SG10201504661VA - Liquid composition, and resistor film, resistor element and circuit board using same - Google Patents

Liquid composition, and resistor film, resistor element and circuit board using same

Info

Publication number
SG10201504661VA
SG10201504661VA SG10201504661VA SG10201504661VA SG10201504661VA SG 10201504661V A SG10201504661V A SG 10201504661VA SG 10201504661V A SG10201504661V A SG 10201504661VA SG 10201504661V A SG10201504661V A SG 10201504661VA SG 10201504661V A SG10201504661V A SG 10201504661VA
Authority
SG
Singapore
Prior art keywords
resistor
circuit board
same
liquid composition
film
Prior art date
Application number
SG10201504661VA
Inventor
Yasushi Kumashiro
Naoki Maruyama
Maki Inada
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of SG10201504661VA publication Critical patent/SG10201504661VA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y99/00—Subject matter not provided for in other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/041—Carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1535—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/32—Inkjet printing inks characterised by colouring agents
    • C09D11/324—Inkjet printing inks characterised by colouring agents containing carbon black
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/36—Inkjet printing inks based on non-aqueous solvents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/0652—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component containing carbon or carbides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06593—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the temporary binder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/004—Additives being defined by their length
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/026—Nanotubes or nanowires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/734—Fullerenes, i.e. graphene-based structures, such as nanohorns, nanococoons, nanoscrolls or fullerene-like structures, e.g. WS2 or MoS2 chalcogenide nanotubes, planar C3N4, etc.
    • Y10S977/742—Carbon nanotubes, CNTs

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Nanotechnology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electromagnetism (AREA)
  • Dispersion Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Non-Adjustable Resistors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Epoxy Resins (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
SG10201504661VA 2010-08-06 2011-08-04 Liquid composition, and resistor film, resistor element and circuit board using same SG10201504661VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010177378 2010-08-06
JP2010177379 2010-08-06

Publications (1)

Publication Number Publication Date
SG10201504661VA true SG10201504661VA (en) 2015-07-30

Family

ID=45559587

Family Applications (2)

Application Number Title Priority Date Filing Date
SG2013009410A SG187760A1 (en) 2010-08-06 2011-08-04 Liquid composition, and resistor film, resistor element and circuit board using same
SG10201504661VA SG10201504661VA (en) 2010-08-06 2011-08-04 Liquid composition, and resistor film, resistor element and circuit board using same

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG2013009410A SG187760A1 (en) 2010-08-06 2011-08-04 Liquid composition, and resistor film, resistor element and circuit board using same

Country Status (9)

Country Link
US (2) US9228100B2 (en)
EP (1) EP2602288B1 (en)
JP (1) JP6015445B2 (en)
KR (1) KR101788731B1 (en)
CN (1) CN103052682B (en)
MY (2) MY183220A (en)
SG (2) SG187760A1 (en)
TW (1) TWI527851B (en)
WO (1) WO2012018091A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150318550A1 (en) * 2012-08-27 2015-11-05 Takeshi Hashimoto Carbon nanotube dispersion and method for manufacturing dispersion
CN103037622B (en) * 2013-01-05 2015-08-12 上海卓凯电子科技有限公司 There is the circuit board of built-in type resistance
WO2017029920A1 (en) * 2015-08-17 2017-02-23 デンカ株式会社 Method for producing carbon nanofiber composite and carbon nanofiber composite
CN107545958A (en) * 2016-06-28 2018-01-05 中国科学院成都有机化学有限公司 A kind of method and its device for reducing carbon-based conductive membrane volume resistivity
CN106952677A (en) * 2017-03-28 2017-07-14 北京印刷学院 A kind of high temperature resistant sensing conductive carbon paste and preparation method thereof
WO2018211799A1 (en) * 2017-05-17 2018-11-22 三菱電機株式会社 Liquid thermosetting resin composition, method for producing resin cured product, stator coil, and rotating electrical machine
CN108997711B (en) * 2017-06-07 2023-04-07 洛阳尖端技术研究院 Wave-absorbing impregnation glue solution, wave-absorbing honeycomb and preparation method of wave-absorbing honeycomb
US11178764B2 (en) * 2018-01-15 2021-11-16 Pi-Crystal Incorporation Flexible substrate, electronic device, and method for manufacturing electronic device
US11533809B2 (en) 2019-10-11 2022-12-20 Schlumberger Technology Corporation Three dimensional printed resistor for downhole applications
US11523513B2 (en) 2019-10-11 2022-12-06 Schlumberger Technology Corporation Passive component adapter for downhole application
JP2021118290A (en) * 2020-01-28 2021-08-10 ジカンテクノ株式会社 Conductive electronic component using carbon material, and manufacturing method thereof
CN111410871A (en) * 2020-03-06 2020-07-14 南昌欧菲生物识别技术有限公司 Conductive ink, display module and electronic equipment
JP7537326B2 (en) 2020-05-14 2024-08-21 味の素株式会社 Resin composition
EP3967720A1 (en) * 2020-09-09 2022-03-16 Daw Se Method for producing a precursor for a conductive coating composition, in particular for coating ground areas, and conductive coating obtained using the method
TWI797623B (en) * 2021-05-15 2023-04-01 道登電子材料股份有限公司 Chip resistance and preparing method thereof
CN115975418A (en) * 2022-07-27 2023-04-18 上海亿尚金属有限公司 Anti-static nano resin coating and application thereof

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2005A (en) * 1841-03-16 Improvement in the manner of constructing molds for casting butt-hinges
US3808576A (en) 1971-01-15 1974-04-30 Mica Corp Circuit board with resistance layer
FR2166347A1 (en) 1972-01-04 1973-08-17 Mica Corp Printed circuit laminate - with resistive under-cladding
JPS573234A (en) 1980-06-05 1982-01-08 Matsushita Electric Ind Co Ltd Optical recorder and reproducer
US6265051B1 (en) * 1998-11-20 2001-07-24 3Com Corporation Edge connectors for printed circuit boards comprising conductive ink
JP3972523B2 (en) * 1999-07-07 2007-09-05 松下電器産業株式会社 Carbon paste
JP2003080694A (en) 2001-06-26 2003-03-19 Seiko Epson Corp Method for forming membrane pattern, apparatus for forming membrane pattern, electrically conductive membrane wiring, electrooptic apparatus, electronic instrument and non-contact type card medium
JP4009080B2 (en) 2001-10-02 2007-11-14 イビデン株式会社 Wiring board and manufacturing method thereof
US20060001726A1 (en) * 2001-10-05 2006-01-05 Cabot Corporation Printable conductive features and processes for making same
US6617377B2 (en) 2001-10-25 2003-09-09 Cts Corporation Resistive nanocomposite compositions
US7141184B2 (en) * 2003-12-08 2006-11-28 Cts Corporation Polymer conductive composition containing zirconia for films and coatings with high wear resistance
JP4803715B2 (en) * 2004-10-15 2011-10-26 昭和電工株式会社 Conductive paste, its production method and use
JP2006269588A (en) 2005-03-23 2006-10-05 Shinshu Univ Thick film resistor paste, thick film resistor, and manufacturing method thereof
JP4844112B2 (en) * 2005-12-15 2011-12-28 日立化成工業株式会社 Printing resistor, printing ink and wiring board
CN101033349A (en) * 2006-03-07 2007-09-12 合正科技股份有限公司 Halogen-free phosphor-free resistance printing ink, producing method and application thereof
US8040486B2 (en) * 2006-04-06 2011-10-18 Hitachi Chemical Company, Ltd. Ink for forming liquid crystal spacer and liquid crystal display device using such ink
WO2008078956A1 (en) * 2006-12-27 2008-07-03 Posco Excellent heat-dissipating black resin composition, method for treating a zinc coated steel sheet using the same and steel sheet treated thereby
US7743518B2 (en) * 2007-12-31 2010-06-29 Bahram Khoshnood Programmable sight and method of use thereof
FR2941938B1 (en) * 2009-02-06 2011-05-06 Commissariat Energie Atomique METHOD FOR THE SEPARATION KIT OF METALLIC CARBON NANOTUBES AND SEMICONDUCTORS
CN101597396B (en) * 2009-07-02 2011-04-20 浙江华源电热有限公司 Polymer-based positive temperature coefficient thermistor material

Also Published As

Publication number Publication date
KR20130101007A (en) 2013-09-12
US9650528B2 (en) 2017-05-16
EP2602288A1 (en) 2013-06-12
MY159094A (en) 2016-12-15
JP6015445B2 (en) 2016-10-26
JPWO2012018091A1 (en) 2013-10-03
US20150068426A1 (en) 2015-03-12
EP2602288A4 (en) 2016-11-16
TWI527851B (en) 2016-04-01
WO2012018091A1 (en) 2012-02-09
KR101788731B1 (en) 2017-10-20
CN103052682A (en) 2013-04-17
TW201221565A (en) 2012-06-01
EP2602288B1 (en) 2017-09-06
MY183220A (en) 2021-02-18
US20130153834A1 (en) 2013-06-20
CN103052682B (en) 2018-07-31
SG187760A1 (en) 2013-03-28
US9228100B2 (en) 2016-01-05

Similar Documents

Publication Publication Date Title
SG10201504661VA (en) Liquid composition, and resistor film, resistor element and circuit board using same
EP2774945A4 (en) Thermoplastic liquid crystal polymer film, and laminate and circuit board using same
TWI563057B (en) Adhesive film, adhesive composition, and display apparatus including the same
EP3039504A4 (en) Foldable electronic device including flexible display element
HK1206536A1 (en) Printed circuit board with embedded heater
EP2927296A4 (en) Adhesive agent composition, adhesive sheet, and electronic device
EP2436725A4 (en) Resin composition, laminate film comprising same, and image forming device using the laminate film as part thereof
EP2530103A4 (en) Polyimide resin composition, adhesive agent and laminate each comprising same, and device
HK1176911A1 (en) Printing device, printing material cartridge, printing material container adapter and circuit board
HK1204139A1 (en) Transparent conductive film, conductive element, composition, colored self-organized material, input device, display device and electronic instrument
EP2647685A4 (en) Adhesive composition, adhesive sheet, and semiconductor device using the adhesive composition or the adhesive sheet
EP2833368A4 (en) Conductive composition and conducting film
EP2624293A4 (en) Element housing package, and electronic device using the same
EP2720520A4 (en) Circuit board and electronic device provided with same
EP2940075A4 (en) Polyester resin composition, adhesive, and film
EP2927298A4 (en) Adhesive agent composition, adhesive sheet, and electronic device
EP2237650A4 (en) Circuit connecting adhesive film and circuit connecting structure
GB2490072B (en) printed circuit board
EP2833369A4 (en) Conductive composition and conducting film
EP2927295A4 (en) Adhesive agent composition, adhesive sheet, and electronic device
EP2649126A4 (en) Fast response photochromic composition and device
EP2918637A4 (en) Resin composition, and laminate for printed circuit board comprising same
TWI561603B (en) Adhesive composition, adhesive film and electronic component
EP3054752A4 (en) Curable composition for printed circuit board, and cured coating film and printed circuit board incorporating same
TWI561545B (en) Curable composition, curable film and display element