JP6015445B2 - 液状組成物、並びに、それを用いた抵抗体膜、抵抗体膜の製造方法、抵抗体素子及び配線板 - Google Patents
液状組成物、並びに、それを用いた抵抗体膜、抵抗体膜の製造方法、抵抗体素子及び配線板 Download PDFInfo
- Publication number
- JP6015445B2 JP6015445B2 JP2012527773A JP2012527773A JP6015445B2 JP 6015445 B2 JP6015445 B2 JP 6015445B2 JP 2012527773 A JP2012527773 A JP 2012527773A JP 2012527773 A JP2012527773 A JP 2012527773A JP 6015445 B2 JP6015445 B2 JP 6015445B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid composition
- less
- carbon black
- black particles
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000007788 liquid Substances 0.000 title claims description 139
- 239000000203 mixture Substances 0.000 title claims description 139
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000002245 particle Substances 0.000 claims description 124
- 239000006229 carbon black Substances 0.000 claims description 70
- 239000002041 carbon nanotube Substances 0.000 claims description 54
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 50
- 238000000034 method Methods 0.000 claims description 50
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 49
- 239000003822 epoxy resin Substances 0.000 claims description 48
- 229920000647 polyepoxide Polymers 0.000 claims description 48
- 239000002904 solvent Substances 0.000 claims description 41
- 150000002009 diols Chemical class 0.000 claims description 35
- 238000007639 printing Methods 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 22
- 239000003795 chemical substances by application Substances 0.000 claims description 21
- 239000006185 dispersion Substances 0.000 claims description 19
- 238000010438 heat treatment Methods 0.000 claims description 13
- 150000002989 phenols Chemical class 0.000 claims description 13
- 239000007787 solid Substances 0.000 claims description 13
- 150000001299 aldehydes Chemical class 0.000 claims description 12
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 12
- 229920005989 resin Polymers 0.000 description 35
- 239000011347 resin Substances 0.000 description 35
- 238000001723 curing Methods 0.000 description 25
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 24
- 239000000047 product Substances 0.000 description 21
- 239000000463 material Substances 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 19
- 238000007641 inkjet printing Methods 0.000 description 18
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 14
- 239000004020 conductor Substances 0.000 description 13
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 12
- -1 Glycidyl ester Chemical class 0.000 description 11
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 9
- 239000011521 glass Substances 0.000 description 9
- 239000010410 layer Substances 0.000 description 7
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 6
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 6
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 150000002460 imidazoles Chemical class 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 6
- SESYNEDUKZDRJL-UHFFFAOYSA-N 3-(2-methylimidazol-1-yl)propanenitrile Chemical compound CC1=NC=CN1CCC#N SESYNEDUKZDRJL-UHFFFAOYSA-N 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 239000005011 phenolic resin Substances 0.000 description 5
- 239000002002 slurry Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000013007 heat curing Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000011164 primary particle Substances 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 3
- 239000004962 Polyamide-imide Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000001588 bifunctional effect Effects 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- 150000004820 halides Chemical class 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 229920002312 polyamide-imide Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- UNVGBIALRHLALK-UHFFFAOYSA-N 1,5-Hexanediol Chemical compound CC(O)CCCCO UNVGBIALRHLALK-UHFFFAOYSA-N 0.000 description 2
- LLPKQRMDOFYSGZ-UHFFFAOYSA-N 2,5-dimethyl-1h-imidazole Chemical compound CC1=CN=C(C)N1 LLPKQRMDOFYSGZ-UHFFFAOYSA-N 0.000 description 2
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 2
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 2
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 description 2
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 2
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 description 2
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 2
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000000805 composite resin Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000007645 offset printing Methods 0.000 description 2
- XLMFDCKSFJWJTP-UHFFFAOYSA-N pentane-2,3-diol Chemical compound CCC(O)C(C)O XLMFDCKSFJWJTP-UHFFFAOYSA-N 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 150000008442 polyphenolic compounds Chemical class 0.000 description 2
- 235000013824 polyphenols Nutrition 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 125000005591 trimellitate group Chemical group 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- ORTVZLZNOYNASJ-UPHRSURJSA-N (z)-but-2-ene-1,4-diol Chemical compound OC\C=C/CO ORTVZLZNOYNASJ-UPHRSURJSA-N 0.000 description 1
- MTZUIIAIAKMWLI-UHFFFAOYSA-N 1,2-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC=C1N=C=O MTZUIIAIAKMWLI-UHFFFAOYSA-N 0.000 description 1
- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 description 1
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 description 1
- 229940015975 1,2-hexanediol Drugs 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 description 1
- XZKLXPPYISZJCV-UHFFFAOYSA-N 1-benzyl-2-phenylimidazole Chemical compound C1=CN=C(C=2C=CC=CC=2)N1CC1=CC=CC=C1 XZKLXPPYISZJCV-UHFFFAOYSA-N 0.000 description 1
- POMHKJNILBRCPM-UHFFFAOYSA-N 1H-imidazole (5-methyl-2-phenyl-1H-imidazol-4-yl)methanol Chemical class C1(=CC=CC=C1)C=1NC(=C(N1)C)CO.N1C=NC=C1 POMHKJNILBRCPM-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 description 1
- QUPKCFBHJFNUEW-UHFFFAOYSA-N 2-ethyl-4,5-dihydro-1h-imidazole Chemical compound CCC1=NCCN1 QUPKCFBHJFNUEW-UHFFFAOYSA-N 0.000 description 1
- NCVGSSQICKMAIA-UHFFFAOYSA-N 2-heptadecyl-4,5-dihydro-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NCCN1 NCVGSSQICKMAIA-UHFFFAOYSA-N 0.000 description 1
- VWSLLSXLURJCDF-UHFFFAOYSA-N 2-methyl-4,5-dihydro-1h-imidazole Chemical compound CC1=NCCN1 VWSLLSXLURJCDF-UHFFFAOYSA-N 0.000 description 1
- BKCCAYLNRIRKDJ-UHFFFAOYSA-N 2-phenyl-4,5-dihydro-1h-imidazole Chemical compound N1CCN=C1C1=CC=CC=C1 BKCCAYLNRIRKDJ-UHFFFAOYSA-N 0.000 description 1
- FUOZJYASZOSONT-UHFFFAOYSA-N 2-propan-2-yl-1h-imidazole Chemical compound CC(C)C1=NC=CN1 FUOZJYASZOSONT-UHFFFAOYSA-N 0.000 description 1
- BTYIFQSAIPDZQW-UHFFFAOYSA-N 2-propan-2-yl-4,5-dihydro-1h-imidazole Chemical compound CC(C)C1=NCCN1 BTYIFQSAIPDZQW-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- FQHUDZKKDCTQET-UHFFFAOYSA-N 2-undecyl-4,5-dihydro-1h-imidazole Chemical compound CCCCCCCCCCCC1=NCCN1 FQHUDZKKDCTQET-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- CPHGOBGXZQKCKI-UHFFFAOYSA-N 4,5-diphenyl-1h-imidazole Chemical compound N1C=NC(C=2C=CC=CC=2)=C1C1=CC=CC=C1 CPHGOBGXZQKCKI-UHFFFAOYSA-N 0.000 description 1
- JJUVAPMVTXLLFR-UHFFFAOYSA-N 5-methyl-2-phenyl-4,5-dihydro-1h-imidazole Chemical compound N1C(C)CN=C1C1=CC=CC=C1 JJUVAPMVTXLLFR-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- FVASVIZHVCPQJQ-UHFFFAOYSA-N C(#N)C(C)C=1N=C(NC1)CCCCCCCCCCC.N1C=NC=C1 Chemical class C(#N)C(C)C=1N=C(NC1)CCCCCCCCCCC.N1C=NC=C1 FVASVIZHVCPQJQ-UHFFFAOYSA-N 0.000 description 1
- QDZXJOMXPRWGFG-UHFFFAOYSA-N CCC1=NC=NC=N1.O=C1NC(=O)NC(=O)N1 Chemical compound CCC1=NC=NC=N1.O=C1NC(=O)NC(=O)N1 QDZXJOMXPRWGFG-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- 101710088194 Dehydrogenase Proteins 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- BMRWNKZVCUKKSR-UHFFFAOYSA-N butane-1,2-diol Chemical compound CCC(O)CO BMRWNKZVCUKKSR-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 238000002508 contact lithography Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000006266 etherification reaction Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- HTXVEEVTGGCUNC-UHFFFAOYSA-N heptane-1,3-diol Chemical compound CCCCC(O)CCO HTXVEEVTGGCUNC-UHFFFAOYSA-N 0.000 description 1
- OGRCRHSHBFQRKO-UHFFFAOYSA-N heptane-1,4-diol Chemical compound CCCC(O)CCCO OGRCRHSHBFQRKO-UHFFFAOYSA-N 0.000 description 1
- NNYOSLMHXUVJJH-UHFFFAOYSA-N heptane-1,5-diol Chemical compound CCC(O)CCCCO NNYOSLMHXUVJJH-UHFFFAOYSA-N 0.000 description 1
- UQGLNXPQGUMNRU-UHFFFAOYSA-N heptane-1,6-diol Chemical compound CC(O)CCCCCO UQGLNXPQGUMNRU-UHFFFAOYSA-N 0.000 description 1
- SXCBDZAEHILGLM-UHFFFAOYSA-N heptane-1,7-diol Chemical compound OCCCCCCCO SXCBDZAEHILGLM-UHFFFAOYSA-N 0.000 description 1
- VUVZASHBYYMLRC-UHFFFAOYSA-N heptane-2,3-diol Chemical compound CCCCC(O)C(C)O VUVZASHBYYMLRC-UHFFFAOYSA-N 0.000 description 1
- XTVHTJKQKUOEQA-UHFFFAOYSA-N heptane-2,5-diol Chemical compound CCC(O)CCC(C)O XTVHTJKQKUOEQA-UHFFFAOYSA-N 0.000 description 1
- OZIMXLFSRSPFAS-UHFFFAOYSA-N heptane-2,6-diol Chemical compound CC(O)CCCC(C)O OZIMXLFSRSPFAS-UHFFFAOYSA-N 0.000 description 1
- ZNZZFXONMYVVGZ-UHFFFAOYSA-N heptane-3,4-diol Chemical compound CCCC(O)C(O)CC ZNZZFXONMYVVGZ-UHFFFAOYSA-N 0.000 description 1
- BQWORYKVVNTRAW-UHFFFAOYSA-N heptane-3,5-diol Chemical compound CCC(O)CC(O)CC BQWORYKVVNTRAW-UHFFFAOYSA-N 0.000 description 1
- FHKSXSQHXQEMOK-UHFFFAOYSA-N hexane-1,2-diol Chemical compound CCCCC(O)CO FHKSXSQHXQEMOK-UHFFFAOYSA-N 0.000 description 1
- AVIYEYCFMVPYST-UHFFFAOYSA-N hexane-1,3-diol Chemical compound CCCC(O)CCO AVIYEYCFMVPYST-UHFFFAOYSA-N 0.000 description 1
- QVTWBMUAJHVAIJ-UHFFFAOYSA-N hexane-1,4-diol Chemical compound CCC(O)CCCO QVTWBMUAJHVAIJ-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- QCIYAEYRVFUFAP-UHFFFAOYSA-N hexane-2,3-diol Chemical compound CCCC(O)C(C)O QCIYAEYRVFUFAP-UHFFFAOYSA-N 0.000 description 1
- TXGJTWACJNYNOJ-UHFFFAOYSA-N hexane-2,4-diol Chemical compound CCC(O)CC(C)O TXGJTWACJNYNOJ-UHFFFAOYSA-N 0.000 description 1
- OHMBHFSEKCCCBW-UHFFFAOYSA-N hexane-2,5-diol Chemical compound CC(O)CCC(C)O OHMBHFSEKCCCBW-UHFFFAOYSA-N 0.000 description 1
- POFSNPPXJUQANW-UHFFFAOYSA-N hexane-3,4-diol Chemical compound CCC(O)C(O)CC POFSNPPXJUQANW-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 125000001841 imino group Chemical group [H]N=* 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- WCVRQHFDJLLWFE-UHFFFAOYSA-N pentane-1,2-diol Chemical compound CCCC(O)CO WCVRQHFDJLLWFE-UHFFFAOYSA-N 0.000 description 1
- RUOPINZRYMFPBF-UHFFFAOYSA-N pentane-1,3-diol Chemical compound CCC(O)CCO RUOPINZRYMFPBF-UHFFFAOYSA-N 0.000 description 1
- GLOBUAZSRIOKLN-UHFFFAOYSA-N pentane-1,4-diol Chemical compound CC(O)CCCO GLOBUAZSRIOKLN-UHFFFAOYSA-N 0.000 description 1
- GTCCGKPBSJZVRZ-UHFFFAOYSA-N pentane-2,4-diol Chemical compound CC(O)CC(C)O GTCCGKPBSJZVRZ-UHFFFAOYSA-N 0.000 description 1
- 238000005325 percolation Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- QCTJRYGLPAFRMS-UHFFFAOYSA-N prop-2-enoic acid;1,3,5-triazine-2,4,6-triamine Chemical compound OC(=O)C=C.NC1=NC(N)=NC(N)=N1 QCTJRYGLPAFRMS-UHFFFAOYSA-N 0.000 description 1
- 235000013772 propylene glycol Nutrition 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- DIHAURBCYGTGCV-UHFFFAOYSA-N xi-4,5-Dihydro-2,4(5)-dimethyl-1H-imidazole Chemical compound CC1CN=C(C)N1 DIHAURBCYGTGCV-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/32—Inkjet printing inks characterised by colouring agents
- C09D11/324—Inkjet printing inks characterised by colouring agents containing carbon black
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/041—Carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1535—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/36—Inkjet printing inks based on non-aqueous solvents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/0652—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component containing carbon or carbides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06593—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the temporary binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y99/00—Subject matter not provided for in other groups of this subclass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/004—Additives being defined by their length
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/026—Nanotubes or nanowires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/734—Fullerenes, i.e. graphene-based structures, such as nanohorns, nanococoons, nanoscrolls or fullerene-like structures, e.g. WS2 or MoS2 chalcogenide nanotubes, planar C3N4, etc.
- Y10S977/742—Carbon nanotubes, CNTs
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Electromagnetism (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Non-Adjustable Resistors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Epoxy Resins (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
[1](a)エポキシ樹脂と、(b)カーボンブラック粒子と、(c)カーボンナノチューブと、(d)25℃における蒸気圧が1.34×103Pa未満の溶剤と、を含む液状組成物。
[2]前記(b)カーボンブラック粒子の平均分散粒径が500nm以下であり、かつ、最大分散粒径が2μm以下である、上記[1]に記載の液状組成物。
[3]前記(c)カーボンナノチューブの外径が3nm以上であり、かつ、長さが100nm以上である、上記[1]又は[2]に記載の液状組成物。
[4]前記(b)カーボンブラック粒子の含有量が、当該液状組成物の固形分全体積を基準として10〜80体積%である、上記[1]〜[3]のいずれか一項に記載の液状組成物。
[5]前記(c)カーボンナノチューブの含有量が、前記(b)カーボンブラック粒子の固形分100質量部に対して0.1〜20質量部である、上記[1]〜[4]のいずれか一項に記載の液状組成物。
[6]25℃における粘度が50mPa・s以下である、上記[1]〜[5]のいずれか一項に記載の液状組成物。
[7]前記(a)エポキシ樹脂が、フェノール類とアルデヒド類との縮合物のグリシジルエーテル化物である、上記[1]〜[6]のいずれか一項に記載の液状組成物。
[8]更に、(e)硬化剤を含み、該(e)硬化剤が、フェノール類とアルデヒド類との縮合物を含む、上記[1]〜[7]のいずれか一項に記載の液状組成物。
[9](a1)分子量が40以上1000未満のジオール類、及び/又は、該ジオール類を骨格に含む樹脂と、(b)カーボンブラック粒子と、を含む液状組成物。
[10]前記(a1)分子量が40以上1000未満のジオール類、及び/又は、該ジオール類を骨格に含む樹脂が、(a2)分子量が40以上1000未満のジオール類を骨格に含む、分子量200以上50,000以下のエポキシ樹脂を含む、上記[9]に記載の液状組成物。
[11]更に、(d)25℃における蒸気圧が1.34×103Pa未満の溶剤と、(e)硬化剤とを含む、上記[9]又は[10]に記載の液状組成物。
[12]前記(e)硬化剤が、フェノール類とアルデヒド類との縮合物を含む、上記[11]に記載の液状組成物。
[13]前記(b)カーボンブラック粒子の平均分散粒径が500nm以下であり、かつ、最大分散粒径が2μm以下である、上記[9]〜[12]のいずれか一項に記載の液状組成物。
[14]前記(b)カーボンブラック粒子の含有量が、当該液状組成物の固形分全体積を基準として10〜80体積%である、上記[9]〜[13]のいずれか一項に記載の液状組成物。
[15]25℃における粘度が50mPa・s以下である、上記[9]〜[14]のいずれか一項に記載の液状組成物。
[16]更に、(c)カーボンナノチューブを含む、上記[9]〜[15]のいずれか一項に記載の液状組成物。
[17]前記(c)カーボンナノチューブの外径が3nm以上であり、かつ、長さが100nm以上である、上記[16]に記載の液状組成物。
[18]前記(c)カーボンナノチューブの含有量が、前記(b)カーボンブラック粒子の固形分100質量部に対して0.1〜20質量部である、上記[16]又は[17]に記載の液状組成物。
[19]上記[1]〜[18]のいずれか一項に記載の液状組成物から加熱により溶剤を除去して形成される抵抗体膜。
[20]上記[1]〜[18]のいずれか一項に記載の液状組成物を基材上に印刷又は塗布して当該液状組成物の膜を形成し、当該液状組成物の膜から加熱により溶剤を除去して形成される抵抗体膜。
[21]上記[19]又は[20]に記載の抵抗体膜を有する抵抗体素子。
[22]上記[21]記載の抵抗体素子が基材上に形成された配線板。
ガンマブチロラクトン(25℃における蒸気圧:2.3×102Pa)中にカーボンブラック粒子(平均一次粒子径:約20nm)を分散させたカーボンブラックスラリー(カーボンブラック粒子の含有量:20質量%、平均分散粒径:115nm、最大分散粒径:300nm):100gを、ガンマブチロラクトン:13.5gと、エポキシ樹脂(DIC株式会社製、商品名:N−865):5.9gと、フェノール樹脂(DIC株式会社製、商品名:VH−4170):3.2gと、1−シアノエチル−2−メチルイミダゾール(東京化成工業株式会社製):0.44gとを混合した樹脂溶液に加えて混合し、混合液を得た。この混合液に、ガンマブチロラクトン中にカーボンナノチューブ(CNT)(外径:10〜30nm、長さ:100〜1000nm)を分散させたCNT分散液(CNTの含有量:2質量%)を、カーボンブラック粒子100質量部に対してCNTの量が3質量部(0.6g)となるように添加して、粘度が15mPa・s、カーボンブラック粒子の平均分散粒径が130nm且つ最大分散粒径が300nmである液状組成物を得た。
混合液の調製において、カーボンブラックスラリーの量を110g、ガンマブチロラクトンの量を12gとし、混合液に対するCNT分散液の添加量を、CNTの量が0.65g(カーボンブラック粒子100質量部に対してCNTの量が3質量部)となるように調整した以外は実施例1−1と同様の方法で、粘度が18mPa・s、カーボンブラック粒子の平均分散粒径が140nm且つ最大分散粒径が300nmである液状組成物を得た。
CNT分散液を添加しなかった以外は実施例1−1と同様の方法で、粘度が15mPa・s、カーボンブラック粒子の平均分散粒径が130nm且つ最大分散粒径が300nmである液状組成物を得た。
CNT分散液を添加しなかった以外は実施例1−2と同様の方法で、粘度が18mPa・s、カーボンブラック粒子の平均分散粒径が140nm且つ最大分散粒径が300nmである液状組成物を得た。
溶剤として、ガンマブチロラクトンに替えてメチルエチルケトン(26℃における蒸気圧:1.3×104Pa)を使用した以外は実施例1−1と同様の方法で、粘度が12mPa・s、カーボンブラック粒子の平均分散粒径が140nm且つ最大分散粒径が300nmである液状組成物を得た。
溶剤として、ガンマブチロラクトンに替えてメチルイソブチルケトン(22℃における蒸気圧:2.2×103Pa)を使用した以外は実施例1−1と同様の方法で、粘度が14mPa・s、カーボンブラック粒子の平均分散粒径が140nm且つ最大分散粒径が300nmである液状組成物を得た。
実施例1−1〜1−2及び比較例1−1〜1−4で得られた液状組成物をインクジェット印刷装置により印刷したところ、実施例1−1〜1−2及び比較例1−1〜1−2の液状組成物はインクジェットヘッドの目詰まりを生じることなく良好に塗布できた。これに対して比較例1−3で得られた液状組成物では、インクジェットヘッドの目詰まりを生じ、塗布できなかった。また、比較例1−4で得られた液状組成物では、短時間での目詰まりは生じないものの、60分以上無吐出の状態で放置し、再度吐出しようとすると初期吐出できないノズルが散見された。
実施例1−1〜1−2及び比較例1−1〜1−2で得られた液状組成物をマイクロピペットで100μL分取し、ガラス板上に滴下した。これを210℃で所定の時間加熱硬化した。この硬化物の体積固有抵抗率を、加熱硬化時間:1、2、3、4.5及び5.5時間でそれぞれ測定し、図3に示す結果を得た。この結果、実施例1−1及び1−2の液状組成物では、1時間後以降更に加熱時間を伸ばしても体積抵抗率の変動が少なく、安定して低い体積抵抗率が得られたが、比較例1−1及び1−2の液状組成物では、経時的に体積抵抗率が変動し、また、実施例のものと比較して体積抵抗率が高かった。
ガンマブチロラクトン(25℃における蒸気圧:2.3×102Pa)中にカーボンブラック粒子(平均一次粒子径:約20nm)を分散させたカーボンブラックスラリー(カーボンブラック粒子の含有量:20質量%、平均分散粒径:115nm、最大分散粒径:300nm):100gを、ガンマブチロラクトン:13.5gと、分子量が40以上1000未満のジオール骨格を含み、分子量900であるエポキシ樹脂(DIC株式会社製、商品名:EXA4850−150):6.1gと、フェノール樹脂(DIC株式会社製、商品名:VH−4170):1.6gと、1−シアノエチル−2−メチルイミダゾール(東京化成工業株式会社製):0.47gとを混合した樹脂溶液に加えて混合し、粘度が15mPa・s、カーボンブラック粒子の平均分散粒径が140nm且つ最大分散粒径が300nmである液状組成物を得た。
実施例2−1で得られた液状組成物に、ガンマブチロラクトン中にカーボンナノチューブ(CNT)(外径:10〜30nm、長さ:100〜1000nm)を分散させたCNT分散液(CNTの含有量:2質量%)を、カーボンブラック粒子100質量部に対してCNTの量が3質量部(0.6g)となるように添加して、粘度が17mPa・s、カーボンブラック粒子の平均分散粒径が130nm且つ最大分散粒径が300nmである液状組成物を得た。
ガンマブチロラクトン中にカーボンブラック粒子を分散させたカーボンブラックスラリー(カーボンブラック粒子の含有量:20質量%、平均分散粒径:115nm、最大分散粒径:300nm):100gを、ガンマブチロラクトン:13.5gと、ジオール骨格を含まないビスフェノールAノボラック型エポキシ樹脂(DIC株式会社製、商品名:N865):5.9gと、フェノール樹脂(DIC株式会社製、商品名:VH−4170):3.2gと、1−シアノエチル−2−メチルイミダゾール(東京化成工業株式会社製):0.44gとを混合した樹脂溶液に加えて混合し、粘度が15mPa・s、カーボンブラック粒子の平均分散粒径が130nm且つ最大分散粒径が300nmである液状組成物を得た。
カーボンブラックスラリーの量を110gとし、ガンマブチロラクトンの量を11.9gとした以外は比較例2−1と同様の方法で、粘度が20mPa・s、カーボンブラック粒子の平均分散粒径が130nm且つ最大分散粒径が300nmである液状組成物を得た。
実施例2−1〜2−2及び比較例2−1〜2−2で得られた液状組成物をインクジェット印刷装置により印刷したところ、いずれもインクジェットヘッドの目詰まりを生じることなく良好に塗布できた。
実施例2−1〜2−2及び比較例2−1〜2−2で得られた液状組成物をマイクロピペットで100μL分取し、ガラス板上に滴下した。これを210℃で所定の時間加熱硬化した。この硬化物の体積固有抵抗率を、加熱硬化時間:1、2、3、4.5及び5.5時間でそれぞれ測定し、図4に示す結果を得た。この結果、実施例2−1及び2−2の液状組成物では、2時間後以降更に加熱時間を伸ばしても体積抵抗率の変動が少なく、2時間後以降は安定して低い体積抵抗率が得られたが、比較例2−1及び2−2の液状組成物では、経時的に体積抵抗率が変動し、また、実施例のものと比較して体積抵抗率が高かった。なお、実施例2−2の液状組成物では、実施例2−1の液状組成物よりも体積抵抗率が安定化する時間が早いことが確認された。
Claims (19)
- (a)エポキシ樹脂と、
(b)カーボンブラック粒子と、
(c)カーボンナノチューブと、
(d)25℃における蒸気圧が1.34×103Pa未満の溶剤と、
を含み、
前記(c)カーボンナノチューブの外径が3nm以上であり、かつ、長さが100nm以上である、液状組成物。 - 前記(b)カーボンブラック粒子の平均分散粒径が500nm以下であり、かつ、最大分散粒径が2μm以下である、請求項1に記載の液状組成物。
- 前記(b)カーボンブラック粒子の含有量が、当該液状組成物の固形分全体積を基準として10〜80体積%である、請求項1又は2に記載の液状組成物。
- 前記(c)カーボンナノチューブの含有量が、前記(b)カーボンブラック粒子の固形分100質量部に対して0.1〜20質量部である、請求項1〜3のいずれか一項に記載の液状組成物。
- 25℃における粘度が50mPa・s以下である、請求項1〜4のいずれか一項に記載の液状組成物。
- 前記(a)エポキシ樹脂が、フェノール類とアルデヒド類との縮合物のグリシジルエーテル化物である、請求項1〜5のいずれか一項に記載の液状組成物。
- 更に、(e)硬化剤を含み、該(e)硬化剤が、フェノール類とアルデヒド類との縮合物を含む、請求項1〜6のいずれか一項に記載の液状組成物。
- (a2)分子量が40以上1000未満のジオール類を骨格に含む、分子量200以上50,000以下のエポキシ樹脂と、
(b)カーボンブラック粒子と、
(c)カーボンナノチューブと、
を含み、
前記(c)カーボンナノチューブの外径が3nm以上であり、かつ、長さが100nm以上である、液状組成物。 - 更に、(d)25℃における蒸気圧が1.34×103Pa未満の溶剤と、(e)硬化剤とを含む、請求項8に記載の液状組成物。
- 前記(e)硬化剤が、フェノール類とアルデヒド類との縮合物を含む、請求項9に記載の液状組成物。
- 前記(b)カーボンブラック粒子の平均分散粒径が500nm以下であり、かつ、最大分散粒径が2μm以下である、請求項8〜10のいずれか一項に記載の液状組成物。
- 前記(b)カーボンブラック粒子の含有量が、当該液状組成物の固形分全体積を基準として10〜80体積%である、請求項8〜11のいずれか一項に記載の液状組成物。
- 25℃における粘度が50mPa・s以下である、請求項8〜12のいずれか一項に記載の液状組成物。
- 前記(c)カーボンナノチューブの含有量が、前記(b)カーボンブラック粒子の固形分100質量部に対して0.1〜20質量部である、請求項8〜13のいずれか一項に記載の液状組成物。
- 請求項1〜14のいずれか一項に記載の液状組成物から加熱により溶剤を除去して抵抗体膜を形成する工程を有する、抵抗体膜の製造方法。
- 請求項1〜14のいずれか一項に記載の液状組成物を基材上に印刷又は塗布して当該液状組成物の膜を形成する工程と、
当該液状組成物の膜から加熱により溶剤を除去して抵抗体膜を形成する工程と、
を有する、抵抗体膜の製造方法。 - 請求項1〜14のいずれか一項に記載の液状組成物を用いて作製された抵抗体膜。
- 請求項17に記載の抵抗体膜を有する抵抗体素子。
- 請求項18に記載の抵抗体素子が基材上に形成された配線板。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010177378 | 2010-08-06 | ||
JP2010177379 | 2010-08-06 | ||
JP2010177379 | 2010-08-06 | ||
JP2010177378 | 2010-08-06 | ||
PCT/JP2011/067893 WO2012018091A1 (ja) | 2010-08-06 | 2011-08-04 | 液状組成物、並びに、それを用いた抵抗体膜、抵抗体素子及び配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2012018091A1 JPWO2012018091A1 (ja) | 2013-10-03 |
JP6015445B2 true JP6015445B2 (ja) | 2016-10-26 |
Family
ID=45559587
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012527773A Expired - Fee Related JP6015445B2 (ja) | 2010-08-06 | 2011-08-04 | 液状組成物、並びに、それを用いた抵抗体膜、抵抗体膜の製造方法、抵抗体素子及び配線板 |
Country Status (9)
Country | Link |
---|---|
US (2) | US9228100B2 (ja) |
EP (1) | EP2602288B1 (ja) |
JP (1) | JP6015445B2 (ja) |
KR (1) | KR101788731B1 (ja) |
CN (1) | CN103052682B (ja) |
MY (2) | MY159094A (ja) |
SG (2) | SG10201504661VA (ja) |
TW (1) | TWI527851B (ja) |
WO (1) | WO2012018091A1 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5604609B2 (ja) * | 2012-08-27 | 2014-10-08 | 株式会社名城ナノカーボン | カーボンナノチューブ分散液及び当該分散液の製造方法 |
CN103037622B (zh) * | 2013-01-05 | 2015-08-12 | 上海卓凯电子科技有限公司 | 具有内埋式电阻的电路板 |
JP6810042B2 (ja) * | 2015-08-17 | 2021-01-06 | デンカ株式会社 | カーボンナノファイバー複合体の製造方法、カーボンナノファイバー複合体、残留触媒の除去方法、導電性樹脂組成物、及び分散液、インク又は塗料 |
CN107545958A (zh) * | 2016-06-28 | 2018-01-05 | 中国科学院成都有机化学有限公司 | 一种降低碳基导电膜体积电阻率的方法及其装置 |
CN106952677A (zh) * | 2017-03-28 | 2017-07-14 | 北京印刷学院 | 一种耐高温传感用导电碳浆及其制备方法 |
EP3626779B1 (en) * | 2017-05-17 | 2021-04-21 | Mitsubishi Electric Corporation | Liquid thermosetting resin composition, method for producing resin cured product, stator coil, and rotating electrical machine |
CN108997711B (zh) * | 2017-06-07 | 2023-04-07 | 洛阳尖端技术研究院 | 一种吸波浸渍胶液和吸波蜂窝及其制备方法 |
WO2019138855A1 (ja) * | 2018-01-15 | 2019-07-18 | パイクリスタル株式会社 | フレキシブル基板、電子デバイス、電子デバイスの製造方法 |
US11523513B2 (en) | 2019-10-11 | 2022-12-06 | Schlumberger Technology Corporation | Passive component adapter for downhole application |
US11533809B2 (en) * | 2019-10-11 | 2022-12-20 | Schlumberger Technology Corporation | Three dimensional printed resistor for downhole applications |
JP2021118290A (ja) * | 2020-01-28 | 2021-08-10 | ジカンテクノ株式会社 | 炭素素材を使用した導電性の電子部品及びその製造方法 |
CN111410871A (zh) * | 2020-03-06 | 2020-07-14 | 南昌欧菲生物识别技术有限公司 | 导电油墨、显示模组和电子设备 |
JP7537326B2 (ja) | 2020-05-14 | 2024-08-21 | 味の素株式会社 | 樹脂組成物 |
EP3967720A1 (de) * | 2020-09-09 | 2022-03-16 | Daw Se | Verfahren zur herstellung eines vorprodukts für eine ableitfähige beschichtungszusammensetzung, insbesondere zur beschichtung von bodenflächen, sowie ableitfähige beschichtung erhalten gemäss dem verfahren |
TWI797623B (zh) * | 2021-05-15 | 2023-04-01 | 道登電子材料股份有限公司 | 晶片電阻及其製備方法 |
EP4370343A4 (en) * | 2021-09-09 | 2024-10-23 | Hewlett Packard Dev Company L P | CONDUCTIVE COMPOUNDS DESIGNED FOR ENCAPSULATING FLUIDIC CHIPS |
CN115975418A (zh) * | 2022-07-27 | 2023-04-18 | 上海亿尚金属有限公司 | 一种防静电纳米树脂涂层及其应用 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005507146A (ja) * | 2001-10-25 | 2005-03-10 | シーティーエス・コーポレーション | 抵抗体ナノコンポジット組成物 |
JP2006140142A (ja) * | 2004-10-15 | 2006-06-01 | Showa Denko Kk | 導電性ペースト、その製造方法及び用途 |
JP2006269588A (ja) * | 2005-03-23 | 2006-10-05 | Shinshu Univ | 厚膜抵抗体ペースト、厚膜抵抗器およびその製造方法 |
JP2007165708A (ja) * | 2005-12-15 | 2007-06-28 | Hitachi Chem Co Ltd | 印刷抵抗体、印刷インク及び配線板 |
JP2010514886A (ja) * | 2006-12-27 | 2010-05-06 | ポスコ | 優れた放熱黒色樹脂組成物、これを利用した亜鉛めっき鋼板処理方法、及びこれにより処理されためっき鋼板 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2005A (en) * | 1841-03-16 | Improvement in the manner of constructing molds for casting butt-hinges | ||
US3808576A (en) | 1971-01-15 | 1974-04-30 | Mica Corp | Circuit board with resistance layer |
FR2166347A1 (en) | 1972-01-04 | 1973-08-17 | Mica Corp | Printed circuit laminate - with resistive under-cladding |
JPS573234A (en) | 1980-06-05 | 1982-01-08 | Matsushita Electric Ind Co Ltd | Optical recorder and reproducer |
US6265051B1 (en) * | 1998-11-20 | 2001-07-24 | 3Com Corporation | Edge connectors for printed circuit boards comprising conductive ink |
JP3972523B2 (ja) * | 1999-07-07 | 2007-09-05 | 松下電器産業株式会社 | カーボンペースト |
JP2003080694A (ja) | 2001-06-26 | 2003-03-19 | Seiko Epson Corp | 膜パターンの形成方法、膜パターン形成装置、導電膜配線、電気光学装置、電子機器、並びに非接触型カード媒体 |
JP4009080B2 (ja) | 2001-10-02 | 2007-11-14 | イビデン株式会社 | 配線板およびその製造方法 |
US20060001726A1 (en) * | 2001-10-05 | 2006-01-05 | Cabot Corporation | Printable conductive features and processes for making same |
US7141184B2 (en) * | 2003-12-08 | 2006-11-28 | Cts Corporation | Polymer conductive composition containing zirconia for films and coatings with high wear resistance |
CN101033349A (zh) * | 2006-03-07 | 2007-09-12 | 合正科技股份有限公司 | 无卤无磷电阻油墨、制造方法及其应用 |
WO2007114145A1 (ja) * | 2006-04-06 | 2007-10-11 | Hitachi Chemical Company, Ltd. | 液晶スペーサー形成用インク及びそれを用いた液晶表示装置 |
US7743518B2 (en) * | 2007-12-31 | 2010-06-29 | Bahram Khoshnood | Programmable sight and method of use thereof |
FR2941938B1 (fr) * | 2009-02-06 | 2011-05-06 | Commissariat Energie Atomique | Procede de kit de separation de nanotubes de carbone metalliques et semi-conducteurs. |
CN101597396B (zh) | 2009-07-02 | 2011-04-20 | 浙江华源电热有限公司 | 聚合物基正温度系数热敏电阻材料 |
-
2011
- 2011-08-04 JP JP2012527773A patent/JP6015445B2/ja not_active Expired - Fee Related
- 2011-08-04 US US13/814,293 patent/US9228100B2/en not_active Expired - Fee Related
- 2011-08-04 MY MYPI2013000392A patent/MY159094A/en unknown
- 2011-08-04 SG SG10201504661VA patent/SG10201504661VA/en unknown
- 2011-08-04 WO PCT/JP2011/067893 patent/WO2012018091A1/ja active Application Filing
- 2011-08-04 KR KR1020137005510A patent/KR101788731B1/ko active IP Right Grant
- 2011-08-04 MY MYPI2015002959A patent/MY183220A/en unknown
- 2011-08-04 CN CN201180037723.3A patent/CN103052682B/zh not_active Expired - Fee Related
- 2011-08-04 SG SG2013009410A patent/SG187760A1/en unknown
- 2011-08-04 EP EP11814716.4A patent/EP2602288B1/en not_active Not-in-force
- 2011-08-05 TW TW100127990A patent/TWI527851B/zh active
-
2014
- 2014-11-13 US US14/540,182 patent/US9650528B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005507146A (ja) * | 2001-10-25 | 2005-03-10 | シーティーエス・コーポレーション | 抵抗体ナノコンポジット組成物 |
JP2006140142A (ja) * | 2004-10-15 | 2006-06-01 | Showa Denko Kk | 導電性ペースト、その製造方法及び用途 |
JP2006269588A (ja) * | 2005-03-23 | 2006-10-05 | Shinshu Univ | 厚膜抵抗体ペースト、厚膜抵抗器およびその製造方法 |
JP2007165708A (ja) * | 2005-12-15 | 2007-06-28 | Hitachi Chem Co Ltd | 印刷抵抗体、印刷インク及び配線板 |
JP2010514886A (ja) * | 2006-12-27 | 2010-05-06 | ポスコ | 優れた放熱黒色樹脂組成物、これを利用した亜鉛めっき鋼板処理方法、及びこれにより処理されためっき鋼板 |
Also Published As
Publication number | Publication date |
---|---|
CN103052682B (zh) | 2018-07-31 |
MY183220A (en) | 2021-02-18 |
TWI527851B (zh) | 2016-04-01 |
US20150068426A1 (en) | 2015-03-12 |
MY159094A (en) | 2016-12-15 |
TW201221565A (en) | 2012-06-01 |
WO2012018091A1 (ja) | 2012-02-09 |
US20130153834A1 (en) | 2013-06-20 |
US9228100B2 (en) | 2016-01-05 |
CN103052682A (zh) | 2013-04-17 |
US9650528B2 (en) | 2017-05-16 |
SG10201504661VA (en) | 2015-07-30 |
JPWO2012018091A1 (ja) | 2013-10-03 |
EP2602288A4 (en) | 2016-11-16 |
KR20130101007A (ko) | 2013-09-12 |
KR101788731B1 (ko) | 2017-10-20 |
SG187760A1 (en) | 2013-03-28 |
EP2602288A1 (en) | 2013-06-12 |
EP2602288B1 (en) | 2017-09-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6015445B2 (ja) | 液状組成物、並びに、それを用いた抵抗体膜、抵抗体膜の製造方法、抵抗体素子及び配線板 | |
KR100476285B1 (ko) | 관통 구멍 배선판 | |
JP2013175559A (ja) | 接着剤層と配線層よりなる複合層及びそれを形成するための印刷用接着剤層形成インク | |
WO2006028205A1 (ja) | 導電性ペースト及びその導電性ペーストを用いて得られるフレキシブルプリント配線板 | |
JP4961665B2 (ja) | 絶縁体インク、印刷配線板及び多層印刷配線板 | |
JP5859823B2 (ja) | 加熱硬化型導電性ペースト組成物 | |
JP4844112B2 (ja) | 印刷抵抗体、印刷インク及び配線板 | |
JP5076696B2 (ja) | 液状組成物、抵抗体、抵抗体素子及び配線板 | |
JP2008047487A (ja) | 導電性ペースト組成物およびプリント配線板 | |
JP5751438B2 (ja) | 絶縁体インク及びこれを用いた絶縁層、複合層、回路基板、半導体パッケージ | |
JP2007123550A (ja) | 誘電体ペースト、キャパシタおよび基板 | |
JP6852846B2 (ja) | 電極用ペーストおよび積層セラミック電子部品 | |
JP5332102B2 (ja) | 液状組成物、抵抗体、抵抗体素子及び配線板 | |
JP4844113B2 (ja) | 液状組成物、抵抗体膜及びその形成方法、抵抗体素子並びに配線板 | |
JP2005268543A (ja) | 絶縁層形成用材料及び絶縁層 | |
JP5541017B2 (ja) | 絶縁層形成用材料及び絶縁層 | |
JP2005150233A (ja) | 回路基板形成方法 | |
JP2006244927A (ja) | 複合材料、複合材料膜およびこれを用いた薄膜トランジスタ | |
JP5782216B2 (ja) | 絶縁体インクとそれを用いた印刷配線基板 | |
JP2011103325A (ja) | 絶縁層と配線層の複合層及びそれを用いた回路基板、半導体パッケージ | |
KR20230058317A (ko) | 도전성 접착제, 그것을 사용한 전자 회로 및 그 제조 방법 | |
WO2020166137A1 (ja) | 導電性組成物 | |
JP2012117055A (ja) | 絶縁体インク樹脂組成物、レジストパターン及びレジストパターン形成方法 | |
JP2012028136A (ja) | 導電膜形成用導電粒子分散物、プリント配線板の製造方法及び導電膜形成方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140704 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150908 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20151102 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160308 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160415 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160830 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160912 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 6015445 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
LAPS | Cancellation because of no payment of annual fees |