WO2014106331A1

WO2014106331A1 - Circuit board with buried resistor

Info

Publication number: WO2014106331A1
Application number: PCT/CN2013/070065
Authority: WO
Inventors: 温耀隆
Original assignee: 上海卓凯电子科技有限公司
Priority date: 2013-01-05
Filing date: 2013-01-05
Publication date: 2014-07-10

Abstract

Provided is a circuit board (10) with a buried resistor. The circuit board (10) comprises an insulation substrate (11), at least one pair of electrodes (12) and a resistance layer (13). The at least one pair of electrodes (12) are arranged on the surface of the insulation substrate (11), and each pair of electrodes (12) comprise a first electrode (120) and a second electrode (121). The first electrode (120) comprises a first body (120a) and a first guard fence (120b) connected to the first body (120a). The second electrode (121) is arranged opposite to and separated from the first electrode (120), and the second electrode (121) comprises a second body (121a) and a second guard fence (121b) connected to the second body (121a). The resistance layer (13) is formed on the insulation substrate (11) among the first body (120a), the second body (121a), the first guard fence (120b) and the second guard fence (121b). The circuit board (10) with a buried resistor buries the resistor in the circuit board (10). Compared with a circuit board manufactured using surface mounting technology (SMT), the welding points of components are reduced, the stability of assembled components is improved, the signal crosstalk is reduced, and the increasingly strict requirements for light and thin products are met.

Description

Circuit board with built-in resistor

Technical field

The present invention relates to the field of circuit board technologies, and in particular, to a circuit board having a buried resistor.

Background technique

As the demand for consumer electronic products such as mobile phones, notebook computers, digital cameras and game consoles in the market has increased significantly, thin, high frequency and versatility have become trends in electronic products. In order to make electronic products thinner, more functional, and more integrated with electronic products, it is often necessary to integrate more electronic components such as resistors and capacitors on the board.

At present, the manufacturing of circuit boards mainly uses surface mounted technology (SMT) or plug-in technology to integrate electronic components such as resistors into printed circuit boards, but this method is prone to impedance, causing signal crosstalk, and cannot be satisfied. The increasingly stringent requirements of thin and light products.

Therefore, it is necessary to provide an improved technical solution to overcome the above technical problems existing in the prior art.

Summary of the invention

The main technical problem to be solved by the present invention is to provide a circuit board having a built-in resistor, which can reduce signal crosstalk and meet increasingly stringent thin and light requirements of products.

In order to solve the above technical problems, the present invention provides a circuit board having a buried resistor, comprising an insulating substrate, at least one pair of electrodes, and a resistive layer. The at least one pair of electrodes are disposed on a surface of the insulating substrate, and each pair of electrodes includes a first electrode and a second electrode. The first electrode includes a first body and a first grill connected to the first body. The second electrode is opposite to and spaced apart from the first electrode, and the second electrode includes a second body and a second grill connected to the second body. The resistive layer is formed on the insulating substrate between the first body, the second body, the first grill and the second grill.

According to an embodiment of the present invention, the first grille and the second grille are both rectangular, and the first grille is integrally formed by the first body toward the second electrode, and the second grille is formed by the second body. Formed integrally with the first electrode. According to an embodiment of the invention, the resistance layer includes a first resistance region, a second resistance region, and a third resistance region. The width of the first resistance region is equal to the width of the first grid, and the length of the first resistor region is the distance between the first grid and the second body. The width of the second resistive region is the difference between the width of the first body and the width of the first grille and the second grille, and the length of the second resistor region is the first body and the The spacing of the second body. The width of the third resistance region is equal to the width of the second grid, and the length of the third resistor region is the distance between the second grid and the first body.

According to an embodiment of the invention, the resistance values of the first resistance region, the second resistance region, and the third resistance region are both equal to a product of a resistivity of the resistance region and a quotient of a length and a width of the resistance region.

According to an embodiment of the present invention, the reciprocal of the resistance of the resistance layer is a reciprocal of the resistance of the first resistance region, a reciprocal of the resistance of the second resistance region, and a reciprocal of the resistance of the third resistance region. Sum.

According to an embodiment of the invention, the resistive layer is a carbon ink layer. Compared with the circuit board manufactured by technology, the soldering point of the component is reduced, the stability of the component after assembly is improved, the signal crosstalk is reduced, and the increasingly strict thin and light requirements of the product are satisfied.

The above description is only an overview of the technical solutions of the present invention, and the present invention can be implemented in accordance with the contents of the specification, and the above and other features and advantages of the present invention can be more clearly understood. The specific embodiments are described in detail below with reference to the accompanying drawings.

BRIEF abstract

1 is a schematic structural view of a circuit board having a buried resistor according to an embodiment of the present invention.

Preferred embodiment of the invention

The technical solutions in the present invention will be clearly and completely described in the following with reference to the accompanying drawings in the drawings. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

1 is a schematic structural view of a circuit board having a buried resistor according to an embodiment of the present invention. As shown As shown in FIG. 1, the circuit board 10 includes an insulating substrate 11, at least a pair of electrodes 12, and a resistance layer 13. Each pair of electrodes 12 is formed on the surface of the insulating substrate 11. Each pair of electrodes 12 includes a first electrode 120 and a second electrode 121. The first electrode 120 includes a first body 120a and a first grill 120b connected to the first body 120a. The second electrode 121 is opposite to and spaced apart from the first electrode 120. The second electrode 121 includes a second body 121a and a second grill 121b connected to the second body 121a. The resistive layer 13 is formed on the first body 120a, the second body 121a, and the insulating substrate 11 between the first grill 120b and the second grill 121b. The first body 120a, the second body 121a, the first grill 120b and the second grill 121b are both rectangular, and the first grill 120b is formed by the first body 120a extending toward the second electrode 121, and the second The grille 121b is integrally formed by the second body 121a toward the first electrode 120. That is, the first grille 120b and the second grille 121b are located between the first body 120a and the second body 121a. The gate 120b and the second barrier 121b can prevent breakage of the resistive layer 13 by manual or mechanical scratching during processing.

The resistance layer 13 includes a first resistance region 130, a second resistance region 131, and a third resistance region 132. The first resistance region 130, the second resistance region 131 and the third resistance region 132 are all rectangular, and the width of the first resistance region 130 is equal to the width of the first gate 120b, and the length of the first resistance region 130 is the first protection. The spacing between the gate 120b and the second body 121a. The width of the second resistor region 131 is the difference between the width of the first body 120a and the width of the first grill 120b and the second grill 121b. The length of the second resistor region 131 is the first body 120a and the second body 121a. Pitch. The width of the third resistance region 132 is equal to the width of the second barrier 121b, and the length of the third resistance region 132 is the distance between the second barrier 121b and the first body 120a. In one embodiment of the invention, the material of the resistive layer 13 is a carbon ink.

In one embodiment of the present invention, it is assumed that the resistivity of the resistive layer 13 is p, the width of the first electrode 120 and the first electrode 121 are both C, and the distance between the first body 120a and the second body 121a is B, first The length of the grill 120b is El, the width of the first grill 120b is F1, the length of the second grill 121b is E2, the width of the second grill 121b is F2, and the width of the first resistor 130 is F1. A resistor region has a length of B-E1. The second resistance region 131 has a width of C-F1-F2, and the second resistance region 131 has a length B. The width of the third resistance region 132 is F2, and the width of the third resistance region 132 is B-E2. In this embodiment, the resistance of each of the resistance regions is equal to the product of the resistivity of the resistance region and the quotient of the length and width of the resistance region, that is, the resistance of the first resistance region 130 is rl=(B- El)* p /Fl , the resistance of the second resistance region 131 is r2 = B * p / (C - F1 - F2), and the resistance of the third resistance region 132 is r3 = (B - E2) * p / F2. In an embodiment of the invention, the reciprocal of the resistance of the resistive layer 13 is the reciprocal of the resistance of the first resistive region 130, the reciprocal of the resistance of the second resistive region 131, and the reciprocal of the resistance of the third resistive region 132, After calculating the formulas of rl, r2, and r3, the calculation formula of the resistance value r of the resistance layer 13 is as follows:

r=B* (B-E1) * (B-E2)* p /[B* (B-El) *F2+(B-E1) * (B-E2) * (C-F1-F2)+B* F1* (B-E2)]

In the embodiment where the material of the resistive layer 13 is carbon ink, it is assumed that B=8, El=4, E2=4, ¥1=9, F2=3, Fl=9, C=20, and the resistivity of the carbon ink. p=45, according to the above formula, the resistance value rl=20 ohm of the first resistance region 130, the resistance value r2=45 ohm of the second resistance region 131, and the resistance value r3=60 ohm of the third resistance region 132, the resistance The resistance of layer 13 is r = 11.25 ohm. Compared with the circuit board manufactured by SMT technology, the solder joints of the components are reduced, the stability of the components after assembly is improved, the signal crosstalk is reduced, and the increasingly strict thin and light requirements of the products are met.

The above disclosure is only a few specific embodiments of the present invention, but the present invention is not limited thereto, and any changes that can be made by those skilled in the art should fall within the protection scope of the present invention.

Claims

Claim

A circuit board having a built-in resistor, comprising:

Insulating substrate;

At least one pair of electrodes disposed on a surface of the insulating substrate, including:

The first electrode includes a first body and a first grille connected to the first body; and a second electrode, the second electrode is opposite to and spaced apart from the first electrode, and the second electrode includes a second body And a second grill connected to the second body; and

The resistive layer is formed on the insulating substrate between the first body, the second body, the first grill and the second grill.

2 . The circuit board with built-in resistor according to claim 1 , wherein the first grille and the second grille are both rectangular, and the first grille is oriented by the first body The two electrodes are integrally formed, and the second grille is integrally formed by the second body extending toward the first electrode.

The circuit board with built-in resistor according to claim 1, wherein the resistor layer comprises:

a first resistance region, a width of the first resistance region is equal to a width of the first grille, and a length of the first resistor region is a distance between the first grille and the second body;

a second resistance region, wherein a width of the second resistance region is a difference between a width of the first body and a width of the first grid and a second grid, and a length of the second resistor region is a spacing between the first body and the second body;

a third resistance region, a width of the third resistance region is equal to a width of the second grid, and a length of the third resistor region is a distance between the second grid and the first body.

4. The circuit board with built-in resistor according to claim 3, wherein the resistance values of the first resistance region, the second resistance region and the third resistance region are equal to the resistivity of the resistance region and The product of the quotient of the length and width of the resistive zone.

The circuit board with built-in resistor according to claim 4, wherein a reciprocal of the resistance of the resistance layer is a reciprocal of the resistance of the first resistance region, and the second resistance region is The reciprocal of the value and the reciprocal of the resistance of the third resistance zone.

The circuit board with built-in resistor according to claim 1, wherein the resist layer is a carbon ink layer.