JP2017022125A5 - - Google Patents
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- Publication number
- JP2017022125A5 JP2017022125A5 JP2016162615A JP2016162615A JP2017022125A5 JP 2017022125 A5 JP2017022125 A5 JP 2017022125A5 JP 2016162615 A JP2016162615 A JP 2016162615A JP 2016162615 A JP2016162615 A JP 2016162615A JP 2017022125 A5 JP2017022125 A5 JP 2017022125A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive substrate
- copper
- mgkoh
- less
- producing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010949 copper Substances 0.000 claims description 25
- 229910052802 copper Inorganic materials 0.000 claims description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- 239000002105 nanoparticle Substances 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 17
- 239000006185 dispersion Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 239000002270 dispersing agent Substances 0.000 claims description 11
- 229920000642 polymer Polymers 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 8
- 150000003973 alkyl amines Chemical class 0.000 claims description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 8
- 150000001412 amines Chemical class 0.000 claims description 7
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 6
- 238000002296 dynamic light scattering Methods 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- 238000010304 firing Methods 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 4
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 claims description 3
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 150000001735 carboxylic acids Chemical class 0.000 claims 6
- 125000004432 carbon atom Chemical group C* 0.000 claims 3
- 230000004580 weight loss Effects 0.000 claims 3
- 238000005530 etching Methods 0.000 claims 2
- -1 copper carboxylates Chemical class 0.000 claims 1
- 150000002429 hydrazines Chemical class 0.000 claims 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 4
- 241000255925 Diptera Species 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016162615A JP2017022125A (ja) | 2016-08-23 | 2016-08-23 | 銅ナノ粒子分散体、及び導電性基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016162615A JP2017022125A (ja) | 2016-08-23 | 2016-08-23 | 銅ナノ粒子分散体、及び導電性基板の製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014092473A Division JP5994811B2 (ja) | 2014-04-28 | 2014-04-28 | 銅ナノ粒子分散体、及び導電性基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017022125A JP2017022125A (ja) | 2017-01-26 |
| JP2017022125A5 true JP2017022125A5 (enExample) | 2017-07-06 |
Family
ID=57888512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016162615A Pending JP2017022125A (ja) | 2016-08-23 | 2016-08-23 | 銅ナノ粒子分散体、及び導電性基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2017022125A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7129043B2 (ja) * | 2018-08-31 | 2022-09-01 | 京セラ株式会社 | 接合用銅粒子の製造方法、接合用ペーストおよび半導体装置並びに電気・電子部品 |
| CN115678347B (zh) * | 2022-09-08 | 2024-03-22 | 江南大学 | 一种低温等离子体诱导功能薄膜的制备方法及其关键材料 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5661273B2 (ja) * | 2008-11-26 | 2015-01-28 | 三ツ星ベルト株式会社 | 金属コロイド粒子及びそのペースト並びにその製造方法 |
| WO2011161817A1 (ja) * | 2010-06-25 | 2011-12-29 | リケンテクノス株式会社 | 塗料およびこれを用いたプライマー、インクジェット用インク |
-
2016
- 2016-08-23 JP JP2016162615A patent/JP2017022125A/ja active Pending
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