JP5994811B2 - 銅ナノ粒子分散体、及び導電性基板の製造方法 - Google Patents

銅ナノ粒子分散体、及び導電性基板の製造方法 Download PDF

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JP5994811B2
JP5994811B2 JP2014092473A JP2014092473A JP5994811B2 JP 5994811 B2 JP5994811 B2 JP 5994811B2 JP 2014092473 A JP2014092473 A JP 2014092473A JP 2014092473 A JP2014092473 A JP 2014092473A JP 5994811 B2 JP5994811 B2 JP 5994811B2
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copper
nanoparticle dispersion
conductive substrate
copper nanoparticle
acid
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Japanese (ja)
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JP2015210973A (ja
JP2015210973A5 (enExample
Inventor
吉信 大森
吉信 大森
洋介 田口
洋介 田口
将徳 澤田
将徳 澤田
北條　美貴子
美貴子 北條
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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Priority to JP2014092473A priority Critical patent/JP5994811B2/ja
Priority to PCT/JP2015/060007 priority patent/WO2015166755A1/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Electric Cables (AREA)
JP2014092473A 2014-04-28 2014-04-28 銅ナノ粒子分散体、及び導電性基板の製造方法 Active JP5994811B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014092473A JP5994811B2 (ja) 2014-04-28 2014-04-28 銅ナノ粒子分散体、及び導電性基板の製造方法
PCT/JP2015/060007 WO2015166755A1 (ja) 2014-04-28 2015-03-30 銅ナノ粒子分散体、及び導電性基板の製造方法

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JP2014092473A JP5994811B2 (ja) 2014-04-28 2014-04-28 銅ナノ粒子分散体、及び導電性基板の製造方法

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JP2016162615A Division JP2017022125A (ja) 2016-08-23 2016-08-23 銅ナノ粒子分散体、及び導電性基板の製造方法

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JP2015210973A JP2015210973A (ja) 2015-11-24
JP2015210973A5 JP2015210973A5 (enExample) 2016-03-10
JP5994811B2 true JP5994811B2 (ja) 2016-09-21

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JP (1) JP5994811B2 (enExample)
WO (1) WO2015166755A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3903966A4 (en) * 2018-12-25 2022-05-04 Kyocera Corporation COPPER PARTICLES, PROCESS FOR PRODUCTION OF COPPER PARTICLES, COPPER PASTE, SEMICONDUCTOR DEVICE AND ELECTRICAL/ELECTRONIC COMPONENT

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11104813B2 (en) * 2015-06-02 2021-08-31 Asahi Kasei Kabushiki Kaisha Dispersion
JP6642218B2 (ja) * 2016-04-05 2020-02-05 日油株式会社 レーザーエッチング用銅ペースト組成物
JPWO2018003399A1 (ja) * 2016-06-30 2018-07-05 株式会社コイネックス 銅配線およびそれを用いた電子機器、タッチパッド、タッチパネル
US11328835B2 (en) 2017-03-16 2022-05-10 Asahi Kasei Kabushiki Kaisha Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern
US11270809B2 (en) 2017-03-16 2022-03-08 Asahi Kasei Kabushiki Kaisha Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern
JP2018168439A (ja) * 2017-03-30 2018-11-01 日立化成株式会社 電磁波遮蔽体の製造に用いられる組成物、及び電磁波遮蔽体の製造方法
JP2018170228A (ja) * 2017-03-30 2018-11-01 日立化成株式会社 導体形成用組成物、並びに接合体及びその製造方法
CN110870392B (zh) 2017-07-18 2023-04-14 旭化成株式会社 具有导电性图案区域的结构体及其制造方法、层积体及其制造方法、以及铜布线
KR102456821B1 (ko) * 2017-07-27 2022-10-19 아사히 가세이 가부시키가이샤 산화구리 잉크 및 이것을 이용한 도전성 기판의 제조 방법, 도막을 포함하는 제품 및 이것을 이용한 제품의 제조 방법, 도전성 패턴을 갖는 제품의 제조 방법, 및 도전성 패턴을 갖는 제품
JP7430483B2 (ja) * 2017-11-10 2024-02-13 旭化成株式会社 導電性パターン領域付構造体及びその製造方法
JP2019211243A (ja) * 2018-05-31 2019-12-12 旭化成株式会社 Ｒｆｉｄタグ
JP2020084242A (ja) * 2018-11-20 2020-06-04 京セラ株式会社 接合用銅粒子の製造方法、接合用ペースト及び半導体装置並びに電気・電子部品
JP7269565B2 (ja) * 2019-03-29 2023-05-09 学校法人 関西大学 導電性インキ組成物及び導電性積層体
JP7434786B2 (ja) * 2019-09-27 2024-02-21 Dic株式会社 銅／酸化銅微粒子ペースト
WO2022196620A1 (ja) * 2021-03-17 2022-09-22 京セラ株式会社 ペースト組成物、半導体装置、電気部品及び電子部品
WO2023017747A1 (ja) * 2021-08-10 2023-02-16 株式会社ダイセル 導電性インク

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4865772B2 (ja) * 2007-08-30 2012-02-01 三ツ星ベルト株式会社 金属コロイド粒子およびその分散液
JP5661273B2 (ja) * 2008-11-26 2015-01-28 三ツ星ベルト株式会社 金属コロイド粒子及びそのペースト並びにその製造方法
KR20110027487A (ko) * 2009-09-10 2011-03-16 삼성전자주식회사 금속 패턴 형성용 조성물 및 이를 이용한 금속 패턴 형성방법
JP5623861B2 (ja) * 2010-10-14 2014-11-12 株式会社東芝 金属ナノ粒子分散組成物
JP5715851B2 (ja) * 2011-02-24 2015-05-13 東芝テック株式会社 ナノ粒子インク組成物を用いた印刷物の製造方法
JP6127433B2 (ja) * 2012-10-03 2017-05-17 大日本印刷株式会社 金属粒子分散体、及び物品

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3903966A4 (en) * 2018-12-25 2022-05-04 Kyocera Corporation COPPER PARTICLES, PROCESS FOR PRODUCTION OF COPPER PARTICLES, COPPER PASTE, SEMICONDUCTOR DEVICE AND ELECTRICAL/ELECTRONIC COMPONENT

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WO2015166755A1 (ja) 2015-11-05

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