JP2015210973A5 - - Google Patents
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- Publication number
- JP2015210973A5 JP2015210973A5 JP2014092473A JP2014092473A JP2015210973A5 JP 2015210973 A5 JP2015210973 A5 JP 2015210973A5 JP 2014092473 A JP2014092473 A JP 2014092473A JP 2014092473 A JP2014092473 A JP 2014092473A JP 2015210973 A5 JP2015210973 A5 JP 2015210973A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive substrate
- copper
- polymer dispersant
- less
- substrate according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010949 copper Substances 0.000 claims description 22
- 229910052802 copper Inorganic materials 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 239000002105 nanoparticle Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 15
- 239000002253 acid Substances 0.000 claims description 12
- 150000001412 amines Chemical class 0.000 claims description 12
- 239000002270 dispersing agent Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 239000006185 dispersion Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 8
- 150000003973 alkyl amines Chemical class 0.000 claims description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 8
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 8
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- 238000002296 dynamic light scattering Methods 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- 238000010304 firing Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 claims description 3
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 150000001735 carboxylic acids Chemical class 0.000 claims 6
- 125000004432 carbon atom Chemical group C* 0.000 claims 3
- 230000004580 weight loss Effects 0.000 claims 3
- 238000005530 etching Methods 0.000 claims 2
- -1 copper carboxylates Chemical class 0.000 claims 1
- 150000002429 hydrazines Chemical class 0.000 claims 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 4
- 239000000463 material Substances 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014092473A JP5994811B2 (ja) | 2014-04-28 | 2014-04-28 | 銅ナノ粒子分散体、及び導電性基板の製造方法 |
| PCT/JP2015/060007 WO2015166755A1 (ja) | 2014-04-28 | 2015-03-30 | 銅ナノ粒子分散体、及び導電性基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014092473A JP5994811B2 (ja) | 2014-04-28 | 2014-04-28 | 銅ナノ粒子分散体、及び導電性基板の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016162615A Division JP2017022125A (ja) | 2016-08-23 | 2016-08-23 | 銅ナノ粒子分散体、及び導電性基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015210973A JP2015210973A (ja) | 2015-11-24 |
| JP2015210973A5 true JP2015210973A5 (enExample) | 2016-03-10 |
| JP5994811B2 JP5994811B2 (ja) | 2016-09-21 |
Family
ID=54358492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014092473A Active JP5994811B2 (ja) | 2014-04-28 | 2014-04-28 | 銅ナノ粒子分散体、及び導電性基板の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5994811B2 (enExample) |
| WO (1) | WO2015166755A1 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016195047A1 (ja) * | 2015-06-02 | 2016-12-08 | 旭化成株式会社 | 分散体 |
| JP6642218B2 (ja) * | 2016-04-05 | 2020-02-05 | 日油株式会社 | レーザーエッチング用銅ペースト組成物 |
| JPWO2018003399A1 (ja) * | 2016-06-30 | 2018-07-05 | 株式会社コイネックス | 銅配線およびそれを用いた電子機器、タッチパッド、タッチパネル |
| WO2018169012A1 (ja) | 2017-03-16 | 2018-09-20 | 旭化成株式会社 | 分散体並びにこれを用いた導電性パターン付構造体の製造方法及び導電性パターン付構造体 |
| US11328835B2 (en) | 2017-03-16 | 2022-05-10 | Asahi Kasei Kabushiki Kaisha | Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern |
| JP2018170228A (ja) * | 2017-03-30 | 2018-11-01 | 日立化成株式会社 | 導体形成用組成物、並びに接合体及びその製造方法 |
| JP2018168439A (ja) * | 2017-03-30 | 2018-11-01 | 日立化成株式会社 | 電磁波遮蔽体の製造に用いられる組成物、及び電磁波遮蔽体の製造方法 |
| WO2019017363A1 (ja) | 2017-07-18 | 2019-01-24 | 旭化成株式会社 | 導電性パターン領域を有する構造体及びその製造方法、積層体及びその製造方法、並びに、銅配線 |
| EP3660112B1 (en) | 2017-07-27 | 2021-08-25 | Asahi Kasei Kabushiki Kaisha | Copper oxide ink and method for producing conductive substrate using same, product containing coating film and method for producing product using same, method for producing product with conductive pattern, and product with conductive pattern |
| JP7430483B2 (ja) * | 2017-11-10 | 2024-02-13 | 旭化成株式会社 | 導電性パターン領域付構造体及びその製造方法 |
| JP2019211243A (ja) * | 2018-05-31 | 2019-12-12 | 旭化成株式会社 | Ｒｆｉｄタグ |
| JP2020084242A (ja) * | 2018-11-20 | 2020-06-04 | 京セラ株式会社 | 接合用銅粒子の製造方法、接合用ペースト及び半導体装置並びに電気・電子部品 |
| JP2020100888A (ja) * | 2018-12-25 | 2020-07-02 | 京セラ株式会社 | 銅粒子、銅粒子の製造方法、銅ペースト及び半導体装置並びに電気・電子部品 |
| JP7269565B2 (ja) * | 2019-03-29 | 2023-05-09 | 学校法人 関西大学 | 導電性インキ組成物及び導電性積層体 |
| JP7434786B2 (ja) * | 2019-09-27 | 2024-02-21 | Dic株式会社 | 銅／酸化銅微粒子ペースト |
| EP4309828A4 (en) * | 2021-03-17 | 2025-03-05 | Kyocera Corporation | Paste composition, semiconductor device, electrical component and electronic component |
| WO2023017747A1 (ja) * | 2021-08-10 | 2023-02-16 | 株式会社ダイセル | 導電性インク |
| KR20260105870A (ko) | 2023-11-01 | 2026-07-07 | 이시하라 산교 가부시끼가이샤 | 복합 구리 입자 및 그 제조 방법, 그리고 그 용도 |
| CN118045998A (zh) * | 2024-02-22 | 2024-05-17 | 深圳市惟楚新材料有限公司 | 一种单分散高结晶超细铜粉的制备方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4865772B2 (ja) * | 2007-08-30 | 2012-02-01 | 三ツ星ベルト株式会社 | 金属コロイド粒子およびその分散液 |
| JP5661273B2 (ja) * | 2008-11-26 | 2015-01-28 | 三ツ星ベルト株式会社 | 金属コロイド粒子及びそのペースト並びにその製造方法 |
| KR20110027487A (ko) * | 2009-09-10 | 2011-03-16 | 삼성전자주식회사 | 금속 패턴 형성용 조성물 및 이를 이용한 금속 패턴 형성방법 |
| JP5623861B2 (ja) * | 2010-10-14 | 2014-11-12 | 株式会社東芝 | 金属ナノ粒子分散組成物 |
| JP5715851B2 (ja) * | 2011-02-24 | 2015-05-13 | 東芝テック株式会社 | ナノ粒子インク組成物を用いた印刷物の製造方法 |
| JP6127433B2 (ja) * | 2012-10-03 | 2017-05-17 | 大日本印刷株式会社 | 金属粒子分散体、及び物品 |
-
2014
- 2014-04-28 JP JP2014092473A patent/JP5994811B2/ja active Active
-
2015
- 2015-03-30 WO PCT/JP2015/060007 patent/WO2015166755A1/ja not_active Ceased
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