TWI710147B - Light emitting diode assembly structure - Google Patents

Abstract

A light emitting diode assembly structure includes a light emitting chip, a color converting layer, a light guiding member, and a reflecting member. The color converting layer coats the light emitting chip. The light guiding member is arranged over the light emitting chip. The reflecting member is arranged over the light guiding member. The light emitting chip is used to emit a light, and the light guiding member is used to adjust the irradiation angle of the light emitted from the light emitting chip. The reflecting member is a planar or non-planar structure. The reflecting member is faced towards the light emitting chip and is arranged over the light guiding member. And the light emitted from the light emitting chip changes the irradiation range of the light through the reflection surface structure of the reflection member. A package structure of another light emitting diode also is provided, wherein the light guiding ring and the reflection member are arranged around the light emitting chip so that the light emitted from the light emitting chip can be concentrated to irradiate toward the outside of the assembly structure.

Description

Packaging structure of light emitting diode

The invention relates to a packaging structure of a light emitting diode.

Technology is changing with each passing day, and many new technology products are being introduced one after another. At present, you can see the application of various light-emitting diode products in life, such as traffic signs, automobile lights, street lights, indicator lights, or flashlights. In addition to the necessary light-emitting chip manufacturing process, these light-emitting diode products usually also need to go through a packaging process.

The packaging structure of the light emitting diode is mainly used to improve the power supply of the light emitting chip and to improve the related problems of the light emitting mode. When the light-emitting chip assembly is exposed to the atmosphere for a long time, it will be affected by moisture or other chemical substances in the environment and deteriorate, thereby causing the characteristics of the light-emitting diode to decline. Currently, high-transparency epoxy resin is used to coat the light-emitting chip, which can effectively isolate the atmosphere. Therefore, the selection of a suitable packaging substrate can provide better protection for the light-emitting chip element, and greatly increase the service life of the light-emitting diode element. However, the use of high-transparency epoxy resin to cover the light-emitting chip, the irradiation range of the light emitted by the light-emitting chip is limited, and the light extraction efficiency is low.

In addition, optical design is also an important part of the packaging process. At present, the research focus is on how to effectively extract the light emitted by the light-emitting chip, so that the light emitted by the light-emitting diode chip can be optimized in use. At present, after the traditional light-emitting diode packaging is completed, a secondary optical lens is selected, which can adjust the appropriate light-emitting angle. However, the use of secondary optical transmission The mirror is not easy to assemble, is aligned, and the cost is relatively high.

In order to solve the above-mentioned problems, the present invention provides a light-emitting diode package structure with simple assembly and high luminous efficiency. The packaging structure of the light-emitting diode is designed by applying an optical structure, so that it can control the angle of the light emitted by the light-emitting diode, so as to replace the high-cost secondary optical lens.

A light-emitting diode packaging structure includes a light-emitting chip, a color conversion layer, a light guide member and a reflective member. The color conversion layer covers the light-emitting chip. The light guide member is arranged above the light-emitting chip. The reflecting member is arranged above the light guide member. The reflecting member includes a first reflecting surface facing the light-emitting chip, and the first reflecting surface is a flat surface, a concave surface, a convex surface, a parabolic surface, a polyline segment surface or a curved surface.

In an embodiment, the color conversion layer is disposed between the light-emitting chip and the light guide.

In an embodiment, the light guide member covers the color conversion layer or is disposed above the color conversion layer.

In an embodiment, the color conversion layer is disposed between the light guide member and the reflective member.

In an embodiment, the color conversion layer covers the light guide and the light-emitting chip.

In an embodiment, the color conversion layer covers the light guide, and the light guide covers the light-emitting chip.

In one embodiment, the light emitting diode package structure further includes a substrate, the substrate includes a second emitting surface facing the first reflective surface of the reflector, and the light emitting chip is disposed on the substrate On the second reflective surface.

In an embodiment, the light guide includes silicone resin and additional materials. The additional material is 5%-15% of the weight of the silicone resin. The additional material is selected from one or a combination of organic diffusion particles and inorganic diffusion particles.

In one embodiment, the refractive index of the silicone resin is 1.4-1.6. The refractive index of the additional material is 1.5-1.8.

In one embodiment, the organic diffusion particles include organosilicon compounds and acrylic compounds. The inorganic diffusion particles include silicon dioxide or calcium carbonate compounds.

The present invention also provides another light-emitting diode package structure, which includes a light-emitting chip, a color conversion layer, a light guide, and a reflective member. The color conversion layer covers the light-emitting chip. The reflector is arranged around the side of the color conversion layer. The light guide member covers the color conversion layer and the surroundings of the reflective member. The inner surface of the reflector opposite to the light-emitting chip is a reflective surface. The reflective surface is a symmetrical or asymmetrical surface.

In an embodiment, the reflective surface is a flat surface, a parabolic surface, a polyline segment surface or a curved surface.

In an embodiment, the light guide member includes a light emitting surface opposite to the light emitting chip. The light emitting surface is a continuous structure surface or a discontinuous structure surface. The continuous structure surface and the discontinuous structure surface are a circular arc surface, a circular arc cylinder surface and a V-shaped groove surface.

In an embodiment, the light guide includes silicone resin and additional materials. The additional material is 5%-15% of the weight of the silicone resin. The additional material is selected from one or a combination of organic diffusion particles and inorganic diffusion particles.

In one embodiment, the refractive index of the silicone resin is 1.4-1.6. The refractive index of the additional material is 1.5-1.8.

In one embodiment, the organic diffusion particles include organosilicon compounds and acrylic compounds. The inorganic diffusion particles include silicon dioxide or calcium carbonate compounds.

The present invention also provides a light-emitting diode packaging structure, which includes a light-emitting chip, A color conversion layer, a light guide part, and a reflection part. The color conversion layer covers the light-emitting chip. The light guide member is arranged above the light-emitting chip. The reflecting member is arranged above the light guide member. The reflecting member includes a first reflecting surface facing the light-emitting chip, and the first reflecting surface is a flat surface, a concave surface, a convex surface, a parabolic surface, a polyline segment surface or a curved surface. The reflector is provided with a groove directly above the light-emitting chip, and the groove penetrates from the upper surface of the reflector to the lower surface of the reflector.

In one embodiment, the grooves are distributed symmetrically.

In one embodiment, the groove is a cross-shaped groove or a round groove.

In an embodiment, the width of the groove ranges from 0.05 mm to 0.3 mm.

In one embodiment, the groove includes an upper end far from the light guide and a lower end close to the light guide, and the width of the upper end is greater than or equal to the width of the lower end.

In an embodiment, the light guide includes silicone resin and additional materials. The additional material is 5%-15% of the weight of the silicone resin. The additional material is selected from one or a combination of organic diffusion particles and inorganic diffusion particles.

In one embodiment, the refractive index of the silicone resin is 1.4-1.6. The refractive index of the additional material is 1.5-1.8.

In one embodiment, the organic diffusion particles include organosilicon compounds and acrylic compounds. The inorganic diffusion particles include silicon dioxide or calcium carbonate compounds.

The present invention also provides another light-emitting diode packaging structure, which includes a light-emitting chip, a color conversion layer, a light guide, and a reflective member. The color conversion layer covers the light-emitting chip. The light guide member is arranged above the light-emitting chip. The reflecting member is arranged above the light guide member. The reflecting member includes a first reflecting surface facing the light-emitting chip, and the first reflecting surface is a flat surface, a concave surface, a convex surface, a parabolic surface, a polyline segment surface or a curved surface. Of the light-emitting diode The packaging structure is provided with a groove directly above the light-emitting chip, and the groove penetrates from the upper surface of the reflecting member to a predetermined position between the upper surface and the lower surface of the light guide member.

In one embodiment, the grooves are distributed symmetrically.

In one embodiment, the groove is a cross-shaped groove or a round groove.

In an embodiment, the width of the groove ranges from 0.05 mm to 0.3 mm.

In an embodiment, the groove includes an upper end portion away from the color conversion layer and a lower end portion close to the color conversion layer, and the width of the upper end portion is greater than or equal to the width of the lower end portion.

In an embodiment, the light guide includes silicone resin and additional materials. The additional material is 5%-15% of the weight of the silicone resin. The additional material is selected from one or a combination of organic diffusion particles and inorganic diffusion particles.

In one embodiment, the refractive index of the silicone resin is 1.4-1.6. The refractive index of the additional material is 1.5-1.8.

In one embodiment, the organic diffusion particles include organosilicon compounds and acrylic compounds. The inorganic diffusion particles include silicon dioxide or calcium carbonate compounds.

Compared with the prior art, the encapsulation structure of the light-emitting diode of the present invention is able to control the angle of light emitted by the light-emitting diode through the structural design of the light guide and the reflector, and replace the existing high-cost Secondary optical lens. Therefore, the packaging structure of the light-emitting diode of the present invention is not only easy to assemble, high luminous efficiency, but also low in production cost, which is suitable for industrial production.

1,2,3: Package structure of light-emitting diode

10, 10A: package body

20, 20A: Light-emitting chip

21, 31, 41, 51: upper surface

30, 30A: color conversion layer

40, 40A: light guide

42, 52: lower surface

401A: Glossy surface

50, 50A: reflector

503: reflection area

51A: Front panel

52A: Rear panel

53A: The first side panel

54A: second side panel

55A: Top part

56A: bottom end

α, γ: included angle

β: bottom angle

100, 100A: light

60: substrate

70: groove

701: side wall

702: upper end

703: lower end

The present invention will be better understood from the following description with accompanying drawings, in which:

FIG. 1A is a schematic diagram of the packaging structure of a light-emitting diode in the first embodiment of the present invention, wherein the packaging structure of the light-emitting diode includes a reflective member and a light guide member.

FIG. 1B is a schematic diagram of the light path of the package structure of the light emitting diode in the first embodiment of the present invention.

Fig. 2A is a schematic diagram of a first implementation of the reflector in the first embodiment of the present invention.

Fig. 2B is a schematic diagram of a second embodiment of the reflector in the first embodiment of the present invention.

Fig. 2C is a schematic diagram of a third embodiment of the reflector in the first embodiment of the present invention.

Fig. 2D is a schematic diagram of a fourth embodiment of the reflector in the first embodiment of the present invention.

FIG. 3 is a schematic diagram of the packaging structure of the light emitting diode in the second embodiment of the present invention.

4 is a schematic diagram of the packaging structure of the light emitting diode in the third embodiment of the present invention.

FIG. 5 is a schematic diagram of the packaging structure of the light emitting diode in the fourth embodiment of the present invention.

6A is a schematic diagram of the packaging structure of a light-emitting diode in a fifth embodiment of the present invention, wherein the packaging structure of the light-emitting diode includes a reflector and a light guide.

6B is a schematic diagram of light paths of the light emitting diode packaging structure in the fifth embodiment of the present invention.

Fig. 6C is a top view of the first embodiment of the angle of the reflector in the fifth embodiment of the present invention.

Fig. 6D is a top view of a second embodiment of the angle of the reflector in the fifth embodiment of the present invention.

Fig. 7A is a schematic diagram of the first embodiment of the reflector in the fifth embodiment of the present invention.

Fig. 7B is a schematic diagram of the second embodiment of the reflector in the fifth embodiment of the present invention.

Fig. 7C is a schematic diagram of a third embodiment of the reflector in the fifth embodiment of the present invention.

Fig. 8A is a schematic diagram of the first implementation of the light guide in the fifth embodiment of the present invention.

Fig. 8B is a schematic diagram of a second embodiment of the light guide in the fifth embodiment of the present invention.

Fig. 8C is a schematic diagram of a third embodiment of the light guide in the fifth embodiment of the present invention.

Fig. 8D is a schematic diagram of a fourth embodiment of the light guide in the fifth embodiment of the present invention.

Fig. 8E is a schematic diagram of a fifth embodiment of the light guide in the fifth embodiment of the present invention.

Fig. 8F is a schematic diagram of a sixth embodiment of the light guide in the fifth embodiment of the present invention.

9A is a schematic diagram of a first implementation of a light-emitting diode packaging structure in a sixth embodiment of the present invention, wherein the light-emitting diode packaging structure includes a reflector, and the light-emitting diode packaging structure The structure is provided with a groove penetrating the reflector.

FIG. 9B is a schematic diagram of a second embodiment of the packaging structure of a light emitting diode in the sixth embodiment of the present invention.

FIG. 10A is a top view of an embodiment of the packaging structure of a light emitting diode in the sixth embodiment of the present invention.

10B is a top view of another embodiment of the packaging structure of the light emitting diode in the sixth embodiment of the present invention.

11A is a schematic diagram of the first implementation of the light emitting diode package structure in the seventh embodiment of the present invention, wherein the light emitting diode package structure includes a reflective member and a light guide member, the light emitting diode The package structure of the diode is provided with a groove penetrating the reflecting part and the light guide part.

FIG. 11B is a schematic diagram of a second embodiment of the packaging structure of the light emitting diode in the seventh embodiment of the present invention.

FIG. 12 is a schematic diagram of the packaging structure of the light emitting diode in the eighth embodiment of the present invention.

FIG. 13 is a schematic diagram of the packaging structure of the light emitting diode in the ninth embodiment of the present invention.

Fig. 14 is a schematic diagram of a package structure of a light emitting diode in a tenth embodiment of the present invention.

15 is a schematic diagram of the packaging structure of a light emitting diode in the eleventh embodiment of the present invention.

FIG. 16 is a schematic diagram of the packaging structure of the light emitting diode in the twelfth embodiment of the present invention.

FIG. 17 is a schematic diagram of the packaging structure of a light emitting diode in the thirteenth embodiment of the present invention.

In order to have a clearer understanding of the technical features, objectives and effects of the present invention, the specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

Please refer to FIG. 1A and FIG. 1B together, which show a schematic diagram of a light emitting diode package structure and a schematic diagram of light paths in the first preferred embodiment of the present invention. As shown in FIG. 1A, the present invention provides a light-emitting diode package structure 1, which includes a light-emitting chip 20 and a package body 10 for fixing the light-emitting chip 20. The package body 10 includes a color conversion layer 30, a light guide 40 and a reflective member 50. The color conversion layer 30 covers the light-emitting chip 20. The light guide 40 covers the color conversion layer 30. The reflecting member 50 is disposed above the light guide member 40. In this embodiment, the light emitting diode package structure 1 can enable the light emitted by the light emitting chip 20 to reach a wider irradiation range.

The light-emitting chip 20 is selected from one of a horizontal light-emitting diode chip, a vertical light-emitting diode chip, or a flip-chip light-emitting diode chip. It is understandable that the use of the light-emitting chip 20 can be replaced according to the needs of users.

The color conversion layer 30 is used to change the color of light emitted by the light-emitting chip 20. It is understandable that the color conversion layer 30 can change the color of the light emitted by the light-emitting chip 20 into a desired color light according to the needs of the user.

The light guide 40 includes silicone. Those skilled in the art can understand that it is not limited to silicone resin, and other light-transmitting materials that can seal the light-emitting chip 20 and have high transparency can also be used in the present invention. The light guide 40 can be used to guide the irradiation range of the light emitted by the light-emitting chip 20, and can guide the light to a preset position.

In order to make the light emitted by the light-emitting chip 20 uniformly irradiate the outside of the package structure 1 of the light-emitting diode, the light guide 40 further includes an additional material. The additional material is 5%-15% of the weight of the silicone resin. The additional material is, for example, but not limited to, organic diffusion particles, inorganic diffusion particles, and combinations thereof.

The refractive index of the silicone resin is 1.4-1.6. The refractive index of the additional material is 1.5-1.8. Preferably, the refractive index of the silicone resin and the refractive index of the additional material are different from each other. Therefore, after the additional material is mixed with the silicone resin, the light emitted by the light-emitting chip 20 can scatter more uniform light through the additional material in the light guide 40.

It is understandable that the organic diffusion particles include, but are not limited to, organosilicon compounds and acrylic compounds, and the inorganic diffusion particles include, but are not limited to, silicon dioxide (SiO ₂ ) and titanium dioxide (TiO ₂ ). Or calcium carbonate compounds. The organosilicon compound is, for example, but not limited to, silicone rubber, silicone resin, and silicone oil. The acrylic compound is, for example, but not limited to, acrylic resin, polymethylmethacrylate (PMMA), polytetrafluoroethylene (PTFE).

The thickness of the light guide 40 is preferably 0.4 mm.

The reflecting member 50 includes a reflecting surface 501. The reflective surface 501 faces the light emitting chip 20. The reflective surface 501 may be flat or non-planar.

The thickness of the reflector 50 is preferably 0.4 mm.

It is understandable that, in order to increase the light-emitting rate of the light emitted by the light-emitting chip 20, the color of the reflective surface 501 is a light-colored color.

Preferably, the color of the reflective surface 501 is silver or white.

As shown in FIG. 1B, the light-emitting chip 20 emits a light 100, and the light 100 passes through the color conversion layer 30, so that the light 100 can be changed into a desired color light. The light 100 enters the light guide 40 after passing through the color conversion layer 30. It is understandable that the light guide 40 can guide the light 100 inside the light guide 40 until the light 100 is irradiated to the reflective member 50. when After the light 100 irradiates the reflective surface 501, most of the light 100 is reflected around the light emitting chip 20. Therefore, the light 100 emitted by the light-emitting chip 20 is reflected for the first time, and after the light 100 emitted through the reflective surface 501 passes through the light guide 40, the light 100 can be directed toward the package body 10. The outer side of the transmission distance is greater.

In this embodiment, the package body 10 further includes a substrate 60. The substrate 60 is provided with a reflective surface 61. The reflective surface 61 of the substrate 60 faces the reflective surface 501 of the reflector 50. The light-emitting chip 20, the color conversion layer 30 and the light guide 40 are arranged on the reflective surface 61 of the substrate 60. After the light 100 is reflected by the reflective surface 501 of the reflector 50, it irradiates the reflective surface 61 of the substrate 60; after the light 100 is reflected by the reflective surface 61 of the substrate 60, the light 100 will face The outside of the package 10 is illuminated. Therefore, the encapsulation structure 1 of the light-emitting diode can cause the light 100 emitted by the light-emitting chip 20 to be reflected a second time, thereby forming a wider illumination range.

According to the light-emitting diode package structure 1 provided by the present invention, the light-emitting diode package structure 1 includes the light guide 40, the reflector 50 and the substrate 60. The light guide 40 is formed on the outer side of the color conversion layer 30 and the light-emitting chip 20. The light 100 emitted by the light-emitting chip 20 enters the light guide 40, is guided by the light guide 40 and irradiates the reflective member 50, and the light 100 passes through the reflective surface 501 of the reflective member 50 reflection. At this time, the light 100 is reflected for the first time, and the light 100 reflected by the reflective surface 501 will irradiate toward the surrounding of the light-emitting chip 20. Further, when the light 100 reflected by the reflective surface 501 passes through the light guide 40, the light 100 can be transmitted farther according to the material properties of the light guide 40. Therefore, the light 100 passes through The angle range of the reflection surface 501 of the reflector 50 can be larger, so that the light emitted by the light-emitting chip 20 can obtain a wider illumination range.

In addition, in order to further expand the illumination range of the light emitted by the light-emitting chip 20, the light-emitting chip 20 is disposed on the reflective surface 61 of the substrate 60. Therefore, the light 100 reflected by the reflective surface 501 of the reflective member 50 passes through the light guide member 40 and irradiates the reflective surface of the substrate 60. On the surface 61, at this time, the light 100 is reflected for the second time. Therefore, the irradiation range of the light 100 is wider than the irradiation range of the light directly emitted by the light-emitting chip or the light that undergoes a single reflection in the prior art.

Please also refer to FIGS. 2A to 2D, which show schematic diagrams of the first embodiment to the fourth embodiment of the reflector of the light emitting diode package structure in the first embodiment of the present invention. The reflector 50 of the light-emitting diode package structure 1 includes a reflective surface 501, and the reflective surface 501 faces the light-emitting chip 20. The reflective surface 501 may be a flat surface, a concave surface, a convex surface, a parabolic surface, a polyline segment surface or a curved surface. The reflective surface 501 may be a symmetrical surface or an asymmetrical surface.

Please refer to FIG. 2A. In the first embodiment, the reflective surface 501 of the reflector 50 is a concave surface. The reflecting member 50 is disposed above the light guide member 40. The surface of the light guide 40 facing the reflective surface 501 of the reflector 50 has a convex structure. The concave structure of the reflective surface 501 faces the light-emitting chip 20. Therefore, the light emitted by the light-emitting chip 20 is concentrated and reflected to the inner side of the package body 10 through the reflective surface 501, so that the light irradiation range is More concentrated.

Please refer to FIG. 2B. In the second embodiment, the reflective surface 501 of the reflective member 50 is convex. The reflecting member 50 is disposed above the light guide member 40. The surface of the light guide 40 facing the reflective surface 501 of the reflector 50 has a concave structure. The convex structure of the reflective surface 501 faces the light-emitting chip 20. Therefore, the light emitted by the light-emitting chip 20 is reflected to the outside of the package body 10 via the reflective surface 501, so that the light irradiation range is Wider.

Please refer to FIG. 2C. In the third embodiment, the reflective surface 501 of the reflector 50 is an asymmetric surface. The left half of the reflective surface 501 is a convex surface, the right half of the reflective surface 501 is a concave surface, and the light guide 40 faces the concave and convex surfaces of the reflective member 50. Wherein, the light guide member 40 has a concave surface and a convex surface structure corresponding to the reflection member 50, which will not be repeated here. The concave and convex surfaces of the reflective surface 501 face the light-emitting chip 20. Therefore, the light emitted by the light-emitting chip 20 is reflected by the reflective surface 501, and the light that passes through the convex surface of the reflective surface 501 is directed toward the light-emitting chip 20. Package 10 The light rays passing through the concave surface of the reflective surface 501 are concentrated and reflected toward the inner side of the package body 10, so that the irradiation range of the light rays is wider on the left half of the reflector 50, while The right half of the reflector 50 is narrow, thereby increasing the brightness of the light.

Please refer to FIG. 2D. In the fourth embodiment, the reflective surface 501 of the reflective member 50 is a symmetrical surface. The left half of the reflective surface 501 is a convex surface, and the right half of the reflective surface 501 is another convex surface arranged in a mirror direction with the convex surface of the left half. The light guide 40 has a double-concave surface with a symmetrical structure, and the double-concave surface of the light guide 40 faces the double-convex structure of the reflector 50, which will not be repeated. The biconvex surface of the reflector 50 faces the light-emitting chip 20. Therefore, the light emitted by the light-emitting chip 20 is reflected by the reflective surface 501, and the light on the left half of the reflective surface 501 is directed toward the The outside of the package body 10 is reflected, and the light rays passing through the right half of the reflective surface 501 are also reflected to the outside of the package body 10, so that the irradiation range of the light is on the left and right sides of the reflector 50. The same half. Since the middle of the reflective surface 501 in this embodiment is concave, the overall irradiation range of the light is narrow.

Please refer to FIG. 3, which shows a schematic diagram of a light emitting diode packaging structure 2 in a second embodiment of the present invention. As shown in FIG. 3, the light-emitting diode package structure 2 provided by this embodiment is basically the same as the structure of the first embodiment. The difference is that the color conversion layer 30 is arranged opposite to the light guide 40, that is, the light guide 40 covers the light-emitting chip 20, and the color conversion layer 30 covers the light guide 40 .

The light-emitting chip 20 is selected from one of a horizontal light-emitting diode chip, a vertical light-emitting diode chip, or a flip-chip light-emitting diode chip. The light-emitting chip 20 can be used in accordance with the needs of users replace. The reflector 50 is applicable to the first embodiment to the fourth embodiment of the reflector 50 in the first embodiment or a combination change thereof. The reflective surface 501 of the reflector 50 is a flat surface, a concave surface, a convex surface, a parabolic surface, a polyline segment surface, or a curved surface. The reflective surface 501 of the reflector 50 is a symmetrical surface or an asymmetrical surface.

Please refer to FIG. 4, which shows a schematic diagram of a light emitting diode packaging structure 3 in a third embodiment of the present invention. As shown in FIG. 4, the package structure 3 of the light emitting diode provided in this embodiment is basically the same as the structure of the first embodiment. The difference is that the light guide 40 does not cover the color conversion layer 30.

In this embodiment, the light guide 40 is disposed above the color conversion layer 30 and faces the light-emitting chip 20. The light-emitting chip 20 is selected from one of a horizontal light-emitting diode chip, a vertical light-emitting diode chip, or a flip-chip light-emitting diode chip. The light-emitting chip 20 can be used in accordance with the needs of users replace. The reflector 50 is applicable to the first embodiment to the fourth embodiment of the reflector 50 in the first embodiment or a combination change thereof. The reflective surface 501 of the reflector 50 is a flat surface, a concave surface, a convex surface, a parabolic surface, a polyline segment surface, or a curved surface. The reflective surface 501 of the reflector 50 is a symmetrical surface or an asymmetrical surface.

Please refer to FIG. 5, which shows a schematic diagram of a light emitting diode packaging structure 4 in a fourth embodiment of the present invention. As shown in FIG. 5, the package structure 4 of the light emitting diode provided by this embodiment is basically the same as the structure of the first embodiment. The difference is that the light guide 40 is disposed above the light emitting chip 20, and then the light guide 40 and the light emitting chip 20 are covered by the color conversion layer 30.

The light-emitting chip 20 is selected from one of a horizontal light-emitting diode chip, a vertical light-emitting diode chip, or a flip-chip light-emitting diode chip. The light-emitting chip 20 can be used in accordance with the needs of users replace. The reflector 50 is applicable to the first embodiment to the fourth embodiment of the reflector 50 in the first embodiment or a combination change thereof. The reflective surface 501 of the reflector 50 is a flat surface, a concave surface, a convex surface, a parabolic surface, a polyline segment surface, or a curved surface. The reflective surface 501 of the reflector 50 is a symmetrical surface or an asymmetrical surface.

Please refer to FIGS. 6A to 6D, which show a schematic diagram of a light emitting diode packaging structure 5 and a schematic diagram of light paths in a fifth embodiment of the present invention. As shown in FIG. 6A, this embodiment provides another light-emitting diode package structure 5, which includes a light-emitting chip 20A and a package body 10A for fixing the light-emitting chip 20A. The package body 10A includes a color conversion layer 30A, a light guide 40A, and a reflective member 50A. So The color conversion layer 30A covers the light-emitting chip 20A. The light guide 40A is arranged around the color conversion layer 30A, and the reflector 50A is arranged on the inner surface of the light guide 40A. The reflector 50A is arranged around the light emitting chip 20A.

It can be understood that, in order to improve the light extraction efficiency, the width of the cross section of the reflector 50A gradually increases from a direction away from the light emitting chip 20A.

The reflective member 50A includes a reflective surface 501A facing the light-emitting chip 20A. The reflective surface 501A and the bottom surface of the light guide 40A form an included angle α.

Preferably, the included angle α is an obtuse angle. Therefore, the light emitted by the light-emitting chip 20A will be reflected toward the outside of the package 10A after being irradiated on the reflective surface 501A.

The reflective surface 501A is flat or non-planar. The color of the reflective surface 501A is light-colored.

Preferably, the color of the reflective surface 501A is silver or white.

As shown in FIG. 6B, a light 100A emitted by the light-emitting chip 20A passes through the color conversion layer 30A, so that the light 100A can be changed into a desired color light. A part of the light 100A directly irradiates the outside of the package 10A, another part of the light 100A irradiates and reflects on the reflective surface 501A of the reflector 50A, and the light 100A can indirectly face the package The outside of the body 10A is irradiated, so that the light 100A irradiates a wider range.

Please refer to FIGS. 6C and 6D together, which show the top views of the first embodiment and the second embodiment of the angle of the reflector of the light-emitting diode packaging structure 5 in the fifth embodiment of the present invention. In the combined structure of the light guide 40A and the reflective member 50A, the light guide 40A is arranged around the side of the color conversion layer 30A. The reflecting member 50A is disposed on the inner surface of the light guide member 40A.

As shown in FIG. 6C, in the first embodiment, the reflector 50A includes a front plate 51A, a rear plate 52A, a first side plate 53A, and a second side plate 54A. The front panel 51A, the rear panel 52A, the first side panel 53A, and the second side panel 54A may have a trapezoidal structure. The front plate 51A and the rear plate 52A, and the first Both the side plate 53A and the second side plate 54A can have a symmetric structure or an asymmetric structure. In this embodiment, the front plate 51A and the rear plate 52A are symmetrically distributed, and the first side plate 53A and the second side plate 54A are also symmetrically distributed. The size of the front plate 51A or the rear plate 52A is different from the first side plate 53A or the second side plate 54A. The bottom and/or top of the reflector 50 has a rectangular structure. Each trapezoidal structure has a wider top end 55A and a narrower bottom end 56A to promote the light emitted by the light-emitting chip 20A to irradiate more light to the reflective surface 501A of the reflector 50A, thereby irradiating to Most of the light of the reflective surface 501A is reflected toward the outside of the package 10A. The inner surfaces of the rear plate 52A, the first side plate 53A, and the second side plate 54A collectively enclose the reflective surface 501A of the reflector 50A. The reflective surface 501A is a closed and continuous structural surface to promote most of the light irradiated by the light-emitting chip 20A to irradiate to the outside of the package 10A.

It is understandable that in other embodiments, the structure of the rear plate 52A, the first side plate 53A, and the second side plate 54A can also be set in any shape, as long as the light emitted by the light-emitting chip 20A can It is sufficient to irradiate more toward the outside of the package 10A.

As shown in FIG. 6D, in the second embodiment, the structure of the reflector 50A is substantially the same as the structure of the reflector 50A in FIG. 6C. The difference is that the front plate 51A, the rear plate 52A, the first side plate 53A, and the second side plate 54A have the same size. The bottom and/or top of the reflecting member 50 of the reflecting member 50A is a square structure. In the embodiment, each trapezoid is an isosceles trapezoid structure. Each trapezoid has a bottom angle β near the light-emitting chip 20A. The angle setting of the bottom angle β can be adjusted according to the needs of users. When the light-emitting chip 20A emits light, the light will form different light-emitting angles and light patterns.

It is understandable that the light-emitting chip 20A of the present invention is selected from one of a horizontal light-emitting diode chip, a vertical light-emitting diode chip, or a flip-chip light-emitting diode chip. The use of the light-emitting chip 20 can be replaced according to the user's needs, and the above-mentioned use methods can all be replaced according to the user's needs, and its structure is not repeated here.

Please also refer to FIGS. 7A to 7C, which are schematic diagrams of the first embodiment to the third embodiment of the reflector of the light emitting diode packaging structure 5 in the fifth embodiment of the present invention. The reflecting member 50A includes a reflecting surface 501A. The reflective surface 501A is arranged around the light emitting chip 20A, and the reflective surface 501A may be non-planar. The reflective surface 501A may also be a flat surface, a concave surface, a convex surface, a parabolic surface, a polyline segment surface or a curved surface. Further, the reflective surface 501A may be a symmetrical surface or an asymmetrical surface.

It is understandable that in other embodiments, the structure and shape of the reflective surface 501A can be changed according to the user's needs. Therefore, the structure of the reflective surface 501A is not limited to the fixed structure shown in the foregoing embodiments. In addition, in other embodiments, the combined structure of the light guide member 40A and the reflective member 50A is not limited to the fixed structure shown in the above embodiment. The left, right, front and rear sides of the reflective member 50A The bottom angle of the trapezoidal surface can be adjusted according to the needs of users.

Please refer to FIG. 7A. In the first embodiment, the reflective surface 501A of the reflector 50A is convex. The light (not shown) irradiated by the light-emitting chip 20A toward the reflector 50A is reflected by the reflective surface 501A of the reflector 50A. The convex structure of the reflective surface 501A can make the light emitted by the light-emitting chip 20A irradiate toward the outside of the package 10A, so that the light-emitting chip 20A can emit a wider light irradiation range.

Please refer to FIG. 7B. In the second embodiment, the reflective surface 501A of the reflective member 50A is concave. The light irradiated by the light-emitting chip 20A toward the reflector 50A is reflected by the reflective surface 501A of the reflector 50A. The concave structure of the reflective surface 501A can make the light emitted by the light-emitting chip 20A radiate concentratedly toward the inner side of the package body 10A, so that the light-emitting chip 20A can emit brighter light brightness, but the light The wafer 20A emits a narrow light irradiation range.

Please refer to FIG. 7C. In the third embodiment, the reflective surface 501A of the reflective member 50A is a flat surface. The reflective surface 501A and the plane where the light-emitting chip 20A is located form an angle α facing the light-emitting chip 20A. Preferably, the included angle α is an obtuse angle. The light irradiated by the light-emitting chip 20A to the surroundings is reflected by the reflective surface 501A of the reflector 50A. Understandably, when the reflection When the angle α formed by the surface 501A and the plane where the light-emitting chip 20A is located is small, the irradiation direction of the light is concentrated toward the inside of the package body 10A, so the light-emitting chip 20A can emit brighter light Brightness, but the light-emitting chip 20A emits a narrow light irradiation range. When the angle α formed by the reflective surface 501A and the plane where the light-emitting chip 20A is located is large, the irradiation direction of the light is irradiated to the outside of the package body 10A. Therefore, the light-emitting chip 20A can emit more Wide light exposure range.

Please also refer to FIGS. 8A to 8F, which are schematic diagrams of the first embodiment to the sixth embodiment of the light guide member of the light emitting diode packaging structure 5 in the fifth embodiment of the present invention. The color conversion layer 30A covers the light-emitting chip 20A, and the reflector 50A is arranged around the side of the color conversion layer 30A. The light guide 40A covers the color conversion layer 30A and the reflection member 50A. The light guide 40A includes a light emitting surface 401A. The light emitting surface 401A faces the light emitting chip 20A. The light-emitting surface 401A is a continuous structure surface or a discontinuous structure surface. Both the continuous structure surface and the discontinuous structure surface may be flat, circular arc, circular cylindrical, and V-shaped groove surfaces.

As shown in FIG. 8A, in the first embodiment, the light-emitting surface 401A of the light guide 40A is flat. As shown in FIG. 8B, in the second embodiment, the light-emitting surface 401A of the light guide 40A is a circular arc surface. As shown in FIG. 8C, in the third embodiment, the light-emitting surface 401A of the light guide 40A is a discontinuous V-shaped groove surface. As shown in FIG. 8D, in the fourth embodiment, the light-emitting surface 401A of the light guide 40A is a discontinuous arc surface. As shown in FIG. 8E, in the fifth embodiment, the light exit surface 401A of the light guide 40A is a discontinuous circular arc cylindrical surface. As shown in FIG. 8F, in the sixth embodiment, the light-emitting surface 401A of the light guide 40A is a continuous V-shaped groove surface. The light emitting surface 401A is provided with a circular arc surface or a circular cylindrical surface structure, which can change the light guide path and the light type of the light emitted by the light emitting chip 20A.

Please refer to FIGS. 9A and 9B together, which show schematic diagrams of the first embodiment to the second embodiment of the light-emitting diode package structure 6 in the sixth embodiment of the present invention. The package structure 6 of the light emitting diode provided in this embodiment is basically the same as the structure of the first embodiment. The reflector 50 includes a The upper surface 51 of the light guide 40 and a lower surface 52 contacting the light guide 40. The difference is that the reflector 50 is provided with a groove 70 directly above the light-emitting chip 20 to expose the light guide member 40, and the width of the groove 70 is smaller than the width of the light-emitting chip 20, so The groove 70 penetrates the upper surface 51 and the lower surface 52 of the reflector 50. Specifically, the groove 70 penetrates from the upper surface 51 of the reflector 50 to the lower surface 52 of the reflector 50.

It is understandable that the groove 70 is arranged directly above the light-emitting chip 20 to allow the light emitted by the light-emitting chip 20 to pass through the groove 70, so as to solve the problem when the light-emitting surface is a reflective surface. The problem that the top of the light-emitting chip 20 is too dark.

In order to ensure that the light emitted by the light-emitting chip 20 can diverge uniformly, the grooves 70 are distributed symmetrically. The groove 70 is, for example, but not limited to, a cross-shaped groove and a round groove.

The width of the groove is about 0.05mm-0.3mm.

The upper surface 51 of the reflecting member 50 is a flat surface, and the lower surface 52 of the reflecting member 50 is the reflecting surface 501. The upper surface 51 of the reflector 50 is directly opposite to the lower surface 52 of the reflector 50.

The trench 70 includes two opposite sidewalls 701. The side wall 701 and the upper surface of the reflector 50 form an included angle γ that faces away from the groove 70. The angle range of the included angle γ is greater than or equal to 90 degrees and less than 180 degrees. When the reflective surface 501 of the reflector 50 is a flat surface, the side wall 701 is perpendicular to the reflective surface 501.

The groove 70 includes an upper end 702 and a lower end 703. The upper end 702 is an end away from the light guide 40, and the lower end 703 is close to the light guide 40. The width of the upper end 702 is greater than or equal to the width of the lower end 703.

It can be understood that, in order to increase the illumination range of the light-emitting chip 20, the width of the cross section of the groove 70 gradually increases from a direction away from the light-emitting chip 20A.

It can be understood that, in this embodiment, the reflector 50 is applicable to the first embodiment to the fourth embodiment of the reflector 50 in the first embodiment or a combination change thereof. The reflection table of the reflecting part 50 The surface 501 is a flat surface, a concave surface, a convex surface, a parabolic surface, a polyline segment surface, and a curved surface. The reflective surface 501 of the reflector 50 is a symmetrical surface or an asymmetrical surface.

As shown in FIG. 9A, in this example, the angle γ formed by the side wall 701 and the upper surface of the reflector 50 is 90 degrees, that is, the side wall 701 is perpendicular to the reflective surface 501 of the reflector 50. The width of the upper end 702 is equal to the width of the lower end 703. The cross-sectional area of the groove 70 is a rectangular structure.

As shown in FIG. 9B, in this embodiment, the angle γ formed by the side wall 701 and the upper surface of the reflector 50 is greater than 90 degrees, that is, the width of the upper end 702 is greater than the width of the lower end 703 . In this embodiment. The cross-sectional area of the groove 70 is an inverted trapezoid structure.

It is understandable that the inverted trapezoid structure may be an isosceles trapezoid structure or a non-isosceles trapezoid structure.

Please refer to FIGS. 10A and 10B together, which show top views of the first embodiment to the second embodiment of the groove in the sixth embodiment of the present invention.

As shown in FIG. 10A, the groove 70 is a cross-shaped groove. The cross-shaped groove divides the reflector 50 into four reflecting areas 503 with the same size and symmetrically distributed. Therefore, the light emitted by the light-emitting chip 20 can be evenly distributed to the surrounding area through the reflecting area 503. Irradiation. The junction of the cross-shaped groove faces the center of the light-emitting chip 20. Therefore, the light emitted through the light-emitting chip 20 is partially irradiated to the outside of the package body 10 through the groove 70 to further improve the light-emitting brightness.

As shown in FIG. 10B, in this embodiment, the groove 70 is a circular groove. The circular groove is arranged directly above the light-emitting chip 20. The circular groove divides the reflecting member 50 into a reflecting area 503. The radius of the circular groove is in the range of 0.1 nm-0.3 nm, so that the light emitted by the light-emitting chip 20 is partially irradiated to the outside of the package body 10 through the groove 70 to further improve the luminous brightness.

Please refer to FIG. 11A and FIG. 11B, which show schematic diagrams of the first embodiment and the second embodiment of the light-emitting diode packaging structure 7 in the seventh embodiment of the present invention. The light-emitting diode provided in this embodiment The package structure 7 of the body is basically the same as that of the first embodiment. The light-emitting chip 20 includes an upper surface 21 that is in contact with the color conversion layer 30 and is opposite to the reflective surface 501 of the reflector 50. The color conversion layer 30 includes an upper surface 31 in contact with the light guide 40 and opposite to the upper surface 21 of the light-emitting chip 20. The upper surface 31 of the color conversion layer 30 faces away from the light-emitting chip 20 and is opposite to the reflective surface 501 of the reflector 50. The light guide 40 includes an upper surface 41 in contact with the reflective member 50 and a lower surface 42 in contact with the upper surface 31 of the color conversion layer 30. The reflecting member 50 includes an upper surface 51 away from the light guide 40 and a lower surface 52 in contact with the light guide 40. The difference is that the package structure 7 of the light-emitting diode is provided with a groove 70 directly above the light-emitting chip 20, and the width of the groove 70 is smaller than the width of the light-emitting chip 20. The upper surface 51 of the reflector 50 penetrates into the light guide 40, which penetrates the upper surface 41 and the lower surface 42 of the light guide 40 and the upper surface 51 and the lower surface of the reflector 50, respectively. Surface 52. Specifically, the groove 70 penetrates from the upper surface 51 of the reflector 50 to the lower surface 42 of the light guide 40.

The upper surface of the reflecting member 50 is a flat surface, and the lower surface of the reflecting member 50 is the reflecting surface 501. The upper surface 51 of the reflector 50 is directly opposite to the lower surface 52 of the reflector 50.

The trench 70 includes two opposite sidewalls 701. The sidewall 701 and the upper surface of the reflector 50 form an included angle γ that faces away from the groove 70. The angle range of the included angle γ is greater than or equal to 90 degrees and less than 180 degrees.

The groove 70 includes an upper end 702 and a lower end 703. The upper end 702 is an end away from the color conversion layer 30, and the lower end 703 is close to the color conversion layer 30. The width of the upper end 702 is greater than or equal to the width of the lower end 703.

As shown in FIG. 11A, in the first embodiment, the angle γ formed by the side wall 701 and the upper surface of the reflector 50 is 90 degrees, that is, the side wall 701 is perpendicular to the upper surface of the reflector 50 . The width of the upper end 702 is equal to the width of the lower end 703. The cross-sectional area of the groove 70 is a rectangular structure.

As shown in FIG. 11B, in the second actual manner, the angle γ formed by the side wall 701 and the upper surface of the reflector 50 is greater than 90 degrees.

It can be understood that in order to improve the light extraction efficiency, the width of the cross section of the groove 70 gradually increases from the direction away from the light-emitting chip 20A, that is, the width of the upper end 702 is greater than the width of the lower end 703. In this embodiment, the cross-sectional area of the trench 70 is an inverted trapezoid structure.

It is understandable that the inverted trapezoid structure may be an isosceles trapezoid structure or a non-isosceles trapezoid structure.

The groove 70 is applicable to the first embodiment and the second embodiment in the sixth embodiment or a combination change thereof. The groove 70 is a cross-shaped groove or a round groove, and the characteristics of the groove 70 will not be repeated here.

It can be understood that, in this embodiment, the reflector 50 is applicable to the first embodiment to the fourth embodiment of the reflector 50 in the first embodiment or a combination change thereof. The reflective surface 501 of the reflector 50 is a flat surface, a concave surface, a convex surface, a parabolic surface, a polyline segment surface, or a curved surface. The reflective surface 501 of the reflector 50 is a symmetrical surface or an asymmetrical surface.

Please refer to FIG. 12, which shows a schematic diagram of a light emitting diode packaging structure 8 in an eighth embodiment of the present invention. The package structure 8 of the light emitting diode provided by this embodiment is basically the same as the structure of the seventh embodiment. The light-emitting chip 20 includes an upper surface 21 that is in contact with the color conversion layer 30 and is opposite to the reflective surface 501 of the reflector 50. The color conversion layer 30 includes an upper surface 31 in contact with the light guide 40 and opposite to the upper surface 21 of the light-emitting chip 20. The upper surface 31 of the color conversion layer 30 faces away from the light-emitting chip 20 and is opposite to the reflective surface 501 of the reflector 50. The light guide 40 includes an upper surface 41 contacting the reflecting member 50 and a lower surface 42 contacting the upper surface 31 of the color conversion layer 30. The reflecting member 50 includes an upper surface 51 away from the light guide 40 and a lower surface 52 contacting the light guide 40. The difference is that the package structure 7 of the light-emitting diode is provided with a groove 70 directly above the light-emitting chip 20, and the width of the groove 70 is smaller than the width of the light-emitting chip 20. Self-evident The upper surface 51 of the projection member 50 penetrates into the light guide member 40, and penetrates the upper surface and the lower surface of the reflective member 50 and the upper surface of the light guide member 40 respectively. Specifically, the groove 70 penetrates from the upper surface 51 of the reflector 50 to the upper surface 41 of the light guide 40.

It can be understood that the groove 70 can penetrate from the upper surface 51 of the reflector 50 to a predetermined position between the upper surface 41 and the lower surface 42 of the light guide 40.

Preferably, the groove 70 penetrates from the upper surface 51 of the reflector 50 to an intermediate position between the upper surface 41 and the lower surface 42 of the light guide 40.

It can be understood that, in this embodiment, the reflector 50 is applicable to the first embodiment to the fourth embodiment of the reflector 50 in the first embodiment or a combination change thereof. The reflective surface 501 of the reflector 50 is a flat surface, a concave surface, a convex surface, a parabolic surface, a polyline segment surface, or a curved surface. The reflective surface 501 of the reflector 50 is a symmetrical surface or an asymmetrical surface. The groove 70 is applicable to the first embodiment and the second embodiment in the sixth embodiment or a combination change thereof. The groove 70 is a cross-shaped groove or a round groove, and the characteristics of the groove 70 will not be repeated here.

Please refer to FIG. 13, which shows a schematic diagram of a light emitting diode package structure 9 in a ninth embodiment of the present invention. The package structure 9 of the light-emitting diode provided by this embodiment is basically the same as the structure of the second embodiment. The reflecting member 50 includes an upper surface 51 away from the light guide 40 and a lower surface 52 contacting the light guide 40. The difference is that the reflector 50 is provided with a groove 70 directly above the light-emitting chip 20, the width of the groove 70 is smaller than the width of the light-emitting chip 20, and the groove 70 penetrates the reflector 50 of the upper surface 51 and the lower surface 52. Specifically, the groove 70 penetrates from the upper surface 51 of the reflector 50 to the lower surface 52 of the reflector 50.

It can be understood that, in this embodiment, the reflector 50 is applicable to the first embodiment to the fourth embodiment of the reflector 50 in the first embodiment or a combination change thereof. The reflective surface 501 of the reflector 50 is a flat surface, a concave surface, a convex surface, a parabolic surface, a polyline segment surface, or a curved surface. The reflective surface 501 of the reflector 50 is a symmetrical surface or an asymmetrical surface. The groove 70 is applicable to the first embodiment and the sixth embodiment The second embodiment or its combination changes. The groove 70 is a cross-shaped groove or a round groove, and the characteristics of the groove 70 will not be repeated here.

Please refer to FIG. 14, which shows a schematic diagram of the first embodiment of the light emitting diode package structure 10 in the tenth embodiment of the present invention. The package structure 10 of the light emitting diode provided in this embodiment is basically the same as the structure of the third embodiment. The reflecting member 50 includes an upper surface 51 away from the light guide 40 and a lower surface 52 contacting the light guide 40. The difference is that the reflector 50 is provided with a groove 70 directly above the light-emitting chip 20 to expose the light guide member 40, and the width of the groove 70 is smaller than the width of the light-emitting chip 20, so The groove 70 penetrates the upper surface 51 and the lower surface 52 of the reflector 50. Specifically, the groove 70 penetrates from the upper surface 51 of the reflector 50 to the lower surface 52 of the reflector 50.

It can be understood that, in this embodiment, the reflector 50 is applicable to the first embodiment to the fourth embodiment of the reflector 50 in the first embodiment or a combination change thereof. The reflective surface 501 of the reflector 50 is a flat surface, a concave surface, a convex surface, a parabolic surface, a polyline segment surface, or a curved surface. The reflective surface 501 of the reflector 50 is a symmetrical surface or an asymmetrical surface. The groove 70 is applicable to the first embodiment and the second embodiment in the sixth embodiment or a combination change thereof. The groove 70 is a cross-shaped groove or a round groove, and the characteristics of the groove 70 will not be repeated here.

Please refer to FIG. 15, which shows a schematic diagram of a second embodiment of the light emitting diode package structure 11 in the eleventh embodiment of the present invention. The package structure 11 of the light emitting diode provided in this embodiment is basically the same as the structure of the third embodiment. The light-emitting chip 20 includes an upper surface 21 that is in contact with the color conversion layer 30 and is opposite to the reflective surface 501 of the reflector 50. The color conversion layer 30 includes an upper surface 31 in contact with the light guide 40 and opposite to the upper surface 21 of the light-emitting chip 20. The upper surface 31 of the color conversion layer 30 faces away from the light-emitting chip 20 and is opposite to the reflective surface 501 of the reflector 50. The light guide 40 includes an upper surface 41 contacting the reflective member 50 and a lower surface 42 contacting the color conversion layer 30. The reflecting member 50 includes an upper surface 51 away from the light guide 40 and a lower surface 52 contacting the light guide 40. The difference is that the package structure 11 of the light-emitting diode is on the front side of the light-emitting chip 20. A groove 70 is provided above, the width of the groove 70 is smaller than the width of the light-emitting chip 20, the groove 70 penetrates into the light guide 40 from the upper surface 51 of the reflector 50, and The upper surface 41 and the lower surface 42 of the light guide 40 and the upper surface 51 and the lower surface 52 of the reflector 50 are respectively penetrated. Specifically, the groove 70 penetrates from the upper surface 51 of the reflector 50 to the lower surface 42 of the light guide 40.

It can be understood that, in this embodiment, the reflector 50 is applicable to the first embodiment to the fourth embodiment of the reflector 50 in the first embodiment or a combination change thereof. The reflective surface 501 of the reflector 50 is a flat surface, a concave surface, a convex surface, a parabolic surface, a polyline segment surface, or a curved surface. The reflective surface 501 of the reflector 50 is a symmetrical surface or an asymmetrical surface. The groove 70 is applicable to the first embodiment and the second embodiment in the sixth embodiment or a combination change thereof. The groove 70 is a cross-shaped groove or a round groove, and the characteristics of the groove 70 will not be repeated here.

Please refer to FIG. 16, which shows a schematic diagram of a second embodiment of the light emitting diode packaging structure 12 in the twelfth embodiment of the present invention. The package structure 12 of the light emitting diode provided in this embodiment is basically the same as the structure of the third embodiment. The light-emitting chip 20 includes an upper surface 21 that is in contact with the color conversion layer 30 and is opposite to the reflective surface 501 of the reflector 50. The color conversion layer 30 includes an upper surface 31 in contact with the light guide 40 and opposite to the upper surface 21 of the light-emitting chip 20. The upper surface 31 of the color conversion layer 30 faces away from the light-emitting chip 20 and is opposite to the reflective surface 501 of the reflector 50. The light guide 40 includes an upper surface 41 contacting the reflective member 50 and a lower surface 42 contacting the color conversion layer 30. The reflecting member 50 includes an upper surface 51 away from the light guide 40 and a lower surface 52 contacting the light guide 40. The difference is that the light-emitting diode package structure 12 is provided with a groove 70 directly above the light-emitting chip 20. The width of the groove 70 is smaller than the width of the light-emitting chip 20. The upper surface 51 of the reflector 50 penetrates into the light guide 40, which penetrates the upper surface 41 and the lower surface 42 of the light guide 40 and the upper surface 51 of the reflector 50 respectively. Specifically, the groove 70 penetrates from the upper surface 51 of the reflector 50 to the upper surface 43 of the light guide 40.

It can be understood that the groove 70 can penetrate from the upper surface 51 of the reflector 50 to a predetermined position between the upper surface 41 and the lower surface 42 of the light guide 40.

Preferably, the groove 70 penetrates from the upper surface 51 of the reflector 50 to an intermediate position between the upper surface 41 and the lower surface 42 of the light guide 40.

It can be understood that, in this embodiment, the reflector 50 is applicable to the first embodiment to the fourth embodiment of the reflector 50 in the first embodiment or a combination change thereof. The reflective surface 501 of the reflector 50 is a flat surface, a concave surface, a convex surface, a parabolic surface, a polyline segment surface, or a curved surface. The reflective surface 501 of the reflector 50 is a symmetrical surface or an asymmetrical surface. The groove 70 is applicable to the first embodiment and the second embodiment in the sixth embodiment or a combination change thereof. The groove 70 is a cross-shaped groove or a round groove, and the characteristics of the groove 70 will not be repeated here.

Please refer to FIG. 17, which shows a schematic diagram of a light-emitting diode packaging structure 13 in a thirteenth embodiment of the present invention. The package structure 13 of the light emitting diode provided in this embodiment is basically the same as the structure of the fourth embodiment. The reflecting member 50 includes an upper surface 51 away from the light guide 40 and a lower surface 52 contacting the light guide 40. The difference is that the reflector 50 is provided with a groove 70 directly above the light-emitting chip 20, the width of the groove 70 is smaller than the width of the light-emitting chip 20, and the groove 70 penetrates the reflector 50 of the upper surface 51 and the lower surface 52. Specifically, the groove 70 penetrates from the upper surface 51 of the reflector 50 to the lower surface 52 of the reflector 50.

It can be understood that, in this embodiment, the reflector 50 is applicable to the first embodiment to the fourth embodiment of the reflector 50 in the first embodiment or a combination change thereof. The reflective surface 501 of the reflector 50 is a flat surface, a concave surface, a convex surface, a parabolic surface, a polyline segment surface, or a curved surface. The reflective surface 501 of the reflector 50 is a symmetrical surface or an asymmetrical surface. The groove 70 is applicable to the first embodiment and the second embodiment in the sixth embodiment or a combination change thereof. The groove 70 is a cross-shaped groove or a round groove, and the characteristics of the groove 70 will not be repeated here.

The present invention provides a light-emitting diode packaging structure, which enables the light-emitting chip to irradiate a wider range of light through the combined structure of the light guide and the reflector. The light guide member covers the outer side of the color conversion layer and the light-emitting chip. The light from the light-emitting chip is incident on the light guide through the color conversion layer, and the light is guided by the light guide to irradiate the reflective member, and the reflective member reflects the light back to the Light guide, this is the first light reflection. The material properties of the light guide can transmit the light farther, and the angle at which the light is reflected can be greater. Further, the packaging structure of the light-emitting diode can also be arranged on the reflective surface of the substrate, and the light reflected by the reflector will irradiate the reflective surface of the substrate. This is the second light reflection. Therefore, the light irradiation range is wider than that of the light emitting diode directly or once reflected by the conventional light emitting diode. The invention can also change the light irradiation range and light path by changing the structure of the reflector.

The present invention also provides another light-emitting diode package structure. The difference is that the light guide and the reflector are arranged around the light-emitting chip, so that the light emitted by the light-emitting chip is The reflector reflects light to the outside of the package, or the light irradiation range and light path can be changed by changing the structure of the reflector.

The present invention also provides another light-emitting diode package structure. The difference is that grooves are provided on the reflector or grooves are provided on the reflector and the light guide to make the light-emitting chip emit Light can be partially irradiated from the groove to the outside of the package of the light-emitting diode, thereby improving the problem that the light-emitting chip is too dark when the light-emitting surface is entirely a reflective layer.

The embodiments shown and described above are only examples. Therefore, many of these details are neither shown nor described. Although many features and advantages of the present invention have been described in the foregoing description, together with the details of the structure and function of the present invention, the present invention is only illustrative and can be changed in details, including shapes and element arrangements, It is within the scope of the principle of the present disclosure and includes the full range established by the broad meaning of the terms used in the claims. Therefore, it can be understood that the above-mentioned embodiments can be modified within the scope of the claims.

10‧‧‧Package body

20‧‧‧Light-emitting chip

30‧‧‧color conversion layer

40‧‧‧Light guide

50‧‧‧Reflector

Claims (16)

A light-emitting diode package structure, comprising: a light-emitting chip including an upper surface; a color conversion layer, the color conversion layer covering the light-emitting chip, which includes a light-emitting chip and the upper surface The lower surface in contact, and an upper surface away from the light-emitting chip; a light guide member disposed above the light-emitting chip, the light guide member being in contact with the upper surface of the color conversion layer; And a reflector, disposed above the light guide, the reflector includes an upper surface and a lower surface, the lower surface is in contact with the light guide, and the lower surface of the reflector defines a Facing the first reflective surface of the light-emitting chip, the first reflective surface is a concave surface, a convex surface, a parabolic surface, a polyline segment surface or a curved surface, and the reflective member is provided directly above the light-emitting chip such that the light guide member The width of the exposed groove is smaller than the width of the light-emitting chip. The package structure of the light emitting diode according to claim 1, wherein the grooves are distributed symmetrically. The light emitting diode package structure according to claim 1, wherein the groove is a cross-shaped groove or a round-shaped groove. The light emitting diode package structure according to claim 1, wherein the width of the groove is in the range of 0.05mm-0.3mm. The light-emitting diode package structure according to claim 1, wherein the groove includes an upper end far from the light guide and a lower end close to the light guide, and the width of the upper end It is greater than or equal to the width of the lower end. The light-emitting diode package structure of claim 1, wherein the light guide includes silicone resin and additional materials, and the additional material is 5% to 15% by weight of the silicone resin, so The additional material is selected from one or a combination of organic diffusion particles and inorganic diffusion particles. The light emitting diode package structure according to claim 6, wherein the refractive index of the silicone resin is 1.4-1.6, and the refractive index of the additional material is 1.5-1.8. The light emitting diode package structure according to claim 6, wherein the organic diffusion particles include organic silicon-based compounds and acrylic compounds, and the inorganic diffusion particles include silicon dioxide or calcium carbonate-based compounds. A light-emitting diode package structure, comprising: a light-emitting chip including an upper surface; a color conversion layer, the color conversion layer covering the light-emitting chip, which includes a light-emitting chip and the upper surface , And an upper surface away from the light-emitting chip; a light guide member disposed above the light-emitting chip, the light guide member being in contact with the upper surface of the color conversion layer; and a reflecting member , Arranged above the light guide member, the reflecting member includes an upper surface and a lower surface, the lower surface contacts the light guide member, and the lower surface of the reflecting member defines a surface facing the light emitting chip The first reflective surface is a concave, convex, parabolic, polyline or curved surface, and the package structure of the light-emitting diode is provided with a groove directly above the light-emitting chip. The width of the groove is smaller than the width of the light emitting chip, and the groove penetrates into the light guide member from the upper surface of the reflector. The light emitting diode package structure according to claim 9, wherein the grooves are symmetrically distributed. The light emitting diode package structure according to claim 9, wherein the groove is a cross-shaped groove or a circular groove. The package structure of the light-emitting diode according to claim 9, wherein the width of the groove is in the range of 0.05 mm-0.3 mm. The light emitting diode package structure according to claim 9, wherein the groove includes an upper end far from the color conversion layer and a lower end close to the color conversion layer, and the width of the upper end It is greater than or equal to the width of the lower end. The light-emitting diode package structure according to claim 9, wherein the light guide includes a silicone resin and an additional material, and the additional material is 5% to 15% by weight of the silicone resin. The additional material is selected from one or a combination of organic diffusion particles and inorganic diffusion particles. The light emitting diode package structure according to claim 14, wherein the refractive index of the silicone resin is 1.4-1.6, and the refractive index of the additional material is 1.5-1.8. The light emitting diode package structure according to claim 14, wherein the organic diffusion particles include organosilicon compounds and acrylic compounds, and the inorganic diffusion particles include silica or calcium carbonate compounds.

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