CN103037622B - There is the circuit board of built-in type resistance - Google Patents
There is the circuit board of built-in type resistance Download PDFInfo
- Publication number
- CN103037622B CN103037622B CN201310002528.8A CN201310002528A CN103037622B CN 103037622 B CN103037622 B CN 103037622B CN 201310002528 A CN201310002528 A CN 201310002528A CN 103037622 B CN103037622 B CN 103037622B
- Authority
- CN
- China
- Prior art keywords
- resistance
- grille
- electrode
- resistance area
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The present invention discloses a kind of circuit board with built-in type resistance, and it comprises insulated substrate, at least one pair of electrode and resistive layer.At least one pair of electrode described is located at the surface of described insulated substrate, and each pair of electrode comprises the first electrode and the second electrode.The first grille that described first electrode comprises the first noumenon and is connected with the first noumenon.Described second electrode and interval relative with described first electrode is arranged, and the second grille that described second electrode comprises the second body and is connected with described second body.Described resistive layer is formed on the first noumenon, the second body, insulated substrate between the first grille and the second grille.The circuit board with built-in type resistance of the present invention will be embedded in circuit board in resistance, compared with utilizing the circuit board of SMT technology manufacture, decrease the pad of components and parts, improve the stability after components and parts assembling. decrease signal cross-talk, and meet the frivolous requirement of product increasingly stringent.
Description
Technical field
The present invention relates to circuit board technology field, particularly a kind of circuit board with built-in type resistance.
Background technology
Because the demand of consumption electronic products on market such as mobile phone, notebook computer, digital camera and game machine significantly improves, and frivolous, high frequency and the multi-functional development trend having become electronic product.In order to make electronic product more frivolous, functional good, the integrated level of electronic product is more and more higher, usually needs on circuit boards to integrate more electronic component, such as resistance, electric capacity etc.
At present, the manufacture view of circuit board mainly utilizes surface mounting technology (surface mountedtechnology, SMT) or plug-in mounting technique the electronic components such as resistance are incorporated in printed circuit board (PCB), but the method easily produces impedance, cause signal cross-talk, and the frivolous requirement of product increasingly stringent can not be met.
Therefore, be necessary to provide the technical scheme of improvement to overcome the above technical problem existed in prior art.
Summary of the invention
The main technical problem to be solved in the present invention is to provide a kind of circuit board with built-in type resistance, and it can reduce signal cross-talk, meets the frivolous requirement of product increasingly stringent.
For solving the problems of the technologies described above, the invention provides a kind of circuit board with built-in type resistance, it comprises insulated substrate, at least one pair of electrode and resistive layer.At least one pair of electrode described is located at the surface of described insulated substrate, and each pair of electrode comprises the first electrode and the second electrode.The first grille that described first electrode comprises the first noumenon and is connected with the first noumenon.Described second electrode and interval relative with described first electrode is arranged, and the second grille that described second electrode comprises the second body and is connected with described second body.Described resistive layer is formed on the first noumenon, the second body, insulated substrate between the first grille and the second grille.
According to one embodiment of present invention, described first grille and described second grille are rectangle, and the first grille is integrally extended to form to the second electrode by the first noumenon, and the second grille is integrally extended to form to the first electrode by the second body.
According to one embodiment of present invention, described resistive layer comprises the first resistance area, the second resistance area and the 3rd resistance area.The width of described first resistance area is equal with the width of described first grille, and the length of described first resistance area is the spacing of described first grille and described second body.The width of described second resistance area be the width of described the first noumenon and the width of described first grille and the second grille and difference, the length of described second resistance area is the spacing of described the first noumenon and described second body.The width of described 3rd resistance area is equal with the width of described second grille, and the length of described 3rd resistance area is the spacing of described second grille and described the first noumenon.
According to one embodiment of present invention, the resistance of described first resistance area, the second resistance area and the 3rd resistance area is equal to the product of the business of the resistivity of this resistance area and the length of this resistance area and width.
According to one embodiment of present invention, the inverse of the resistance of described resistive layer is the sum reciprocal of the inverse of described first resistance area resistance, the inverse of described second resistance area resistance and described 3rd resistance area resistance.
According to one embodiment of present invention, described resistive layer is carbon ink layer.
The circuit board with built-in type resistance of the present invention will be embedded in circuit board in resistance, compared with utilizing the circuit board of SMT technology manufacture, decrease the pad of components and parts, improve the stability after components and parts assembling. decrease signal cross-talk, and meet the frivolous requirement of product increasingly stringent.
By the detailed description below with reference to accompanying drawing, other side of the present invention and feature become obvious.But it should be known that this accompanying drawing is only the object design of explanation, instead of as the restriction of scope of the present invention, this is because it should with reference to additional claim.Should also be appreciated that, unless otherwise noted, unnecessaryly draw accompanying drawing to scale, they only try hard to structure described herein and flow process are described conceptually.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.
Fig. 1 is the structural representation with the circuit board of built-in type resistance of one embodiment of the invention.
Embodiment
For enabling above-mentioned purpose of the present invention, feature and advantage become apparent more, are described in detail the specific embodiment of the present invention below in conjunction with accompanying drawing.
Fig. 1 is the structural representation with the circuit board of built-in type resistance of one embodiment of the invention.As shown in Figure 1, circuit board 10 comprises insulated substrate 11, at least one pair of electrode 12 and resistive layer 13.Each pair of electrode 12 is formed at the surface of insulated substrate 11.Each pair of electrode 12 includes the first electrode 120 and the second electrode 121.The first grille 120b that first electrode 120 comprises the first noumenon 120a and is connected with the first noumenon 120a.Second electrode 121 and interval relative with the first electrode 120 is arranged, the second grille 121b that the second electrode 121 comprises the second body 121a and is connected with the second body 121a.Resistive layer 13 is formed on the insulated substrate 11 between the first noumenon 120a, the second body 121a, the first grille 120b and the second grille 121b.Wherein, the first noumenon 120a, the second body 121a, the first grille 120b and the second grille 121b are rectangle, and the first grille 120b is integrally extended to form to the second electrode 121 by the first noumenon 120a, second grille 121b is integrally extended to form to the first electrode 120 by the second body 121a, that is, first grille 120b and the second grille 121b is between the first noumenon 120a and the second body 121a, so, the first grille 120b and the second grille 121b can prevent the fracture that resistive layer 13 is swiped by artificial or machinery and caused in the course of processing.
Resistive layer 13 comprises the first resistance area 131, resistance area 130, second and the 3rd resistance area 132.First resistance area 131, resistance area 130, second and the 3rd resistance area 132 are rectangle, and the width of the first resistance area 130 is equal with the width of the first grille 120b, and the length of the first resistance area 130 is the spacing of the first grille 120b and the second body 121a.The width of the second resistance area 131 be the width of the first noumenon 120a and the width of the first grille 120b and the second grille 121b and difference, the length of the second resistance area 131 is the spacing of the first noumenon 120a and the second body 121a.The width of the 3rd resistance area 132 is equal with the width of the second grille 121b, and the length of the 3rd resistance area 132 is the spacing of the second grille 121b and the first noumenon 120a.In an embodiment of the invention, the material of resistive layer 13 is carbon ink.
In an embodiment of the invention, suppose that the resistivity of resistive layer 13 is ρ, the width of the first electrode 120 and the first electrode 121 is C, the spacing of the first noumenon 120a and the second body 121a is B, the length of the first grille 120b is E1, the width of the first grille 120b is F1, the length of the second grille 121b is E2, the width of the second grille 121b is F2, then the width of the first resistance area 130 is F1, and the length of the first resistance area is B-E1.The width of the second resistance area 131 is C-F1-F2, and the length of the second resistance area 131 is B.The width of the 3rd resistance area 132 is F2, and the width of the 3rd resistance area 132 is B-E2.In the present embodiment, the resistance of each resistance area is equal to the product of the business of the resistivity of this resistance area and the length of this resistance area and width, that is, resistance r1=(B-E1) * ρ/F1 of the first resistance area 130, resistance r2=B* ρ/(C-F1-F2) of the second resistance area 131, resistance r3=(B-E2) * ρ/F2 of the 3rd resistance area 132.
In an embodiment of the present invention, the inverse of the resistance of resistive layer 13 is the sum reciprocal of the inverse of the first resistance area 130 resistance, the inverse of the second resistance area 131 resistance and the 3rd resistance area 132 resistance, and the computing formula obtaining the resistance r of resistive layer 13 after bringing the computing formula of r1, r2, r3 into is:
r=B*(B-E1)*(B-E2)*ρ/[B*(B-E1)*F2+(B-E1)*(B-E2)*(C-F1-F2)+B*F1*(B-E2)]
Be in the embodiment of carbon ink at the material of resistive layer 13, suppose B=8, E1=4, E2=4, F1=9, F2=3, F1=9, C=20, and electricalresistivityρ=45 of carbon ink, then can calculate the resistance r1=20ohm of the first resistance area 130 according to above-mentioned formula, the resistance r2=45ohm of the second resistance area 131, the resistance r3=60ohm of the 3rd resistance area 132, the resistance r=11.25ohm of resistive layer 13.
In sum, the circuit board with built-in type resistance of the present invention will be embedded in circuit board in resistance, compared with utilizing the circuit board of SMT technology manufacture, decrease the pad of components and parts, improve the stability after components and parts assembling. decrease signal cross-talk, and meet the frivolous requirement of product increasingly stringent.
Apply principle that specific case has a circuit board of built-in type resistance to of the present invention herein and execution mode is set forth, the explanation of above execution mode just understands method of the present invention and core concept thereof for helping; Meanwhile, for one of ordinary skill in the art, according to thought of the present invention; all will change in specific embodiments and applications; in sum, this description should not be construed as limitation of the present invention, and protection scope of the present invention should be as the criterion with appended claim.
Claims (5)
1. there is a circuit board for built-in type resistance, it is characterized in that, comprising:
Insulated substrate;
At least one pair of electrode, be located at the surface of described insulated substrate, comprise:
First electrode, the first grille comprising the first noumenon and be connected with the first noumenon; And
Second electrode, described second electrode and interval relative with described first electrode is arranged, the second grille that described second electrode comprises the second body and is connected with described second body; And
Resistive layer, is formed on the first noumenon, the second body, insulated substrate between the first grille and the second grille;
Wherein, described resistive layer comprises:
First resistance area, the width of described first resistance area is equal with the width of described first grille, and the length of described first resistance area is the spacing of described first grille and described second body;
Second resistance area, the width of described second resistance area be the width of described the first noumenon and the width of described first grille and the second grille and difference, the length of described second resistance area is the spacing of described the first noumenon and described second body; And
3rd resistance area, the width of described 3rd resistance area is equal with the width of described second grille, and the length of described 3rd resistance area is the spacing of described second grille and described the first noumenon.
2. there is the circuit board of built-in type resistance as claimed in claim 1, it is characterized in that, described first grille and described second grille are rectangle, and the first grille is integrally extended to form to the second electrode by the first noumenon, and the second grille is integrally extended to form to the first electrode by the second body.
3. have the circuit board of built-in type resistance as claimed in claim 1, it is characterized in that, the resistance of described first resistance area, the second resistance area and the 3rd resistance area is equal to the product of the business of the resistivity of this resistance area and the length of this resistance area and width.
4. have the circuit board of built-in type resistance as claimed in claim 3, it is characterized in that, the inverse of the resistance of described resistive layer is the inverse of described first resistance area resistance, the inverse of described second resistance area resistance and the sum reciprocal of described 3rd resistance area resistance.
5. have the circuit board of built-in type resistance as claimed in claim 1, it is characterized in that, described resistive layer is carbon ink layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310002528.8A CN103037622B (en) | 2013-01-05 | 2013-01-05 | There is the circuit board of built-in type resistance |
| TW102106247A TWI473546B (en) | 2013-01-05 | 2013-02-22 | Printed circuit board with embedded resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310002528.8A CN103037622B (en) | 2013-01-05 | 2013-01-05 | There is the circuit board of built-in type resistance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103037622A CN103037622A (en) | 2013-04-10 |
| CN103037622B true CN103037622B (en) | 2015-08-12 |
Family
ID=48023952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310002528.8A Expired - Fee Related CN103037622B (en) | 2013-01-05 | 2013-01-05 | There is the circuit board of built-in type resistance |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103037622B (en) |
| TW (1) | TWI473546B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014106331A1 (en) * | 2013-01-05 | 2014-07-10 | 上海卓凯电子科技有限公司 | Circuit board with buried resistor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203027605U (en) * | 2013-01-05 | 2013-06-26 | 上海卓凯电子科技有限公司 | Circuit board provided with built-in type resistor |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100694383B1 (en) * | 2003-09-17 | 2007-03-12 | 엘에스전선 주식회사 | Surface Mounted Type Thermistor |
| KR100754065B1 (en) * | 2003-11-05 | 2007-08-31 | 삼성전기주식회사 | Manufacturing method of printed circuit board with embedded resistor |
| JP2006156913A (en) * | 2004-12-01 | 2006-06-15 | Ricoh Co Ltd | Printed wiring board |
| WO2012018091A1 (en) * | 2010-08-06 | 2012-02-09 | 日立化成工業株式会社 | Liquid composition, and resistor film, resistor element and circuit board using same |
-
2013
- 2013-01-05 CN CN201310002528.8A patent/CN103037622B/en not_active Expired - Fee Related
- 2013-02-22 TW TW102106247A patent/TWI473546B/en not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203027605U (en) * | 2013-01-05 | 2013-06-26 | 上海卓凯电子科技有限公司 | Circuit board provided with built-in type resistor |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201429334A (en) | 2014-07-16 |
| TWI473546B (en) | 2015-02-11 |
| CN103037622A (en) | 2013-04-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201285850Y (en) | Electric connector | |
| US8263877B2 (en) | Printed circuit board | |
| US20130059475A1 (en) | USB Connector | |
| CN204316868U (en) | The integrated structure of circuit board | |
| CN203027605U (en) | Circuit board provided with built-in type resistor | |
| CN103037622B (en) | There is the circuit board of built-in type resistance | |
| US10490953B2 (en) | Bridging piece, shielding structure and display device | |
| CN103092445A (en) | Manufacturing method of capacitive touchpad | |
| EP2086296A3 (en) | Printed circuit board and method of manufacturing the same | |
| CN205847726U (en) | A kind of electronic equipment | |
| CN204482149U (en) | Flexible PCB | |
| CN208190991U (en) | Flexible circuit board | |
| CN210627169U (en) | Thin film circuit capacitive screen type touch screen | |
| CN203251505U (en) | Circuit board with white oil coverage layer | |
| CN206003115U (en) | The mounting structure of fingerprint module, fingerprint module and mobile terminal | |
| CN204129709U (en) | A kind of Antistatic touch screen | |
| CN104536616A (en) | Frameless touch screen and manufacturing method thereof | |
| CN204707161U (en) | A kind of camera adopting connection socket to connect | |
| CN102955638A (en) | Capacitive touch screen wiring method | |
| CN204440374U (en) | A kind of capacitive touch screen of dual electric layer structure | |
| CN205334437U (en) | Function chip architecture | |
| CN204576457U (en) | A kind of composing structure responding to carrier | |
| CN202424806U (en) | Insulation structure of SIM (subscriber identity module) card metal support | |
| CN111104003B (en) | Method for improving touch performance of capacitive touch screen with non-rectangular shape | |
| TWM403126U (en) | Circuit card connector for providing a mating blade for the edge of a circuit card |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150812 Termination date: 20180105 |