M397557 五、新型說明： 【新型所屬之技術領域】 本創作係關於一種電容式觸控面板，尤指一種具有高 製造良率而適合大尺寸製造的電容式觸控面板。 【先前技術】 按，既有的觸控面板有電阻式觸控面板和電容式觸控 面板兩種’近年來，又以電容式觸控面板較受到市場上的 重視。 請參閱圖3所示，既有電容式觸控面板的結構係包括 一玻璃基板61、一下觸控感應線路層62、一上觸控感應線 路層63、一軟性電路板64、一透明絕緣膠層65及一破璃 蓋板66，其中：該玻璃基板61係具有一上表面和一下表 面，省上、下觸控感應線路層63、62係分別形成於該玻璃 基板61的上、下表面上；該軟性電路板64係設於該玻璃M397557 V. New Description: [New Technology Area] This is a capacitive touch panel, especially a capacitive touch panel with high manufacturing yield and suitable for large-scale manufacturing. [Prior Art] According to the conventional touch panel, there are two types of resistive touch panels and capacitive touch panels. In recent years, capacitive touch panels have received more attention in the market. Referring to FIG. 3, the structure of the capacitive touch panel includes a glass substrate 61, a lower touch sensing circuit layer 62, an upper touch sensing circuit layer 63, a flexible circuit board 64, and a transparent insulating rubber. a layer 65 and a glass cover 66, wherein the glass substrate 61 has an upper surface and a lower surface, and the upper and lower touch sensing circuit layers 63 and 62 are respectively formed on the upper and lower surfaces of the glass substrate 61. Upper; the flexible circuit board 64 is attached to the glass
基板61社表面±，並與部分上觸控感應線路|⑽接觸 而與之電連接；該透明絕緣膠層65係覆蓋於該玻璃蓋板Μ 上；該玻璃蓋板66係覆蓋於該透明絕緣膠層的上而由該 透明絕緣膠層65黏貼固定。 然由於目前的技術’僅能分開地在該玻璃基板61的 上、下表面形成該上觸控感應線路層63和下觸控感應線路 層62,例如先形成該上觸控感應線路層们，如此—來，後 續形成該下觸控感應線路層62 ^ ^ 已元成的上觸控感應線 路詹63極谷易在形成τ觸控感應線路層Μ的過程中遭到 3 M397557 丨傷或沾巧’進而使製造良率大幅降低。也因為良率過低， 匕種電办式觸控面板的尺寸通常無法做得太大，導致其 -用範圍又限，此外，因該下觸控感應線路層a外露而未 有任何保護，故在搬運時容易因碰撞導致該下觸控感應線 路層62損壞。 【新型内容】 <為改善既有電谷式觸控面板製造良率不佳和應用範圍 受限的缺點’本創作之主要目的在提供一種電容式觸控面 板，其具有高製造良率而適合大尺寸製造。 為達成前述目的所採取之主要技術手段係令前述電容 式觸控面板包括： —破螭基板，係具有一線路面； 下觸控感應線路層，係形成於該玻璃基板之線路面 上； 下絕緣墨水層’係、形成並覆蓋於該下觸控感應線路 層之邊，’彖上’纟未文覆蓋之下觸控感應線路層構成一觸控 區又。玄下絕緣墨水層在對應所覆蓋之下觸控感應線路層 邊緣處形成有複數穿槽，各穿槽中係填充有顏色與該下絕 緣墨水層相同的導電層； 下導線層，係形成並覆蓋於該下絕緣墨水層上而 透過該穿槽巾的導電層與該下觸㈣應線路層電連接； -下絕緣層’係形成並覆蓋於該下導線層上，又該下 絕緣層上係具有至少一缺口而露出部分的下導線層； 一下導電膠層，係形成於該τ絕緣層上該至少一缺口 4 M397557 處而覆蓋露出的下導線層； 一軟性電路板，係設於該下導電膠層上，並延伸至該 玻璃基板外，又該軟性電路板係透過該下導電膠層及導電 層而與該下觸控感應線路層電連接； 一透明絕緣勝層，係形成於該觸控區及下絕緣層上； 一上絕緣層，係形成於該透明絕緣膠層上，又該上絕 緣層上係具有至少一缺口而露出該軟性電路板； 一上導電膠層，係形成於該上絕緣層的該至少一缺口 處而與該軟性電路板接觸； 一上導線層’係形成並覆蓋於該上導電膠層和上絕緣 層上； 一上絕緣墨水層，係形成並覆蓋於該上導線層上，又 該上絕緣墨水層上係形成有複數穿槽，各穿槽中係填充有 與該上導線層接觸、且顏色與該上絕緣墨水層相同的導電 層； 一上觸控感應線路層，係形成於該透明絕緣膠層上， 並覆蓋部分上絕緣墨水層，且與該上絕緣墨水層穿槽中的 導電層接觸； 一玻璃蓋板，係具有一線路面，又該破璃蓋板係以其 線路面設於該上觸控感應線路層和上絕緣墨水層上。 利用上述技術手段，由於該下觸控感應線路層和上觸 控感應線路層係分別與該玻璃基板和玻璃蓋板接觸，因此 在製程上，可設計令該玻璃基板和玻璃蓋板以分開的製程 形成該下觸控感應線路層和上觸控感應線路層，由於利用 平板玻璃製程對平板玻璃進行單面線路層的製造已是成熟 5 ivuy/557 的技術’因此製程良率佳， 造大尺寸面板。 而較佳的製造良率則有利於製 【實施方式】The surface of the substrate 61 is ± and is in electrical contact with a portion of the upper touch sensing line | (10); the transparent insulating layer 65 is overlying the glass cover ;; the glass cover 66 is covered by the transparent insulating The adhesive layer is adhered and fixed by the transparent insulating adhesive layer 65. However, the current technology can only form the upper touch sensing circuit layer 63 and the lower touch sensing circuit layer 62 on the upper and lower surfaces of the glass substrate 61 separately, for example, the upper touch sensing circuit layer is formed first. In this way, the subsequent touch sensing circuit layer 62 ^ ^ has been formed into an upper touch sensing circuit. Zhan 63 is in the process of forming a τ touch sensing circuit layer and is subjected to 3 M397557 bruising or dip. Ingeniously, the manufacturing yield is greatly reduced. Also, because the yield is too low, the size of the electric touch panel can not be made too large, resulting in a limited range of use, and in addition, since the touch sensing circuit layer a is exposed without any protection, Therefore, the lower touch sensing circuit layer 62 is easily damaged by the collision during transportation. [New content] <In order to improve the manufacturing yield of the existing electric valley touch panel, and the limited application range, the main purpose of the present invention is to provide a capacitive touch panel with high manufacturing yield. Suitable for large size manufacturing. The main technical means for achieving the foregoing objectives is that the capacitive touch panel comprises: a broken substrate, having a circuit surface; a lower touch sensing circuit layer formed on a circuit surface of the glass substrate; The ink layer is formed and covered on the side of the lower touch sensing circuit layer, and the touch sensing circuit layer forms a touch area again. The underlying insulating ink layer is formed with a plurality of through grooves at the edges of the touch sensing circuit layer corresponding to the covered layer, and each of the through grooves is filled with a conductive layer having the same color as the lower insulating ink layer; the lower wire layer is formed and a conductive layer covering the lower insulating ink layer and passing through the through-groove is electrically connected to the lower contact (four) circuit layer; a lower insulating layer is formed on and covering the lower wire layer, and the lower insulating layer is further disposed on the lower insulating layer a lower conductive layer having at least one notch to expose a portion; a lower conductive adhesive layer formed on the τ insulating layer at the at least one notch 4 M397557 to cover the exposed lower conductive layer; a flexible circuit board disposed on the The lower conductive adhesive layer is extended to the outside of the glass substrate, and the flexible circuit board is electrically connected to the lower touch sensing circuit layer through the lower conductive adhesive layer and the conductive layer; The upper touch layer is formed on the transparent insulating layer, and the upper insulating layer has at least one notch to expose the flexible circuit board; Formed in The at least one gap of the upper insulating layer is in contact with the flexible circuit board; an upper wire layer is formed and overlaid on the upper conductive adhesive layer and the upper insulating layer; an upper insulating ink layer is formed and covered on the On the upper wire layer, the upper insulating ink layer is formed with a plurality of through grooves, and each of the through grooves is filled with a conductive layer that is in contact with the upper wire layer and has the same color as the upper insulating ink layer; The sensing circuit layer is formed on the transparent insulating adhesive layer and covers a portion of the upper insulating ink layer and is in contact with the conductive layer in the through-insulating ink layer; a glass cover has a line surface and is broken The glass cover is disposed on the upper touch sensing circuit layer and the upper insulating ink layer with its wiring surface. With the above technical means, since the lower touch sensing circuit layer and the upper touch sensing circuit layer are respectively in contact with the glass substrate and the glass cover, the glass substrate and the glass cover can be designed to be separated in the process. The process forms the lower touch sensing circuit layer and the upper touch sensing circuit layer. Since the single-sided circuit layer manufacturing of the flat glass by the flat glass process is a mature 5 ivuy/557 technology, the process yield is good, and the process is large. Size panel. The preferred manufacturing yield is advantageous for the implementation.
關於本創作之一較佳實施例’請參閱圖^及圖2所示 本創作之電容式觸控面板係包括一玻璃基板”、一下觸控 感應線路I 12' -下絕緣墨水層13、一下導線層14、— 下絕緣層15、一下導電膠層16、一軟性電路板2〇' —透 明絕緣膠| 3G、-上絕緣層41、—上導電膠層42、—上 導線層43、一上絕緣墨水層44、一上觸控感應線路層耗、 一玻璃蓋板46、一上保護層51及一下保護層52。 上述玻璃基板11係具有一線路面111。 上述下觸控感應線路層12係形成於該玻璃基板n之 線路面11 1上，於本實施例中，該下觸控感應線路層1 2係 扎由一雙層式觸控電極層的下觸控線路所構成，例如—X 轴觸控線路。 上述下絕緣墨水層1 3係形成並覆蓋於該下觸控感應線 路層12之邊緣上’使未受覆蓋之下觸控感應線路層I?構 成一觸控區131 ’又該下絕緣墨水層13在對應所覆蓋之下 觸控感應線路層12邊緣處形成有複數穿槽132,各穿槽132 中係填充有一導電層】33 ;於本實施例中，該下絕緣墨水層 1 3係採用深色油墨，以印刷及烘烤等技術將深色油墨附著 於該玻璃蓋板1彳之線路面111上而成形，欲設置該穿槽 1 32處則不印刷深色油墨使該穿槽1 32成形，故自該玻璃 蓋板1 1上相對於該線路面111的另側觀之，該下絕緣墨水 6 9 1 3具有遮蔽的效果；此外，該導電層1 係採用與該下 邑緣墨水層1 3之顏色相同或近似的導電物質，故可掩蔽該 穿槽132的存在。 上述下導線層14係形成並覆蓋於該下絕緣墨水層13 而透過該穿槽132中的該導電層133與該下觸控感應 線路層12電連接。 上述下絕緣層1 5係形成並覆蓋於該下導線層14上， 以避免該下導線層14因暴露於空氣中造成氧化，又該下絕 緣層15上係具有至少一缺口 151而露出部分的該下導線層 14;於本實施例中，該下絕緣層15係採用透明的絕緣材質。 上述下導電膠層1 6係形成於該下絕緣層彳5上的該至 少一缺口 151處而覆蓋露出的該下導線層14 ;於本實施例 中，該導電膠層16係採用異方性導電膜（Anis〇tr〇pjc Conductive Film，簡稱 ACF)或異方性導電膠（Anis〇tr〇picA preferred embodiment of the present invention is shown in FIG. 2 and FIG. 2 . The capacitive touch panel of the present invention includes a glass substrate, a touch sensing line I 12 ′ - a lower insulating ink layer 13 , Conductor layer 14, - lower insulating layer 15, lower conductive adhesive layer 16, a flexible circuit board 2'' transparent insulating adhesive | 3G, upper insulating layer 41, upper conductive adhesive layer 42, upper conductive layer 43, one The upper insulating ink layer 44, an upper touch sensing circuit layer, a glass cover 46, an upper protective layer 51 and a lower protective layer 52. The glass substrate 11 has a line surface 111. The lower touch sensing circuit layer 12 The lower touch sensing circuit layer 12 is formed by a lower touch line of a double-layer touch electrode layer, for example, in the present embodiment, the touch sensing circuit layer 12 is connected to the bottom surface of the glass substrate n. The X-axis touch line is formed on the edge of the lower touch sensing circuit layer 12, so that the untouched touch sensing circuit layer I forms a touch area 131. The lower insulating ink layer 13 is adjacent to the touch sensing circuit layer 12 A plurality of through holes 132 are formed in the edge, and each of the through grooves 132 is filled with a conductive layer 33. In the embodiment, the lower insulating ink layer 13 is made of dark ink, which is deep in printing and baking techniques. The color ink is attached to the line surface 111 of the glass cover 1 and is formed. If the groove 1 32 is to be disposed, the dark ink is not printed to form the groove 1 32. Therefore, the glass cover 11 is oppositely formed. The lower insulating ink 6 9 1 3 has a shielding effect on the other side of the wiring surface 111. Further, the conductive layer 1 is made of a conductive material having the same or similar color as the lower insulating ink layer 13 . Therefore, the presence of the through-hole 132 can be masked. The lower conductive layer 14 is formed and covers the lower insulating ink layer 13 and is electrically connected to the lower touch sensing circuit layer 12 through the conductive layer 133 in the through-hole 132. The lower insulating layer 15 is formed on and covered on the lower wiring layer 14 to prevent the lower wiring layer 14 from being oxidized by exposure to air, and the lower insulating layer 15 has at least one notch 151 to expose a portion thereof. The lower wire layer 14; in the embodiment, the lower insulation layer 15 is adopted The lower conductive layer 16 is formed on the at least one notch 151 of the lower insulating layer 5 to cover the exposed lower wire layer 14; in the embodiment, the conductive adhesive layer 16 Use an anisotropic conductive film (Anis〇tr〇pjc Conductive Film, ACF for short) or an anisotropic conductive adhesive (Anis〇tr〇pic)
Conductive Paste，簡稱 ACP)。 於製程上，可設計一下板製程完成前述玻璃基板扪、 下觸控感應線路層12、下絕緣墨水層13、下導線層14、 下絕緣層15及下導電膠層16的製程。 上述軟性電路板20係具有一下表面21和一上表面 2 2且4軟性電路板2 0係以其下表面設於該下導電膠層16 上，並延伸至該玻璃基板1彳外，又該軟性電路板2〇係透 過該下導電膠層1 6及該下絕緣墨水層】3穿槽彳32中的導 電層1 33而與該下觸控感應線路層1 2電連接。 上述透明絕緣膠層30係形成於該觸控區，3彳及該下絕 緣層1 5上。 M397557 上述上絕緣層41係形成於該透明絕緣膠層30 °亥上絕緣層41上係具有至少 板20 〇 缺口 411而露出該軟性電路 上述上導電膠層42係形成於該上絕緣層41的該至少 —缺口 411處而與該軟性電路板2〇的該上表面22接觸。 上述上導線層43係形成並覆蓋於該上導電膠層42和 該上絕緣層41上。 上述上絕緣墨水層44係形成並覆蓋於該上導線層43 上，又該上絕緣墨水層44上係形成有複數穿槽441，各穿 槽441中係填充有與該上導線層43接觸的一導電層々Μ ; 於本實施例中，該導電層442係採用與該上絕緣墨水層44 之顏色相同或近似的導電物質，以掩蔽該穿槽441的存在。 上述上觸控感應線路層4 5係形成於該透明絕緣膠層 30上，並覆蓋部分該上絕緣墨水層44，且與該上絕緣墨水 層44穿槽441中的該導電層442接觸，如此一來，該上觸 控感應線路層45可透過該上絕緣墨水層44穿槽441中的 該導電層442及該上導電膠層42與該軟性電路板2〇電連 接，於本實施例中，該上觸控感應線路層45係指由該雙層 式觸控電極層的一上觸控線路所構成，例如一丫軸觸控線 路。 上述玻璃蓋板46係具有一線路面461，又該玻璃蓋板 46係以其線路面461設於該上觸控感應線路層45和該上 絕緣墨水層44上，因此·從該玻璃蓋板46上相對於該線路 面461的另側觀之，該上絕緣墨水層44具有遮蔽線路的效 果0 8 M397557 於製程上，可設計以一與該下板製程獨立的上板製程 完成則述上絕緣層41、上導電膠層42、上導線層43、上 絕緣墨水層44、上觸控感應線路層45及玻璃蓋板46的製 造。 請參閱圖2所示，上述上保護層51係黏貼於該軟性電 路板20的該上表面22和該玻璃蓋板46之一侧邊之間，藉 此保護彎折該軟性電路板2〇時，不致與該玻璃蓋板46之 側邊直接接觸，因此可避免該軟性電路板2〇因彎折而遭該 玻璃蓋板46之側邊切割損壞。 上述下保護層52係黏貼於該軟性電路板2〇的該下表 面21和該玻璃基板彳彳之一側邊之間，其效果與該上保護 層51相同。 本創作具有下列優點： 1 ·藉由上述構造’可在製程上設計分離的上板製程和下 板製程，因以目前技術水準，使用平板玻璃製程進行單面 線路層的製作良率佳，故本創作之構造可使製造良率較既 有電容式觸控面板佳 2. 由於本創作之製造良率較佳，故有利於製作大尺寸面 板’使本創作之電容式觸控面板的應用領域可較既有電容 式觸控面板廣。 3. 本創作之觸控面板係於玻璃蓋板46和玻璃基板u 的線路面461、1 11分別形成上、下絕緣墨水層44、1 3， 以分別覆蓋上、下觸控感應線路層45 ' 1 2之邊緣，故可遮 蔽設於該上、下絕緣墨水層44、1 3之間的上、下導線層43、 14、上、下絕緣層41、15及上、下導電膠層42'16 •因 9 M397557 此’當本創作之觸控面板完成後欲與電子產品機殼組裝 時’機殼之邊緣可直接設計於玻璃蓋板46和玻璃基板川 之邊緣’増加本創作觸控面板設計上之方便性。 4-由於本創作之上、下觸控感‘線路層45、1 2以及上、 下導線層43、14係設於該玻璃基板彳彳和玻璃蓋板46之間 而不致裸路，因此在搬運本創作之觸控面板時，可避免搬Conductive Paste (referred to as ACP). In the process, the process of completing the glass substrate, the lower touch sensing circuit layer 12, the lower insulating ink layer 13, the lower wiring layer 14, the lower insulating layer 15, and the lower conductive adhesive layer 16 can be designed. The flexible circuit board 20 has a lower surface 21 and an upper surface 2 2 and 4 flexible circuit boards 20 are disposed on the lower conductive adhesive layer 16 and extend to the outside of the glass substrate 1 . The flexible circuit board 2 is electrically connected to the lower touch sensing circuit layer 12 through the lower conductive adhesive layer 16 and the lower insulating ink layer 3 through the conductive layer 133 in the trench 32. The transparent insulating layer 30 is formed on the touch area, 3 彳 and the lower insulating layer 15. M397557 The upper insulating layer 41 is formed on the transparent insulating layer 30°. The insulating layer 41 has at least a plate 20 cutout 411 to expose the flexible circuit. The upper conductive adhesive layer 42 is formed on the upper insulating layer 41. The at least gap 411 is in contact with the upper surface 22 of the flexible circuit board 2''. The upper wiring layer 43 is formed and covered on the upper conductive paste layer 42 and the upper insulating layer 41. The upper insulating ink layer 44 is formed on the upper conductive layer 43, and the upper insulating ink layer 44 is formed with a plurality of through grooves 441, and each of the through grooves 441 is filled with the upper conductive layer 43. A conductive layer 々Μ; in the embodiment, the conductive layer 442 is made of the same or similar conductive material as the upper insulating ink layer 44 to mask the presence of the through-hole 441. The upper touch sensing circuit layer 45 is formed on the transparent insulating layer 30 and covers a portion of the upper insulating ink layer 44, and is in contact with the conductive layer 442 in the through insulating layer 44 of the upper insulating ink layer 44. The upper touch sensing circuit layer 45 is electrically connected to the flexible circuit board 2 through the conductive layer 442 and the upper conductive adhesive layer 42 in the through-insulating ink layer 44, in this embodiment. The upper touch sensing circuit layer 45 is formed by an upper touch line of the double-layer touch electrode layer, such as a x-axis touch line. The glass cover 46 has a line surface 461. The glass cover 46 is disposed on the upper touch sensing circuit layer 45 and the upper insulating ink layer 44 with the circuit surface 461. Therefore, the glass cover 46 is removed from the glass cover 46. The upper insulating ink layer 44 has the effect of shielding the line from the other side of the line surface 461. The effect of shielding the line is 8 8 M397557, which can be designed to be insulated by an upper board process independent of the lower board process. Fabrication of layer 41, upper conductive adhesive layer 42, upper conductive layer 43, upper insulating ink layer 44, upper touch sensing circuitry layer 45, and glass cover 46. Referring to FIG. 2, the upper protective layer 51 is adhered between the upper surface 22 of the flexible circuit board 20 and one side of the glass cover 46, thereby protecting the flexible circuit board 2 from being bent. Therefore, the side of the glass cover 46 is not directly in contact with each other, so that the flexible circuit board 2 can be prevented from being damaged by the side of the glass cover 46 due to bending. The lower protective layer 52 is adhered between the lower surface 21 of the flexible circuit board 2 and one side of the glass substrate, and has the same effect as the upper protective layer 51. The creation has the following advantages: 1) By the above-mentioned structure, it is possible to design a separate upper plate process and a lower plate process in the process, because the current technical level, using the flat glass process for the single-sided circuit layer production yield is good, so The structure of the creation can make the manufacturing yield better than that of the existing capacitive touch panel. 2. Since the manufacturing yield of the creation is better, it is advantageous for the production of the large-sized panel's application field of the capacitive touch panel of the present invention. It can be wider than existing capacitive touch panels. 3. The touch panel of the present invention is formed on the line faces 461 and 117 of the glass cover 46 and the glass substrate u to form upper and lower insulating ink layers 44 and 13 respectively to cover the upper and lower touch sensing circuit layers 45, respectively. The edge of '1 2 can cover the upper and lower wire layers 43, 14 and the upper and lower insulating layers 41 and 15 and the upper and lower conductive adhesive layers 42 disposed between the upper and lower insulating ink layers 44 and 13. '16 • Because 9 M397557 This is the edge of the case that can be directly designed on the edge of the glass cover 46 and the glass substrate when the touch panel of this creation is assembled with the electronic product case. The convenience of the panel design. 4-Because the upper and lower touch sense 'circuit layers 45, 12 and the upper and lower wire layers 43, 14 are disposed between the glass substrate 彳彳 and the glass cover 46 without causing a bare road, When moving the touch panel of this creation, you can avoid moving
運不甚導致上、下觸控感應線路層45、12以及上、下導線 層43、14損壞的問題。 惟本創作雖已於前述實施射所揭露，但並不僅限於 前述實施例中所提及之内容，在 在不脫離本創作之精神和範 圍内所作之任何變化與修改，均屬 1屬於本創作之保護範圍。 綜上所述，本創作實為一極具 作，日丨目& , 1 r 進步性與實用性之佳 未見於刊物或公開使用’符合新型專利 爰依法提出申請。 W之申。月要件， 【圖式簡單說明】 圖彳：係本創作一較佳實施例之分解圖。 圖2 :係本創作一較佳實施例之剖面圖。 圖3:係、既有電容式觸控面板之剖面圖。 【主要元件符號說明】 111線路面 1 31觸控區 11破璃基板 12下觸控感應線路層 1 3下絕緣墨水層 M397557The problem of damage to the upper and lower touch sensing circuit layers 45, 12 and the upper and lower wire layers 43, 14 is not caused. However, this creation has been disclosed in the above-mentioned implementation, but it is not limited to the contents mentioned in the foregoing embodiments. Any changes and modifications made without departing from the spirit and scope of this creation belong to the creation. The scope of protection. In summary, this creation is a very important one, and the Japanese project & 1 r is of good progress and practicality. It is not found in the publication or public use. W's application. Monthly requirements, [Simplified illustration of the drawings] Figure 彳: An exploded view of a preferred embodiment of the present invention. Figure 2 is a cross-sectional view of a preferred embodiment of the present invention. Figure 3: A cross-sectional view of a conventional capacitive touch panel. [Main component symbol description] 111 line surface 1 31 touch area 11 glass substrate 12 touch sensing circuit layer 1 3 insulating ink layer M397557
132穿槽 133導電層 14下導線層 1 5下絕緣層 151 缺口 16下導電膠層 20軟性電路板 21下表面 22上表面 30透明絕緣膠層 41上絕緣層 411 缺口 42上導電膠層 43上導線層 44上絕緣墨水層 441穿槽 442導電層 45上觸控感應線路層 46玻璃蓋板 461線路面 51上保護層 52下保護層 61玻璃基板 62下觸控感應線路層 63上觸控感應線路層 64軟性電路板 65透明絕緣膠層 6 6破璃蓋板 11132 through slot 133 conductive layer 14 lower wire layer 1 5 lower insulating layer 151 notch 16 under conductive layer 20 flexible circuit board 21 lower surface 22 upper surface 30 transparent insulating layer 41 upper insulating layer 411 notch 42 on conductive adhesive layer 43 The insulating layer 441 on the wire layer 44 is 441 through the conductive layer 45 on the conductive layer 45 on the touch sensing circuit layer 46 the glass cover 461 on the line surface 51 on the protective layer 52 under the protective layer 61 on the glass substrate 62 under the touch sensing circuit layer 63 touch sensing Circuit layer 64 flexible circuit board 65 transparent insulating layer 6 6 broken glass cover 11