TWM524953U - Stacked wire structure of touch panel frame border - Google Patents

Description

Stacked line structure of touch panel frame

The present invention relates to a line structure of a touch panel frame, in particular to a stacked line structure of a touch panel frame.

Touch-sensitive electronic products such as smart phones or tablets are now widely used. Consumers have increasingly demanded touch-sensitive electronic products. For example, narrow-frame electronic products can increase the touch-enabled operating area of electronic products. Further shrinking the size of the fuselage can also bring a strong visual impact to consumers, which can cause popularity in the market and increase consumers' desire to purchase.

Referring to FIG. 4, the conventional touch panel includes a substrate 20, a plurality of sensing electrodes 21, and a plurality of signal lines 22. The substrate 20 includes a touch area and a frame area 200 located at the periphery of the touch area. 21 is formed in the touch area, the signal lines 22 are formed in the frame area 200, and the signal lines 22 are concentrated along the frame area 200 to one side edge of the substrate 20. As can be seen from FIG. 4, the signal lines 22 are equidistantly arranged in the bezel area 200 of the substrate 20, and the signal lines 22 are located on the same plane.

However, the width of the signal lines 22 and the spacing of the two adjacent signal lines 22 are limited by the processing capability, and the width of each signal line 22 or the spacing between two adjacent signal lines 22 cannot be further reduced, resulting in touch-type electronics. The effect of the narrow frame of the product is greatly reduced. For example, if the width of each signal line 22 and the distance between two adjacent signal lines 22 are both 30 micrometers (μm), a certain process yield can be maintained; however, if the width of each signal line 22 and two When the pitch of the adjacent signal lines 22 is further shortened to 15 micrometers (μm), the signal line 22 is likely to be short-circuited or broken during the etching process, thereby reducing the process yield.

In view of this, the main purpose of the present invention is to provide a stacked circuit structure of a touch panel frame, whereby the stacked circuit structure can reduce the border wiring area to narrow the edge of the touch panel, and ensure a certain process. Yield.

The stacked circuit structure of the touch panel frame is formed on a surface of a substrate. A touch area of the substrate is formed with a plurality of X-axis proximal electrode strings and a plurality of X-axis distal electrode strings. The circuit structure includes: a plurality of first signal lines arranged side by side and connected to the plurality of X-axis proximal electrode strings respectively; a first insulating layer formed on the surface of the first signal lines to cover the first signals a plurality of second signal lines formed on the surface of the first insulating layer and configured to respectively connect the plurality of X-axis distal electrode strings, wherein the extension paths of the second signal lines are respectively staggered to at least one of the first An extension path of the signal line and alternately arranged with the projections of the first signal lines; a metal layer formed on the surface of the second signal lines not interlaced on each of the first signal lines; and a second insulation layer Formed on the metal layer to cover the metal layer.

According to the first signal line, the first insulating layer, the second signal line, the metal layer and the second insulating layer of the present invention, a structure in which the upper and lower stacked layers are formed, compared with the structure in which the signal lines of the prior art are formed on the same surface of the substrate, Under the condition that the process capability of the same line width and spacing is created to ensure the process yield, the spacing between the first signal line and the second signal line of the present invention after planar projection can be greatly shortened, so that the border of the touch panel is made. There is more space available for effective use, or the narrowing of the touch panel is implemented to overcome the problems of the prior art.

The following is a description of the structure of the present invention. Referring to FIG. 1A, a circuit layer 11 is formed on a surface of a substrate 10. A surface of the substrate 10 has a touch area 101 and is located outside the touch area 101. a frame area 102 and a circuit board setting area 103 at the edge of the substrate 10. The circuit layer 11 includes a plurality of bridge lines 111 and a plurality of first signal lines 112. The bridge lines 111 are arranged in a matrix on the touch. In the area 101, the bridge lines 111 may be X-axis bridge lines or Y-axis bridge lines. Here, the X-axis bridge lines are taken as an example. The bridge lines 111 can be X-axis divided into a plurality of near-end bridge lines 111A and The plurality of remote bridge lines 111B are closer to the circuit board setting area 103 than the far side bridge lines 111B, that is, the bridge lines 111 are distinguished from the circuit board setting area 103 by X-axis. The plurality of proximal bridge lines 111A and the plurality of remote bridge lines 111B located at the other end of the substrate 10 with respect to the circuit board setting area 103; the first signal lines 112 are formed in the frame area 102, and each of the first signal lines 112 Extending from the edge of the touch area 101 to the circuit board setting area 103, the connection positions of the first signal lines 112 in the touch area 101 correspond to the near-end bridge lines 111A, in other words, the first signal lines 112 does not extend to the remote bridge lines 111B.

Referring to FIG. 1B, a first insulating layer 13 is formed. The first insulating layer 13 covers the surface of the bridge lines 111 and the surface of the first signal line 112 corresponding to the near-end bridge line 111A. Both ends of the line 111 are exposed to the first insulating layer 13.

Referring to FIG. 1C, a matrix-arranged plurality of sensing electrodes are formed in the touch area, and a plurality of second signal lines 142 are formed in the frame region. The sensing electrodes include an X sensing electrode 141X and a Y sensing electrode 141Y. The X sensing electrodes 141X are respectively connected to the bridge lines 111 to be exposed at both ends of the first insulating layer 13, and the X sensing electrodes 141X are formed through the bridge lines 111 to form a series structure, and the Y sensing electrodes 141Y are formed on the surface of the first insulating layer 13. The line 143 forms a tandem structure. The serially connected proximal bridge line 111A and the X-sensing electrode 141X form an X-axis proximal electrode string, which are respectively connected to the first signal line 112, and the serially connected remote bridge line 111B and the X-sensing electrode 141X form an X-axis far. End electrode string. Each of the second signal lines 142 extends from the edge of the touch area to the circuit board setting area 103, and the second signal lines 142 are respectively connected to the X-axis remote electrode strings. Furthermore, the second signal lines 142 are formed on the surface of the first insulating layer 13 and the substrate 10 such that the partial sections of the second signal lines 142 are located above the first signal lines 112, and the The extension paths of the two signal lines 142 are respectively staggered with the extension paths of the at least one first signal line 112, and are alternately arranged with the projections of the first signal lines 112 on the substrate 10.

Referring to FIG. 1D and FIG. 1E, a metal layer 15 is formed. The metal layer 15 is formed on the second signal lines 142 not interleaved on the surface of each of the first signal lines 112. In other words, the second signal line 142 is The surface at which the first signal lines 112 are staggered has no metal layer. Since the first signal line 112 is connected to the X-axis proximal electrode string and the second signal line 142 is connected to the X-axis distal electrode string, it can be seen that the length of the second signal line 142 is longer than the length of the first signal line 112, resulting in The impedance of the second signal line 142 itself is higher than the impedance of the first signal line 112, so that the impedance of the first signal line 112 and the second signal line 142 is not uniform; the creation of the metal layer 15 is used to reduce the overall line impedance. The impedance of the combined structure of the metal layer 15 and the second signal line 142 is made more uniform with the impedance of the first signal line 112.

Referring to FIG. 1F, a second insulating layer 16 is formed to cover the metal layer 15 on the surface of the second signal lines 142, thereby isolating the metal layer 15 from the external environment and avoiding the metal layer. 15 oxidation.

In summary, the stacked circuit structure of the touch panel frame is formed in the frame region 102 of a substrate 10 to form a plurality of first signal lines 112, a first insulating layer 13, a plurality of second signal lines 142, and a metal layer. 15 and a second insulating layer 16. The plurality of first signal lines 112 are arranged side by side and are respectively connected to the plurality of X-axis proximal electrode strings; the first insulating layer 13 is formed on the surface of the first signal lines 112 to cover the first signal lines 112. The plurality of second signal lines 142 are formed on the surface of the first insulating layer 13 and are respectively connected to the plurality of X-axis distal electrode strings, wherein the extension paths of the second signal lines 142 are respectively staggered to at least one of the first An extension path of the signal line 112 is alternately arranged with the projections of the first signal lines 112; the metal layer 15 is formed on the surface of the second signal lines 142 not interlaced with each of the first signal lines 112; A second insulating layer 16 is formed on the metal layer 15 to cover the metal layer 15.

Please refer to FIG. 2 , which is a partial enlarged view of FIG. 1C . The first signal line 112 and the second signal line 142 are arranged up and down and arranged alternately, compared to the signal line 22 of the prior art shown in FIG. 4 . The structure formed on the same surface of the substrate 20, under the condition of the same line width and spacing to ensure the process yield, the spacing between the first signal line 112 and the second signal line 142 of the present invention after planar projection can be greatly increased. Shortened, there is more space at the border of the touch panel for efficient use, or narrow edge of the touch panel. For example, the width of the first signal line 112 and the second signal line 142 may be 30 micrometers (μm), and the pitch of the first signal line 112 and the second signal line 142 on the substrate 10 may be 5 micrometers (μm). Thus, this creation does reduce the overall width of the bezel area 102 compared to the 30 micron (μm) line spacing of the prior art.

Referring to FIG. 1E, in the intersection of the first signal line 112 and the second signal line 142, the combination of the second signal line 142 of the upper layer and the metal layer 15 and the first signal line 112 of the lower layer are conductors, and the middle Referring to FIG. 3, the insulating first insulating layer 13 is interposed. Therefore, a coupling capacitor is generated at the intersection of the first signal line 112 and the second signal line 142, and the capacitance value (C) of the coupling capacitor is at a different input. The change of signal frequency and capacitance value will make the coupling capacitor have a certain impedance. This impedance is called capacitive reactance (Xc). The formula is as follows: Xc: capacitive reactance; ω: angular frequency; f: signal frequency; C: capacitance value of the coupling capacitor.

When the signal frequency (f) passing through the first signal line 112 and the second signal line 142 is fixed, the capacitive reactance (Xc) is inversely proportional to the capacitance value (C), and the magnitude of the capacitance value (C) and the amount of stored charge (Q) related, the formula is as follows: Q: amount of charge; V: voltage; I: current; R: line resistance.

Since the line resistance (R) is proportional to the amount of charge (Q) and inversely proportional to the capacitance value (C), when the first signal line 112 overlaps with the second signal line 142, the metal layer 15 is not formed, and the line at the overlap The impedance (R) will rise, so the capacitance value (C) decreases, thereby increasing the capacitive reactance (Xc), effectively reducing the combination of the second signal line 142 and the metal layer 15 disposed above and below and the signal transmission capacitance of the first signal line 112. The phenomenon that the effects pass through each other.

10‧‧‧Substrate
101‧‧‧ touch area
102‧‧‧Border area
103‧‧‧Board setting area
11‧‧‧Line layer
111‧‧‧Bridge line
111A‧‧‧ Near-end bridged line
111B‧‧‧Remote bridged line
112‧‧‧First signal line
13‧‧‧First insulation
141X‧‧‧X induction electrode
141Y‧‧‧Y induction electrode
142‧‧‧second signal line
143‧‧‧ lines
15‧‧‧metal layer
16‧‧‧Second insulation
20‧‧‧Substrate
21‧‧‧Induction electrodes
22‧‧‧Signal lines
200‧‧‧Border area

FIG. 1A is a schematic view showing the formation of a bridge line and a first signal line on the surface of the substrate. FIG. 1B is a schematic view showing the formation of a first insulating layer. Figure 1C: Schematic representation of the creation of a second signal line. Figure 1D: Schematic representation of the creation of a metal layer. FIG. 1E is a partial enlarged view of FIG. 1D. Figure 1F is a plan view of an embodiment of the present creation. Fig. 2 is a partially enlarged schematic view of Fig. 1C. Figure 3: Schematic diagram of the intersection of the first signal line and the second signal line of the present creation. Figure 4: A schematic plan view of a conventional touch panel.

112‧‧‧First signal line

13‧‧‧First insulation

142‧‧‧second signal line

15‧‧‧metal layer

Claims (1)

A stacked circuit structure of a touch panel frame is formed on a surface of a substrate. A touch area of the substrate is formed with a plurality of X-axis proximal electrode strings and a plurality of X-axis distal electrode strings. The circuit structure includes: a plurality of first signal lines arranged side by side and connected to the plurality of X-axis proximal electrode strings respectively; a first insulating layer formed on the surface of the first signal lines to cover the first signals a plurality of second signal lines formed on the surface of the first insulating layer and configured to respectively connect the plurality of X-axis distal electrode strings, wherein the extension paths of the second signal lines are respectively staggered to at least one of the first An extension path of the signal line and alternately arranged with the projections of the first signal lines; a metal layer formed on the surface of the second signal lines not interlaced on each of the first signal lines; and a second insulation layer Formed on the metal layer to cover the metal layer.