the mounting substrate 1 side, but is bonded to the mounting substrate 1 at the outer peripheral portion. Thereby, the package 10 can suppress the occurrence of thermal stress between the reflector 2 and the submount member 13. The reflector 2 and the mounting substrate 1 are bonded via the bonding portion 4. The joint 4 is located where the light from the light emitting element 6 does not reach directly. For this reason, as a material of the junction part 4, an epoxy resin etc. are employable, for example.

  In the reflector 2, an electrical insulating layer 5 is formed at least in a region where the recess 2 b is not formed in a region overlapping the submount member 13. The electrical insulating layer 5 can employ a silicone-based coating film, an aluminum oxide film, or the like.

  The reflector 2 has a convex portion 2d on the surface opposite to the mounting substrate 1 side. The convex portion 2d has a function of surrounding the window member 32 and positioning the window member 32. Thereby, the package 10 can position the window member 32. Although the protrusion dimension of the convex part 2d is set to 0.2 mm, it is not specifically limited.

  The convex portion 2d is formed in an annular shape, and it is preferable that the opening area gradually increases as the distance from the mounting substrate 1 increases. Thereby, the package 10 can position the window member 32 more easily and with high accuracy. The convex portion 2d is not limited to an annular shape, and a plurality of convex portions 2d may be provided apart from each other in the outer peripheral direction of the window member 32 so as to surround the window member 32.

  The lid body 31 of the lid 3 is made of metal. As the metal that is the material of the lid body 31, stainless steel is adopted. Thereby, when the package 10 accommodates an ultraviolet LED chip as the light emitting element 6, it is possible to suppress deterioration with time due to ultraviolet light from the light emitting element 6. Moreover, the lid body 31 can be made of stainless steel, thereby improving heat dissipation, productivity, corrosion resistance, and the like. In forming the lid body 31, for example, the lid body 31 may be formed by processing a stainless steel plate by press molding. The thickness of the stainless steel plate is set to about 0.2 mm, but is not particularly limited.

  The metal that is the material of the lid main body 31 is not limited to stainless steel, and for example, Kovar or the like can also be employed. Kovar is an alloy containing iron and nickel. An example of the component ratio of Kovar is, by weight, iron: 53.5% by weight, nickel: 29% by weight, cobalt: 17% by weight, silicon: 0.2% by weight, manganese: 0.3% by weight. . The component ratio of Kovar is not particularly limited. When the metal is Kovar, the lid main body 31 may be one in which an oxide film is formed by oxidizing the surface of a base made of this metal.

  The lid body 31 is far from the mounting body 1 in the cylindrical body 31a, the first flange 31b projecting outward from the first end that is the end of the cylindrical body 31a closer to the mounting board 1, and the cylindrical body 31a. And a second flange 31c protruding inward from a second end which is a side end. In the lid main body 31, the inner peripheral surface of the second flange 31c is the inner peripheral surface of the window hole 31d.

  The cylinder 31a has a cylindrical shape. Although the outer diameter of the cylinder 31a is set to 8 mm, it is not limited to this value. The cylindrical body 31a is not limited to a cylindrical shape, and may be a cylindrical shape, for example, a rectangular cylindrical shape. The outer peripheral shape of the first flange 31b is circular. The outer peripheral shape of the first flange 31b is not limited to a circular shape, and may be, for example, an elliptical shape or a polygonal shape.

The inner peripheral shape of the second flange 31c is a circular shape. Therefore, the window hole 31d is a circular hole. The inner diameter of the window hole 31d is set to 3 mm, but is not limited to this value. The inner peripheral shape of the second flange 31 c is not limited to a circular shape, for example, it may be an elliptical shape or a polygonal shape.

  The window material 32 is disposed in the lid main body 31. The window member 32 is preferably joined to the second flange 31 c inside the lid body 31. The window member 32 is preferably welded to the second flange 31c so as to close the window hole 31d surrounded by the second flange 31c. The window member 32 and the lid main body 31 may be joined by a separate joining material.

  The window material 32 preferably has a transmittance with respect to light having a wavelength to be transmitted of 70% or more, and more preferably 80% or more. When an ultraviolet LED chip is assumed as the light emitting element 6, it is preferable to employ borosilicate glass having a transmittance of 80% or more for the ultraviolet rays emitted from the light emitting element 6 as the material of the window member 32. As such borosilicate glass, for example, 8337B manufactured by SCHOTT can be adopted.

  Thereby, the light-emitting device provided with the ultraviolet LED chip as the light-emitting element 6 can make the transmittance of the window material 32 with respect to the ultraviolet light that is the light emitted from the light-emitting element 6 80% or more.

  The lid 3 preferably has a smaller difference in linear expansion coefficient between the metal that is the material of the lid body 31 and the borosilicate glass that is the material of the window material 32. Thereby, the lid 3 can reduce the stress generated near the boundary between the window material 32 and the lid body 31 and the window material 32 due to the difference in the linear expansion coefficient between the window material 32 and the lid body 31. Become.

  When the light emitting element 6 is an LED chip or a semiconductor laser chip that emits visible light, the material of the window material 32 is not limited to borosilicate glass, but other glass, silicone resin, acrylic resin, glass, organic components, and inorganic An organic / inorganic hybrid material in which components are mixed and bonded at the nm level or molecular level may be used.

  Further, the window material 32 may contain a wavelength conversion material such as a phosphor that converts the wavelength of light from the light emitting element 6.

  The first flange 31 b of the lid 3 is bonded to the mounting substrate 1 via the bonding portion 4. As a material of the joint portion 4, for example, an epoxy resin or the like can be employed. In the package 10, since the lid body 31 of the lid 3 includes the first flange 31b, it is possible to widen the sealing allowance and improve the airtightness. The joint 4 is located where the light from the light emitting element 6 does not reach directly. For this reason, as a material of the junction part 4, an epoxy resin etc. are employable, for example. Therefore, when the lid body 31 is made of stainless steel, the package 10 can further increase the adhesive force between the lid body 31 and the joint portion 4.

  The window member 32 is a lens, and includes an aspheric lens portion 32a and a base portion 32b protruding outward from the outer peripheral portion of the aspheric lens portion 32a. The aspheric lens portion 32a is formed in a plano-convex aspheric lens shape. In the present embodiment, the aspheric lens part 32a constitutes a lens part.

  The base portion 32b is formed in an annular shape. The base portion 32b preferably has a uniform thickness dimension. The aspheric lens portion 32a includes a first lens surface 32aa and a second lens surface 32ab. In the aspherical lens portion 32 a, the first lens surface 32 aa is located inside the lid body 31, and the second lens surface 32 ab is located outside the lid body 31. The first lens surface 32aa is an aspheric first convex curved surface. The second lens surface 32ab is an aspherical second convex curved surface. The curvatures of the first convex curved surface and the second convex curved surface change continuously. Although the first lens surface 32aa and the second lens surface 32ab have different shapes, the shape is not limited to this and may be the same.

  As for the window material 32 which comprises a lens, the aspherical lens part 32a is arrange | positioned in the window hole 31d, and the base part 32b is joined to the 2nd flange 31c. Here, it is preferable that the base part 32b is joined over the entire circumference of one surface in the thickness direction of the second flange 31c. The base portion 32b preferably has a larger width dimension in the direction along the radial direction of the aspheric lens portion 32a. In short, it is preferable that the lid 3 has substantially the same width dimension of the base portion 32b and the width dimension of the second flange 31c. Thereby, the lid | cover 3 becomes possible [improving joining reliability and airtightness]. Here, the airtightness of the lid 3 means the airtightness of the joint portion between the lid main body 31 and the window member 32.

  Therefore, the package 10 can improve hermeticity and can have a long life.

The package 10 does not join the window member 32 and the second flange 31c, and instead of the ring-shaped packing 8 between the second flange 31c of the lid 3 and the reflector 2, as in Modification 1 shown in FIG. and the base portion 32 b of the window material 32 may be configured sandwiched by superimposed. Thereby, the package 10 can ensure airtightness without joining the window material 32 and the second flange 31c. As a material for the packing 8, it is preferable to employ a fluorine-based resin or the like. Thereby, the package 10 can suppress the deterioration of the packing 8 due to the ultraviolet rays from the light emitting element 6 when the light emitting element 6 is an ultraviolet LED chip. As the fluororesin, for example, Teflon (registered trademark) can be adopted.

  The shape of the window material 32 constituting the lens is not particularly limited. For example, the window material 32 in the package 10 is not limited to the aspherical lens portion 32a formed in a biconvex aspherical lens shape. For example, as shown in FIGS. 5 and 6, the window member 32 in the package 10 may have an aspheric lens portion 32 a formed into a plano-convex aspheric lens shape. In the package 10 of the second modification shown in FIG. 5, the first lens surface 32aa is an aspherical convex curved surface, and the second lens surface 32ab is a flat surface. In the package 10 of the third modified example shown in FIG. 6, the first lens surface 32aa is a flat surface, and the second lens surface 32ab is an aspheric convex curved surface.

  Further, the number of the light emitting elements 6 to be mounted on the mounting substrate 1 is not limited to a plurality, and the package 10 may be one as in Modification 4 shown in FIG. When the number of the light emitting elements 6 housed in the package 10 is one, the second conductor layer 13b of the submount member 13 only needs to be patterned so that power can be supplied to the light emitting elements 6.

  A configuration in which the ring-shaped packing 8 and the base portion 32b of the window member 32 are overlapped and sandwiched between the second flange 31c of the lid 3 and the reflector 2 as in Modification 1 shown in FIG. The case of the window material 32 like 2-4, and when the window material 32 is flat form are also employable.

DESCRIPTION OF SYMBOLS 1 Mounting board | substrate 1a Mounting area | region 2 Reflector 2b Recessed part 2d Convex part 3 Lid 6 Light emitting element 10 Light emitting element package 11 Metal plate 12a Electrical insulation layer 12b First conductor layer 12ba First terminal part 12bb Second terminal part 13 Submount member 13a base material 13b second conductor layer 13bb wiring part 14 hole 17 wire 31 lid body 31a cylindrical body 31b first flange 31c second flange 32 window material (lens)
32a Aspherical lens part (lens part)
32b Base part

Claims (8)

A mounting board on which the light emitting element is mounted; a reflector disposed on one surface side of the mounting board so as to surround the mounting region of the light emitting element; and the reflector covering the reflector on the one surface side of the mounting board. A lid bonded to the mounting substrate,
The lid includes a lid body and a light extraction window member joined to the lid body so as to close a window hole formed in front of the mounting region in the lid body.
The mounting board includes a metal plate, an electric insulating layer formed on the one surface side of the metal plate, a hole formed in the electric insulating layer and exposing a part of the one surface of the metal plate, A power supply first conductor layer formed on the electrical insulating layer, and a submount member disposed inside the hole and joined to the one surface side of the metal plate,
The submount member has a base material having a higher thermal conductivity than the electric insulating layer and an electric insulating property, and a second power supply formed on the surface side of the base material opposite to the metal plate side. A conductor layer,
The first conductor layer is formed across the projection area of the lid and the outside of the projection area on the mounting substrate, and has a first terminal portion for internal connection in the projection area of the reflector. A second terminal portion for external connection on the outside of the lid;
The second conductor layer has a wiring portion formed across the mounting region and a projection region of the reflector in the mounting substrate,
The wiring portion and the first terminal portion are electrically connected via a wire,
The reflector is formed with a recess for housing the wire on the surface facing the mounting substrate .
The reflector, the light emitting wherein in a region overlapping the sub-mount member in contact without being bonded to the mounting board, characterized that you have been joined via a joint to the mounting board in the area overlapping the electrically insulating layer Device package.   2. The light emitting device package according to claim 1, wherein the recess is separated from both an outer peripheral end and an inner peripheral end of the surface of the reflector on the mounting substrate side. The light emitting device package according to claim 1, wherein the recess is a space.   The said window material is a lens, and the said reflector has the convex part which surrounds the said lens and positions the said lens on the surface opposite to the said mounting substrate side. 2. A package for a light-emitting element according to item 1.   The light emitting element package according to claim 4, wherein the convex portion has an annular shape, and an opening area gradually increases with distance from the mounting substrate.   The lid body includes a cylinder, a first flange projecting outward from a first end that is an end of the cylinder close to the mounting board, and a side of the cylinder that is far from the mounting board. A second flange projecting inward from a second end that is an end, an inner peripheral surface of the second flange is an inner peripheral surface of the window hole, and the lens includes a lens portion, the lens And a base portion protruding outward from the outer periphery of the portion, the lens portion is disposed in the window hole, and the base portion is joined to the second flange. The light emitting element package according to claim 4 or 5. The light emitting device package according to any one of claims 1 to 6, wherein the light emitting device can emit light in an ultraviolet wavelength region having a light emission wavelength of 210 nm to 360 nm. A light emitting device comprising: the light emitting element package according to claim 1; and the light emitting element mounted on the mounting substrate in the light emitting element package.

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