JP5994811B2 - 銅ナノ粒子分散体、及び導電性基板の製造方法 - Google Patents

銅ナノ粒子分散体、及び導電性基板の製造方法 Download PDF

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Publication number
JP5994811B2
JP5994811B2 JP2014092473A JP2014092473A JP5994811B2 JP 5994811 B2 JP5994811 B2 JP 5994811B2 JP 2014092473 A JP2014092473 A JP 2014092473A JP 2014092473 A JP2014092473 A JP 2014092473A JP 5994811 B2 JP5994811 B2 JP 5994811B2
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Prior art keywords
copper
nanoparticle dispersion
conductive substrate
copper nanoparticle
acid
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Japanese (ja)
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JP2015210973A (ja
JP2015210973A5 (enExample
Inventor
吉信 大森
吉信 大森
洋介 田口
洋介 田口
将徳 澤田
将徳 澤田
北條　美貴子
美貴子 北條
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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Priority to JP2014092473A priority Critical patent/JP5994811B2/ja
Priority to PCT/JP2015/060007 priority patent/WO2015166755A1/ja
Publication of JP2015210973A publication Critical patent/JP2015210973A/ja
Publication of JP2015210973A5 publication Critical patent/JP2015210973A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Powder Metallurgy (AREA)
JP2014092473A 2014-04-28 2014-04-28 銅ナノ粒子分散体、及び導電性基板の製造方法 Active JP5994811B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014092473A JP5994811B2 (ja) 2014-04-28 2014-04-28 銅ナノ粒子分散体、及び導電性基板の製造方法
PCT/JP2015/060007 WO2015166755A1 (ja) 2014-04-28 2015-03-30 銅ナノ粒子分散体、及び導電性基板の製造方法

Applications Claiming Priority (1)

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JP2014092473A JP5994811B2 (ja) 2014-04-28 2014-04-28 銅ナノ粒子分散体、及び導電性基板の製造方法

Related Child Applications (1)

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JP2016162615A Division JP2017022125A (ja) 2016-08-23 2016-08-23 銅ナノ粒子分散体、及び導電性基板の製造方法

Publications (3)

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JP2015210973A JP2015210973A (ja) 2015-11-24
JP2015210973A5 JP2015210973A5 (enExample) 2016-03-10
JP5994811B2 true JP5994811B2 (ja) 2016-09-21

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JP (1) JP5994811B2 (enExample)
WO (1) WO2015166755A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3903966A4 (en) * 2018-12-25 2022-05-04 Kyocera Corporation COPPER PARTICLES, PROCESS FOR PRODUCTION OF COPPER PARTICLES, COPPER PASTE, SEMICONDUCTOR DEVICE AND ELECTRICAL/ELECTRONIC COMPONENT

Families Citing this family (18)

* Cited by examiner, † Cited by third party
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WO2016195047A1 (ja) * 2015-06-02 2016-12-08 旭化成株式会社 分散体
JP6642218B2 (ja) * 2016-04-05 2020-02-05 日油株式会社 レーザーエッチング用銅ペースト組成物
JPWO2018003399A1 (ja) * 2016-06-30 2018-07-05 株式会社コイネックス 銅配線およびそれを用いた電子機器、タッチパッド、タッチパネル
WO2018169012A1 (ja) 2017-03-16 2018-09-20 旭化成株式会社 分散体並びにこれを用いた導電性パターン付構造体の製造方法及び導電性パターン付構造体
US11328835B2 (en) 2017-03-16 2022-05-10 Asahi Kasei Kabushiki Kaisha Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern
JP2018170228A (ja) * 2017-03-30 2018-11-01 日立化成株式会社 導体形成用組成物、並びに接合体及びその製造方法
JP2018168439A (ja) * 2017-03-30 2018-11-01 日立化成株式会社 電磁波遮蔽体の製造に用いられる組成物、及び電磁波遮蔽体の製造方法
WO2019017363A1 (ja) 2017-07-18 2019-01-24 旭化成株式会社 導電性パターン領域を有する構造体及びその製造方法、積層体及びその製造方法、並びに、銅配線
EP3660112B1 (en) 2017-07-27 2021-08-25 Asahi Kasei Kabushiki Kaisha Copper oxide ink and method for producing conductive substrate using same, product containing coating film and method for producing product using same, method for producing product with conductive pattern, and product with conductive pattern
JP7430483B2 (ja) * 2017-11-10 2024-02-13 旭化成株式会社 導電性パターン領域付構造体及びその製造方法
JP2019211243A (ja) * 2018-05-31 2019-12-12 旭化成株式会社 Ｒｆｉｄタグ
JP2020084242A (ja) * 2018-11-20 2020-06-04 京セラ株式会社 接合用銅粒子の製造方法、接合用ペースト及び半導体装置並びに電気・電子部品
JP7269565B2 (ja) * 2019-03-29 2023-05-09 学校法人 関西大学 導電性インキ組成物及び導電性積層体
JP7434786B2 (ja) * 2019-09-27 2024-02-21 Dic株式会社 銅／酸化銅微粒子ペースト
EP4309828A4 (en) * 2021-03-17 2025-03-05 Kyocera Corporation Paste composition, semiconductor device, electrical component and electronic component
WO2023017747A1 (ja) * 2021-08-10 2023-02-16 株式会社ダイセル 導電性インク
KR20260105870A (ko) 2023-11-01 2026-07-07 이시하라 산교 가부시끼가이샤 복합 구리 입자 및 그 제조 방법, 그리고 그 용도
CN118045998A (zh) * 2024-02-22 2024-05-17 深圳市惟楚新材料有限公司 一种单分散高结晶超细铜粉的制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4865772B2 (ja) * 2007-08-30 2012-02-01 三ツ星ベルト株式会社 金属コロイド粒子およびその分散液
JP5661273B2 (ja) * 2008-11-26 2015-01-28 三ツ星ベルト株式会社 金属コロイド粒子及びそのペースト並びにその製造方法
KR20110027487A (ko) * 2009-09-10 2011-03-16 삼성전자주식회사 금속 패턴 형성용 조성물 및 이를 이용한 금속 패턴 형성방법
JP5623861B2 (ja) * 2010-10-14 2014-11-12 株式会社東芝 金属ナノ粒子分散組成物
JP5715851B2 (ja) * 2011-02-24 2015-05-13 東芝テック株式会社 ナノ粒子インク組成物を用いた印刷物の製造方法
JP6127433B2 (ja) * 2012-10-03 2017-05-17 大日本印刷株式会社 金属粒子分散体、及び物品

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3903966A4 (en) * 2018-12-25 2022-05-04 Kyocera Corporation COPPER PARTICLES, PROCESS FOR PRODUCTION OF COPPER PARTICLES, COPPER PASTE, SEMICONDUCTOR DEVICE AND ELECTRICAL/ELECTRONIC COMPONENT

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WO2015166755A1 (ja) 2015-11-05

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